Lateral light-emitting multicolor integrated LED (light-emitting diode) packaging structure

By combining flip-chip design with microlenses, the problems of thickness and complex wiring in traditional side-emitting LEDs are solved, achieving uniform light mixing and simplified wiring in ultra-thin LED packaging structures, which are suitable for ultra-thin displays and lighting devices.

CN224290532UActive Publication Date: 2026-05-26SHENZHEN CROSS-STRAIT SEMICON TECH CO LTD
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Patent Information

Application Number
CN202521389540.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-07-03
Publication Date
2026-05-26
Estimated Expiration
2035-07-03

AI Technical Summary

Technical Problem

Traditional side-emitting LEDs are taller than 2mm, which makes it difficult to meet the requirements of ultra-thin display devices. In addition, LED RGBW lamp beads require 8 solder pads, resulting in complex and cumbersome wiring.

Method used

By adopting a flip-chip design, the RGBW chipset is directly soldered onto the ceramic substrate. Combined with film bonding technology and microlenses, the number of pads is reduced to five, the overall thickness of the package structure is ≤1.2mm, the pad wiring is simplified, and microlenses are set on the outside of the ceramic substrate for light mixing.

Benefits of technology

It achieves ultra-thin packaging structure, simplifies wiring process, improves light mixing uniformity and color mixing effect, and is suitable for ultra-thin application scenarios.

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Abstract

The utility model relates to the technical field of LED packaging, in particular to a side-emitting multi-color integrated LED packaging structure, which comprises a ceramic substrate provided with a common-anode RGBW chip group. The RGBW chip set is directly welded on the ceramic substrate by adopting a flip chip design, the overall thickness of the packaging structure is less than or equal to 1.2 mm, the RGBW chip set is matched with preset solder paste below the RGBW chip set to be mounted on a bonding pad, the RGBW chip set is directly welded on the ceramic substrate by adopting the flip chip design, technologies such as gold wire bonding and matching with a film pasting technology are abandoned, and the packaging structure is simple in structure, convenient to manufacture and high in packaging efficiency. The overall thickness of the packaging structure is smaller than or equal to 1.2 mm, the packaging thickness is greatly reduced, the packaging structure can perfectly adapt to ultrathin application scenes such as side-entry backlight, the problem in the aspect of ultra-thinness in the traditional technology is effectively solved, the number of bonding pads is reduced to five by adopting the design that RGBW four-in-one chips share the anode / cathode, the anodes of the RGBW chips are connected in parallel, and the thickness of the packaging structure is greatly reduced. Only one common bonding pad and four independent bonding pads are needed, and the problem that bonding pad wiring is complex in the prior art is solved.
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