Hard drive cooling module and server

Abstract

This application provides a hard drive heat dissipation module and a server, relating to the field of hard drive heat dissipation technology. The hard drive heat dissipation module includes a support part and a liquid cooling part; the support part has an accommodating space for accommodating the hard drive; the liquid cooling part is disposed within the accommodating space to connect to the target surface of the hard drive, and the liquid cooling part has liquid cooling channels for flowing cooling medium to dissipate heat from the hard drive.

Description

Technical Field

[0001] This application relates to the field of hard disk heat dissipation technology, and in particular to a hard disk heat dissipation module and server. Background Technology

[0002] With the increasing demand for high-performance computing in data centers, the heat dissipation of hard drives in servers has become a significant factor limiting their performance and reliability. Although traditional air-cooling systems are widely used in servers, their heat dissipation efficiency is insufficient for the heat generated by high-density deployments and high-performance computing. Utility Model Content

[0003] The purpose of this application is to provide a hard drive heat dissipation module and a server, and the technical solution is as follows:

[0004] The first aspect of this application provides a hard drive heat dissipation module, comprising:

[0005] The support section has a storage space for accommodating the hard drive;

[0006] The liquid cooling section is located within the housing space to connect to the target surface of the hard drive. The liquid cooling section has liquid cooling channels for the flow of cooling medium to dissipate heat from the hard drive.

[0007] In some embodiments, the aforementioned hard drive heat dissipation module includes a support portion comprising a first bracket and a second bracket. The first bracket has a first region, and the second bracket has a second region. The hard drive is disposed in the first region along a first direction, and the first region and the second region are connected in a second direction to form an accommodating space. A liquid cooling portion is disposed in the second region. The first direction is the insertion direction of the hard drive relative to the accommodating space, and the second direction is perpendicular to the first direction.

[0008] In some embodiments, the aforementioned hard disk heat dissipation module includes a first connecting surface of the liquid cooling section for connecting to a target surface, the first connecting surface being parallel to a first direction; a second connecting surface of the liquid cooling section having a first liquid cooling inlet and a first liquid cooling outlet spaced apart, the first liquid cooling inlet and the first liquid cooling outlet being respectively connected to both ends of the liquid cooling channel to flow through the cooling medium; and the second connecting surface intersecting with the first connecting surface.

[0009] In some embodiments, the aforementioned hard disk heat dissipation module includes a liquid cooling section comprising a first plate and a second plate connected along a second direction. The side of the first plate opposite to the second plate is connected to a target surface. A liquid cooling channel is formed in the second plate. One end of the second plate is recessed relative to the first plate in a first direction to make the liquid cooling section step-shaped. The second plate, the first plate, and the second bracket form an insertion space. A first liquid cooling inlet and a first liquid cooling outlet are located in the insertion space.

[0010] In some embodiments, the aforementioned hard disk heat dissipation module further includes: a liquid-cooled backplate module, which is disposed on one side of the support in a first direction. The liquid-cooled backplate module includes a substrate and a first liquid distribution section and a second liquid distribution section disposed on one side of the substrate. The first liquid distribution section includes at least one second liquid cooling outlet facing away from the substrate, and the second liquid distribution section includes at least one second liquid cooling inlet facing away from the substrate. The second liquid cooling outlet and the first liquid cooling inlet are adapted and connected within a plug-in space, and the second liquid cooling inlet and the first liquid cooling outlet are adapted and connected within a plug-in space.

[0011] In some embodiments, the aforementioned hard disk heat dissipation module includes a guide post on the first liquid distribution section spaced apart from the second liquid cooling outlet, and a guide cylinder on the side of the second plate facing the insertion space, wherein the guide post and the guide cylinder are adapted to be connected within the insertion space.

[0012] In some embodiments, the aforementioned hard disk heat dissipation module further includes: a housing, the housing including a housing body and a fastener, the housing body being fixedly connected to the support portion, one end of the fastener being fixedly connected to the housing body, and the other end being fastened to the substrate.

[0013] In some embodiments, the aforementioned hard disk heat dissipation module further includes a third plate portion, which is connected between the first plate portion and the target surface, and / or the third plate portion is connected to the side of the hard disk away from the first plate portion.

[0014] A second aspect of this application provides a server, comprising:

[0015] At least one hard drive;

[0016] A hard drive cooling module, in which the hard drive is housed, comprises:

[0017] The support section has a storage space for accommodating the hard drive;

[0018] The liquid cooling section is located within the housing space to connect to the target surface of the hard drive. The liquid cooling section has liquid cooling channels for the flow of cooling medium to dissipate heat from the hard drive.

[0019] In some embodiments, the aforementioned server further includes: an air-cooled module; and a hard disk cooling module is correspondingly disposed on the air outlet side of the air-cooled module.

