Power module assembly and battery production equipment

Abstract

This application relates to the field of battery manufacturing technology and discloses a power module assembly and battery manufacturing equipment, including: a liquid cooling plate, a first power module, and a second power module. The liquid cooling plate includes a liquid cooling channel, a first cooling surface, and a second cooling surface that are thermally connected to each other. The first cooling surface and the second cooling surface are arranged opposite to each other along a first direction. The liquid cooling channel is located inside the liquid cooling plate and is used to connect to a coolant circulation pipeline. The first power module is thermally connected to the first cooling surface. The second power module is arranged opposite to the first power module along the first direction and is thermally connected to the second cooling surface. In this application, the first power module and the second power module are cooled by a liquid cooling plate. Compared with the heat dissipation mode of room temperature air cooling, this method not only has better heat dissipation effect and lower noise, but also allows each liquid cooling plate to cool two power modules, making fuller use of the liquid cooling plate and improving cooling efficiency.

Description

Technical Field

[0001] This application relates to the field of battery manufacturing technology, and in particular to a power module assembly and battery manufacturing equipment. Background Technology

[0002] In the battery manufacturing process, formation and capacity testing are two very important processes, both of which affect the quality of the battery. These two processes can be completed by battery formation and capacity testing equipment, which generally includes power modules.

[0003] Currently, most battery formation and capacity testing equipment uses ambient temperature air cooling, typically placing the fan below the power module to blow air or above the power module to draw air in, with cool air entering from the side of the equipment. However, ambient temperature air cooling is not only noisy but also has poor heat dissipation. Utility Model Content

[0004] This application discloses a power module assembly that can cool a first power module and a second power module using a liquid cooling plate. Compared with the ambient temperature air cooling mode, it not only has better heat dissipation effect and lower noise, but also each liquid cooling plate can cool two power modules, which can make fuller use of the liquid cooling plate and improve cooling efficiency.

[0005] To achieve the above objectives, according to the first aspect disclosed in this application, a power module assembly is provided, comprising: a liquid cooling plate, the liquid cooling plate including a liquid cooling channel, a first cooling surface and a second cooling surface that are thermally connected to each other, the first cooling surface and the second cooling surface being disposed opposite to each other along a first direction, the liquid cooling channel being located inside the liquid cooling plate, and the liquid cooling channel being used to connect a coolant circulation pipeline;

[0006] A first power module, wherein the first power module is thermally connected to the first cooling surface;

[0007] The second power module is disposed opposite to the first power module along the first direction and is thermally connected to the second cooling surface.

[0008] As an optional implementation, the first power module includes:

[0009] The first positive busbar includes a first electrical connection portion and a first heat dissipation portion;

[0010] The first negative busbar includes a second electrical connection portion and a second heat dissipation portion;

[0011] In this configuration, both the first heat dissipation part and the second heat dissipation part of the first power module are thermally connected to the first cooling surface, and there is a first separation gap between the first heat dissipation part and the second heat dissipation part.

[0012] As an optional implementation, the second power module includes:

[0013] The second positive bus includes a third electrical connection portion and a third heat dissipation portion;

[0014] The second negative busbar includes a fourth electrical connection portion and a fourth heat dissipation portion;

[0015] Both the third heat dissipation part and the fourth heat dissipation part are thermally connected to the second cooling surface, and there is a second separation gap between the third heat dissipation part and the fourth heat dissipation part.

[0016] As an optional implementation, the first heat dissipation part and the second heat dissipation part are located in the same plane and laid on the first cooling surface;

[0017] The third heat dissipation section and the fourth heat dissipation section are located in the same plane and laid on the second cooling surface.

[0018] As an optional implementation, the first heat dissipation part and the second heat dissipation part are jointly laid on the entire first cooling surface;

[0019] The third and fourth heat dissipation sections are laid together on the entire second cooling surface.

[0020] As an optional implementation, the area of ​​the first heat dissipation part laid on the cooling surface is smaller than the area of ​​the second heat dissipation part laid on the cooling surface;

[0021] The area of ​​the third heat dissipation part laid on the cooling surface is smaller than the area of ​​the fourth heat dissipation part laid on the cooling surface.

[0022] As an optional implementation, a first thermally conductive adhesive layer is provided on the first cooling surface, and both the first heat dissipation part and the second heat dissipation part are adhered to the first thermally conductive adhesive layer;

[0023] A second thermally conductive adhesive layer is provided on the second cooling surface, and the third heat dissipation part and the fourth heat dissipation part are both adhered to the second thermally conductive adhesive layer.

[0024] As an optional implementation, the liquid cooling plate includes a plate body, the plate body having a first pipe, a second pipe, a third pipe, and adjacent first and second side surfaces, one end of the first pipe being located on the first side surface and the other end being located inside the plate body, one end of the second pipe being located on the second side surface and the other end being connected to the periphery of the first pipe, and one end of the third pipe being located on the second side surface and the other end being connected to the periphery of the first pipe.

[0025] The first pipe has a plug at one end on the first side, and the second pipe, the third pipe, and the first pipe located between the second pipe and the third pipe together form a liquid cooling channel.

[0026] As an optional implementation, both the first power module and the second power module include:

[0027] A first circuit board, the first circuit board being used to connect an external power supply device;

[0028] The second circuit board and the first circuit board are arranged at intervals along a first direction. The voltage of the second circuit board is lower than that of the first circuit board. The second circuit board is used to supply power to the probe assembly.

[0029] A transformer is disposed on and electrically connected to the second circuit board, and the transformer is also electrically connected to the first circuit board;

[0030] A connecting circuit board is electrically connected to the first circuit board and the second circuit board respectively. The connecting circuit board includes a first edge and a second edge disposed opposite to each other. The first edge is connected to the first circuit board, and the second edge is connected to the second circuit board to support the first circuit board and the second circuit board in the first direction.

[0031] As an optional implementation, the second circuit board of the first power module is disposed adjacent to the liquid cooling plate; and / or,

[0032] The second circuit board of the second power module is positioned adjacent to the liquid cooling plate.

[0033] According to an embodiment of the second aspect of this application, a battery production apparatus is provided, comprising: a plurality of the aforementioned power module groups.

[0034] As an optional implementation, the plurality of power module groups are arranged at intervals along the first direction.

