Wafer cleaning device and wafer processing equipment

Abstract

The utility model discloses a wafer cleaning device and wafer processing equipment, and relates to the technical field of semiconductor equipment. The wafer cleaning device comprises a base, at least two rotating assemblies and at least two cleaning assemblies, the rotating assemblies and the cleaning assemblies are arranged on the base, and the rotating assemblies are arranged on the outer edge of a wafer in the horizontal direction and used for supporting and driving the wafer to rotate. The at least two cleaning assemblies are arranged on the two sides of the wafer in the vertical direction and used for cleaning the surface of the wafer. The wafer cleaning device can solve the problem that a traditional roller device is prone to pressing the top face or the bottom face of a wafer, so that the wafer is damaged due to pressing.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment technology, and more specifically, to a wafer cleaning apparatus and wafer processing equipment. Background Technology

[0002] Chemical mechanical polishing (CMP) is an ultra-precision surface processing technology that achieves global planarization of wafer surfaces. During CMP, a large number of abrasive particles and byproducts remain on the wafer surface. If these contaminants are not thoroughly removed, they can easily reappear on the wafer surface before subsequent processes, affecting wafer performance and quality. Therefore, multiple surface cleaning processes are required during wafer manufacturing. Traditional cleaning methods use roller brushes to remove contaminants such as metal ions, atoms, organic matter, and particles adhering to the wafer surface. However, the rollers in these traditional roller devices tend to press against the top or bottom surface of the wafer, causing damage due to pressure. Utility Model Content

[0003] The purpose of this application is to provide a wafer cleaning device and wafer processing equipment that can solve the problem that traditional roller devices easily press on the top or bottom surface of the wafer, causing the wafer to break due to pressure.

[0004] The embodiments of this application are implemented as follows:

[0005] A first aspect of this application provides a wafer cleaning apparatus, including a base and at least two rotating components and at least two cleaning components disposed on the base. The at least two rotating components are horizontally disposed at the outer edge of the wafer to support and drive the wafer to rotate. The at least two cleaning components are vertically disposed on both sides of the wafer to clean the surface of the wafer. This wafer cleaning apparatus solves the problem that traditional roller devices easily press against the top or bottom surface of the wafer, causing damage due to pressure.

[0006] In one possible implementation, each of the rotating components includes a first driving member and a rolling member. The fixed end of the first driving member is fixedly disposed on the base, and the output end of the first driving member is connected to the rolling member for transmission. The first driving member is used to drive the rolling member to rotate so as to drive the wafer to rotate synchronously.

[0007] As one possible implementation, a receiving groove is provided along the outer edge of the rolling element, and the outer edge of the wafer is received in the receiving groove.

[0008] As one possible implementation, the height of the receiving groove is adapted to the thickness of the wafer along the vertical direction.

[0009] In one possible implementation, at least two of the rotating components are uniformly distributed along the outer edge of the wafer.

[0010] In one possible implementation, each of the cleaning components includes a second driving member, a rotating shaft, and a cleaning component. Two brackets are spaced apart on the base. The fixed end of the second driving member is fixedly mounted on the bracket. The output end of the second driving member is connected to the rotating shaft. The rotating shaft is rotatably mounted between the two brackets. The cleaning component is sleeved on the rotating shaft. The second driving member is used to drive the rotating shaft to rotate, thereby causing the cleaning component to rotate synchronously.

[0011] In one possible implementation, the cleaning element is provided with bristles, and the cleaning element is driven to rotate so that the bristles come into contact with the surface of the wafer.

[0012] In one possible implementation, an airflow channel is provided inside the rotating shaft, and an air guide hole is provided on the cleaning component. The air guide hole is connected to the air supply device through the airflow channel, so that the processing gas provided by the air supply device can flow to the surface of the wafer through the air guide hole.

[0013] As one possible implementation method, the processing gas is nitrogen, helium, or argon.

[0014] A second aspect of this application provides a wafer processing apparatus, including the wafer cleaning device described above. This wafer cleaning device can solve the problem that traditional roller devices easily press on the top or bottom surface of the wafer, causing the wafer to break due to pressure.

