Telescopic plating assembly for circuit board electroplating

Abstract

This disclosure provides a telescopic plating assembly for circuit board electroplating. The telescopic plating assembly includes a plating plate, a plating movable part, and an adjusting and fixing member. The plating plate is connected to a target; the plating movable part is slidably connected to the plating plate; the adjusting and fixing member is movably connected to both the plating plate and the plating movable part, and is used to adjust the telescopic length of the plating movable part relative to the plating plate. When pressed against the plating movable part, the adjusting and fixing member is used to fix the plating movable part to the plating plate. The telescopic plating assembly provides good adaptability for plating circuit boards.

Description

Technical Field

[0001] This disclosure relates to the technical field of fixtures for circuit board electroplating, and in particular to a telescopic plating assembly for circuit board electroplating. Background Technology

[0002] A circuit board is a support for electronic components. Circuit board electroplating is a manufacturing process that coats a circuit board with a layer of metal. Workers use fixtures to position the circuit board on a plating target, and then place the circuit board and target together into an electroplating tank for the plating operation. During copper plating, the current density is higher at both ends of the target, making the circuit board near these ends more susceptible to burning. Therefore, to prevent this burning, plating support components are installed at both ends of the target. These components distribute the current and protect the circuit board.

[0003] The plating assembly of the related technology includes a clamping part and a supporting part. The clamping part is connected to the supporting part. The supporting part has multiple hollow holes evenly arranged along the length direction of the plating assembly, such as Chinese patent with patent number CN221275925U.

[0004] However, since the clamping part and the support part are integrally molded, the length of the plating component cannot be changed after it is manufactured. This makes it impossible to adjust the plating length of the plating component. Different models of circuit boards have different lengths. In order to ensure the plating effect, the plating length of the plating component must be consistent with the length of the circuit board. This means that the plating component can only be adapted to a single model of circuit board, making it difficult for the plating component to be adapted to multiple models of circuit boards for plating. Consequently, the plating component has poor adaptability to the plating of circuit boards. Utility Model Content

[0005] The purpose of this disclosure is to overcome the shortcomings of the prior art and provide a telescopic plating assembly for circuit board electroplating that is well adapted to the plating of circuit boards.

[0006] The purpose of this disclosure is achieved through the following technical solution:

[0007] A telescopic plating assembly for circuit board electroplating, for connection to a target, includes:

[0008] A plating plate is used to connect to the flying target;

[0009] The plating-coating movable part is slidably connected to the plating-coating plate body;

[0010] Adjusting fasteners are movably connected to the plating plate and the plating movable part, respectively. The adjusting fasteners are used to adjust the extension length of the plating movable part relative to the plating plate. When the adjusting fasteners press against the plating movable part, they are used to fix the plating movable part to the plating plate.

[0011] In one embodiment, the plating plate includes a plating mounting portion and a plating extension portion connected together. The plating mounting portion is used to connect to the target. The plating movable portion is slidably connected to the plating extension portion. The adjusting fixing member is movably connected to the plating extension portion. The adjusting fixing member is used to adjust the extension length of the plating movable portion relative to the plating extension portion. When the adjusting fixing member presses against the plating movable portion, it is used to fix the plating movable portion to the plating extension portion.

[0012] In one embodiment, the plating extension has a protruding anti-deviation positioning post, the plating movable part has an anti-deviation waist-shaped hole, and the anti-deviation positioning post passes through the anti-deviation waist-shaped hole and is slidably connected to the plating movable part.

[0013] In one embodiment, the plating mounting part, the plating extension part, and the anti-deviation positioning post are integrally formed.

[0014] In one embodiment, the plating extension has a connecting through hole that communicates with the anti-deviation waist-shaped hole. The adjusting fastener includes an adjusting bolt and a fixing nut. The adjusting bolt passes through the anti-deviation waist-shaped hole and the connecting through hole in sequence. One end of the adjusting bolt abuts against the plating movable part, and the other end of the adjusting bolt is threadedly connected to the fixing nut. The fixing nut abuts against the side of the plating extension away from the plating movable part. The adjusting bolt is rotatably connected to the plating plate and slidably connected to the plating movable part.

[0015] In one embodiment, the adjusting bolt is provided with a pressure washer that presses against the plating movable part.