[0035] Compared with the prior art, the beneficial effects of this application are:

[0036] The power module assembly provided in this application embodiment can cool the first power module and the second power module through a liquid cooling plate. Compared with the normal temperature air cooling mode, it not only has a better heat dissipation effect but also lower noise. Moreover, the first power module is thermally connected to the first cooling surface of the liquid cooling plate, and the second power module is thermally connected to the second cooling surface, so that each liquid cooling plate can cool two power modules, making fuller use of the liquid cooling plate and improving cooling efficiency. Attached Figure Description

[0037] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0038] Figure 1 This is a schematic diagram of the power module group disclosed in the embodiments of this application;

[0039] Figure 2 This is a schematic diagram of the structure of the liquid cooling plate disclosed in the embodiments of this application;

[0040] Figure 3 This is an exploded view of the power module assembly disclosed in an embodiment of this application;

[0041] Figure 4 The embodiments disclosed in this application Figure 3 Enlarged structural diagram at point A;

[0042] Figure 5 One of the structural schematic diagrams of the first power module or the second power module provided in the embodiments of this application;

[0043] Figure 6 A second schematic diagram of the structure of the first or second power module provided in the embodiments of this application;

[0044] Figure 7 A third schematic diagram of the structure of the first power module or the second power module provided in the embodiments of this application;

[0045] Figure 8 Fourth schematic diagram of the structure of the first power module or the second power module provided in the embodiments of this application;

[0046] Figure 9 This is a schematic diagram of the structure of the first circuit board provided in an embodiment of this application;

[0047] Figure 10 This is a schematic diagram of the structure of the second circuit board provided in an embodiment of this application;

[0048] Figure 11 This is a schematic diagram of the connector provided in an embodiment of this application.

[0049] Explanation of reference numerals in the attached figures:

[0050] 100-Liquid cooling plate; 11-Liquid cooling channel; 12-Plate body; 121-First cooling surface; 1211-First thermally conductive adhesive layer; 122-Second cooling surface; 1221-Second thermally conductive adhesive layer; 123-First side; 124-Second side; 125-First pipe; 126-Second pipe; 127-Third pipe; 128-Plug; 200-First power module; 21-First positive busbar; 211-First electrical connection; 212-First heat dissipation part; 22-First negative busbar; 221-Second electrical connection part; 222-Second heat dissipation part; 23-First separation gap; 300-Second power module; 31-First... 311-Second positive busbar; 312-Third electrical connection; 32-Second heat dissipation; 321-Second negative busbar; 322-Fourth electrical connection; 323-Fourth heat dissipation; 33-Second separation gap; 4-First circuit board; 41-Second snap-fit ​​part; 5-Second circuit board; 51-Third edge; 52-Fourth edge; 53-First snap-fit ​​part; 6-Connecting circuit board; 61-First edge; 62-Second edge; 71-First connecting component; 72-Second connecting component; 8-Connector; 81-First snap-fit ​​slot; 82-Second snap-fit ​​slot; 83-Third snap-fit ​​slot; 84-Fourth snap-fit ​​slot; 9-Transformer; 91-Conductive lead. Detailed Implementation

[0051] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0052] In this application, the terms "upper," "lower," "top," "bottom," "inner," "vertical," and "horizontal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0053] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0054] Furthermore, the terms "set up," "equipped with," and "connected" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0055] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, elements, or components (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, elements, or components. Unless otherwise stated, "a plurality of" means two or more.

[0056] In the battery manufacturing process, formation and capacity testing are two very important processes, both of which affect the quality of the battery. These two processes can be completed by battery formation and capacity testing equipment. Generally, battery formation and capacity testing equipment includes a power module and a probe assembly. The power module can supply power to the probe assembly.

[0057] Battery formation and capacity testing equipment can use ambient temperature air cooling. The fan is placed below the power module to blow air or above the power module to draw air in. Cold air enters from the side of the equipment to dissipate heat from the power module and prevent the power module from overheating, so that the power module can be in good working condition. However, ambient temperature air cooling is not only noisy, but also has poor heat dissipation effect and low heat dissipation efficiency.

[0058] Based on this, the embodiments of this application provide a power module group that can cool the first power module and the second power module through a liquid cooling plate. Compared with the normal temperature air cooling mode, it not only has a better heat dissipation effect and lower noise, but also each liquid cooling plate can cool two power modules, which can make fuller use of the liquid cooling plate and improve cooling efficiency.

[0059] The technical solution of this application will be further described below with reference to the embodiments and accompanying drawings.

[0060] Please see Figure 1 , Figure 1This is a schematic diagram of the power module assembly disclosed in an embodiment of this application. The embodiment of this application discloses a power module assembly, including: a liquid cooling plate 100, a first power module 200, and a second power module 300. The liquid cooling plate 100 includes a liquid cooling channel 11, a first cooling surface 121, and a second cooling surface 122 that are thermally connected to each other. The first cooling surface 121 and the second cooling surface 122 are arranged opposite to each other along a first direction. The liquid cooling channel 11 is located inside the liquid cooling plate 100 and is used to connect to a coolant circulation pipeline. The first power module 200 is thermally connected to the first cooling surface 121. The second power module 300 is arranged opposite to the first power module 200 along the first direction and is thermally connected to the second cooling surface 122.

[0061] Specifically, the liquid cooling plate 100 is a component used for heat dissipation. The liquid cooling plate 100 may include a housing, within which a liquid cooling channel 11 is provided. The liquid cooling channel 11 may consist of multiple water channels and can be connected to a coolant circulation pipeline. The coolant circulation pipeline may contain components such as a water pump, water tank, and condenser, forming a complete heat dissipation system. This system pumps coolant to the liquid cooling channel 11, where heat exchange occurs, and the coolant carrying away heat is pumped to the condenser, where it releases heat to the external environment. The two side surfaces of the liquid cooling plate 100 along a first direction are a first cooling surface 121 and a second cooling surface 122, respectively. The liquid cooling channel 11 within the liquid cooling plate 100 can directly contact the first cooling surface 121 and the second cooling surface 122 to achieve thermal conductivity. Alternatively, the liquid cooling plate 100 can be a single unit made of a thermally conductive material, with the liquid cooling channel 11 formed by openings within the liquid cooling plate 100, enabling high-efficiency heat exchange directly with the first cooling surface 121 and the second cooling surface 122. The liquid cooling plate 100 can be made of thermally conductive metals, such as copper, aluminum, and stainless steel. The coolant can be water.

[0062] The liquid cooling plate 100 can be a plate 12. The first direction can be the thickness direction of the liquid cooling plate 100. The first cooling surface 121 and the second cooling surface 122 are two surfaces of the liquid cooling plate 100 with large areas and opposite each other along the first direction. The heat exchange efficiency between the first power module 200 and the liquid cooling plate 100 can be improved by contacting the first cooling surface 121 with a large area and the first power module 200. The heat exchange efficiency between the second power module 300 and the liquid cooling plate 100 can be improved by contacting the second cooling surface 122 with a large area and the second power module 300.

[0063] Each power module group can be equipped with one liquid cooling plate 100 and two power modules. The two power modules are thermally connected to two cooling surfaces of the liquid cooling plate 100, namely the first cooling surface 121 and the second cooling surface 122. The two power modules are respectively the first power module 200 and the second power module 300. This arrangement allows one liquid cooling plate 100 to cool two power modules simultaneously, with heat exchange between each side of the liquid cooling plate 100 and one power module. Compared to setting only one power module on one side of the liquid cooling plate 100, the cooling function of the liquid cooling plate 100 can be more fully utilized. Setting two power modules on one side of the liquid cooling plate 100 avoids increasing the volume of the liquid cooling plate 100. Compared to setting multiple power modules on both sides of the liquid cooling plate 100, it avoids heat interference between power modules on the same side. It also avoids the coolant in the liquid cooling channel 11 of the cooling plate cooling one power module first and then cooling the second and third power modules, which would result in different heat dissipation effects on each power module and different temperatures among them. In particular, there is a large temperature difference between the first and last power module cooled, which affects the consistency of the working state of each power module.

