A target structure and acceleration tube

Abstract

The application discloses a target structure and an acceleration tube, relates to the technical field of medical equipment, and aims to solve the technical problem of poor heat dissipation of a ray target in the prior art, which leads to thermal failure. The target structure comprises a target, a first cooling device and a second cooling device. The first cooling device is located at the bottom of the target, the second cooling device is located at the circumferential side of the target, and the first cooling device contains flowing cooling medium.

Description

Technical Field

[0001] This application relates to the field of medical device technology, and in particular to a target structure and an accelerator tube. Background Technology

[0002] Medical linear accelerators use microwave electric fields to accelerate electrons to higher energies in a straight line. The accelerator tube is filled with a microwave electric field. When electrons are emitted from the electron gun and enter the accelerator tube, they are continuously accelerated under the influence of the microwave electric field, gaining sufficient energy. The accelerated high-energy electron beam is guided to a radiation target. When the high-energy electrons collide with the radiation target, they suddenly decelerate, and according to electromagnetic radiation theory, high-energy photons, i.e., X-rays, are generated. These X-rays are then adjusted by components such as collimators and homogenizers to form a radiation beam suitable for treatment, used for precise irradiation of tumors.

[0003] The accelerator tube is the core component of a medical linear accelerator, used to treat patients with X-rays. The accelerator tube generates X-rays by accelerating electrons within the tube to bombard a target. Typically, the conversion rate is only 1%-2%, with 98%-99% of the electron kinetic energy being converted into heat and deposited on the target. Poor heat dissipation from the target can lead to thermal failure, reducing its lifespan.

[0004] In related technologies, heat dissipation devices are designed with multiple heat dissipation points around the circumference of the X-ray target. A water-cooling system dissipates heat from these points, with the temperature controlled at a fixed value and the flow rate adjustable individually, although the flow velocity is difficult to control. However, due to the need to dissipate heat from multiple points, the designed piping structure is complex, resulting in a low flow velocity of the cooling medium within the pipes. The heat generated by the X-ray target in the accelerating tube differs by orders of magnitude from the heat generated by other heat-generating points, leading to inadequate cooling of the X-ray target and making it prone to damage. Utility Model Content

[0005] The purpose of this application is to provide a target structure and an accelerator tube to solve the technical problem of thermal failure caused by poor heat dissipation of X-ray targets in related technologies.

[0006] To achieve the above objectives, this application adopts the following technical solution:

[0007] In a first aspect, this application provides a target structure, including a target, a first cooling device and a second cooling device, wherein the first cooling device is located at the bottom of the target and the second cooling device is located on the periphery of the target, and the first cooling device contains a flowing cooling medium.

[0008] During the operation of the accelerator tube, the portion of the target attacked by the high-speed electron beam generates a large amount of heat, forming a concentrated heat-generating area. This application incorporates a first cooling device at the bottom corresponding to this concentrated heat-generating area, which can promptly remove the large amount of heat generated and conducted to the bottom during operation. This effectively reduces the temperature of the concentrated heat-generating area of ​​the target, preventing performance degradation, deformation, or even damage due to localized overheating, thus ensuring the structural integrity of the target.

[0009] Furthermore, in practical applications, the periphery of the target also generates a significant amount of heat due to energy interaction. Since the second cooling device is located on the periphery of the target, it can cool the target circumferentially, achieving all-around cooling. This prevents excessively high temperatures on the target periphery from adversely affecting the target structure. Moreover, uniform circumferential cooling helps maintain the target's temperature uniformity, preventing thermal stress within the target material caused by uneven temperature distribution, thereby improving the overall performance and service life of the target.

[0010] Furthermore, since the first cooling device cools the bottom of the target structure (i.e., the concentrated heat-generating area), while the second cooling device cools the periphery of the target, the two devices complement each other, forming a three-dimensional cooling network. In actual operation, when the target is bombarded by an electron beam and generates heat, the first cooling device rapidly reduces the temperature of the bottom corresponding to the concentrated heat-generating area, preventing heat from being conducted from the bottom to other parts; simultaneously, the second cooling device cools the periphery of the target, preventing heat from accumulating on the periphery and spreading to the top or other directions. This three-dimensional cooling method can more effectively control the overall temperature of the target, avoid localized overheating, and ensure that the target structure remains within a suitable operating temperature range in all parts.