[0020] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, the preferred embodiments of this application are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 An exploded isometric view of a hard drive cooling module provided in this application is shown schematically.

[0023] Figure 2 This schematic diagram illustrates an isometric view of a hard disk heat dissipation module provided in this application.

[0024] Figure 3 This schematic diagram illustrates an isometric view of the support portion of a hard drive heat dissipation module provided in this application.

[0025] Figure 4 The schematic diagram shows the isometric view of the first connection surface of the liquid cooling section of a hard disk heat dissipation module provided in this application.

[0026] Figure 5 The schematic diagram shows the isometric view of the second connection surface of the liquid cooling section of a hard disk heat dissipation module provided in this application.

[0027] Figure 6 This schematic diagram illustrates the isometric structure of a liquid-cooled backplate module for a hard drive heat dissipation module provided in this application.

[0028] Figure 7 This schematically illustrates another isometric structural diagram of a liquid-cooled backplate module of a hard drive heat dissipation module provided in this application;

[0029] Figure 8 This schematic diagram illustrates the isometric structure of the liquid cooling backplate module connection support of a hard drive heat dissipation module provided in this application.

[0030] Figure 9 This illustration schematically shows a partial isometric structural diagram of the liquid cooling backplate module connection support of a hard drive heat dissipation module provided in this application.

[0031] Figure 10 This schematic diagram shows an isometric view of the housing connection support and the base plate of a hard disk heat dissipation module provided in this application.

[0032] Figure 11 An exploded isometric view of another hard drive heat dissipation module provided in this application is shown schematically.

[0033] Figure 12 This schematic diagram illustrates an isometric view of another hard drive heat dissipation module provided in this application.

[0034] Figure 13 An exploded isometric view of another hard drive heat dissipation module provided in this application is shown schematically.

[0035] Figure 14 A schematic diagram of a partial isometric structure of a server provided in this application is shown.

[0036] Explanation of reference numerals in the attached figures:

[0037] 1. Supporting part; 11. Accommodating space; 12. First bracket; 13. Second bracket; 121. First area; 131. Second area;

[0038] 2. Liquid cooling section; 21. First connecting surface; 22. Second connecting surface; 23. First plate section; 24. Second plate section; 25. Insertion space; 26. Third plate section; 221. First liquid cooling inlet; 222. First liquid cooling outlet; 241. Guide cylinder;

[0039] 3. Liquid-cooled backplane module; 31. Substrate; 32. First liquid distribution section; 33. Second liquid distribution section; 321. Second liquid cooling outlet; 322. Guide post; 331. Second liquid cooling inlet;

[0040] 4. Housing; 41. Housing body; 42. Fasteners;

[0041] 5. Server; 51. Hard drive; 52. Hard drive cooling module; 53. Air cooling module; 531. Exhaust side;

[0042] A. First direction; B. Second direction. Detailed Implementation

[0043] The embodiments of this disclosure will be further described in detail below with reference to the accompanying drawings and examples. The detailed description of the embodiments and the accompanying drawings are used to illustrate the principles of this disclosure by way of example, but should not be used to limit the scope of this disclosure. This disclosure can be implemented in many different forms and is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

[0044] These embodiments are provided to make the disclosure thorough and complete, and to fully express the scope of the disclosure to those skilled in the art. It should be noted that, unless otherwise specifically stated, the relative arrangement of components and steps, material composition, numerical expressions, and values ​​set forth in these embodiments should be interpreted as exemplary only and not as limiting.

[0045] It should be noted that, in the description of this disclosure, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicating orientation or positional relationship, are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0046] Furthermore, the terms "first," "second," and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different parts. "Vertical" is not strictly vertical, but within the permissible margin of error. "Parallel" is not strictly parallel, but within the permissible margin of error. Terms such as "including" or "contains" mean that the element preceding the word encompasses the element listed after the word, and do not exclude the possibility of encompassing other elements as well.

[0047] It should also be noted that, in the description of this disclosure, unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this disclosure depending on the specific circumstances. When a particular device is described as being located between a first device and a second device, an intermediary device may or may not be present between the particular device and the first or second device.

[0048] All terms used in this disclosure have the same meaning as understood by one of ordinary skill in the art to which this disclosure pertains, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant art, and not as idealized or highly formalized, unless expressly defined herein.

[0049] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, they should be considered part of the specification.

[0050] Example 1

[0051] like Figure 1 and Figure 2As shown, the first aspect of this application provides a hard disk heat dissipation module 52, including a support part 1 and a liquid cooling part 2; the support part 1 has an accommodating space 11 for accommodating a hard disk 51; the liquid cooling part 2 is disposed in the accommodating space 11 to connect to the target surface 51 of the hard disk 51, and a liquid cooling channel is formed in the liquid cooling part 2 for flowing a cooling medium to dissipate heat from the hard disk 51.