[0015] The beneficial effects of the embodiments of this application include:

[0016] The wafer cleaning apparatus includes a base and at least two rotating components and at least two cleaning components disposed on the base. The at least two rotating components are horizontally disposed at the outer edge of the wafer to support and drive the wafer to rotate, and the at least two cleaning components are vertically disposed on both sides of the wafer to clean the wafer surface. The wafer cleaning apparatus provided in this application, by having the rotating components support only the outer edge of the wafer, allows the wafer surface to be suspended in the air. Furthermore, by using the cleaning components to clean the wafer surface from both sides, it avoids direct pressure on the wafer surface, thus eliminating the risk of wafer breakage due to support contact from a structural design perspective. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is one of the structural schematic diagrams of the wafer cleaning apparatus provided in the embodiments of this application;

[0019] Figure 2 This is a second schematic diagram of the structure of the wafer cleaning apparatus provided in the embodiments of this application;

[0020] Figure 3 This is the third schematic diagram of the wafer cleaning apparatus provided in the embodiments of this application;

[0021] Figure 4 The fourth schematic diagram of the wafer cleaning apparatus provided in the embodiments of this application.

[0022] Icons: 100-Wafer cleaning device; 10-Rotating component; 11-First driving component; 12-Rolling component; 121-Accommodation tank; 20-Cleaning component; 21-Second driving component; 22-Rotating shaft; 23-Cleaning component; 231-Brush bristles; 232-Vent vent; 30-Supporting platform; 200-Wafer. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0024] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. These terms are used only for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "horizontal," "vertical," etc., do not indicate that the component must be absolutely horizontal or suspended, but can be slightly tilted. The terms "first," "second," and "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0025] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0026] In the semiconductor manufacturing industry, wafer cleaning is a critical process to ensure chip yield. Traditional cleaning methods use roller brushes to remove contaminants such as metal ions, atoms, organic matter, and particles adhering to the wafer surface. However, the rollers of this traditional roller device tend to press against the top or bottom surface of the wafer, causing the wafer to break due to pressure.

[0027] To solve the above problems, please refer to the following: Figures 1 to 4 This application provides a wafer cleaning apparatus 100, including a base and at least two rotating components 10 and at least two cleaning components 20 disposed on the base. The at least two rotating components 10 are horizontally disposed on the outer edge of the wafer 200 to support and drive the wafer 200 to rotate. The at least two cleaning components 20 are vertically disposed on both sides of the wafer 200 to clean the surface of the wafer 200. This wafer cleaning apparatus 100 can solve the problem that traditional roller devices easily press on the top or bottom surface of the wafer 200, causing the wafer 200 to break due to pressure.

[0028] It should be noted that the wafer cleaning apparatus 100 includes a base (not shown in the figure), at least two rotating components 10, and at least two cleaning components 20. The at least two rotating components 10 and at least two cleaning components 20 are disposed on the base, which serves as the mounting foundation for the entire wafer cleaning apparatus 100. The at least two rotating components 10 are horizontally distributed at the outer edge of the wafer 200. On one hand, the at least two rotating components 10 can serve as support members, supporting the wafer 200 through contact with its outer edge. On the other hand, the at least two rotating components 10 can also serve as driving members, driving the wafer 200 through contact with its outer edge. The contact mechanism drives the wafer 200 to rotate, ensuring that the wafer 200 remains rotating during the cleaning process. This allows for cleaning of each area of ​​the wafer 200, thereby improving the cleaning effect. At least two cleaning components 20 are vertically distributed on both sides of the wafer 200 (i.e., the top and bottom surfaces of the wafer 200). These components can function as cleaning parts. For example, the cleaning components 20 can employ cleaning methods such as spray heads or brushes to spray or brush the top and bottom surfaces of the wafer 200. Impurities on the surface of the wafer 200 are removed through water flow, cleaning fluid, and mechanical action, thus achieving the purpose of cleaning the surface of the wafer 200.

[0029] Traditional roller devices support the wafer 200 by directly contacting its top or bottom surface, which can easily lead to wafer breakage due to uneven pressure or mechanical friction. However, the wafer cleaning device 100 provided in this application supports only the outer edge of the wafer 200 through the rotating component 10, allowing the surface of the wafer 200 to be suspended. Furthermore, the cleaning component 20 cleans the surface of the wafer 200 from both sides (i.e., the upper and lower sides), avoiding direct pressure on the wafer surface. This structural design eliminates the risk of wafer breakage caused by support contact, making it particularly suitable for cleaning thin or high-precision wafers 200.