[0011] In some embodiments of this application, the first cooling device includes: a first flow channel, a second flow channel, and a third flow channel connected in sequence, wherein the cross-sectional area of ​​the second flow channel is smaller than the cross-sectional areas of the first flow channel and the third flow channel; and a cooling medium flows within the first flow channel, the second flow channel, and the third flow channel.

[0012] In some embodiments of this application, the ratio of the major axis to the minor axis of the cross-section of the second flow channel is greater than 1, so as to increase the heat conduction area of ​​the second flow channel.

[0013] In some embodiments of this application, the orthographic projection of the second channel onto the first plane at least partially coincides with the orthographic projection of the target onto the first plane, wherein the first plane is a plane perpendicular to the extension direction from the top to the bottom of the target.

[0014] In some embodiments of this application, the first cooling device includes an inlet and an outlet for conveying a cooling medium, the inlet and outlet being located on opposite sides of the bottom of the target along the flow direction of the cooling medium.

[0015] In some embodiments of this application, the second cooling device includes a heat dissipation substrate and a third cooling device disposed within the heat dissipation substrate, the third cooling device including a heat pipe assembly and / or a cooling jacket assembly.

[0016] In some embodiments of this application, the third cooling device includes a cooling jacket assembly containing a circulating cooling medium, and the cooling jacket assembly is not in communication with the first cooling device.

[0017] In some embodiments of this application, when the third cooling device includes a heat pipe assembly, the heat pipe assembly may include a heat pipe, which is arranged to spirally wrap around the target along the axial direction of the target structure, and the heat pipe is thermally connected to the target structure; the heat pipe assembly may include multiple heat pipes, which are arranged at intervals along the circumference of the target, and all of the multiple heat pipes are thermally connected to the target.

[0018] In some embodiments of this application, the outer surface of the heat dissipation substrate is provided with heat dissipation fan fins, and the heat dissipation fan fins are thermally connected to the heat dissipation substrate.

[0019] In some embodiments of this application, the second cooling device may also be a gradient heat dissipation component; the gradient heat dissipation component is disposed around the target, and the gradient heat dissipation component includes a multi-layer gradient heat dissipation material layer with a thermal conductivity rate that increases sequentially from the direction closer to the target to the direction farther away from the target.

[0020] Secondly, this application also provides an accelerator tube, including the target structure described in the first aspect.

[0021] The technical effects brought about by the second aspect described above can be referred to the technical effects brought about by the corresponding embodiments in the first aspect, and will not be repeated here. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is one of the schematic diagrams of a target structure provided in an embodiment of this application;

[0024] Figure 2 This is one of the schematic diagrams of a target structure provided in an embodiment of this application;

[0025] Figure 3 This is the third schematic diagram of a target structure provided in the embodiments of this application;

[0026] Figure 4 This is a partial structural diagram of an accelerator tube provided in an embodiment of this application.

[0027] Figure label:

[0028] 1000-accelerator tube;

[0029] 100 - Target structure; 200 - Accelerator tube body;

[0030] 10-Target; 11-Concentrated heat zone;

[0031] 20 - Heat dissipation substrate;

[0032] 30 - First cooling device; 31 - First flow channel; 32 - Second flow channel; 33 - Third flow channel; 34 - Inlet; 35 - Outlet;

[0033] 40 - Second cooling device; 41 - Third cooling device; 42 - Gradient heat dissipation assembly; 421 - Oxygen-free copper layer; 422 - Molybdenum alloy layer; 423 - Graphite layer;

[0034] 50 - Thermal conductive component;

[0035] 60 - Fourth cooling device. Detailed Implementation

[0036] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0037] In this article, the term "and / or" is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone.

[0038] The terms "first" and "second," etc., used in the specification and drawings of this application are used to distinguish different objects or to distinguish different treatments of the same object, rather than to describe a specific order of objects.

[0039] Furthermore, the terms "comprising" and "having," and any variations thereof, used in the description of this application are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the steps or units listed, but may optionally include other steps or units not listed, or may optionally include other steps or units inherent to such process, method, product, or apparatus.

[0040] It should be noted that in the embodiments of this application, the words "exemplary" or "for example" are used to indicate examples, illustrations, or explanations. Any embodiment or design scheme described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design schemes. Specifically, the use of the words "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0041] In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0042] First, for ease of understanding, the terms used in this application will be explained.

