Lateral light-emitting multicolor integrated LED (light-emitting diode) packaging structure

Abstract

The utility model relates to the technical field of LED packaging, in particular to a side-emitting multi-color integrated LED packaging structure, which comprises a ceramic substrate provided with a common-anode RGBW chip group. The RGBW chip set is directly welded on the ceramic substrate by adopting a flip chip design, the overall thickness of the packaging structure is less than or equal to 1.2 mm, the RGBW chip set is matched with preset solder paste below the RGBW chip set to be mounted on a bonding pad, the RGBW chip set is directly welded on the ceramic substrate by adopting the flip chip design, technologies such as gold wire bonding and matching with a film pasting technology are abandoned, and the packaging structure is simple in structure, convenient to manufacture and high in packaging efficiency. The overall thickness of the packaging structure is smaller than or equal to 1.2 mm, the packaging thickness is greatly reduced, the packaging structure can perfectly adapt to ultrathin application scenes such as side-entry backlight, the problem in the aspect of ultra-thinness in the traditional technology is effectively solved, the number of bonding pads is reduced to five by adopting the design that RGBW four-in-one chips share the anode / cathode, the anodes of the RGBW chips are connected in parallel, and the thickness of the packaging structure is greatly reduced. Only one common bonding pad and four independent bonding pads are needed, and the problem that bonding pad wiring is complex in the prior art is solved.

Description

Technical Field

[0001] This utility model relates to the field of LED packaging technology, and in particular to a side-emitting multicolor integrated LED packaging structure. Background Technology

[0002] Edge-lit LED technology is a technique that uses a light guide plate to guide light emitted from the side of an LED and diffuse it evenly within a plane. With its advantages of achieving high brightness, low energy consumption, and ultra-thin structure, it is widely used in scenarios such as LCD backlighting and flat panel lighting.

[0003] However, traditional side-emitting LEDs have certain drawbacks in practical applications. They are typically taller than 2mm, which makes it difficult to meet the stringent requirements of ultra-thin display devices for lightness and thinness. Furthermore, LED RGBW chips on the market require eight solder pads, which makes the LED strip wiring complex and cumbersome, contradicting the needs of ultra-thin application scenarios.

[0004] Therefore, we provide a side-emitting multicolor integrated LED packaging structure. Utility Model Content

[0005] The purpose of this invention is to address the aforementioned technical problems by providing a side-emitting multi-color integrated LED packaging structure, thereby resolving the problems mentioned above.

[0006] In view of this, the present invention provides a side-emitting multi-color integrated LED packaging structure, including a ceramic substrate, wherein a common anode RGBW chip group is provided on the ceramic substrate;

[0007] The RGBW chipset (adopting a flip-chip design and directly soldered onto a ceramic substrate, the overall thickness of the package structure is ≤1.2mm, the RGBW chipset is mounted on pads with pre-applied solder paste below, and the number of pads is at least five).

[0008] Preferably, the white light-emitting chip in the RGBW chipset is produced using a film-coating process, which allows for customization of the color temperature and color rendering index parameters of the white light-emitting chip.

[0009] Preferably, the RGBW chipset comprises: a blue light chip with a wavelength of 450nm paired with a fluorescent film, a red light chip with a wavelength of 620-630nm, a green light chip with a wavelength of 520-530nm, and a blue light chip with a wavelength of 450-460nm.

[0010] Preferably, the ceramic substrate is provided with a positioning groove with an accuracy of ±5μm, and the protrusions extending from the four side walls of the positioning groove enable automatic alignment of the chip.

[0011] Preferably, the pads are pre-coated with Sn-Ag-Cu solder, the Sn-Ag-Cu solder having a melting point of 217°C, and are formed in one step by reflow soldering.

[0012] Preferably, the RGBW chipset anodes are connected in parallel, and the five pads include one common pad and four independent pads.

[0013] Preferably, the ceramic substrate has positive and negative electrode markings on its side surface, and a microlens with a diameter of 50-100 μm is provided on the surface of the encapsulation colloid of the encapsulation structure on the outside of the ceramic substrate.