[0016] In one embodiment, the end of the adjusting bolt opposite to the fixing nut is provided with a hand-tightening part.

[0017] In one embodiment, the plating mounting portion has a first anti-detachment groove.

[0018] In one embodiment, the plating-coated movable part is an integrally formed structure.

[0019] In one embodiment, the plating-coating movable part is provided with a second anti-detachment groove.

[0020] Compared with the prior art, this disclosure has at least the following advantages:

[0021] Because the plating plate is used to connect to the target so that it is positioned adjacent to the circuit board, the plating movable part is slidably connected to the plating plate. An adjusting fastener is used to adjust the telescopic length of the plating movable part relative to the plating plate. This allows the adjusting fastener to adjust the plating length of the telescopic plating assembly used for circuit board electroplating by adjusting the telescopic length of the plating movable part. This solves the problem in the prior art where the plating length of the plating assembly cannot be adjusted. The adjusting fastener adjusts the plating length of the telescopic plating assembly used for circuit board electroplating by adjusting the telescopic length of the plating movable part, thus adapting to... Different types of circuit boards are used, so that the adjusting fixing part and the plating movable part work together to ensure that the plating length of the telescopic plating assembly for circuit board electroplating is always consistent with the length of the circuit board. This allows the telescopic plating assembly for circuit board electroplating to be adapted to multiple types of circuit boards, thus avoiding the problem in the prior art that the plating assembly can only be adapted to a single type of circuit board. This makes it easier for the telescopic plating assembly for circuit board electroplating to be adapted to multiple types of circuit boards for plating processing, and thus makes the telescopic plating assembly for circuit board electroplating have better adaptability to the plating of circuit boards. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this disclosure and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of a telescopic plating assembly for circuit board electroplating according to an embodiment.

[0024] Figure 2 for Figure 1 The diagram shows an enlarged view of point A of a telescopic plating assembly used for circuit board electroplating.

[0025] Figure 3 for Figure 1 The diagram shows another perspective of the structure of the telescopic plating assembly used for circuit board electroplating. Detailed Implementation

[0026] To facilitate understanding of this disclosure, a more complete description will be given below with reference to the accompanying drawings, which illustrate preferred embodiments of the present disclosure. However, this disclosure can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure.

[0027] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this disclosure. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0029] This disclosure provides a telescopic plating assembly for electroplating circuit boards, for connection to a target.

[0030] Furthermore, the telescopic plating assembly for circuit board electroplating includes a plating plate, a plating movable part, and an adjustment fixing member; the plating plate is used to connect to the target; the plating movable part is slidably connected to the plating plate; the adjustment fixing member is movably connected to the plating plate and the plating movable part respectively, the adjustment fixing member is used to adjust the telescopic length of the plating movable part relative to the plating plate, and when the adjustment fixing member presses against the plating movable part, it is used to fix the plating movable part to the plating plate.

[0031] The aforementioned telescopic plating assembly for circuit board electroplating, in which the plating plate is connected to the target so that it is positioned adjacent to the circuit board, and the plating movable part is slidably connected to the plating plate, and the adjusting fixing member is used to adjust the telescopic length of the plating movable part relative to the plating plate, so that the adjusting fixing member can adjust the plating length of the telescopic plating assembly for circuit board electroplating by adjusting the telescopic length of the plating movable part, thereby solving the problem that the plating length of the plating assembly in the prior art cannot be adjusted, and that the adjusting fixing member can adjust the telescopic plating assembly for circuit board electroplating by adjusting the telescopic length of the plating movable part. The plating length is designed to adapt to different types of circuit boards. The adjustment fixture and the plating movable part work together to ensure that the plating length of the telescopic plating assembly for circuit board electroplating always matches the length of the circuit board. This allows the telescopic plating assembly for circuit board electroplating to adapt to multiple types of circuit boards, avoiding the problem in the prior art where plating assemblies could only adapt to a single type of circuit board. This makes it easier for the telescopic plating assembly for circuit board electroplating to adapt to multiple types of circuit boards for plating processing, resulting in better adaptability of the telescopic plating assembly for circuit board electroplating.