[0052] Specifically, the hard drive cooling module 52 provided in this application provides a space 11 for the hard drive 51 and the liquid cooling unit 2 for heat conduction by setting a support part 1. The support part 1 can be an integral frame structure, or it can adopt a partitioned design structure for the liquid cooling unit 2 and the hard drive 51. Furthermore, the support part 1 can also adopt a modular design to allow users to adjust the number of support parts 1 according to their needs to meet the layout requirements of the hard drive 51 for different data. In addition, an opening is provided on one side of the support part 1 to meet the insertion and removal requirements of the hard drive 51. In conjunction with the insertion and removal of the hard drive 51, an unlocking and locking linkage structure can also be set inside the support part 1 to ensure the stable placement of the hard drive 51 within the support part 1. The specific design is not limited.

[0053] To more efficiently dissipate heat from the hard drive 51, this application includes a liquid cooling section 2. The liquid cooling section 2 can be a block structure, plate structure, stepped structure, sandwich structure, etc. Liquid cooling channels are formed within the liquid cooling section 2 to provide space for the flow of the cooling medium. Heat is conducted between the cooling medium and the heat generated by the hard drive 51 to remove heat and achieve heat dissipation. The liquid cooling channels can be S-shaped channels, honeycomb channels, mesh channels, microchannel channels, etc. The cooling medium can be chilled water, water-glycol solution, electronic coolant, etc., with no specific limitation, as long as it can achieve stable and efficient heat conduction and exchange. Furthermore, to connect the cooling medium to the liquid cooling pump, distributor, and reservoir outside the hard drive heat dissipation module 52 to achieve a circulation channel, this application requires an inlet and outlet on the outside of the liquid cooling section 2 to connect the liquid cooling channels, so that the cooling medium circulates within the liquid cooling channels through these inlets and outlets.

[0054] The liquid cooling unit 2 can directly contact the target surface 51 of the hard disk 51 for efficient heat transfer. The hard disk heat dissipation module 52 can provide one or more liquid cooling units 2 for a hard disk 51 to directly contact one or more target surfaces 51 of the hard disk 51. The specific units are not limited, as long as they meet the high-efficiency heat dissipation requirements of the hard disk 51. Considering that the hard disk 51 is typically a flat cuboid, in several embodiments of this application, the target surface 51 of the hard disk 51 can be one or both sides of the flat cuboid in its thickness direction, which has a relatively large surface area; it can also be one or both sides of the flat cuboid in its width direction, which has a smaller surface area; or it can be one side of the flat cuboid in its length direction, which gradually moves away from the user when the user inserts the hard disk 51 into the support part 1. In the above embodiments, this application does not specifically limit the location of the target surface 51 of the hard disk 51. The liquid cooling part 2 can directly contact the target surface 51 of the hard disk 51 for efficient heat transfer, so that the cooling medium in the liquid cooling channel of the liquid cooling part 2 can remove the heat generated by the hard disk 51, thereby achieving efficient heat dissipation of the hard disk 51 and ensuring the performance and stability of the hard disk 51 and the server.

[0055] This application provides a hard disk cooling module 52, including a support portion 1 and a liquid cooling portion 2. The support portion 1 has a housing space 11 for housing a hard disk 51. The liquid cooling portion 2 is disposed within the housing space 11 to connect to the target surface 51 of the hard disk 51. The liquid cooling portion 2 has liquid cooling channels for a cooling medium to flow through, thereby dissipating heat from the hard disk 51. The hard disk cooling module 52 provided by this application houses the liquid cooling portion 2 and the hard disk 51 in the same space via the support portion 1, allowing the liquid cooling portion 2 to directly contact the target surface 51 of the hard disk 51 for efficient heat transfer. The cooling medium within the liquid cooling channels of the liquid cooling portion 2 can remove the heat generated by the hard disk 51, achieving efficient heat dissipation for the hard disk 51 and ensuring the performance and stability of the hard disk 51 and the server.

[0056] like Figures 1 to 3 As shown, in some embodiments, the support 1 includes a first bracket 12 and a second bracket 13. The first bracket 12 has a first region 121, and the second bracket 13 has a second region 131. The hard disk 51 is disposed in the first region 121 along a first direction A. The first region 121 and the second region 131 are connected in a second direction B to form an accommodating space 11. The liquid cooling part 2 is disposed in the second region 131. The first direction A is the insertion direction of the hard disk 51 relative to the accommodating space 11, and the second direction B is perpendicular to the first direction A.

[0057] Specifically, the support part 1 of this application includes a first bracket 12 and a second bracket 13 to provide support for the hard disk 51 and the liquid cooling part 2 respectively, so as to prevent the hard disk 51 from shifting or loosening during operation, and also to prevent the liquid cooling part 2 from shifting or loosening within the hard disk heat dissipation module 52 due to vibration caused by the cooling medium flowing through its liquid cooling channel, which would affect the contact between the liquid cooling part 2 and the target surface 51 of the hard disk 51 and affect the heat dissipation efficiency.