[0014] Compared with the prior art, this utility model provides a side-emitting multi-color integrated LED packaging structure, which has the following beneficial effects:

[0015] 1. This utility model adopts a flip-chip design to directly solder the RGBW chipset onto a ceramic substrate, eliminating the need for gold wire bonding. Combined with film bonding technology, the overall thickness of the package structure is ≤1.2mm, which greatly reduces the package thickness and can perfectly adapt to ultra-thin application scenarios such as side-lit backlighting, effectively solving the problem of ultra-thinness in traditional technologies.

[0016] 2. This utility model reduces the number of pads to five by adopting a design that uses an RGBW four-in-one chip with a shared anode / cathode. The RGBW chip anodes are connected in parallel, requiring only one common pad and four independent pads, thus solving the problem of complex pad wiring in traditional technology.

[0017] 3. In this invention, a microlens is provided on the surface of the encapsulating colloid on the outer side of the ceramic substrate. The microlens has a diameter of 50-100μm and can diffuse light in a secondary manner, effectively improving the light propagation path and making the light mix uniformly. Compared with traditional technology, it significantly improves the color mixing uniformity.

[0018] The parts of this device not covered herein are the same as or can be implemented using existing technologies. This utility model has a simple structure and is easy to operate. Attached Figure Description

[0019] Figure 1 This is the overall view of the present utility model;

[0020] Figure 2 This is a schematic diagram of the RGBW chipset mounting structure proposed in this utility model;

[0021] Figure 3 This is a schematic diagram of the overall two-dimensional structure proposed in this utility model;

[0022] Figure 4 This is another perspective view of the two-dimensional structure proposed in this utility model.

[0023] In the diagram: 1. Ceramic substrate; 11. Positive and negative electrode markings; 2. RGBW chipset; 21. White light-emitting chip; 4. Positioning groove; 41. Protrusion; 5. Pre-applied solder paste; 6. Solder pad; 7. Microlens. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model. Example

[0025] Please see Figure 1 - Figure 4 The side-emitting multi-color integrated LED packaging structure in this embodiment includes: a ceramic substrate 1, on which a common anode RGBW chip group 2 is provided; the RGBW chip group 2 is directly soldered onto the ceramic substrate 1 using a flip-chip design, the overall thickness of the packaging structure is ≤1.2mm, and the RGBW chip group 2 is mounted on pads 6 with pre-applied solder paste 5 below, the number of pads 6 being at least five.

[0026] Since traditional side-emitting LEDs are generally taller than 2mm, which is difficult to meet the requirements of ultra-thin display devices, this application adopts a flip-chip design to directly solder the common anode RGBW chipset 2 onto the ceramic substrate 1, eliminating the need for gold wire bonding, greatly simplifying the internal structure, and enabling the overall thickness of the package structure to be controlled to ≤1.2mm, which greatly improves the applicability of the product in ultra-thin display, ultra-thin lighting and other fields.

[0027] In this process, by pre-applying solder paste 5 to pad 6, the RGBW chipset 2 is installed on pad 6 with the pre-applied solder paste 5. Utilizing the characteristic that Sn-Ag-Cu solder has a melting point of 217°C, it can be formed in one step through reflow soldering. Compared with traditional soldering methods, this not only simplifies the soldering process and reduces the number of soldering steps, but also improves the stability and reliability of soldering by precisely controlling the amount of solder with the pre-applied solder paste 5, and reduces the probability of defects such as cold solder joints and desoldering.

[0028] Among them, different application scenarios have different requirements for the color temperature and color rendering index of lighting. The white light emitting chip 21 in the RGBW chipset 2 adopts a film bonding process, which can customize the color temperature and color rendering index parameters of the white light emitting chip 21.

[0029] The RGBW chipset 2 includes a combination of a 450nm blue light chip with a fluorescent film, a 620-630nm red light chip, a 520-530nm green light chip, and a 450-460nm blue light chip. Since red, green, and blue are the three primary colors that constitute a variety of colors, the combination of a blue light chip with a specific wavelength and a fluorescent film produces white light, which can cover a wider color gamut. The white light produced by the 450nm blue light chip with the fluorescent film can further adjust the brightness and hue on the basis of color light mixing, making the final color presentation richer.