[0043] A radiation target (or target) is a component in a radiation-generating device that interacts with high-speed particles (such as electrons and ions) to produce specific types of radiation (such as X-rays and gamma rays). When high-speed particles bombard the radiation target, the atoms of the target material are excited, and their inner-shell electrons transition to higher energy levels. Subsequently, outer-shell electrons transition to inner-shell electrons to fill the vacancies, and the excess energy is released as photons, forming radiation. Different target materials and particle bombardment conditions will produce radiation with different energies and characteristics. The material, structure, and performance of the radiation target directly affect the intensity, energy distribution, and radiation characteristics of the radiation.

[0044] Accelerator tubes typically consist of electrodes, a focusing system, and a vacuum system. The electrodes apply a specific electric field to provide acceleration to charged particles, enabling them to achieve higher speeds and energies. The focusing system ensures that the particle beam maintains minimal divergence during acceleration, preserving beam stability and directionality. The vacuum system reduces collisions between particles and gas molecules during acceleration, minimizing energy loss and ensuring optimal acceleration. Accelerator tubes can be categorized into traveling-wave and standing-wave types based on their acceleration principles. In medical linear accelerators, accelerator tubes accelerate electrons to high-energy states for use in radiotherapy of tumors.

[0045] An accelerator is a device that uses electric and magnetic fields to give charged particles higher energy. It includes a particle source, an acceleration system, a beam transport system, a vacuum system, and a control system. The particle source generates initial charged particles, the acceleration system (such as an accelerator tube) accelerates the particles, the beam transport system guides and controls the trajectory of the particle beam, the vacuum system ensures that the particles are not disturbed by gas during acceleration, and the control system precisely regulates the operating state of each part of the accelerator. Accelerators can accelerate particles to near the speed of light, producing high-energy particle beams or rays.

[0046] The accelerator tube is the core component of a medical linear accelerator, used to treat patients with X-rays. The accelerator tube generates X-rays by accelerating electrons within the tube to bombard a target. Typically, the conversion rate is only 1%-2%, with 98%-99% of the electron kinetic energy being converted into heat and deposited on the target. Poor heat dissipation from the target can lead to thermal failure, reducing its lifespan.

[0047] In related technologies, heat dissipation devices are designed with multiple heat dissipation points around the circumference of the X-ray target, and a water cooling system is used to dissipate heat from these points. However, because multiple heat dissipation points need to be cooled, the designed pipe structure is complex, resulting in a low flow rate of the cooling medium within the pipes. Consequently, the X-ray target is not adequately cooled, making it prone to damage.

[0048] Based on this, firstly, an embodiment of this application provides a target structure, please refer to... Figure 1 , Figure 1 This illustration shows a schematic diagram of a target structure provided in an embodiment of this application.

[0049] The target structure 100 includes a target 10, a first cooling device 30, and a second cooling device 40. For example, the target 10 can be made of tungsten alloy, and trace elements such as rhenium can be added to the tungsten alloy to improve fatigue life.

[0050] The first cooling device 30 is located at the bottom of the target 10, and the second cooling device 40 is located around the target 10. The first cooling device 30 contains a flowing cooling medium. For example, the cooling medium can be water, an aqueous solution of ethylene glycol, or an aqueous solution of propylene glycol, etc.

[0051] During the operation of the accelerating tube, the portion of the target 10 subjected to high-speed electron beam attack generates a large amount of heat, forming a concentrated heat-generating area. This application incorporates a first cooling device 30 at the bottom corresponding to this concentrated heat-generating area, which can promptly remove the large amount of heat generated and conducted to the bottom by the target 10 during operation. This effectively reduces the temperature of the concentrated heat-generating area of ​​the target 10, preventing performance degradation, deformation, or even damage due to localized overheating, thus ensuring the structural integrity of the target 10.

[0052] Furthermore, in actual operation, the periphery of the target 10 also generates a large amount of heat due to energy action. Since the second cooling device 40 is located on the periphery of the target 10, it can cool the target 10 circumferentially, achieving all-round cooling of the target 10. In this way, uniform circumferential cooling helps to maintain the temperature uniformity of the target 10, avoiding the generation of thermal stress inside the target 10 material due to uneven temperature, thereby improving the overall performance and service life of the target 10.

