Peeling apparatus for peeling a substrate protection frame from a substrate

Abstract

The utility model provides a kind of stripping equipment for peeling off substrate protection frame from substrate, it includes control unit, stage, heating module, first clamp module and lifting mechanism, wherein stage is used to support and fix substrate, and substrate has protective frame assembly adhered on it.Heating module is used to heat the adhesive layer between substrate and protective frame assembly.First clamp module includes two first clamps and two first moving mechanisms, and two first moving mechanisms are respectively connected to two first clamps, and control unit can control two first moving mechanisms by first actuating unit, so that two first clamps can clamp protective frame assembly.Lifting mechanism is arranged below stage, and control unit can make lifting mechanism move downward by second actuating unit, thereby making protective frame assembly peel off from substrate, so that protective frame assembly is still intact when peeling off from substrate, and using automated way to peel off can improve peeling efficiency.

Description

Technical Field

[0001] This utility model relates to a peeling device for peeling a substrate protective frame from a substrate, and more particularly to an automatic peeling device that can automatically peel the substrate protective frame assembly from the substrate. Background Technology

[0002] In today's society, people's lives are filled with more and more communication and consumer electronics products (3C electronic products), which has led to an increasing demand for semiconductor chips. The manufacturing process of semiconductor chips is very complicated, including processes such as deposition, photolithography, development, etching, and cleaning.

[0003] In these manufacturing processes, the photolithography process primarily involves placing a photomask on the semiconductor. The photomask is etched with circuit patterns, and then ultraviolet light is shone onto it, transferring the circuit patterns onto the semiconductor. Currently, semiconductor chip manufacturing is generally carried out in a cleanroom environment. This is because semiconductor chips are extremely small; if even a speck of dust adheres to the photomask, it could affect the yield of subsequent semiconductor production. Therefore, semiconductor chip manufacturing must be conducted in a cleanroom to prevent the photomask from being contaminated by airborne particles. However, current cleanrooms cannot achieve a completely dust-free state. Therefore, when using a photomask, a protective frame is used to place a thin film over the photomask to ensure it remains clean.

[0004] Currently, the removal of the protective frame assembly (i.e., the combination of the protective frame and the film) from the photomask is partially done manually. However, the protective frame assembly is fragile, and this often results in damage during operation, rendering the removed assembly unusable. Furthermore, manual peeling of the protective frame assembly from the photomask can lead to improper handling and damage to the photomask. Therefore, there is still a demand in the industry for equipment that automatically separates the protective frame assembly from the substrate. Utility Model Content

[0005] The main objective of this invention is to provide a peeling device for separating a protective frame from a substrate. This device utilizes a control unit to control a heating module, a first clamping module, a second clamping module, and a lifting mechanism to automatically separate the protective frame assembly from the substrate. This ensures the protective frame assembly remains intact during peeling, and the automated process improves peeling efficiency. Furthermore, this automatic peeling device is applicable to photomasks and protective frame assemblies of different sizes, demonstrating high versatility.

[0006] To achieve any of the above objectives, this utility model provides a peeling device for peeling a protective frame from a substrate. The device includes a control unit, a platform, a heating module, a first clamping module, and a lifting mechanism. The platform supports the substrate, and a protective frame assembly is adhesively bonded to the surface of the substrate, with an adhesive layer between the substrate and the protective frame assembly. The heating module is electrically connected to the control unit and is positioned below the platform and controlled by the control unit to heat the adhesive layer between the substrate and the protective frame assembly. The first clamping module includes two first clamps and two first moving mechanisms positioned on opposite sides of the platform. The two first moving mechanisms are respectively connected to the two first clamps and are connected to at least one first actuation unit. The first actuation unit is electrically connected to and controlled by the control unit, enabling the two first moving mechanisms to move towards each other, thereby allowing the two first clamps to clamp or release the protective frame assembly. The lifting mechanism is located below the stage and the heating module and is connected to the second actuation unit. The second actuation unit is electrically connected to the control unit and is controlled by the control unit. When the two first clamps move to both sides of the protective frame assembly and clamp and fix the protective frame assembly, and the heating module heats the adhesive layer for a period of time, the second actuation unit will cause the lifting mechanism to move downward, thereby driving the substrate downward and causing the protective frame assembly to peel off from the substrate.