[0030] The ceramic substrate 1 is provided with a positioning groove 4 with an accuracy of ±5μm, and the protrusions 41 extending from the four side walls of the positioning groove 4 enable automatic alignment of the chip.

[0031] Among them, the RGBW chipset 2 has parallel anodes and five pads 6, including one common pad and four independent pads.

[0032] The traditional RGBW LED chip design with 8 pads makes the LED strip wiring intricate and complex. This design reduces the number of pads to five, greatly reducing the complexity of PCB wiring. Fewer pads mean simpler routing planning and less cross-interference between lines. This not only effectively shortens the wiring time but also reduces the risk of line failures caused by complex wiring.

[0033] Among them, positive and negative electrode markings 11 are provided on the side surface of the ceramic substrate 1, and microlenses 7 are provided on the surface of the encapsulation colloid of the encapsulation structure on the outside of the ceramic substrate 1, with a diameter of 50-100μm.

[0034] By setting positive and negative electrode markings 11 on the side surface of the ceramic substrate 1, operators can quickly and accurately identify the positive and negative electrode directions of the chip during the production and assembly process, thus avoiding device damage or functional failure caused by reversed positive and negative electrode connections.

[0035] Traditional side-emitting LEDs suffer from poor color mixing due to uneven light mixing, while the microlens 7 can change the light propagation path, allowing the light emitted by different color chips to mix fully during propagation, effectively improving the uniformity of color mixing.

[0036] The installation, connection, or setting methods disclosed in this embodiment are all common mechanical connection methods. As long as they can achieve their beneficial effects, they can be implemented. Therefore, this embodiment will not elaborate on their specific structural composition and working principle.

[0037] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A side emitting multi-color integrated LED package structure, characterized in that, include: A ceramic substrate (1) is provided with a common anode RGBW chip group (2). The RGBW chipset (2) is directly soldered onto the ceramic substrate (1) using a flip-chip design. The overall thickness of the package structure is ≤1.2mm. The RGBW chipset (2) is mounted on the pads (6) with the pre-applied solder paste (5) below. The number of pads (6) is at least five.

2. The side-emitting multi-color integrated LED package structure according to claim 1, wherein, The white light-emitting chip (21) in the RGBW chipset (2) adopts a film-coating process, which can customize the color temperature and color rendering index parameters of the white light-emitting chip (21).

3. The side-emitting multicolor integrated LED packaging structure according to claim 2, characterized in that, The RGBW chipset (2) comprises: a blue light chip with a wavelength of 450nm paired with a fluorescent film, a red light chip with a wavelength of 620-630nm, a green light chip with a wavelength of 520-530nm, and a blue light chip with a wavelength of 450-460nm.

4. The side-emitting multicolor integrated LED packaging structure according to claim 1, characterized in that, The ceramic substrate (1) is provided with a positioning groove (4), the positioning groove (4) has an accuracy of ±5μm, and the protrusions (41) extending from the four side walls of the positioning groove (4) realize automatic alignment of the chip.

5. The side-emitting multi-color integrated LED packaging structure according to claim 1, characterized in that, The pad (6) is pre-coated with Sn-Ag-Cu solder, the Sn-Ag-Cu solder having a melting point of 217°C, and is formed in one step by reflow soldering.

6. The side-emitting multicolor integrated LED packaging structure according to claim 3, characterized in that, The RGBW chipset (2) has its anodes connected in parallel, and the five pads (6) include one common pad and four independent pads.

7. The side-emitting multicolor integrated LED packaging structure according to claim 4, characterized in that, The ceramic substrate (1) has positive and negative electrode markings (11) on its side surface, and a microlens (7) is provided on the surface of the encapsulation colloid of the encapsulation structure on the outside of the ceramic substrate (1), the microlens (7) having a diameter of 50-100μm.

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