[0032] To better understand the technical solutions and beneficial effects of this disclosure, the following detailed description is provided in conjunction with specific embodiments:

[0033] like Figures 1 to 3 As shown, in one embodiment, a telescopic plating assembly 10 for circuit board electroplating is used to connect to a flying target.

[0034] Furthermore, the telescopic plating assembly 10 for circuit board electroplating includes a plating plate 100, a plating movable part 200, and an adjustment fixing member 300; the plating plate 100 is used to connect to the target; the plating movable part 200 is slidably connected to the plating plate 100; the adjustment fixing member 300 is movably connected to the plating plate 100 and the plating movable part 200 respectively, the adjustment fixing member 300 is used to adjust the telescopic length of the plating movable part 200 relative to the plating plate 100, and when the adjustment fixing member 300 presses against the plating movable part 200, it is used to fix the plating movable part 200 to the plating plate 100.

[0035] In this embodiment, the plating plate 100 is connected to the target so that the plating plate 100 is disposed adjacent to the circuit board. The adjusting fastener 300 is used to adjust the telescopic length of the plating movable part 200 relative to the plating plate 100, so that the adjusting fastener 300 adjusts the plating length of the telescopic plating assembly 10 for circuit board electroplating by adjusting the telescopic length of the plating movable part 200.

[0036] The aforementioned telescopic plating assembly 10 for circuit board electroplating, since the plating plate 100 is connected to the target so that the plating plate 100 is positioned adjacent to the circuit board, the plating movable part 200 is slidably connected to the plating plate 100, and the adjusting fixing member 300 is used to adjust the telescopic length of the plating movable part 200 relative to the plating plate 100, so that the adjusting fixing member 300 can adjust the plating length of the telescopic plating assembly 10 for circuit board electroplating by adjusting the telescopic length of the plating movable part 200. This solves the problem that the plating length of the plating assembly cannot be adjusted in the prior art, and allows the adjusting fixing member 300 to adjust the plating length of the circuit board by adjusting the telescopic length of the plating movable part 200. The plating length of the telescopic plating assembly 10 for circuit board electroplating is adapted to different types of circuit boards. The adjusting fixing part 300 and the plating movable part 200 work together to ensure that the plating length of the telescopic plating assembly 10 for circuit board electroplating is always consistent with the length of the circuit board. This allows the telescopic plating assembly 10 for circuit board electroplating to be adapted to multiple types of circuit boards, thus avoiding the problem in the prior art where plating assemblies can only be adapted to a single type of circuit board. This makes it easier for the telescopic plating assembly 10 to be adapted to multiple types of circuit boards for plating, resulting in better adaptability of the telescopic plating assembly 10 for plating circuit boards.

[0037] like Figures 1 to 3 As shown, in one embodiment, the plating plate 100 includes a plating mounting portion 110 and a plating extension portion 120 connected to each other. The plating mounting portion 110 is used to connect to the target. The plating movable portion 200 is slidably connected to the plating extension portion 120. The adjusting fixing member 300 is movably connected to the plating extension portion 120. The adjusting fixing member 300 is used to adjust the telescopic length of the plating movable portion 200 relative to the plating extension portion 120. When the adjusting fixing member 300 presses against the plating movable portion 200, it is used to fix the plating movable portion 200 onto the plating extension portion 120. In this embodiment, the adjusting fixing member 300 is used to adjust the telescopic length of the plating movable portion 200 relative to the plating extension portion 120, so that the adjusting fixing member 300 adjusts the plating length of the telescopic plating assembly 10 for circuit board electroplating by adjusting the telescopic length of the plating movable portion 200, so that the plating use adaptability of the telescopic plating assembly 10 for circuit board electroplating is better.

[0038] like Figures 1 to 2As shown, in one embodiment, the plating extension 120 is provided with an anti-deviation positioning post 121, and the plating movable part 200 is provided with an anti-deviation waist-shaped hole 210. The anti-deviation positioning post 121 passes through the anti-deviation waist-shaped hole 210 and is slidably connected to the plating movable part 200, thereby avoiding the problem of the plating movable part 200 deviating to the left or right relative to the plating extension 120, making it difficult for the plating movable part 200 to deviate in position, thus making the positional stability of the plating movable part 200 better.