[0064] In this embodiment, the first power module 200 is thermally connected to the first surface of the liquid cooling plate 100, and the second power module 300 is thermally connected to the second surface of the liquid cooling plate 100. The liquid cooling plate 100 may also have multiple sides between the first and second surfaces. The inlet and outlet of the liquid cooling channel 11 may be located on one of these sides, or on two of these sides respectively. While the coolant flows in the liquid cooling channel 11, it can simultaneously make thermal connections with the first and second surfaces opposite each other in the first direction, thereby carrying away the heat from the first power module 200 and the second power module 300. This ensures that the cooling effect on the first power module 200 and the second power module 300 is basically the same. Moreover, since the first power module 200 and the second power module 300 are arranged opposite each other on both sides of the liquid cooling plate 100 along the first direction, the mutual influence of the heat generated between the first power module 200 and the second power module 300 is small, which can ensure the consistency of the working state of the first power module 200 and the second power module 300 as much as possible.

[0065] According to the power module assembly of this utility model embodiment, the first power module 200 and the second power module 300 can be cooled by the liquid cooling plate 100. Compared with the normal temperature air cooling mode, it not only has a better heat dissipation effect, but also has less noise. Moreover, the first power module 200 is thermally connected to the first cooling surface 121 of the liquid cooling plate 100, and the second power module 300 is thermally connected to the second cooling surface 122, so that each liquid cooling plate 100 can cool two power modules, which can make fuller use of the liquid cooling plate 100 and improve the cooling efficiency.

[0066] Combination Figure 1 and Figure 3 , Figure 3 This is an exploded view of the power module assembly disclosed in an embodiment of this application. In some embodiments, the first power module 200 includes: a first positive bus 21 and a first negative bus 22, the positive bus including a first electrical connection portion 211 and a first heat dissipation portion 212; the negative bus including a second electrical connection portion 221 and a second heat dissipation portion 222;

[0067] The first heat dissipation part 212 and the second heat dissipation part 222 of the first power module 200 are both thermally connected to the first cooling surface 121, and there is a first separation gap 23 between the first heat dissipation part 212 and the second heat dissipation part 222.

[0068] Specifically, the first positive bus 21 and the first negative bus 22 can be copper busbars. These copper busbars are long conductors made of copper with a rectangular or chamfered rectangular cross-section. Both the first positive bus 21 and the first negative bus 22 have good electrical and thermal conductivity, meeting the electrical connection requirements between the power module and other components. In the first positive bus 21 proposed in this embodiment, the first electrical connection part 211 is used to electrically connect other components, and the first heat dissipation part 212 is thermally connected to the first cooling surface 121, allowing for heat dissipation through the liquid cooling plate 100. In the second negative bus 32, the second electrical connection part 221 is used to electrically connect other components, and the second heat dissipation part 222 is thermally connected to the first cooling surface 121, also allowing for heat dissipation through the liquid cooling plate 100. A first separation gap 23 is provided between the first heat dissipation part 212 and the second heat dissipation part 222 to prevent the first positive bus 21 and the first negative bus 22 from contacting each other and causing a short circuit.

[0069] When the first power module 200 is working, the first positive busbar 21 and the first negative busbar 22 have low voltage and high current, which will generate a lot of heat. That is, the first positive busbar 21 and the first negative busbar 22 are the main heat sources of the first power module 200. In this embodiment, when the first power module 200 is cooled by the liquid cooling plate 100, the first positive busbar 21 and the first negative busbar 22, which are the main heat sources, are directly thermally connected to the first cooling surface 121. This allows the heat generated by the first positive busbar 21 and the first negative busbar 22 to be directly carried away by the liquid cooling plate 100, instead of being transferred to other parts of the first power module 200 and then coming into contact with the liquid cooling plate 100. This can greatly improve the cooling efficiency of the liquid cooling plate 100 for the first power module 200.

[0070] Union Figure 1 , Figure 3 and Figure 4 , Figure 4 The embodiments disclosed in this application Figure 3 An enlarged structural schematic diagram at point A. In some embodiments, the second power module 300 includes: a second positive bus 31 and a second negative bus 32. The second positive bus 31 includes a third electrical connection portion 311 and a third heat dissipation portion 312, and the negative bus includes a fourth electrical connection portion 321 and a fourth heat dissipation portion 322. The third heat dissipation portion 312 and the fourth heat dissipation portion 322 are both thermally connected to the second cooling surface 122, and a second separation gap 33 exists between the third heat dissipation portion 312 and the fourth heat dissipation portion 322.

[0071] Specifically, the second positive busbar 31 and the second negative busbar 32 can be copper busbars. These copper busbars are long conductors made of copper with a rectangular or chamfered rectangular cross-section. Both the second positive busbar 31 and the second negative busbar 32 have good electrical and thermal conductivity, meeting the electrical connection requirements between the power module and other components. In the second positive busbar 31 proposed in this embodiment, the second electrical connection part 221 is used to electrically connect other components, and the second heat dissipation part 222 is thermally connected to the second cooling surface 122, allowing for heat dissipation through the liquid cooling plate 100. Similarly, in the second negative busbar 32, the second electrical connection part 221 is used to electrically connect other components, and the second heat dissipation part 222 is thermally connected to the second cooling surface 122, also allowing for heat dissipation through the liquid cooling plate 100. A second separation gap 33 is provided between the second heat dissipation parts 222 to prevent the second positive busbar 31 and the second negative busbar 32 from contacting and causing a short circuit.

[0072] When the second power module 300 is working, the second positive busbar 31 and the second negative busbar 32 have low voltage and high current, which will generate a lot of heat. That is, the second positive busbar 31 and the second negative busbar 32 are the main heat sources of the second power module 300. In this embodiment, when the second power module 300 is cooled by the liquid cooling plate 100, the second positive busbar 31 and the second negative busbar 32, which are the main heat sources, are directly thermally connected to the second cooling surface 122. This allows the heat generated by the second positive busbar 31 and the second negative busbar 32 to be directly carried away by the liquid cooling plate 100, instead of being transferred to other parts of the second power module 300 and then coming into contact with the liquid cooling plate 100. This can greatly improve the cooling efficiency of the liquid cooling plate 100 for the second power module 300.

[0073] Union Figure 1 In some embodiments, the first heat dissipation part 212 and the second heat dissipation part 222 are located on the same plane and are laid on the first cooling surface 121; the third heat dissipation part 312 and the fourth heat dissipation part 322 are located on the same plane and are laid on the second cooling surface 122.