[0058] The first bracket 12 has a first region 121, and the second bracket 13 has a second region 131. The first region 121 and the second region 131 are connected in a second direction B perpendicular to the insertion direction of the hard disk 51 relative to the accommodating space 11 to form the accommodating space 11. Due to the connectivity of the first region 121 and the second region 131, the liquid cooling part 2 can directly contact the target surface 51 of the hard disk 51 in the second direction B, so that one side surface of the hard disk 51 in the second direction B can fully exchange heat with the liquid cooling part 2, thereby achieving efficient heat dissipation of the hard disk 51.

[0059] In this application, the first direction A is the insertion direction of the hard disk 51 relative to the accommodating space 11, and the second direction B is perpendicular to the first direction A. The second direction B can be, for example, as follows: Figures 1 to 3 The direction shown can be located on the left and right sides of the hard disk 51, or it can be located on the top and bottom sides of the hard disk 51. The specific direction is not limited, as long as the target surface 51 is parallel to the first direction. Considering that the structure of the hard disk 51 is usually a flat cuboid, the target surface 51 on one side of the hard disk 51 in the second direction B can be a large side surface of the hard disk 51 with a relatively large surface area, or it can be a small side surface of the hard disk 51 with a small surface area. The liquid cooling part 2 can be directly connected to the target surface 51 of the hard disk 51 on the corresponding side of the hard disk 51 in the second direction B. Alternatively, the liquid cooling part 2 can be set in an L-shape. In this case, the intersecting large and small side surfaces of the hard disk 51 can serve as the target surface 51 at the same time. The L-shaped liquid cooling part 2 can achieve direct contact with the large and small side surfaces of the hard disk 51 to carry out efficient heat conduction and exchange.

[0060] like Figure 4 and Figure 5 As shown, in some embodiments, the first connecting surface 21 of the liquid cooling section 2 is used to connect the target surface 51, and the first connecting surface 21 is parallel to the first direction A; the second connecting surface 22 of the liquid cooling section 2 is provided with a first liquid cooling inlet 221 and a first liquid cooling outlet 222 at intervals, the first liquid cooling inlet 221 and the first liquid cooling outlet 222 are respectively connected to the two ends of the liquid cooling flow channel to flow through the cooling medium; the second connecting surface 22 intersects with the first connecting surface 21.

[0061] Specifically, in this application, the first connecting surface 21 of the liquid cooling section 2 contacts the target surface 51 of the hard disk 51. The first connecting surface 21 is parallel to the first direction A, which is the insertion direction of the hard disk 51 relative to the accommodating space 11. This makes the target surface 51 of the hard disk 51 have a relatively large surface area. The target surface 51 with a large surface area is in direct contact with the first connecting surface 21, thereby increasing the heat exchange area between the hard disk 51 and the liquid cooling section 2. This also allows the heat to be more evenly distributed and conducted to the first connecting surface 21, thus enhancing the heat dissipation efficiency.

[0062] The second connecting surface 22 of the liquid cooling section 2 is provided with a first liquid cooling inlet 221 and a first liquid cooling outlet 222 at intervals. The second connecting surface 22 intersects with the first connecting surface 21 and is parallel to the thickness direction of the hard disk 51 after it is inserted into the first region 121. This facilitates a thinner and lighter design for the liquid cooling section 2, enabling a compact layout within the liquid-cooled hard disk 51 module and improving space utilization. Furthermore, the thinner and lighter design of the liquid cooling section 2 allows the liquid cooling channels within it to be arranged along the plane of the first direction A, simplifying the layout complexity of the liquid cooling channels. The first liquid cooling inlet 221 and the first liquid cooling outlet 222 are respectively connected to the two ends of the liquid cooling channels to allow the cooling medium to flow through, achieving circulation of the cooling medium within the liquid cooling section 2 to remove heat from the hard disk 51.

[0063] like Figure 4 and Figure 5 As shown, in some embodiments, the liquid cooling section 2 includes a first plate portion 23 and a second plate portion 24 connected along the second direction B. The side of the first plate portion 23 facing away from the second plate portion 24 is connected to the target surface 51. The liquid cooling channel is opened in the second plate portion 24. One end of the second plate portion 24 in the first direction A is recessed relative to the first plate portion 23 so that the liquid cooling section 2 is stepped. The second plate portion 24, the first plate portion 23 and the second bracket 13 enclose an insertion space 25. The first liquid cooling inlet 221 and the first liquid cooling outlet 222 are located in the insertion space 25.