[0053] Furthermore, since the first cooling device 30 can cool the bottom of the target 10 (i.e., the target's concentrated heat-generating area 11), while the second cooling device 40 can cool the periphery of the target 10, the two complement each other, forming a three-dimensional cooling network. In actual operation, when the target 10 is bombarded by an electron beam and generates heat, the first cooling device 30 rapidly reduces the temperature of the bottom corresponding to the concentrated heat-generating area of ​​the target 10, preventing heat from being conducted from the bottom to other parts; simultaneously, the second cooling device 40 cools the periphery of the target 10, preventing heat from accumulating on the periphery of the target 10 and spreading to the top or other directions. This three-dimensional cooling method can more effectively control the overall temperature of the target 10, avoid local overheating, and ensure that the target structure 100 is maintained within a suitable operating temperature range in all parts.

[0054] Please continue reading. Figure 1 In some embodiments of this application, the first cooling device 30 includes a first flow channel 31, a second flow channel 32, and a third flow channel 33, which are sequentially connected. The cross-sectional area of ​​the second flow channel 32 is smaller than that of the first and third flow channels 31 and 33. Cooling media flow within the first, second, and third flow channels 31 and 33. The second flow channel 32 is capable of heat exchange with the bottom of the concentrated heat-generating area 11 of the target 10. The cross-sectional areas of the first and third flow channels 31 and 33 may be the same or different; this embodiment does not limit this.

[0055] Since the cross-sectional area of ​​the second flow channel 32 is smaller than that of the first flow channel 31 and the third flow channel 33, the flow velocity of the cooling medium is increased when it flows through the second flow channel 32 by changing the cross-sectional area of ​​the flow channel. This makes the cooling medium flow in a jet state when it flows through the second flow channel 32, which is in a surging state, thereby maximizing the convective heat transfer effect and improving the heat exchange efficiency between the cooling medium and the bottom of the target 10. At the same time, the high flow velocity in the second flow channel 32 can prevent the deposition of impurities in the flow channel and can wash away the oxide layer inside the flow channel, preventing a decrease in the convective heat transfer coefficient. The cross-sectional areas of the first flow channel 31 and the third flow channel 33 only need to be sufficient to increase the flow velocity of the cooling medium when it flows through the second flow channel 32, making it in a surging state. The size of the cross-sectional areas of the first flow channel 31 and the third flow channel 33 can be selected according to actual needs.

[0056] In some embodiments of this application, the cross-sectional shape of the first flow channel 31, the second flow channel 32 and the third flow channel 33 may be one or a combination of circles, ellipses, squares and other irregular shapes.

[0057] In one possible structural design, the ratio of the major axis to the minor axis of the cross-section of the second flow channel 32 is greater than 1, thereby increasing the heat conduction area of ​​the second flow channel 32. Here, the long side of the cross-section of the second flow channel 32 is the major axis, and the short side is the minor axis. The major axis of the second flow channel 32 can be parallel to the bottom end face of the target 10, and the minor axis can be perpendicular to the bottom end face of the target 10. Specifically, the second flow channel 32 can be a flat structure, and the orthographic projection area of ​​the second flow channel 32 on the plane containing the bottom end face of the target 10 is larger than the orthographic projection area of ​​the second flow channel 32 on the plane perpendicular to the bottom end face of the target 10. Thus, the contact area between the second flow channel 32 and the bottom of the target 10 is larger, which is beneficial to improving the heat dissipation efficiency of the target 10.

[0058] In some embodiments of this application, the orthographic projection of the second flow channel 32 onto the first plane at least partially coincides with the orthographic projection of the target 10 onto the first plane, where the first plane is a plane extending perpendicularly from the top to the bottom of the target 10. Since the cross-sectional area of ​​the second flow channel 32 is smaller than that of the first flow channel 31 and the third flow channel 33, and the orthographic projection of the second flow channel 32 onto the first plane at least partially coincides with the orthographic projection of the target 10 onto the first plane, the second flow channel 32 can directly exchange heat with the target 10.

[0059] It should be noted that the smaller cross-sectional area allows the cooling medium to flow at a faster velocity through the second flow channel 32. According to fluid mechanics principles, this increased velocity enhances the convective heat transfer coefficient, thereby improving the heat exchange efficiency between the cooling medium and the target 10. The projection of the second flow channel 32 coincides with that of the target 10, enabling precise cooling of critical components of the target 10. During the operation of the target 10, different regions may experience varying degrees of heat generation. The second flow channel 32 can selectively cool the main heat-generating areas. Compared to traditional uniform cooling methods, this approach more effectively controls the temperature distribution of the target 10, preventing localized overheating and ensuring stable performance of the target 10.