[0007] In one embodiment of the present invention, the platform has a plurality of abutting members for fixing a substrate placed on the platform.

[0008] In one embodiment of this utility model, the multiple abutting members are four abutting members, which are respectively disposed at the four corners of the platform. When the substrate and the protective frame assembly are placed on the platform, the four abutting members will rotate onto the substrate and fix the substrate in place.

[0009] In one embodiment of the present invention, the protective frame assembly has at least one positioning hole on each side, and the first clamp has at least one positioning element on the side facing the protective frame assembly. The positioning element is correspondingly disposed in the positioning hole, and the positioning hole is used to receive the positioning element, so that the two first clamps clamp and fix the protective frame assembly.

[0010] In one embodiment of the present invention, the peeling device for peeling the substrate protective frame from the substrate further includes a second clamping module. The second clamping module includes two second clamps and two second moving mechanisms disposed on the other opposite sides of the stage. The two second moving mechanisms are respectively connected to the two second clamps, and the two second moving mechanisms are connected to at least one third actuation unit. The third actuation unit is electrically connected to the control unit and is controlled by the control unit to move the two second moving mechanisms toward each other, thereby allowing the two second clamps to carry the protective frame assembly peeled from the substrate.

[0011] In one embodiment of the present invention, the peeling device for peeling the substrate protective frame from the substrate further includes a protective frame assembly placement part, which is disposed at one side of the stage for placing the peeled protective frame assembly.

[0012] In one embodiment of this utility model, the heating module includes at least one of an electric heating tube heating module, a coil heating module, a ceramic heating module, a microwave tube heating module, a quartz tube heating module, an infrared heating module, and a halogen lamp heating module.

[0013] In one embodiment of this utility model, the first moving mechanism and the second moving mechanism are slide rail moving mechanisms.

[0014] In one embodiment of this utility model, the first actuation unit and the third actuation unit are one of a stepper motor, a servo motor and a linear motor.

[0015] In one embodiment of this utility model, the second actuation unit is a pneumatic cylinder or a hydraulic cylinder.

[0016] In summary, the peeling device of this invention for separating the substrate protective frame from the substrate utilizes a control unit to control all mechanisms, thereby automating the peeling operation between the substrate and the protective frame assembly. The peeling method involves fixing the substrate to a platform and the protective frame assembly to a first clamping module, then using a lifting mechanism below the platform to pull the substrate downwards, allowing the protective frame assembly to be peeled off the substrate without damage. This enables the protective frame assembly to be reused, saving labor, time, and capital costs while improving peeling efficiency. Furthermore, the automatic peeling device of this invention is applicable to photomasks and protective frame assemblies of different sizes, demonstrating high versatility. Attached Figure Description

[0017] Figure 1 This is a perspective view of the automatic peeling device according to an embodiment of the present utility model.

[0018] Figure 2 This is a three-dimensional schematic diagram of the automatic peeling device in its initial state according to an embodiment of the present invention.

[0019] Figure 3 This is a three-dimensional schematic diagram of the automatic peeling device after performing the first step according to an embodiment of the present invention.

[0020] Figure 4 This is a three-dimensional schematic diagram of the automatic peeling device after performing the second step according to an embodiment of the present invention.

[0021] Figure 5 This is a three-dimensional schematic diagram of the automatic peeling device after performing the third step according to an embodiment of the present invention.

[0022] Figure 6 This is a perspective view of the automatic peeling device after performing the fourth step according to an embodiment of the present invention.

[0023] Figure 7 This is a three-dimensional schematic diagram of the automatic peeling device after performing the fifth step according to an embodiment of the present invention.

[0024] Figure 8 This is a system block diagram of the automatic peeling device according to an embodiment of the present utility model.