[0074] Specifically, the first heat dissipation part 212 and the second heat dissipation part 222 are located on the same plane, which allows for better contact with the first cooling surface 121. By having the first heat dissipation part 212 and the second heat dissipation part 222 contact the first cooling surface 121 together, and achieving surface-to-surface contact, the contact area can be increased. This effectively dissipates heat from the first positive busbar 21 and the first negative busbar 22 through the liquid cooling plate 100, thereby quickly removing most of the heat from the first power module and achieving cooling of the first power module 200. Similarly, the third heat dissipation part 312 and the fourth heat dissipation part 322 are located on the same plane, which allows for better contact with the second cooling surface 122. By having the third heat dissipation part 312 and the fourth heat dissipation part 322 contact the second cooling surface 122 together, and achieving surface-to-surface contact, the contact area can be increased. This effectively dissipates heat from the second positive busbar 31 and the second negative busbar 32 through the liquid cooling plate 100, thereby quickly removing most of the heat from the second power module and achieving cooling of the second power module 300.

[0075] Union Figure 1 In some embodiments, the first heat dissipation part 212 and the second heat dissipation part 222 are jointly laid on the entire first cooling surface 121; the third heat dissipation part 312 and the fourth heat dissipation part 322 are jointly laid on the entire second cooling surface 122.

[0076] Specifically, the first heat dissipation part 212 and the second heat dissipation part 222 are laid on the first cooling surface 121 and cover the entire first cooling surface 121, which can significantly increase the contact area, so that the entire first cooling surface 121 is in contact with the first heat dissipation part 212 or the second heat dissipation part 222, thereby increasing the overall contact area between the first heat dissipation part 212 and the second heat dissipation part 222 and the first cooling surface 121, thereby further improving the cooling effect of the liquid cooling plate 100 on the first power module 200; the third heat dissipation part 312 and the fourth heat dissipation part 322 are laid on the second cooling surface 122 and cover the entire second cooling surface 122, which can significantly increase the contact area, so that the entire second cooling surface 122 is in contact with the third heat dissipation part 312 or the fourth heat dissipation part 322, thereby increasing the overall contact area between the third heat dissipation part 312 and the fourth heat dissipation part 322 and the second cooling surface 122, thereby further improving the cooling effect of the liquid cooling plate 100 on the second power module 300.

[0077] Union Figure 3 and Figure 4 In some embodiments, the area of ​​the first heat dissipation part 212 laid on the cooling surface is smaller than the area of ​​the second heat dissipation part 222 laid on the cooling surface; the area of ​​the third heat dissipation part 312 laid on the cooling surface is smaller than the area of ​​the fourth heat dissipation part 322 laid on the cooling surface.

[0078] Specifically, the width of the first heat dissipation part 212 can be the same as the width of the first electrical connection part 211. Then, the width of the second heat dissipation part 222 is greater than the width of the second electrical connection part 221 and the same as the width of the first cooling surface 121. The second heat dissipation part 222 partially wraps around the first heat dissipation part 212 on the first cooling surface 121, realizing a structure in which the first heat dissipation part 212 and the second heat dissipation part 222 are in full contact with the first cooling surface 121. A first separation gap 23 is reserved between the two to avoid direct contact. The width of the third heat dissipation part 312 can be the same as the width of the third electrical connection part 311. Then, the width of the fourth heat dissipation part 322 is greater than the width of the fourth electrical connection part 321 and the same as the width of the second cooling surface 122. The fourth heat dissipation part 322 partially wraps around the third heat dissipation part 312 on the second cooling surface 122, realizing a structure in which the third heat dissipation part 312 and the fourth heat dissipation part 322 are in full contact with the second cooling surface 122. A second separation gap 33 is reserved between the two to avoid direct contact.

[0079] Combination Figure 3 and Figure 4 In some embodiments, a first thermally conductive adhesive layer 1211 is provided on the first cooling surface 121, and the first heat dissipation part 212 and the second heat dissipation part 222 are both attached to the first thermally conductive adhesive layer 1211; a second thermally conductive adhesive layer 1221 is provided on the second cooling surface 122, and the third heat dissipation part 312 and the fourth heat dissipation part 322 are both attached to the second thermally conductive adhesive layer 1221.

[0080] Specifically, the first heat dissipation part 212 and the second heat dissipation part 222 are both bonded to the first cooling surface 121 through the first thermally conductive adhesive layer 1211 and conduct heat. The third heat dissipation part 312 and the fourth heat dissipation part 322 are both bonded to the second cooling surface 122 through the second thermally conductive adhesive layer 1221 and conduct heat. The first thermally conductive adhesive layer 1211 and the second thermally conductive adhesive layer 1221 can be thermally conductive silicone grease. The design of the first thermally conductive adhesive layer 1211 and the second thermally conductive adhesive layer 1221 can further improve the heat exchange efficiency between the first heat dissipation part 212 and the second heat dissipation part 222 as a whole and the first cooling surface 121, as well as the heat exchange efficiency between the third heat dissipation part 312 and the fourth heat dissipation part 322 as a whole and the second cooling surface 122.

[0081] Combination Figure 2 , Figure 2This is a schematic diagram of the structure of the liquid cooling plate disclosed in an embodiment of this application. In some embodiments, the liquid cooling plate 100 includes a plate body 12, which has a first pipe 125, a second pipe 126, a third pipe 127, and adjacent first side surface 123 and second side surface 124. One end of the first pipe 125 is located on the first side surface 123, and the other end is located inside the plate body 12. One end of the second pipe 126 is located on the second side surface 124, and the other end is connected to the periphery of the first pipe 125. One end of the third pipe 127 is located on the second side surface 124, and the other end is connected to the periphery of the first pipe 125. A plug 128 is provided at the end of the first pipe 125 located on the first side surface 123. The second pipe 126, the third pipe 127, and the first pipe 125 located between the second pipe 126 and the third pipe 127 together constitute a liquid cooling channel 11.

[0082] Specifically, the liquid cooling plate 100 can be made from a solid plate. The liquid cooling plate 100 includes a plate body 12 with holes on the side of the plate body 12. These holes can be on adjacent first side 123 and second side 124. Two deep holes are made on the second side 124, but they do not penetrate the plate body 12. One deep hole is made on the first side 123, but it does not penetrate the plate body 12. The bottoms of the two deep holes on the second side 124 are connected to the periphery of the deep hole on the first side 123. This structure facilitates processing and saves processing costs. The deep holes on the second side 124 are the second pipe 126 and the third pipe 127, respectively. The deep hole on the first side 123 is the first pipe 125. After the plug 128 blocks the opening of the first pipe 125 on the first side 123, the coolant can enter through the second pipe 126, then flow into the first pipe 125, then into the third pipe 127, and finally flow out from the third pipe 127. The flow direction can also be reversed, and there is no restriction here.

[0083] The third pipe 127 can be connected to the end of the first pipe 125 away from the plug 128, which can make the flow of coolant in the entire liquid cooling channel 11 smoother.