[0060] In some optional embodiments of this application, the orthographic projection of the second flow channel 32 onto the first plane at least partially coincides with the orthographic projection of the concentrated heating area 11 of the target 10 onto the first plane, wherein the first plane is a plane extending perpendicularly from the top to the bottom of the target 10. In this case, the second flow channel 32 can directly exchange heat with the concentrated heating area 11 of the target 10.

[0061] It should be noted that the bottom surface of the target 10 has a concentrated heat-generating area 11 distributed in the direct electron beam irradiation region. This concentrated heat-generating area 11 has a high heat concentration, typically located in the central Φ2mm region. Therefore, in the aforementioned optional structural design, the orthographic projection of the second flow channel 32 onto the first plane coincides with the central region of the orthographic projection of the target 10 onto the first plane, that is, it coincides with the concentrated heat-generating area 11 of the target 10. This ensures that the cooling medium can directly act on the concentrated heat-generating area 11 to quickly remove the heat from it, shorten the heat transfer path, and achieve efficient and precise cooling.

[0062] In addition, in one possible structural design, the extension direction of part of the second flow channel 32 can be set toward the concentrated heat generation area 11. That is, the inner wall of the second flow channel 32 has a certain elevation angle design, which is suitable for the cooling medium in the second flow channel 32 to be directly sprayed onto the concentrated heat generation area 11 at the projection of the inner wall of the second flow channel 32.

[0063] Thus, the upward angle design of the inner wall of the second flow channel 32 allows the cooling medium to act directly on the concentrated heat generation area 11 in the form of spray, enhancing the intensity of heat exchange. Through spraying, the cooling medium can quickly remove heat from the surface of the concentrated heat generation area 11, improving heat exchange efficiency. In addition, the upward angle design allows the cooling medium to be precisely sprayed onto the projection of the concentrated heat generation area onto the inner wall of the second flow channel 32, achieving target-direction cooling. This precision avoids ineffective flow of the cooling medium and heat waste, ensuring that all cooling energy can directly act on the concentrated heat generation area 11.

[0064] In some embodiments of this application, the second cooling device 40 further includes a heat dissipation substrate 20 and a third cooling device 41 disposed within the heat dissipation substrate 20.

[0065] The heat dissipation substrate 20 is positioned in the electron beam emission direction of the accelerating tube. A receiving groove is provided on the first surface of the heat dissipation substrate 20, with this first surface facing the accelerating tube body. The target 10 can be fixedly connected within the receiving groove of the heat dissipation substrate 20, with the top of the target 10 facing the accelerating tube body. Optionally, the target 10 can be fixedly connected to the heat dissipation substrate 20 by means of, but not limited to, snap-fit, threaded connection, hinge, welding, or riveting. For example, the target 10 can be press-fitted into the heat dissipation substrate 20, and the periphery of the target 10 can be brazed to the heat dissipation substrate 20. This provides a high connection strength between the target 10 and the heat dissipation substrate 20, preventing the target 10 from detaching.

[0066] Furthermore, the heat dissipation substrate 20 can be made of a material with high thermal conductivity. For example, the material of the heat dissipation substrate 20 can be a copper alloy, silver alloy, or aluminum alloy. Because the heat dissipation substrate 20 uses a material with high thermal conductivity, it can efficiently transfer heat. Since the target 10 is located within the heat dissipation substrate 20, when the target 10 generates heat under electron beam bombardment, the heat is rapidly conducted to the heat dissipation substrate 20. The heat dissipation substrate 20, with its high thermal conductivity, quickly diffuses the heat to the outside (e.g., outside air), preventing heat accumulation in localized areas of the target 10 and the sealing element. Simultaneously, the heat dissipation substrate 20 also provides a stable support structure for the target 10, ensuring the mechanical stability of the target 10 during operation and preventing displacement of the target 10 due to vibration, external forces, or other factors, which could affect the normal operation of the equipment.

[0067] The third cooling device 41 is disposed within the heat dissipation substrate 20. The third cooling device 41 can be a heat pipe assembly or a cooling jacket assembly. In this way, the heat dissipation efficiency can be further improved by the third cooling device 41. In conjunction with the heat dissipation substrate 20, the heat dissipation effect in the peripheral direction of the target 10 can be improved. Furthermore, the second cooling device 40 works in conjunction with the first cooling device 30 to improve the overall cooling performance of the target 10.