[0025] Explanation of symbols in the diagram:

[0026] 1: Platform; 11: Support component; 12: First clamping module; 121: First clamp; 13: Second clamping module;

[0027] 131: Second clamp; 2: Lifting mechanism; 3: Protective frame assembly placement area; 100: Base plate; 200: Protective frame assembly;

[0028] CTR: Control Unit; H: Heating Module; MV1: First Moving Mechanism; MV2: Second Moving Mechanism;

[0029] M1: First actuation unit; M2: Second actuation unit; M3: Third actuation unit; P_B: Positioning element; P_H: Positioning hole. Detailed Implementation

[0030] Please refer to this as well. Figure 1 , Figure 2 , Figure 8 , Figure 1 This is a perspective view of the automatic peeling device according to an embodiment of the present utility model. Figure 2 This is a perspective view of the automatic peeling device in its initial state according to an embodiment of the present invention. Figure 8 This is a system block diagram of the automatic peeling device according to an embodiment of the present invention. The peeling device of the present invention for peeling a substrate protective frame from a substrate includes a control unit CTR, a stage 1, a heating module H, a first clamping module 12, a second clamping module 13, and a lifting mechanism 2. The heating module H is electrically connected to the control unit CTR and is disposed below the stage 1. The control unit CTR can heat the adhesive layer between the substrate 100 and the protective frame assembly 200 placed on the stage 1 via the heating module H (e.g., ...). Figure 3(As shown). Further explanation: The heating module H includes at least one of an electric heating tube heating module, a coil heating module, a ceramic heating module, a microwave tube heating module, a quartz tube heating module, an infrared heating module, and a halogen lamp heating module; however, the type of heating module H used in this invention is not limited to the above. Furthermore, in the embodiments of this invention, the substrate used is a photomask, and the protective frame assembly includes a protective frame containing a thin film for protecting the photomask; however, this invention is not limited to the types of substrate and protective frame assembly.

[0031] The first clamping module 12 includes two first clamps 121 and two first moving mechanisms MV1. The two first clamps 121 are respectively disposed on opposite sides of the platform 1, and the two first moving mechanisms MV1 are respectively connected to the two first clamps 121. The two first moving mechanisms MV1 are also connected to at least one first actuation unit M1, which is electrically connected to a control unit CTR. The control unit CTR causes the two first moving mechanisms MV1 to move towards each other via the first actuation unit M1, thereby allowing the two first clamps 121 to clamp or release the protective frame assembly 200 (e.g., ...). Figure 3 (As shown).

[0032] The second clamping module 13 includes two second clamps 131 and two second moving mechanisms MV2. The two second clamps 131 are respectively disposed on the other opposite sides of the stage 1, and the two second moving mechanisms MV2 are respectively connected to the two second clamps 131. The two second moving mechanisms MV2 are also connected to at least one third actuation unit M3, which is electrically connected to the control unit CTR. The control unit CTR causes the two second moving mechanisms MV2 to move towards each other through the third actuation unit M3, so that the two second clamps 131 can carry the protective frame assembly 200 (e.g., detached from the substrate 100) peeled off from the substrate 100. Figure 3 (As shown). Further explanation: the first moving mechanism MV1 and the second moving mechanism MV2 are slide rail moving mechanisms, and the first actuation unit M1 and the third actuation unit M3 are one of a stepper motor, a servo motor, and a linear motor, but this utility model is not limited to these.

[0033] Incidentally, considering versatility, the automatic peeling device of this invention can be designed to be suitable for photomasks and protective frame assemblies of different sizes. Furthermore, markings can be made on the platform 1 to indicate the center point. By placing photomasks and protective frame assemblies of different sizes on it, and by increasing the distance that the first moving mechanism MV1 and the second moving mechanism MV2 can move, the automatic peeling device of this invention can be designed to be suitable for photomasks and protective frame assemblies of different sizes.

[0034] The lifting mechanism 2 is located below the platform 1 and the heating module H, and is connected to the second actuation unit M2. The second actuation unit M2 is electrically connected to the control unit CTR, and the control unit CTR can cause the lifting mechanism 2 to lift or lower via the second actuation unit M2. It should be noted that the second actuation unit M2 is a pneumatic cylinder or a hydraulic cylinder, but this invention is not limited to these.