[0084] Please see Figure 5 and Figure 6 , Figure 5 This is one of the structural schematic diagrams of the first power module 200 or the second power module 300 provided in the embodiments of this application. Figure 6This is a second structural schematic diagram of the first power module 200 or the second power module 300 provided in the embodiments of this application. In some embodiments, both the first power module and the second power module include: a first circuit board 4, a second circuit board 5, a transformer 9, and a connecting circuit board 6. The first circuit board 4 is used to connect to an external power supply device. The second circuit board 5 and the first circuit board 4 are arranged at intervals along a first direction. The voltage of the second circuit board 5 is lower than the voltage of the first circuit board 4. The second circuit board 5 is used to supply power to the probe assembly. The transformer 9 is disposed on the second circuit board 5 and electrically connected to the second circuit board 5, and the transformer 9 is also electrically connected to the first circuit board 4. The connecting circuit board 6 is electrically connected to both the first circuit board 4 and the second circuit board 5. The connecting circuit board 6 includes a first edge 61 and a second edge 62 disposed opposite to each other. The first edge 61 is connected to the first circuit board 4, and the second edge 62 is connected to the second circuit board 5 to support the first circuit board 4 and the second circuit board 5 in the first direction.

[0085] Specifically, the first circuit board 4 serves as the power input port for either the first power module 200 or the second power module 300, facilitating connection to external power supply equipment. This ensures that the first power module 200 or the second power module 300 receives the necessary power input, providing a basic energy guarantee for subsequent transformation operations and power supply to the probe components, enabling the entire system to start and operate normally. The second circuit board 5 is arranged at a distance from the first circuit board 4 along the first direction. The voltage of the second circuit board 5 is lower than that of the first circuit board 4. This arrangement allows for the rational arrangement of circuits with different voltage levels within the limited space inside the battery charging and discharging equipment, avoiding problems such as insufficient electrical clearance leading to voltage breakdown caused by high-voltage and low-voltage sections being too close together. Furthermore, the separation between the second circuit board 5 and the first circuit board 4 allows for heat dissipation to a certain extent, facilitating heat dissipation design and reducing the risk of localized overheating. Simultaneously, the lower voltage of the second circuit board 5 provides a suitable low-voltage power supply to the battery, meeting the voltage requirements for battery charging and discharging, ensuring stable and safe operation of the battery during charging and discharging, and preventing damage to the battery due to excessive voltage. The first power module 200 or the second power module 300 also includes a transformer 9, which is disposed on and electrically connected to the second circuit board 5, and is also electrically connected to the first circuit board 4. The transformer 9 converts the higher voltage input to the first circuit board 4 into a lower voltage suitable for battery charging and discharging, meeting the different voltage requirements of different parts, ensuring that all components in the battery charging and discharging equipment can operate stably under appropriate voltage, improving energy utilization efficiency and overall system performance. Simultaneously, the transformer 9 achieves electrical isolation between the first circuit board 4 and the second circuit board 5, reducing electromagnetic interference from the high-voltage part to the low-voltage part, improving current stability and reliability, providing a better working environment for the probe assembly, and contributing to improved battery charging and discharging stability. The connecting circuit board 6 includes a first edge 61 and a second edge 62 disposed opposite to each other. The first edge 61 is connected to the first circuit board 4, and the second edge 62 is connected to the second circuit board 5, supporting the first circuit board 4 and the second circuit board 5 in a first direction and electrically connecting them. The connecting circuit board 6 establishes electrical connections with the first circuit board 4 and with the second circuit board 5, ensuring that control signals can be smoothly transmitted to both the first and second circuit boards 4 and 5. It can be understood that the connecting circuit board 6, the first circuit board 4, and the second circuit board 5 form an "I"-shaped structure.This allows the connecting circuit board 6 to support the first circuit board 4 and the second circuit board 5 in the first direction, making the structure of the entire first power module 200 or second power module 300 more stable. This avoids problems such as poor electrical connections or component damage caused by unstable relative positions between the first circuit board 4 and the second circuit board 5, thus improving the mechanical stability and service life of the first power module 200 or second power module 300. In this embodiment, the first power module 200 or second power module 300 provided in this application, with the first circuit board 4 and the second circuit board 5 arranged at intervals along the first direction, and the connecting circuit board 6 supporting the first circuit board 4 and the second circuit board 5 and achieving electrical connection in the first direction, forms an I-shaped structure that makes the entire structure of the first power module 200 or second power module 300 more compact. Compared to the traditional flat layout, the I-shaped structure can integrate the transformer function and corresponding circuit connections within a limited space, thereby reducing the space required by the first power module 200 or second power module 300, achieving miniaturization of the first power module 200 or second power module 300, and effectively improving the space utilization rate inside the battery charging and discharging device.

[0086] Please see Figure 5 In some embodiments, the connecting circuit board 6 is arranged perpendicularly to the first circuit board 4, and the connecting circuit board 6 is arranged perpendicularly to the second circuit board 5.

[0087] Specifically, this I-shaped structure allows for a more rational distribution of the first circuit board 4 and the second circuit board 5 within three-dimensional space, making full use of the internal space of the battery charging and discharging device. Compared to the traditional flat arrangement, the I-shaped structure can expand the space upwards or downwards within a limited planar space, making the entire first power module 200 or second power module 300 more compact in overall volume and improving the miniaturization of the battery charging and discharging device. Simultaneously, the vertically positioned connecting circuit board 6, compared to connecting circuit boards 6 positioned at other angles, can better resist external impacts and vibrations, forming a stable support frame. During the operation of the first power module 200 or second power module 300, it may be subject to external forces from different directions, such as movement or collisions of the battery charging and discharging device, or vibrations in the working environment. The vertically positioned connecting circuit board 6 can distribute external forces to the first circuit board 4, the second circuit board 5, and the connection points, reducing the risk of structural deformation or damage due to excessive local stress and improving the mechanical stability of the entire first power module 200 or second power module 300.

[0088] Please see Figure 7 , Figure 7The third schematic diagram of the structure of the first power module 200 or the second power module 300 provided in the embodiments of this application shows that in some embodiments, the second circuit board 5 includes a third edge 51 and a fourth edge 52 disposed opposite to each other along a second direction, the second direction being the thickness direction of the connecting circuit board 6, and the connecting circuit board 6 being equidistant from the third edge 51 and the fourth edge 52.

[0089] It is understood that the distances between the connecting circuit board 6 and the third edge 51 and the fourth edge 52 are equal. The connecting circuit board 6 provides uniform support points in the thickness direction of the second circuit board 5, making the supporting force on the second circuit board 5 more uniform in the first direction. During the operation of the battery charging and discharging equipment, the second circuit board 5 may be subjected to external forces from different directions, such as vibration and collision of the battery charging and discharging equipment. Since the distances between the connecting circuit board 6 and the third edge 51 and the fourth edge 52 are equal, the force on the second circuit board 5 in the first direction can be evenly distributed, avoiding bending, deformation or damage to the first circuit board 4 and the second circuit board 5 due to uneven force, and improving the structural stability of the entire first power module 200 or second power module 300.