[0068] In one possible structural design, the third cooling device 41 includes a cooling jacket assembly containing a circulating cooling medium, and the cooling jacket assembly is not connected to the first cooling device 30.

[0069] The cooling sleeve assembly is a closed sleeve-shaped structure surrounding the target 10, with a circulation channel inside. When the cooling sleeve assembly serves as the third cooling device 41, it can be embedded within the heat dissipation substrate 20 and arranged around the target 10. The cooling sleeve assembly contains a flowing circulating cooling medium, i.e., a cooling medium flowing within the circulation channel. This cooling medium is not interconnected with the cooling medium in the first cooling device 30, and the types of cooling medium in the circulation channel and the cooling medium in the first cooling device 30 can be the same or different; this application does not impose any limitations on this.

[0070] Furthermore, the cooling medium flowing within the circulation channel can be either a liquid or a gaseous cooling medium; this embodiment of the application does not limit the specific type. For example, the cooling medium flowing within the circulation channel is a liquid (i.e., coolant). The coolant circulates within the channel, absorbing heat generated by the target 10 through direct contact with the side and surrounding areas of the target 10 via heat conduction. The heated coolant flows out of the cooling jacket, is cooled by external cooling equipment, and then flows back in, forming a continuous cooling cycle. For example, if the cooling medium is a gas, the cooling jacket assembly is a gas cooling jacket. This gas cooling jacket can utilize gas flow to remove heat, achieving efficient cooling by controlling the gas flow rate and temperature.

[0071] Since the cooling medium in the cooling jacket assembly and the first cooling device 30 is not connected, the first cooling device 30 and the cooling jacket assembly are cooled independently. This independent cooling can avoid mutual interference of heat transfer between the two areas (i.e., the periphery of the target 10 and the bottom of the target 10), and prevent the cooling effect of the other area from being affected by the heat change in one place, making the cooling process more stable and efficient.

[0072] In another possible structural design, the third cooling device 41 includes a heat pipe assembly.

[0073] The heat pipe consists of a shell, a wick, and end caps. The shell can be made of a metallic material, such as copper or aluminum alloy. This shell possesses good thermal conductivity and mechanical strength, can withstand internal pressure, and protects the internal structure. The shell is positioned in contact with the heat dissipation substrate 20 via an interference fit, ensuring excellent heat transfer between them. The wick can be made of wire mesh, porous ceramic, or fiber material, with numerous tiny pores distributed on its surface. The wick utilizes capillary action to circulate the working fluid within the heat pipe. The end caps seal both ends of the shell to prevent working fluid leakage and maintain a vacuum environment inside the heat pipe.

[0074] The heat pipe is filled with a working fluid, which, for example, may include pure water, ammonia, or methanol. When one end of the heat pipe (evaporation section) comes into contact with a heat-generating object (such as target 10), it absorbs heat, causing the working fluid to heat up and evaporate into vapor. Since vapor is less dense than liquid, a pressure difference is created within the pipe, driving the vapor to flow rapidly to the other end of the heat pipe (condensation section). In the condensation section, the vapor encounters a cooler environment or heat dissipation device, releases heat, and condenses back into liquid. The condensed liquid, under the capillary action of the wick, flows back to the evaporation section, absorbs heat again, and evaporates, thus creating a highly efficient heat transfer cycle. In this way, through phase change heat transfer, the heat pipe can transfer heat with extremely high efficiency.

[0075] Optionally, the heat pipe assembly includes multiple heat pipes, which are spaced apart circumferentially around the target 10, and all heat pipes are thermally connected to the target 10. Optionally, the multiple heat pipes can be evenly spaced apart circumferentially around the target 10.

[0076] Because multiple heat pipes are arranged circumferentially around the target 10, the heat pipe assembly can have a large contact area with the target 10. When the target 10 generates heat under conditions such as electron beam bombardment, the evaporation sections of the multiple heat pipes can closely adhere to the corresponding areas on the periphery of the target 10, rapidly absorbing heat. Due to the phase change heat transfer principle of the heat pipes, the working liquid absorbing heat can quickly evaporate into steam, and the steam flows to the condensation section under the action of pressure difference, releasing heat and condensing back. In this way, efficient heat transfer and dissipation of the target 10 in the circumferential direction can be achieved. The arrangement of multiple heat pipes along the circumference of the target 10 can remove heat from all sides of the target 10 in a timely manner, avoiding heat accumulation in local areas of the target 10 and ensuring uniform temperature distribution of the target structure 100.