[0030] The rotating component 10 drives the wafer 200 to rotate continuously, ensuring that every area on the surface of the wafer 200 passes evenly within the effective range of the cleaning component 20. For example, the cleaning fluid sprayed by the spray head can evenly cover the entire surface of the wafer 200, and the brushing force can also be kept consistent, avoiding the residue of impurities caused by insufficient cleaning in some areas under traditional fixed support methods, thus improving the uniformity and consistency of the cleaning effect.

[0031] The layout of at least two rotating components 10 and at least two cleaning components 20 can be adjusted according to the size of the wafer 200 (such as adjusting the component spacing, height, etc.). Whether it is a small-sized wafer 200 or a large-sized wafer 200, it can be stably placed by means of outer edge support. Moreover, the cleaning components 20 can be adapted to wafer 200 surfaces of different thicknesses, which enhances the versatility of the device and reduces the equipment replacement cost caused by changes in wafer 200 specifications.

[0032] During the rotation of wafer 200, surface impurities are more easily removed under the combined action of centrifugal force and cleaning component 20, which can shorten the cleaning time compared to traditional static cleaning methods. At the same time, non-contact support reduces the risk of mechanical damage during the cleaning process. When combined with an automated control system, it can also achieve standardized operation of the cleaning process, reduce errors caused by human intervention, and improve overall cleaning efficiency and production safety.

[0033] As one possible implementation method, such as Figures 1 to 4 As shown, each rotating component 10 includes a first driving member 11 and a rolling member 12. The fixed end of the first driving member 11 is fixedly disposed on the base, and the output end of the first driving member 11 is connected to the rolling member 12 for transmission. The first driving member 11 is used to drive the rolling member 12 to rotate, so as to drive the wafer 200 to rotate synchronously.

[0034] It should be noted that each rotating component 10 includes a first driving element 11 and a rolling element 12. The fixed end of the first driving element 11 is fixedly mounted on the base, and its output end can be connected to the rolling element 12 through a transmission structure (such as a belt, gear, coupling, or reducer). When the first driving element 11 is activated, its output end transmits power to the rolling element 12, causing it to rotate around its own axis. The rolling element 12 can be a roller or a shaft, and its surface can have anti-slip textures or elastic material. When the rolling element 12 contacts the outer edge of the wafer 200, it drives the wafer 200 to rotate synchronously through friction. In this design, the first driving element 11 provides the power source, and the rolling element 12 directly contacts the edge of the wafer 200 and transmits rotational motion, forming a complete "drive-transmission-rotation" link.

[0035] The first driving component 11 (such as a servo motor) can precisely control the rotation speed and rotation angle, so that the rolling component 12 drives the wafer 200 to rotate at a set rate. For example, during the cleaning process, the rotation speed can be adjusted according to the type of impurities (such as high-speed rotation to enhance centrifugal force to remove particulate impurities, and low-speed rotation to cooperate with spraying for uniform cleaning), to ensure that every area on the surface of the wafer 200 can be uniformly cleaned, and to avoid cleaning blind spots caused by unstable rotation speed.

[0036] The contact area between the rolling element 12 and the outer edge of the wafer 200 is small and the pressure is uniform. Its surface material can be made of wear-resistant materials such as elastic rubber or ceramic, thereby reducing the contact friction coefficient and avoiding scratches or cracks on the edge of the wafer 200 caused by traditional hard rollers. At the same time, the rotational motion of the rolling element 12 is rolling friction, which is less likely to generate debris than sliding friction, ensuring the edge integrity of the wafer 200 during rotation.

[0037] The first drive unit 11 is directly connected to the rolling element 12, resulting in a short power transmission path and low loss, which ensures that the rolling element 12 obtains a stable torque output. Even if the size or weight of the wafer 200 changes, the first drive unit 11 can adjust the output power in real time through the feedback system to maintain the stable rotation speed of the rolling element 12, avoid rotational jamming caused by load fluctuations, make the cleaning process smoother, and improve the reliability of equipment operation.

[0038] The rotating assembly 10 adopts a modular design, and the first drive component 11 and the rolling component 12 can be independently disassembled and installed. When the rolling component 12 wears out due to long-term use, only the single rolling component 12 needs to be replaced to restore function, without having to disassemble the entire wafer cleaning device 100, thus reducing maintenance costs and downtime. At the same time, the standardized selection of the first drive component 11 also facilitates the procurement of spare parts and improves the convenience of equipment maintenance.