[0090] Furthermore, the equidistant distances of the connecting circuit board 6 from the third edge 51 and the fourth edge 52 facilitate uniform heat dissipation. During the operation of the battery charging and discharging device, the second circuit board 5 generates heat. The uniform support of the connecting circuit board 6 allows the heat to be evenly distributed in the second direction, preventing localized heat accumulation. This helps improve heat dissipation efficiency, reduce the temperature of the circuit board, thereby extending the lifespan of the components on the second circuit board 5, improving the stability and reliability of the entire first power module 200 or second power module 300, and ensuring the heat dissipation performance of the battery power supply.

[0091] Please see Figure 5 and Figure 6 In some embodiments, the second circuit board 5 includes a first circuit and a second circuit. The first circuit is disposed between the connecting circuit board 6 and the first edge 61, and the second circuit is disposed between the connecting circuit board 6 and the second edge 62, so that the connecting circuit board 6 isolates the first circuit and the second circuit.

[0092] It is understood that by setting the first circuit and the second circuit between the connecting circuit board 6 and the first edge 61 and the second edge 62 respectively, and using the connecting circuit board 6 for isolation, signal interference and crosstalk between the first circuit and the second circuit can be prevented.

[0093] Furthermore, isolating the first and second circuits improves system safety. In battery-powered systems, abnormal situations may occur, such as a circuit failure or overcurrent / overvoltage. Isolating the first and second circuits by connecting circuit board 6 prevents the propagation of faults between them, avoiding the failure of the entire first power module 200 or second power module 300 or causing a safety accident due to a single circuit failure. This isolation design effectively protects the battery and other critical components, ensuring the safe operation of the first power module 200 or second power module 300.

[0094] Optionally, the first circuit and the second circuit can be responsible for different functions. For example, the first circuit is responsible for battery charging management, and the second circuit is responsible for battery status monitoring.

[0095] Please see Figure 5 and Figure 6 In some embodiments, the first circuit board 4 includes a first mounting hole, the second circuit board 5 includes a second mounting hole, and the first power module 200 or the second power module 300 further includes: a first connecting component 71, which is disposed between the first edge 61 of the first circuit board 4 and the connecting circuit board 6, and the first connecting component 71 can pass through the first mounting hole in a first direction to electrically connect the first circuit board 4 and the connecting circuit board 6; and a second connecting component 72, which is disposed between the second end of the second circuit board 5 and the connecting circuit board 6, and the second connecting component 72 can pass through the second mounting hole in a first direction to electrically connect the second circuit board 5 and the connecting circuit board 6.

[0096] Specifically, by using the first connecting component 71 and the second connecting component 72, along with the design of the mounting holes, the reliability of the connection between the first circuit board 4, the second circuit board 5, and the connecting circuit board 6 can be improved. The first and second mounting holes provide accurate positioning and fixing points for the first connecting component 71 and the second connecting component 72, ensuring precise alignment and fixation in their respective positions during installation, avoiding problems such as poor contact or loosening caused by unstable connections. This reliable connection method effectively reduces connection resistance, minimizes power loss during transmission, improves the overall power transmission efficiency of the first power module 200 or the second power module 300, and ensures the stability and reliability of battery power supply. Simultaneously, the design of the first connecting component 71 and the second connecting component 72 makes the installation of the first power module 200 or the second power module 300 more convenient. During assembly, simply passing the connecting components through the corresponding mounting holes and connecting them to the connecting circuit board 6 achieves the electrical connection between the first circuit board 4, the second circuit board 5, and the connecting circuit board 6. This installation method is simple and quick, reducing assembly difficulty and time costs, and improving production efficiency. Similarly, due to the design of the connecting components and mounting holes, the corresponding circuit boards can be easily removed from the connecting circuit board 6 for inspection, repair, or replacement. This not only saves maintenance time and reduces maintenance costs, but also improves the maintainability and reliability of the entire system, ensuring the stability and normal operation of the battery charging and discharging equipment during long-term operation. Furthermore, the arrangement of the first connecting component 71 and the second connecting component 72 not only achieves electrical connection but also enhances the structural stability between the first circuit board 4, the second circuit board 5, and the connecting circuit board 6. After passing through the mounting holes, the connecting components tightly connect the first circuit board 4, the second circuit board 5, and the connecting circuit board 6, forming a unified structure. This stable connection structure effectively reduces relative displacement and shaking between circuit boards, lowering the risk of loose connections and solder joint cracking caused by external forces, improving the mechanical stability and reliability of the entire first power module 200 or second power module 300, and ensuring the stability and safety of battery power supply.

[0097] Please see Figure 5 and Figure 6 In some embodiments, the first connecting component 71 includes: a female connector disposed in a first mounting hole and electrically connected to the first circuit board 4; and a pin connector disposed at the first end of the connecting circuit board 6 and electrically connected to the connecting circuit board 6, wherein the pin connector can be inserted into the female connector to make the pin connector electrically connected to the female connector.

[0098] It is understood that the header nut is located in the first mounting hole and electrically connected to the first circuit board 4, while the header pin is located at the first end of the connecting circuit board 6 and electrically connected to the connecting circuit board 6. The header pin can be inserted into the header nut to achieve electrical connection between them. This insertion-fit connection method provides a reliable electrical connection, ensuring stable signal transmission between the first circuit board 4 and the connecting circuit board 6. It provides a stable signal transmission channel for the normal operation of the first power module 200 or the second power module 300, ensuring the continuity and stability of control signals. Simultaneously, the design of the header nut and header pin facilitates multi-point connections. The header nut typically has multiple pins, which can be inserted one-to-one with the multiple pins of the header pin, thereby achieving simultaneous connection between multiple circuit nodes. This multi-point connection method can meet the connection requirements of multiple control signals in complex circuits, ensuring coordinated operation between various circuit parts, improving the functionality and reliability of the entire first power module 200 or the second power module 300, and providing strong support for the stable operation of the battery-powered system. Furthermore, the insertion-fit design of the header nut and header pin simplifies the installation process. When assembling the first power module 200 or the second power module 300, electrical connection can be achieved simply by inserting the pins into the sockets of the sockets, without the need for complex soldering or other connection processes. This simple installation method not only improves assembly efficiency, reduces assembly difficulty and time costs, but also reduces connection problems caused by improper installation, improving product quality and reliability, and facilitating large-scale production and rapid assembly. Similarly, when maintenance or replacement of the first circuit board 4 or the connecting circuit board 6 is required, the design of the sockets and pins makes this process more convenient. Simply pull the pins out of the sockets to easily remove the corresponding circuit board for inspection, repair, or replacement. This convenient maintenance method not only saves maintenance time and reduces maintenance costs, but also improves the maintainability and reliability of the entire system, ensuring the stability and normal operation of the battery charging and discharging equipment during long-term operation and extending the service life of the battery charging and discharging equipment. It should be noted that the first connecting component 71 and the second connecting component 72 can have the same structure and working principle. This article mainly describes and introduces the first connecting component 71, and will not elaborate on the structure and working principle of the second connecting component 72.