[0077] Optionally, the heat pipe assembly includes a heat pipe that is spirally wrapped around the target 10 along the axial direction of the target 10, and the heat pipe is thermally connected to the target 10.

[0078] Thus, when the target 10 generates heat under conditions such as electron beam bombardment, the heat pipe section (evaporation section) in contact with the target 10 absorbs the heat, causing the internal working liquid to evaporate into steam. Driven by the pressure difference within the pipe, the steam flows along a spiral path to a lower temperature region (condensation section), where it releases heat and condenses back into liquid. Subsequently, the liquid, under the capillary action of the wick, flows back along the spiral path to the evaporation section, thus repeating the cycle to achieve continuous and efficient heat transfer and dissipation from the target 10. This embodiment of the application employs a spirally wrapped heat pipe, allowing the heat pipe to contact multiple parts of the target 10, absorbing heat from all directions and ensuring effective heat dissipation. Furthermore, the required number of heat pipes is small, which helps reduce the manufacturing cost of the target structure 100.

[0079] In some embodiments of this application, the outer surface of the heat dissipation substrate 20 is provided with heat dissipation fan fins, which are thermally connected to the heat dissipation substrate 20. These heat dissipation fan fins can increase the contact area between the heat dissipation substrate 20 and the external air.

[0080] In this way, the heat dissipation fan fins increase the contact area between the heat dissipation substrate 20 and the external air, thereby increasing the effective heat dissipation area of ​​the heat dissipation substrate 20 and improving the heat exchange efficiency of the heat dissipation substrate 20. Compared with a heat dissipation substrate 20 without heat dissipation fan fins, the heat dissipation substrate 20 with heat dissipation fan fins can dissipate more heat in the same amount of time, so that the heat generated by the target structure 100 can be transferred to the external environment more quickly.

[0081] Please see Figure 2In other embodiments of this application, the second cooling device 40 may further include a gradient heat dissipation component 42, which surrounds the target 10. The gradient heat dissipation component 42 includes multiple layers of gradient heat dissipation material with progressively increasing thermal conductivity from near the target 10 to away from the target 10. For example, an oxygen-free copper layer 421, a molybdenum alloy layer 422, and a graphite layer 423 may be sequentially disposed from near the target 10 to away from the target 10.

[0082] Since the gradient heat dissipation component 42 is wrapped around the target 10 and consists of multiple layers of gradient heat dissipation material, with the thermal conductivity of the material increasing sequentially from the direction closer to the target 10 to the direction farther away from the target 10, the heat dissipation material layer farther away from the target 10 can quickly transfer heat to the external environment due to its higher thermal conductivity, achieving efficient heat dissipation. Because the thermal conductivity of the gradient heat dissipation material increases from the inside to the outside, heat can be transferred from the target 10 to the outside along a reasonable path and at a reasonable speed, forming an orderly heat dissipation process. Compared with traditional single heat dissipation materials, the gradient heat dissipation component 42 can better match the heat dissipation needs of different parts of the target 10. That is, the low thermal conductivity material layer closer to the target 10 will not generate thermal stress due to a sudden drop in local temperature caused by excessively rapid heat conduction when absorbing heat; while the high thermal conductivity material layer farther away from the target 10 can quickly conduct heat away, effectively preventing heat accumulation near the target 10, improving overall heat dissipation efficiency, and ensuring that the target 10 maintains a relatively stable temperature during operation.

[0083] Please see Figure 1 , Figure 2 and Figure 3 , Figure 3 This is a schematic diagram of a target structure provided in an embodiment of this application. In other embodiments of this application, a heat-conducting element 50 may be provided on the outer peripheral surface of the heat dissipation substrate 20. The heat-conducting element 50 may be disposed around the second cooling device 40 and protrude from the outer peripheral surface of the accelerating tube body 200. For example, the material of the heat-conducting element may be copper or a copper alloy. In this way, the contact area between the target structure 100 and the external air can be increased, thereby improving the heat exchange efficiency of the target structure 100.

[0084] Furthermore, a fourth cooling device 60 may also be provided within the heat-conducting component 50. This fourth cooling device 60 can be a structure such as a coolant channel or a heat pipe, which will not be described in detail here, but can be referred to the above description. In this way, the heat transfer rate from the target structure 100 to the external air can be increased, thereby improving the heat exchange efficiency of the target structure.