[0064] Specifically, in order to optimize the space utilization within the hard disk heat dissipation module 52 and enable the first liquid cooling inlet 221 and the first liquid cooling outlet 222 of the liquid cooling section 2 to communicate with the liquid cooling inlet and outlet of the external device of the liquid cooling section 2 within the second area 131 of the second bracket 13, this application designs a stepped liquid cooling section 2. The liquid cooling section 2 includes a first plate section 23 and a second plate section 24 connected along the second direction B. The side of the first plate section 23 facing away from the second plate section 24 is connected to the target surface 51. The liquid cooling channel is opened in the second plate section 24. One end of the second plate section 24 in the first direction A is recessed relative to the first plate section 23 so that the liquid cooling section 2 is stepped. Since the first plate section 23 has a larger surface area relative to the second plate section 24 in the second direction B, it can make sufficient contact with the target surface 51 of the hard disk 51 for heat conduction with a larger surface area. The second plate 24, the first plate 23, and the second bracket 13 form a plug-in space 25. The first liquid cooling inlet 221 and the first liquid cooling outlet 222 protrude from the second connecting surface 22 of the second plate 24 and are located within the plug-in space 25. This allows the plug-in space 25 to be used in the server layout to connect the first liquid cooling inlet 221 and the first liquid cooling outlet 222 with the liquid cooling inlet and outlet of the external device of the liquid cooling section 2, thereby improving space utilization.

[0065] like Figures 6 to 8 As shown, in some embodiments, it further includes: a liquid-cooled backplate module 3, which is disposed on one side of the support portion 1 in the first direction A. The liquid-cooled backplate module 3 includes a substrate 31 and a first liquid distribution portion 32 and a second liquid distribution portion 33 disposed on one side of the substrate 31. The first liquid distribution portion 32 includes at least one second liquid cooling outlet 321 facing away from the substrate 31. The second liquid distribution portion 33 includes at least one second liquid cooling inlet 331 facing away from the substrate 31. The second liquid cooling outlet 321 and the first liquid cooling inlet 221 are adapted and connected in the insertion space 25. The second liquid cooling inlet 331 and the first liquid cooling outlet 222 are adapted and connected in the insertion space 25.

[0066] Specifically, in order to achieve the circulation supply and heat removal of the cooling medium in the liquid cooling section 2, this application provides a liquid cooling backplate module 3. The liquid cooling backplate module 3 is disposed on one side of the support section 1 in the first direction A. The liquid cooling backplate module 3 includes a substrate 31 and a first liquid distribution section 32 and a second liquid distribution section 33 disposed on one side of the substrate 31. The substrate 31 provides support for the first liquid distribution section 32 and the second liquid distribution section 33. Figure 7 As shown, multiple connection ports for connecting to the server motherboard can be provided on the side of the substrate 31 that is away from the first liquid distribution section 32 and the second liquid distribution section 33, so that the server motherboard can realize flow control of the first liquid distribution section 32 and the second liquid distribution section 33. Temperature sensors, pressure sensors, etc. can also be provided to detect the temperature and pressure parameters of the cooling medium in real time, so as to ensure the stable operation of the heat dissipation process of the hard disk 51.

[0067] The first liquid distribution section 32 includes at least one second liquid cooling outlet 321 facing away from the substrate 31, and the second liquid distribution section 33 includes at least one second liquid cooling inlet 331 facing away from the substrate 31. The second liquid cooling outlet 321 and the first liquid cooling inlet 221 are adapted and connected within the insertion space 25, and the second liquid cooling inlet 331 and the first liquid cooling outlet 222 are adapted and connected within the insertion space 25. The first liquid distribution section 32 and the second liquid distribution section 33 can provide a stable input and output path for the cooling medium. The second liquid cooling outlet 321 of the first liquid distribution section 32 distributes the cooling medium evenly to the first liquid cooling inlets 221 of each liquid cooling section 2. The second liquid cooling inlet 331 of the second liquid distribution section 33 collects the cooled medium after heat exchange flowing out from the first liquid cooling outlet 222 of the liquid cooling section 2, thereby achieving a uniform distribution of the cooling medium. This allows the liquid cooling sections 2 of multiple hard disk heat dissipation modules 52 to stably and evenly exchange and conduct heat to the hard disk 51, avoiding local hot spots that could affect the working performance of the hard disk 51 and the server. Furthermore, the insertion space 25 provides space for the connection between the second liquid cooling outlet 321 and the first liquid cooling inlet 221, and between the second liquid cooling inlet 331 and the first liquid cooling outlet 222, which also facilitates the positioning and installation by the operator.

[0068] The first liquid cooling inlet 221 and the second liquid cooling outlet 321 can be adapted blind-plug quick connectors, and the first liquid cooling outlet 222 and the second liquid cooling inlet 331 can be adapted blind-plug quick connectors. The blind-plug quick connectors allow users to quickly align and insert the first liquid cooling inlet 221 and the second liquid cooling outlet 321, and the first liquid cooling outlet 222 and the second liquid cooling inlet 331 within the insertion space 25, which facilitates installation and avoids operational errors.