[0039] As one possible implementation method, such as Figures 1 to 4 As shown, a receiving groove 121 is provided along the outer edge of the rolling element 12, and the outer edge of the wafer 200 is received within the receiving groove 121. As one possible implementation, such as... Figures 1 to 4 As shown, the height of the receiving groove 121 is adapted to the thickness of the wafer 200 along the vertical direction.

[0040] It should be noted that a receiving groove 121 is formed at the outer edge of the rolling element 12, and the shape of the receiving groove 121 matches the outer edge contour of the wafer 200 (usually an arc or annular groove). When the wafer 200 is placed on the rotating assembly 10, its outer edge is embedded in the receiving groove 121, forming a "slot-type" support structure. The depth and width of the receiving groove 121 are designed to stably hold the edge of the wafer 200 without applying excessive pressure to the surface or sides of the wafer 200. This design allows the rolling element 12 to transmit power through the engagement of the receiving groove 121 with the edge of the wafer 200 during rotation, ensuring that the wafer 200 remains accurately positioned during rotation and does not shift in the horizontal direction (e.g., radial or tangential) due to centrifugal force or the impact of cleaning fluid.

[0041] The depth of the receiving groove 121 is typically greater than the thickness of the wafer 200, allowing wafers 200 of different thicknesses to be inserted into the outer edge (e.g., wafers 200 with a thickness of 1 mm and 0.5 mm can both fit into the same receiving groove 121). This design eliminates the need to adjust the structure of the rolling element 12, thus adapting to the cleaning needs of various wafer 200 specifications, enhancing the versatility of the device, and reducing equipment adjustment costs caused by variations in wafer 200 thickness.

[0042] Furthermore, such as Figure 4 As shown, the wafer cleaning apparatus 100 also includes a support platform 30. The support platform 30 can be fixedly mounted on the base by the fixed ends of the first drive members 11 of at least two rotating components 10 or by at least two pillars. The support platform 30 is provided with a through hole, and a support ring is formed extending along the bottom surface of the support platform 30 toward the center of the through hole. The wafer 200 can be placed in the through hole of the support platform 30 in a horizontal direction (or in a direction parallel to the horizontal plane), and the outer edge of the wafer 200 can overlap the top surface of the support ring (which can be flush with the top surface of the receiving groove 121), thereby improving the stability of the wafer 200 support.

[0043] As one possible implementation method, such as Figures 1 to 4 As shown, at least two rotating components 10 are uniformly distributed along the outer edge of the wafer 200.

[0044] It should be noted that, without interfering with the cleaning component 20, at least two rotating components 10 are evenly arranged along the outer edge of the wafer 200. That is, multiple rotating components 10 are distributed at equal angular intervals around the center of the wafer 200 (e.g., two rotating components 10 are symmetrically distributed at 180°, and three rotating components 10 are distributed at 120°). This arrangement ensures that the supporting force of each rotating component 10 on the edge of the wafer 200 is evenly distributed, forming a stable support structure. When the wafer 200 is placed on the rotating components 10, its weight is shared by multiple rotating components 10, and the contact points between each rotating component 10 and the outer edge of the wafer 200 are evenly distributed circumferentially, ensuring that the wafer 200 remains balanced during rotation and cleaning.

[0045] As one possible implementation method, such as Figures 1 to 4 As shown, each cleaning component 20 includes a second driving member 21, a rotating shaft 22, and a cleaning component 23. Two brackets are spaced apart on the base. The fixed end of the second driving member 21 is fixedly mounted on the bracket. The output end of the second driving member 21 is connected to the rotating shaft 22 for transmission. The rotating shaft 22 is rotatably mounted between the two brackets. The cleaning component 23 is sleeved on the rotating shaft 22. The second driving member 21 is used to drive the rotating shaft 22 to rotate, so as to drive the cleaning component 23 to rotate synchronously.