[0099] Please see Figure 8 , Figure 8 The fourth schematic diagram of the structure of the first power module 200 or the second power module 300 provided in the embodiments of this application. In some embodiments, the first power module 200 and / or the second power module 300 further include: a connector 8, the first end of the connector 8 being connected to the edge of the second circuit board 5, and the second end of the connector 8 being connected to the edge of the first circuit board 4, so as to limit the first circuit board 4 and the second circuit board 5 from moving closer to or further away from each other along a first direction.

[0100] It is understood that connector 8 connects the first circuit board 4 and the second circuit board 5 together, restricting the relative movement of the first circuit board 4 and the second circuit board 5 along the first direction, thereby effectively preventing displacement between the first circuit board 4 and the second circuit board 5. During the operation of the battery charging and discharging equipment, it may be affected by external forces such as vibration and impact. Without the constraint of connector 8, the first circuit board 4 and the second circuit board 5 may experience relative displacement, leading to loosening or disconnection of the electrical connection, affecting the normal operation of the first power module 200 or the second power module 300. The presence of connector 8 keeps the relative position between the circuit boards stable, improving the mechanical stability of the entire first power module 200 or the second power module 300.

[0101] Meanwhile, the use of connector 8 simplifies the structural design of the first power module 200 or the second power module 300. Connecting the circuit boards together via connector 8 eliminates the need for complex support structures or additional fixing components, resulting in a simpler overall structure for the first power module 200 or the second power module 300. This simplified design not only reduces manufacturing costs but also improves assembly efficiency, facilitating large-scale production and maintenance.

[0102] Optionally, the connector 8 can be a connecting plate, a connecting rod, a connecting bolt, or a snap-fit ​​connector, etc., and this application embodiment does not limit this.

[0103] Please see Figure 9 , Figure 10 and Figure 11 , Figure 9 This is a schematic diagram of the structure of the first circuit board 4 provided in an embodiment of this application. Figure 10 This is a schematic diagram of the structure of the second circuit board 5 provided in an embodiment of this application. Figure 11 The diagram below illustrates the structure of the connector 8 provided in an embodiment of this application. In some embodiments, the connector 8 includes a first snap-fit ​​groove 81 disposed at a first end of the connector 8. The second circuit board 5 includes a first snap-fit ​​portion 53, which engages with the first snap-fit ​​groove 81 to limit the movement of the second circuit board 5 along a first direction. The connector 8 also includes a second snap-fit ​​groove 82 disposed at a second end of the connector 8. The first circuit board 4 includes a second snap-fit ​​portion 41, which engages with the second snap-fit ​​groove 82 to limit the movement of the first circuit board 4 along a first direction.

[0104] Specifically, the limiting engagement between the first latching portion 53 and the first latching slot 81, and between the second latching portion 41 and the second latching slot 82, effectively restricts the movement of the second circuit board 5 and the first circuit board 4 along the first direction. This limiting design ensures that the circuit boards maintain a stable position during operation, preventing relative displacement between the first circuit board 4 and the second circuit board 5 due to external forces. This improves the structural stability of the entire first power module 200 or second power module 300 and ensures the reliability of the electrical connection.

[0105] The snap-fit ​​design simplifies and speeds up the installation process. When assembling the first power module 200 or the second power module 300, simply align the first snap-fit ​​part 53 of the second circuit board 5 with the first snap-fit ​​slot 81 of the connector 8, and align the second snap-fit ​​part 41 of the first circuit board 4 with the second snap-fit ​​slot 82 of the connector 8, then gently insert them to achieve a locking fit, eliminating the need for complex tools and equipment. This simple installation method not only improves assembly efficiency, reduces assembly difficulty and time costs, but also reduces connection problems caused by improper installation, thus improving product quality and reliability. Similarly, the snap-fit ​​design provides convenience when maintaining or replacing circuit boards. Simply pull the snap-fit ​​part out of the slot to easily remove the corresponding circuit board for inspection, repair, or replacement. This convenient maintenance method not only saves maintenance time and reduces maintenance costs but also improves the maintainability and reliability of the entire system, ensuring the stability and normal operation of the battery charging and discharging equipment during long-term operation. Optionally, along the width direction of the connector 8, the connector 8 may be provided with a third slot 83 opposite to the first slot 81 and a fourth slot 84 opposite to the second slot 82, so as to enhance the structural stability of the connector 8 and ensure the stable support of the connector 8 for the first circuit board 4 and the second circuit board 5.

[0106] Please see Figure 1 In some embodiments, there are multiple connectors 8, which are arranged at intervals around the second circuit board 5.

[0107] It is understandable that the multiple connectors 8 arranged at intervals around the second circuit board 5 can evenly distribute the connection force along the edges of the circuit board. This evenly distributed connection force can effectively prevent local deformation or stress concentration of the first circuit board 4 and the second circuit board 5 under stress, thereby improving the structural stability of the entire first power module 200 or second power module 300. For example, when the equipment is subjected to vibration or impact, the multiple connectors 8 can share the external force, reducing the pressure on individual connectors 8 and lowering the risk of damage to the connectors 8. In addition, the spaced arrangement of the multiple connectors 8 provides greater flexibility in the design and layout of the first circuit board 4 and the second circuit board 5. Designers can adjust the position and number of connectors 8 according to actual needs to achieve optimal connection effect and space utilization. For example, the number of connectors 8 can be increased at critical parts of the first circuit board 4 and the second circuit board 5 to improve the connection strength and stability at these parts, while the number of connectors 8 can be reduced at other parts to save space and cost.

[0108] Please see Figure 1 In some embodiments, the transformer 9 is electrically connected to the first circuit board 4 via conductive leads 91. The use of conductive leads 91 makes the connection between the transformer 9 and the first circuit board 4 more flexible and convenient. During installation, only one end of the conductive lead 91 needs to be connected to the corresponding terminal of the transformer 9, and the other end needs to be connected to the corresponding pad of the first circuit board 4. No complicated alignment and fixing operations are required, which simplifies the installation steps and improves installation efficiency.

[0109] Optionally, the conductive lead 91 can be made of a material with good conductivity, such as copper or aluminum wire, to provide a stable electrical connection. By soldering the conductive lead 91 to the corresponding connection points of the transformer 9 and the first circuit board 4 or using other reliable connection methods, stable power transmission between the transformer 9 and the first circuit board 4 can be ensured, reducing electrical connection problems caused by poor contact. Furthermore, the use of the conductive lead 91 makes the connection between the transformer 9 and the first circuit board 4 more flexible and not subject to strict geometric limitations. Depending on the overall layout and space constraints of the first power module 200 or the second power module 300, the relative positions of the transformer 9 and the first circuit board 4 can be freely selected and connected via the conductive lead 91, thereby achieving better space utilization.