[0069] like Figure 9 As shown, in some embodiments, a guide post 322 is provided on the first liquid distribution section 32 at a distance from the second liquid cooling outlet 321, and a guide cylinder 241 is provided on the side of the second plate section 24 facing the insertion space 25. The guide post 322 and the guide cylinder 241 are adapted to be connected within the insertion space 25.

[0070] Specifically, in order to achieve precise alignment between the liquid-cooled backplate module 3 and the liquid-cooled section 2, and to ensure accurate positioning and installation of the second liquid-cooled outlet 321 with the first liquid-cooled inlet 221 and the second liquid-cooled inlet 331 with the first liquid-cooled outlet 222, this application provides a guide post 322 on the first liquid distribution section 32 at intervals from the second liquid-cooled outlet 321, and a guide cylinder 241 on the side of the second plate section 24 facing the insertion space 25. The guide post 322 and the guide cylinder 241 are adapted to each other within the insertion space 25, so as to provide guidance for the installation between the liquid-cooled backplate module 3 and the liquid-cooled section 2 by utilizing the adapted connection between the guide post 322 and the guide cylinder 241. As the guide post 322 is inserted into the guide cylinder 241, the second liquid-cooled outlet 321 with the first liquid-cooled inlet 221 and the second liquid-cooled inlet 331 with the first liquid-cooled outlet 222 are automatically aligned, thereby improving installation accuracy. Meanwhile, the fitting connection between the guide post 322 and the guide cylinder 241 ensures a stable connection between the liquid cooling backplate module 3 and the liquid cooling part 2, provides a connection fulcrum to prevent the two from shifting or loosening, and improves the overall stability of the hard drive heat dissipation module 52 structure.

[0071] like Figure 10 As shown, in some embodiments, it also includes: a housing 4, which includes a housing body 41 and a fastener 42. The housing body 41 is fixedly connected to the support part 1, and one end of the fastener 42 is fixedly connected to the housing body 41, while the other end is fastened to the base plate 31.

[0072] Specifically, in order to improve the overall stability and safety of the hard disk heat dissipation module 52, the hard disk heat dissipation module 52 of this application also includes a housing 4. The housing 4 includes a housing body 41, which is fixedly connected to the support part 1. The housing 4 can be wrapped around the outside of the support part 1 to provide protection for the support part 1 and the hard disk 51, liquid cooling part 2 and other components housed inside it. It can also prevent dust, contaminants and other pollutants from entering the hard disk heat dissipation module 52, thereby extending the service life of the hard disk heat dissipation module 52 and the hard disk 51.

[0073] Furthermore, in order to achieve a stable connection between the liquid cooling backplate module 3 and the support part 1 and the liquid cooling part 2, and to ensure a stable circulation and delivery of the cooling medium, the housing 4 of this application also includes a fastener 42. One end of the fastener 42 is fixedly connected to the housing body 41, and the other end is engaged with the base plate 31 to achieve a stable connection between the housing body 41 and the base plate 31 of the liquid cooling backplate module 3, thereby ensuring a stable connection between the liquid cooling backplate module 3 and the liquid cooling part 2. The fastener 42 provides a locking force to prevent loosening between the second liquid cooling outlet 321 and the first liquid cooling inlet 221, and between the second liquid cooling inlet 331 and the first liquid cooling outlet 222, thus ensuring a stable circulation and delivery of the cooling medium and improving the overall stability and safety of the hard drive heat dissipation module 52 structure.

[0074] like Figures 11 to 13As shown, in some embodiments, the liquid cooling section 2 further includes a third plate section 26, which is connected between the first plate section 23 and the target surface 51, and / or the third plate section 26 is connected to the side of the hard disk 51 opposite to the first plate section 23.

[0075] Specifically, in order to improve the heat conduction and exchange efficiency between the hard disk 51 and the liquid cooling section 2, the liquid cooling section 2 of this application also includes a third plate section 26. The third plate section 26 can be elastic to compensate for the dimensional tolerance between the target surface 51 of the hard disk 51 and the first plate section 23 of the liquid cooling section 2. The elastic deformation of the third plate section 26 itself fills the gap between the two due to the dimensional tolerance, thereby ensuring the effective area for heat exchange, so that heat can be fully transferred between the target surface 51 and the first plate section 23, and enhancing the heat dissipation efficiency.

[0076] The third plate 26 can be made of a flexible material with good thermal conductivity, such as a high thermal conductivity silicone pad, graphite sheet, flexible metal composite material, or nano-carbon fiber plate, etc., with no specific limitations.