[0046] It should be noted that each cleaning assembly 20 includes a second drive component 21, a rotating shaft 22, and a cleaning component 23. Two supports are spaced apart on the base to serve as the support structure for the cleaning assembly 20. The fixed end of the second drive component 21 is mounted on the support, and the output end is connected to the rotating shaft 22 via a transmission structure (such as a belt, gear, coupling, or reducer). The two ends of the rotating shaft 22 are supported in the bearings of the two supports, allowing it to rotate freely. The cleaning component 23 (such as a hard brush, soft sponge, or porous spray arm) is fitted onto the rotating shaft 22 and fixedly connected to it. When the second drive component 21 is activated, it drives the rotating shaft 22 to rotate, thereby causing the cleaning component 23 to rotate synchronously, performing brushing 231 or spray cleaning on the surface of the wafer 200. In this structure, the supports provide stable support, the second drive component 21 is the power source, the rotating shaft 22 transmits power, and the cleaning component 23 directly performs the cleaning action, forming a complete transmission chain.

[0047] Different cleaning needs can be adapted by replacing different types of cleaning components 23 (such as hard brushes, soft sponges, or porous spray arms). Simultaneously, the second drive component 21 (such as a servo motor) can adjust the rotation speed of the rotating shaft 22. For example, high-speed rotation increases brush friction, suitable for removing stubborn impurities; low-speed rotation provides more even spraying, suitable for fine cleaning. This flexibility allows the device to handle various types of impurities on the wafer 200 surface, including particles, organic matter, and metal ions.

[0048] The design of two supports for the rotating shaft 22 avoids the wobbling or eccentricity that may occur with a single fulcrum. Even if the cleaning component 23 rotates at high speed or encounters resistance from contact with the wafer 200 surface, the rotating shaft 22 can maintain stable operation, reducing wear on the cleaning component 23 or scratches on the wafer 200 surface caused by vibration. At the same time, the second drive component 21 is fixed on the support, resulting in a short power transmission path, reducing transmission losses and ensuring the stability of the cleaning operation.

[0049] The cleaning assembly 20 adopts a modular design, and the cleaning component 23 can be directly removed and replaced from the rotating shaft 22 (e.g., after the brush wears out, it can be directly removed and replaced), without disassembling the entire cleaning assembly 20. The fixed connection between the bracket and the base also facilitates separate maintenance of the second drive component 21 or the bearing of the rotating shaft 22, reducing maintenance complexity. In addition, the standardized component structure can be adapted to cleaning components 23 of different sizes to meet the needs of diverse cleaning processes.

[0050] As one possible implementation method, such as Figures 1 to 4 As shown, the cleaning component 23 is provided with bristles 231. The cleaning component 23 is driven to rotate so that the bristles 231 come into contact with the surface of the wafer 200.

[0051] It should be noted that the surface of the cleaning component 23 is provided with bristles 231, which are typically made of soft and wear-resistant materials (such as nylon, polyester fiber, etc.) and are densely arranged. When the cleaning component 23 rotates under the drive of the second drive component 21, the bristles 231 rotate accordingly and come into contact with the surface of the wafer 200. Since the cleaning component 23 rotates synchronously with the rotating shaft 22, the bristles 231 remain in a stretched state under the action of centrifugal force, adhering to the surface of the wafer 200 with a certain pressure, and removing particulate impurities, organic residues, or metallic contaminants attached to the wafer 200 through mechanical friction. In this design, the rotational motion of the bristles 231 and the rotation of the wafer 200 form a compound motion, enhancing the cleaning effect on the surface of the wafer 200.

[0052] As one possible implementation method, such as Figures 1 to 4 As shown, an airflow channel is provided inside the rotating shaft 22, and a gas guide hole 232 is provided on the cleaning component 23. The gas guide hole 232 is connected to the gas supply device through the airflow channel, so that the processing gas provided by the gas supply device can flow to the surface of the wafer 200 through the gas guide hole 232. As one possible implementation, the processing gas is nitrogen, helium, or argon.

[0053] It should be noted that the rotating shaft 22 has an airflow channel running along its axial direction. One end of this airflow channel is connected to an external air supply device (such as an air pump or gas cylinder), and the other end extends to the mounting location of the cleaning component 23. The cleaning component 23 has multiple air guide holes 232, which are connected to the airflow channel within the rotating shaft 22, forming a gas transmission path. When the air supply device is activated, the processing gas (such as nitrogen, inert gas, or reactive gas) is delivered to the cleaning component 23 through the airflow channel and then sprayed onto the surface of the wafer 200 through the air guide holes 232. This design combines mechanical cleaning (brush 231 rotation) with gas treatment, allowing the cleaning component 23 to not only remove impurities through friction with the brush 231 during rotation but also simultaneously deliver gases with specific functions to the surface of the wafer 200, achieving a multi-dimensional cleaning effect.