[0110] Reference Figure 3 In some embodiments, the second circuit board 5 of the first power module 200 is disposed adjacent to the liquid cooling plate 100; and / or, the second circuit board 5 of the second power module 300 is disposed adjacent to the liquid cooling plate 100.

[0111] Specifically, the voltage of the second circuit board 5 is lower than that of the first circuit board 4. As the low-voltage side, the second circuit board 5 generates more heat. Therefore, by placing the second circuit board 5 of the first power module 200 near the liquid cooling plate 100, or the second circuit board 5 of the second power module 300 near the liquid cooling plate 100, or both the second circuit boards 5 of the first power module 200 and the second circuit board 5 of the second power module 300 near the liquid cooling plate 100, the components that generate more heat can be placed closer to the liquid cooling plate 100, allowing the heat to be carried away more quickly and improving the heat dissipation efficiency.

[0112] Please see Figures 1 to 4 This application discloses a battery production equipment, including: a plurality of the aforementioned power module groups.

[0113] Specifically, the battery production equipment can be a battery formation and capacity testing equipment. The battery production equipment can include a power module and a probe module. The power module supplies power to the probe module. In this embodiment, a liquid cooling plate 100 and two power modules are combined into a power module group. The liquid cooling plate 100 can simultaneously dissipate heat for the first power module group 200 and the second power module group 300, which can make full use of the liquid cooling plate 100 and improve heat dissipation efficiency. Furthermore, the first power module 200 and the second power module 300 respectively exchange heat with the first cooling surface 121 and the second cooling surface 122 of the liquid cooling plate 100 along the first direction. The first power module 200 and the second power module 300 can be respectively disposed on both sides of the liquid cooling plate 100 along the first direction, which can reduce the mutual heat influence between the first power module 200 and the second power module 300.

[0114] In some embodiments, multiple power module groups are arranged at intervals along a first direction.

[0115] Specifically, after multiple power module groups are arranged along the first direction, a probe assembly is connected below to supply power to the probe assembly. Each power module group is spaced a certain distance apart to avoid mutual interference from the heat generated by each.

[0116] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A power module group, characterized by, include: A liquid cooling plate (100) includes a liquid cooling channel (11), a first cooling surface (121), and a second cooling surface (122) that are thermally connected to each other. The first cooling surface (121) and the second cooling surface (122) are arranged opposite to each other along a first direction. The liquid cooling channel (11) is located inside the liquid cooling plate (100) and is used to connect to the coolant circulation pipeline. The first power module (200) is thermally connected to the first cooling surface (121); The second power module (300) is disposed opposite to the first power module (200) along the first direction and is thermally connected to the second cooling surface (122).

2. The power module assembly according to claim 1, characterized in that, The first power module (200) includes: The first positive bus (21) includes a first electrical connection part (211) and a first heat dissipation part (212); The first negative busbar (22) includes a second electrical connection part (221) and a second heat dissipation part (222); The first heat dissipation part (212) and the second heat dissipation part (222) of the first power module (200) are both thermally connected to the first cooling surface (121), and there is a first separation gap (23) between the first heat dissipation part (212) and the second heat dissipation part (222).

3. The power module assembly according to claim 2, characterized in that, The second power module (300) includes: The second positive bus (31) includes a third electrical connection part (311) and a third heat dissipation part (312); The second negative busbar (32) includes a fourth electrical connection part (321) and a fourth heat dissipation part (322); The third heat dissipation part (312) and the fourth heat dissipation part (322) are both thermally connected to the second cooling surface (122), and there is a second separation gap (33) between the third heat dissipation part (312) and the fourth heat dissipation part (322).

4. The power module assembly according to claim 3, characterized in that, The first heat dissipation part (212) and the second heat dissipation part (222) are located in the same plane and are laid on the first cooling surface (121); The third heat dissipation part (312) and the fourth heat dissipation part (322) are located in the same plane and are laid on the second cooling surface (122).

5. The power module assembly according to claim 4, characterized in that, The first heat dissipation part (212) and the second heat dissipation part (222) are together laid on the entire first cooling surface (121); The third heat dissipation section (312) and the fourth heat dissipation section (322) are together laid on the entire second cooling surface (122).

6. The power module assembly according to claim 4, characterized in that, The area of ​​the first heat dissipation part (212) on the cooling surface is smaller than the area of ​​the second heat dissipation part (222) on the cooling surface; The area of ​​the third heat dissipation part (312) laid on the cooling surface is smaller than the area of ​​the fourth heat dissipation part (322) laid on the cooling surface.

7. The power module assembly according to claim 3, characterized in that, A first thermally conductive adhesive layer (1211) is provided on the first cooling surface (121), and the first heat dissipation part (212) and the second heat dissipation part (222) are both attached to the first thermally conductive adhesive layer (1211); A second thermally conductive adhesive layer (1221) is provided on the second cooling surface (122), and the third heat dissipation part (312) and the fourth heat dissipation part (322) are both attached to the second thermally conductive adhesive layer (1221).

8. The power module assembly according to claim 1, characterized in that, The liquid cooling plate (100) includes a plate body (12), the plate body (12) having a first pipe (125), a second pipe (126), a third pipe (127) and adjacent first side (123) and second side (124), one end of the first pipe (125) is located on the first side (123) and the other end is located inside the plate body (12), one end of the second pipe (126) is located on the second side (124) and the other end is connected to the periphery of the first pipe (125), one end of the third pipe (127) is located on the second side (124) and the other end is connected to the periphery of the first pipe (125); The first pipe (125) is provided with a plug (128) at one end of the first side (123), and the second pipe (126), the third pipe (127) and the first pipe (125) located between the second pipe (126) and the third pipe (127) together constitute a liquid cooling channel (11).

9. The power module assembly according to claim 1, characterized in that, The first power module (200) and / or the second power module (300) include: The first circuit board (4) is used to connect to an external power supply device; The second circuit board (5) and the first circuit board (4) are arranged at intervals along a first direction. The voltage of the second circuit board (5) is lower than the voltage of the first circuit board (4). The second circuit board (5) is used to supply power to the probe assembly. A transformer (9) is disposed on the second circuit board (5) and electrically connected to the second circuit board (5), and the transformer (9) is electrically connected to the first circuit board (4); A connecting circuit board (6) is electrically connected to the first circuit board (4) and the second circuit board (5) respectively. The connecting circuit board (6) includes a first edge (61) and a second edge (62) disposed opposite to each other. The first edge (61) is connected to the first circuit board (4), and the second edge (62) is connected to the second circuit board (5) to support the first circuit board (4) and the second circuit board (5) in the first direction.

10. The power module assembly according to claim 9, characterized in that, The second circuit board (5) of the first power module (200) is disposed adjacent to the liquid cooling plate (100); and / or, The second circuit board (5) of the second power module (300) is positioned adjacent to the liquid cooling plate (100).

11. A battery manufacturing apparatus, characterized in that, Multiple power module groups as described in any one of claims 1-10.

Images