[0077] In one embodiment of this application, such as Figure 11 As shown, within the accommodating space 11, the liquid cooling section 2 is disposed on one side of the hard disk 51 in the second direction B. The third plate section 26 is connected between the first plate section 23 and the target surface 51 to compensate for the dimensional tolerance between the target surface 51 of the hard disk 51 and the first plate section 23 of the liquid cooling section 2. In another embodiment, while the third plate section 26 is connected between the first plate section 23 and the target surface 51, the third plate section 26 can also be connected to the side of the hard disk 51 away from the first plate section 23. Thus, when there are multiple hard disks 51 installed side by side, in parallel, or in multiple rows and columns, the third plate section 26 located on the side of a hard disk 51 away from the first plate section 23 can contact the side of the liquid cooling section 2 connected to the target surface 51 of the adjacent hard disk 51 away from the hard disk 51. This allows for the reuse of the liquid cooling section 2 between adjacent hard disks 51 while the third plate section 26 compensates for the dimensional tolerance between the liquid cooling section 2 and the hard disk 51. The third plate section 26 also serves as a medium for heat conduction and exchange, improving heat dissipation efficiency.

[0078] In another embodiment of this application, such as Figure 12 and Figure 13 As shown, the liquid cooling units 2 are respectively disposed on both sides of the hard disk 51 in the second direction B. In this embodiment, there are two third plate units 26 to compensate for the gap between the hard disk 51 and the liquid cooling units 2 on both sides, thereby improving the stability of heat dissipation.

[0079] Example 2

[0080] like Figure 14As shown, a second aspect of this application provides a server 5, including at least one hard disk 51 and a hard disk heat dissipation module 52. The hard disk 51 is disposed within the hard disk heat dissipation module 52. The hard disk heat dissipation module 52 includes a support portion 1 and a liquid cooling portion 2. The support portion 1 has an accommodating space 11 for accommodating the hard disk 51. The liquid cooling portion 2 is disposed within the accommodating space 11 to connect to the target surface 51 of the hard disk 51. The liquid cooling portion 2 has a liquid cooling channel for flowing a cooling medium to dissipate heat from the hard disk 51.

[0081] For the specific structure of the hard drive heat dissipation module 52, please refer to Embodiment 1, which will not be repeated here.

[0082] The server 5 provided in this application can be configured with the number of hard disks 51 and hard disk heat dissipation modules 52 as needed. The placement of the hard disks 51 is not limited. When there are multiple hard disks 51, the multiple hard disks 51 and hard disk heat dissipation modules 52 can be installed horizontally side by side, vertically side by side, or arranged in a matrix of multiple rows and columns within the server 5. The specific arrangement is not limited and can be adjusted according to the needs of the server 5.

[0083] The hard drive 51 is correspondingly set in the hard drive heat dissipation module 52. The hard drive heat dissipation module 52 can provide one or more liquid cooling parts 2 for one hard drive 51 to directly contact one or more target surfaces 51 of the hard drive 51. The specific parts are not limited, as long as they meet the high-efficiency heat dissipation requirements of the hard drive 51.

[0084] A second aspect of this application provides a server 5, including at least one hard disk 51 and a hard disk cooling module 52. The hard disk 51 is disposed within the hard disk cooling module 52. The hard disk cooling module 52 includes a support portion 1 and a liquid cooling portion 2. The support portion 1 has a receiving space 11 for accommodating the hard disk 51. The liquid cooling portion 2 is disposed within the receiving space 11 to connect to the target surface 51 of the hard disk 51. The liquid cooling portion 2 has liquid cooling channels through which a cooling medium flows to dissipate heat from the hard disk 51. The hard disk cooling module 52 provided by this application accommodates the liquid cooling portion 2 and the hard disk 51 in the same space via the support portion 1, allowing the liquid cooling portion 2 to directly contact the target surface 51 of the hard disk 51 for efficient heat transfer. The cooling medium in the liquid cooling channels of the liquid cooling portion 2 can remove the heat generated by the hard disk 51, achieving efficient heat dissipation for the hard disk 51 and ensuring the performance and stability of the hard disk 51 and the server 5.

[0085] like Figure 14 As shown, in some embodiments, it further includes: an air-cooled module 53; and a hard disk heat dissipation module 52 correspondingly disposed on the air outlet side 531 of the air-cooled module 53.

[0086] Specifically, to further improve the heat dissipation effect of the hard drive 51, the server 5 of this application is also equipped with an air-cooling module 53. The hard drive heat dissipation module 52 is correspondingly arranged on the air outlet side 531 of the air-cooling module 53, so that the air-cooling module 53 can use a fan to blow cool air onto the hard drive 51 module, thereby providing a dual cooling effect of liquid cooling and air cooling for the hard drive 51, achieving efficient heat dissipation of the hard drive 51, ensuring the performance and safety stability of the hard drive 51 and the server 5, and extending its service life. Furthermore, the combined liquid cooling and air cooling method can reduce the overall power consumption of the liquid cooling part 2 in the hard drive heat dissipation module 52 and the fan in the air-cooling module 53, improve the energy efficiency ratio of heat dissipation within the server 5, and save energy.