[0085] Secondly, this application also provides an accelerating tube, please refer to [link to relevant documentation]. Figure 4 , Figure 4The diagram shows a partial structural schematic of an accelerator tube provided in an embodiment of this application. The diagnostic and treatment device includes an accelerator tube 1000, which includes a target structure 100 and an accelerator tube body 200. The accelerator tube body 200 has an electron beam emission port.

[0086] It should be noted that the accelerator tube body 200 is the core of electron acceleration. Through an internal electric or electromagnetic field, electrons are accelerated to higher energy and ultimately emitted from the electron beam exit port. For example, the accelerator tube body 200 can be made of a copper alloy.

[0087] In addition, the target structure can be referred to the description in the first aspect above, and the embodiments of this application will not be described in detail here.

[0088] During operation, the accelerator tube 1000 emits an electron beam towards the target 10. The portion of the target 10 subjected to this high-speed electron beam generates a significant amount of heat, forming a concentrated heat-generating area. This application incorporates a first cooling device 30 at the bottom corresponding to this concentrated heat-generating area, which effectively removes the substantial heat generated and conducted to the bottom during operation. This effectively reduces the temperature of the concentrated heat-generating area 11 of the target 10, preventing performance degradation, deformation, or even damage due to localized overheating, ensuring the structural integrity of the target 10, and thus extending the service life of the accelerator tube 1000.

[0089] Furthermore, in actual operation, the target 10 generates a large amount of heat due to energy action, which diffuses outwards. The second cooling device 40 is located on the periphery of the target 10, and it can cool the peripheral area of ​​the target 10. Together with the first cooling device 30, it can achieve all-round cooling of the target 10. In this way, uniform circumferential cooling and concentrated heat-generating area cooling help maintain the temperature uniformity of the target 10, avoid the generation of thermal stress inside the target 10 material due to uneven temperature, and thus improve the overall performance and service life of the accelerator tube 1000.

[0090] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A target structure, characterized in that, include: Target, first cooling device, and second cooling device; The first cooling device is located at the bottom of the target, and the second cooling device is located on the periphery of the target. The first cooling device contains a flowing cooling medium.

2. The target structure according to claim 1, characterized in that, The first cooling device includes a first flow channel, a second flow channel, and a third flow channel connected in sequence, wherein the cross-sectional area of ​​the second flow channel is smaller than the cross-sectional areas of the first flow channel and the third flow channel; The cooling medium flows within the first flow channel, the second flow channel, and the third flow channel.

3. The target structure according to claim 2, characterized in that, The ratio of the major axis to the minor axis of the cross-section of the second flow channel is greater than 1, so as to increase the heat conduction area of ​​the second flow channel.

4. The target structure according to claim 2, characterized in that, The orthographic projection of the second flow channel onto the first plane at least partially coincides with the orthographic projection of the target onto the first plane, wherein the first plane is a plane perpendicular to the extension direction from the top to the bottom of the target.

5. The target structure according to claim 1, characterized in that, The first cooling device includes an inlet and an outlet for conveying the cooling medium, the inlet and the outlet being located on opposite sides of the bottom of the target along the flow direction of the cooling medium.

6. The target structure according to claim 1, characterized in that, The second cooling device includes a heat dissipation substrate and a third cooling device disposed within the heat dissipation substrate, the third cooling device including a heat pipe assembly and / or a cooling jacket assembly.

7. The target structure according to claim 6, characterized in that, When the third cooling device includes a cooling jacket assembly, the cooling jacket assembly contains a flowing circulating cooling medium, and the cooling jacket assembly is not connected to the first cooling device; Alternatively, when the third cooling device includes a heat pipe assembly, The heat pipe assembly includes a heat pipe that is spirally wrapped around the target along the axial direction of the target, and the heat pipe is thermally connected to the target; The heat pipe assembly includes multiple heat pipes, which are spaced apart circumferentially along the target and are all thermally connected to the target.

8. The target structure according to claim 6, characterized in that, The outer surface of the heat dissipation substrate is provided with heat dissipation fan fins, which are thermally connected to the heat dissipation substrate.

9. The target structure according to claim 1, characterized in that, The second cooling device is a gradient heat dissipation component; the gradient heat dissipation component surrounds the target and includes multiple layers of gradient heat dissipation material with progressively increasing thermal conductivity from the direction closer to the target and away from the target.

10. An accelerating tube, characterized in that, Includes the target structure as described in any one of claims 1-9 above.

Images