[0035] Next, please refer to Figures 2 to 7 and Figure 8 , Figure 2 This is a perspective view of the automatic peeling device in its initial state according to an embodiment of the present invention. Figure 3 This is a perspective view of the automatic peeling device after performing the first step according to an embodiment of the present invention. Figure 4 This is a perspective view of the automatic peeling device after performing the second step according to an embodiment of the present invention. Figure 5 This is a perspective view of the automatic peeling device after performing the third step according to an embodiment of the present invention. Figure 6 This is a perspective view of the automatic peeling device after performing the fourth step according to an embodiment of the present invention. Figure 7 This is a perspective view of the automatic peeling device after performing the fifth step according to an embodiment of the present invention. Before performing the peeling operation between the substrate 100 and the protective frame assembly 200, firstly as follows... Figure 2 As shown, when the substrate 100 and the protective frame assembly 200 are not mounted on the stage 1 (e.g.) Figure 3 As shown), the two first clamps 121 of the first clamping module 12 and the two second clamps 131 of the second clamping module 13 will be a certain distance away from the stage 1 to facilitate the placement of the substrate 100 and the protective frame assembly 200 on the stage 1 (as shown). Figure 3 (As shown).

[0036] Perform the first step, then as follows Figure 3 As shown, the substrate 100 and the protective frame assembly 200 are placed on the stage 1, wherein each of the four corners of the stage 1 is provided with a stop member 11, and the four stop members 11 can be rotated onto the substrate 100 to fix the substrate 100.

[0037] After the abutment 11 fixes the substrate 100, the second step is performed, such as... Figure 4 As shown, the control unit CTR (such as Figure 8As shown, the first actuation unit M1 controls two first moving mechanisms MV1 to move towards each other, causing the two first clamps 121 to clamp the protective frame assembly 200. The protective frame assembly 200 has at least one positioning hole P_H on each of its two sides facing the two first clamps 121, and each of the two first clamps 121 has at least one positioning element P_B on one side facing the protective frame assembly 200. The positioning element P_B is correspondingly positioned in the positioning hole P_H, so that when the two first clamps 121 clamp the protective frame assembly 200, the positioning hole P_H receives the positioning element P_B, thereby enhancing the stability of the two first clamps 121 clamping the protective frame assembly 200. Then, the control unit CTR (such as...) Figure 8 As shown, the heating module H will control the heating module H to heat the adhesive layer between the substrate 100 and the protective frame assembly 200 in order to melt the adhesive layer by heating.

[0038] Then proceed to the third step, such as Figure 5 As shown, after the heating module H heats for a period of time, and after the two first clamps 121 clamp the protective frame assembly 200, the control unit CTR will activate the second actuation unit M2 (as shown in the image). Figure 8 As shown, the lifting mechanism 2 moves downward. At this time, the base plate 100 is fixed on the platform 1 by the four abutment members 11 (as shown). Figure 4 As shown in the figure, the lifting mechanism 2 can pull the substrate 100 down together with the platform 1, so that the substrate 100 is separated from the protective frame assembly 200.

[0039] After the protective frame assembly 200 is peeled off from the substrate 100, proceed to the fourth step, such as... Figure 6 As shown, the control unit CTR will activate the third actuation unit M3 (such as...) Figure 8 (As shown) Control the two second moving mechanisms MV2 to move towards each other, so that the two second clamps 131 approach the protective frame assembly 200, and use the grooves on the two second clamps 131 to support the protective frame assembly 200.

[0040] After confirming that the protective frame assembly 200 is securely supported by the two second clamps 131, proceed to the fifth step, such as... Figure 7 As shown, the control unit CTR controls the two first clamps 121 to release the protective frame assembly 200 via the first actuation unit M1. Finally, the user can manually or the robotic arm can automatically place the protective frame assembly 200 into the protective frame assembly placement section 3 (e.g., Figure 1 As shown), the control unit CTR will control the first clamping module 12, the second clamping module 13, and the lifting mechanism 2 to return them to their initial positions (as shown). Figure 2 (as shown), so that the next peeling operation of the substrate 100 and the protective frame assembly 200 can be carried out.

[0041] In summary, the peeling device of this invention for separating the substrate protective frame from the substrate utilizes a control unit to control the stage, heating module, first clamping module, second clamping module, and lifting mechanism to perform automated peeling operations on the substrate and protective frame assembly, saving labor and time costs and improving peeling efficiency. The peeling method involves fixing the substrate to the stage and the protective frame assembly to the first clamping module, then heating the adhesive layer between the substrate and the protective frame assembly to melt the adhesive layer, and finally using the lifting mechanism to pull the substrate down, allowing the protective frame assembly to be peeled off the substrate without damage. This allows the protective frame assembly to be reused, saving on operating costs. Furthermore, the automatic peeling device of this invention is applicable to photomasks and protective frame assemblies of different sizes, exhibiting high versatility and eliminating the need for manufacturers to purchase a separate automatic peeling device for each size of photomask and protective frame assembly.