[0087] In some embodiments, the hard disk heat dissipation module 52 provided in this application occupies two slots of a traditional air-cooled hard disk for the support part and liquid cooling part of a hard disk. The air-cooling module 53 and the hard disk heat dissipation module 52 provided in the server 5 are compatible within the server 5 chassis, which facilitates user upgrades.

[0088] The embodiments of this disclosure have now been described in detail. To avoid obscuring the concept of this disclosure, some details known in the art have not been described. Those skilled in the art can fully understand how to implement the technical solutions disclosed herein based on the above description.

[0089] While specific embodiments of this disclosure have been described in detail by way of examples, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of this disclosure. Those skilled in the art should understand that modifications can be made to the above embodiments or equivalent substitutions can be made to some technical features without departing from the scope and spirit of this disclosure. In particular, as long as there is no structural conflict, the technical features mentioned in the various embodiments can be combined in any manner.

Claims

1. A hard disk heat dissipation module, characterized in that, include: A support portion having a receiving space for accommodating a hard disk; A liquid cooling section is disposed within the accommodating space to connect to the target surface of the hard disk. The liquid cooling section has liquid cooling channels for flowing cooling medium to dissipate heat from the hard disk.

2. The hard drive heat dissipation module according to claim 1, characterized in that, The support includes a first bracket and a second bracket. The first bracket has a first region, and the second bracket has a second region. The hard disk is disposed in the first region along a first direction. The first region and the second region are connected in a second direction to form the accommodating space. The liquid cooling part is disposed in the second region. The first direction is the insertion direction of the hard disk relative to the accommodating space, and the second direction is perpendicular to the first direction.

3. The hard drive heat dissipation module according to claim 2, characterized in that, The first connecting surface of the liquid cooling section is used to connect to the target surface, and the first connecting surface is parallel to the first direction; the second connecting surface of the liquid cooling section is provided with a first liquid cooling inlet and a first liquid cooling outlet at intervals, and the first liquid cooling inlet and the first liquid cooling outlet are respectively connected to the two ends of the liquid cooling flow channel to flow through the cooling medium; the second connecting surface intersects with the first connecting surface.

4. The hard drive heat dissipation module according to claim 3, characterized in that, The liquid cooling section includes a first plate and a second plate connected along the second direction. The side of the first plate away from the second plate is connected to the target surface. The liquid cooling channel is opened in the second plate. One end of the second plate in the first direction is recessed relative to the first plate to make the liquid cooling section step-shaped. The second plate, the first plate, and the second bracket form an insertion space. The first liquid cooling inlet and the first liquid cooling outlet are located in the insertion space.

5. The hard disk cooling module of claim 4, wherein, Also includes: A liquid-cooled backplate module is disposed on one side of the support portion in the first direction. The liquid-cooled backplate module includes a substrate and a first liquid distribution portion and a second liquid distribution portion disposed on one side of the substrate. The first liquid distribution portion includes at least one second liquid-cooled outlet facing away from the substrate, and the second liquid distribution portion includes at least one second liquid-cooled inlet facing away from the substrate. The second liquid-cooled outlet and the first liquid-cooled inlet are adapted and connected within the insertion space, and the second liquid-cooled inlet and the first liquid-cooled outlet are adapted and connected within the insertion space.

6. The hard drive heat dissipation module according to claim 5, characterized in that, A guide post is provided on the first liquid distribution section at a distance from the second liquid cooling outlet, and a guide cylinder is provided on the side of the second plate facing the insertion space. The guide post and the guide cylinder are adapted to be connected within the insertion space.

7. The hard disk cooling module of claim 5, wherein the hard disk cooling module further comprises a fan. Also includes: The housing includes a housing body and a fastener. The housing body is fixedly connected to the support portion. One end of the fastener is fixedly connected to the housing body, and the other end is fastened to the base plate.

8. The hard drive heat dissipation module according to claim 4, characterized in that, The liquid cooling section further includes a third plate, which is connected between the first plate and the target surface, and / or the third plate is connected to the side of the hard disk away from the first plate.

9. A server, characterized by include: At least one hard drive; A hard drive cooling module, wherein the hard drive is disposed within the hard drive cooling module, and the hard drive cooling module comprises: A support portion having a receiving space for accommodating a hard disk; A liquid cooling section is disposed within the accommodating space to connect to the target surface of the hard disk. The liquid cooling section has liquid cooling channels for flowing cooling medium to dissipate heat from the hard disk.

10. The server of claim 9, wherein, Also includes: Air-cooled module; The hard drive heat dissipation module is correspondingly located on the air outlet side of the air-cooling module.

Images