[0054] When the high-pressure airflow is sprayed from the air guide hole 232 onto the surface of the wafer 200, it generates an impact force that loosens and blows away tiny particulate impurities. For submicron-sized particles that are difficult to remove by direct contact with the brush bristles 231, the gas impact can break the adhesion between the particles and the surface of the wafer 200, making them easier to be carried away by the cleaning fluid, thus improving the precision and thoroughness of the cleaning. This is especially suitable for the high-precision cleaning requirements in integrated circuit manufacturing.

[0055] When the gas supply device provides drying gas (such as nitrogen), the airflow injected through the vent 232 can quickly dry the cleaning solution residue on the surface of wafer 200, reducing water stain formation and drying time. At the same time, the continuous purging of inert gas can isolate oxygen, preventing the surface of wafer 200 (especially the metal layer) from oxidizing after cleaning, thus improving the surface quality of wafer 200 and the compatibility with subsequent processes (such as photolithography, coating, etc.).

[0056] If the gas supply device provides reactive gases (such as ozone, hydrogen fluoride, etc.), these gases can chemically react with specific contaminants on the surface of wafer 200, transforming them into easily cleanable substances. For example, ozone can oxidize organic matter, causing it to decompose, while hydrogen fluoride can remove metal oxides. This combination of chemical-assisted cleaning and mechanical scrubbing significantly improves the removal capacity of complex contaminants, reduces reliance on highly corrosive chemical reagents, and lowers environmental pollution and costs.

[0057] This application also provides a wafer 200 processing apparatus, including the wafer cleaning apparatus 100 described above. Since the structure and beneficial effects of the wafer cleaning apparatus 100 have been described in detail in the foregoing embodiments, they will not be repeated here.

[0058] The above description is merely an optional embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

[0059] It should also be noted that the various specific technical features described in the above embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, this application will not describe the various possible combinations separately.

Claims

1. A wafer cleaning apparatus, characterized in that, The wafer includes a base and at least two rotating components and at least two cleaning components disposed on the base. The at least two rotating components are disposed horizontally on the outer edge of the wafer to support and drive the wafer to rotate. The at least two cleaning components are disposed vertically on both sides of the wafer to clean the surface of the wafer.

2. The wafer cleaning apparatus according to claim 1, characterized in that, Each of the rotating components includes a first driving element and a rolling element. The fixed end of the first driving element is fixedly disposed on the base, and the output end of the first driving element is connected to the rolling element for transmission. The first driving element is used to drive the rolling element to rotate, so as to drive the wafer to rotate synchronously.

3. The wafer cleaning apparatus according to claim 2, characterized in that, A receiving groove is provided along the outer edge of the rolling element, and the outer edge of the wafer is received in the receiving groove.

4. The wafer cleaning apparatus according to claim 3, characterized in that, Along the vertical direction, the height of the receiving groove is adapted to the thickness of the wafer.

5. The wafer cleaning apparatus according to claim 1, characterized in that, At least two of the rotating components are uniformly distributed along the outer edge of the wafer.

6. The wafer cleaning apparatus according to claim 1, characterized in that, Each of the cleaning components includes a second drive component, a rotating shaft, and a cleaning component. Two brackets are spaced apart on the base. The fixed end of the second drive component is fixedly mounted on the bracket. The output end of the second drive component is connected to the rotating shaft for transmission. The rotating shaft is rotatably mounted between the two brackets. The cleaning component is sleeved on the rotating shaft. The second drive component is used to drive the rotating shaft to rotate, so as to drive the cleaning component to rotate synchronously.

7. The wafer cleaning apparatus according to claim 6, characterized in that, The cleaning element is provided with bristles, and the cleaning element is driven to rotate so that the bristles come into contact with the surface of the wafer.

8. The wafer cleaning apparatus according to claim 6, characterized in that, An airflow channel is provided inside the rotating shaft, and an air guide hole is provided on the cleaning component. The air guide hole is connected to the air supply device through the airflow channel, so that the processing gas provided by the air supply device can flow to the surface of the wafer through the air guide hole.

9. The wafer cleaning apparatus according to claim 8, characterized in that, The processing gas is nitrogen, helium, or argon.

10. A wafer processing equipment, characterized in that, Includes the wafer cleaning apparatus according to any one of claims 1 to 9.

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