[0042] The above-described embodiments are merely preferred embodiments provided to fully illustrate the present utility model, and the protection scope of the present utility model is not limited thereto. Equivalent substitutions or modifications made by those skilled in the art based on the present utility model, or reasonable combinations of solutions from various embodiments, are all within the protection scope of the present utility model.

Claims

1. A peeling device for peeling a substrate protective frame from a substrate, characterized in that, Include: One control unit (CTR); A stage (1) is used to support a substrate (100), wherein a protective frame assembly (200) is provided on a surface of the substrate (100), and an adhesive layer is provided between the substrate (100) and the protective frame assembly (200). A heating module (H), electrically connected to the control unit (CTR), is disposed below the stage (1) and controlled by the control unit (CTR) for heating the adhesive layer between the substrate (100) and the protective frame assembly (200); A first clamping module (12) includes two first clamps (121) disposed on opposite sides of the platform (1) and two first moving mechanisms (MV1), wherein the two first moving mechanisms (MV1) are respectively connected to the two first clamps (121), and at least one first actuation unit (M1) connected to the two first moving mechanisms (MV1) is electrically connected to the control unit (CTR); and A lifting mechanism (2) is disposed below the platform (1) and the heating module (H) and connected to a second actuation unit (M2), wherein the second actuation unit (M2) is electrically connected to the control unit (CTR).

2. The peeling device for peeling a substrate protective frame from a substrate as described in claim 1, characterized in that, The platform (1) has a plurality of abutments (11) for fixing the substrate (100) placed on the platform (1).

3. The peeling device for peeling a substrate protective frame from a substrate as described in claim 2, characterized in that, The plurality of abutting members (11) are four abutting members (11), which are respectively disposed at the four corners of the platform (1). The substrate (100) and the protective frame assembly (200) are placed on the platform (1). The four abutting members (11) are rotated onto the substrate (100) to fix the substrate (100).

4. The peeling device for peeling a substrate protective frame from a substrate as described in claim 1, characterized in that, The protective frame assembly (200) has at least one positioning hole (P_H) on each side, and the first clamp (121) has at least one positioning element (P_B) on the side facing the protective frame assembly (200). The positioning element (P_B) is correspondingly disposed in the positioning hole (P_H), and the positioning hole (P_H) is used to receive the positioning element (P_B) so that the two first clamps (121) clamp and fix the protective frame assembly (200).

5. The peeling apparatus for peeling a substrate protective frame from a substrate as described in claim 1, characterized in that, Further includes: A second clamping module (13) includes two second clamps (131) disposed on the other opposite sides of the platform (1) and two second moving mechanisms (MV2), wherein the two second moving mechanisms (MV2) are respectively connected to the two second clamps (131), and at least one third actuation unit (M3) connected to the two second moving mechanisms (MV2) is electrically connected to the control unit (CTR).

6. The peeling apparatus for peeling a substrate protective frame from a substrate as described in claim 1, characterized in that, Further includes: A protective frame assembly placement section (3) is provided on one side of the platform (1) for placing the peeled protective frame assembly (200).

7. The peeling apparatus for peeling a substrate protective frame from a substrate as described in claim 1, characterized in that, The heating module (H) includes at least one of an electric heating tube heating module, a coil heating module, a ceramic heating module, a microwave tube heating module, a quartz tube heating module, an infrared heating module, and a halogen lamp heating module.

8. The peeling apparatus for peeling a substrate protective frame from a substrate as described in claim 5, characterized in that, The first moving mechanism (MV1) and the second moving mechanism (MV2) are slide rail moving mechanisms.

9. The peeling apparatus for peeling a substrate protective frame from a substrate as described in claim 5, characterized in that, The first actuation unit (M1) and the third actuation unit (M3) are one of the following: stepper motor, servo motor and linear motor.

10. The peeling apparatus for peeling a substrate protective frame from a substrate as described in claim 1, characterized in that, The second actuation unit (M2) is a pneumatic cylinder or a hydraulic cylinder.

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