[0039] In one embodiment, the plating mounting part 110, the plating extension part 120 and the anti-deviation positioning post 121 are integrally formed, which makes the structural strength between the plating mounting part 110, the plating extension part 120 and the anti-deviation positioning post 121 high, thereby making the structural stability of the plating plate 100 better.

[0040] like Figures 1 to 3 As shown, in one embodiment, the plating extension 120 has a connecting through hole (not shown), which communicates with the anti-deviation waist-shaped hole 210. The adjusting fastener 300 includes an adjusting bolt 310 and a fixing nut 320. The adjusting bolt 310 passes through the anti-deviation waist-shaped hole 210 and the connecting through hole in sequence. One end of the adjusting bolt 310 presses against the plating movable part 200, and the other end of the adjusting bolt 310 is threadedly connected to the fixing nut 320. The fixing nut 320 abuts against the side of the plating extension 120 away from the plating movable part 200. The adjusting bolt 310 is rotatably connected to the plating plate 100 and slidably connected to the plating movable part 200. In this embodiment, one end of the adjusting bolt 310 presses against the plating movable part 200, and the other end of the adjusting bolt 310 is threadedly connected to the fixing nut 320. The fixing nut 320 abuts against the side of the plating extension 120 away from the plating movable part 200, so that the adjusting bolt 310 and the fixing nut 320 work together to fix the plating movable part 200 to the plating extension 120, so that the connection stability between the plating movable part 200 and the plating extension 120 is better.

[0041] Furthermore, the adjusting bolt 310 is rotatably connected to the plating plate 100 and slidably connected to the plating movable part 200, so that the adjusting bolt 310 rotates relative to the fixing nut 320, causing the adjusting bolt 310 to move away from the plating movable part 200. At this time, the plating movable part 200 separates from the adjusting bolt 310 and abuts against the plating extension 120. Then, the plating movable part 200 slides relative to the plating extension 120 to realize the position extension adjustment of the plating movable part 200. That is, the adjusting bolt 310 and the fixing nut 320 work together to adjust the extension length of the sliding of the plating movable part 200 relative to the plating plate 100, so that the adjustment of the telescopic plating assembly 10 used for circuit board electroplating is more convenient.

[0042] like Figures 1 to 2 As shown, in one embodiment, the adjusting bolt 310 is provided with a pressing washer 311, which presses against the plating movable part 200, thereby effectively preventing the adjusting bolt 310 from rotating accidentally, and making the connection between the adjusting bolt 310 and the plating movable part 200 more stable.

[0043] like Figures 1 to 2 As shown, in one embodiment, the end of the adjusting bolt 310 facing away from the fixing nut 320 is provided with a hand-tightening part 312, so as to facilitate the turning of the adjusting bolt 310, making the adjusting bolt 310 easier to use.

[0044] like Figure 1 As shown, in one embodiment, the plating mounting part 110 is provided with a first anti-detachment groove 111 to prevent the plating mounting part 110 from detaching from the target, so that the positional stability of the plating plate 100 is better.

[0045] In one embodiment, the plating active part 200 is an integrally formed structure, which makes the structural strength of the plating active part 200 high.

[0046] like Figures 1 to 2 As shown, in one embodiment, the plating-coated movable part 200 is provided with a second anti-detachment groove 220 to prevent the plating-coated movable part 200 from detaching from the target, thereby making the positional stability of the plating-coated movable part 200 better.

[0047] Compared with the prior art, this disclosure has at least the following advantages:

[0048] Since the plating plate 100 is used to connect to the target so that it is positioned adjacent to the circuit board, the plating movable part 200 is slidably connected to the plating plate 100. The adjusting fixing member 300 is used to adjust the telescopic length of the plating movable part 200 relative to the plating plate 100. This allows the adjusting fixing member 300 to adjust the plating length of the telescopic plating assembly 10 for circuit board electroplating by adjusting the telescopic length of the plating movable part 200. This solves the problem in the prior art that the plating length of the plating assembly cannot be adjusted. The adjusting fixing member 300 can adjust the telescopic plating assembly for circuit board electroplating by adjusting the telescopic length of the plating movable part 200. The plating length of 10 is used to adapt to different types of circuit boards, so that the adjusting fixing part 300 and the plating movable part 200 work together to ensure that the plating length of the telescopic plating component 10 for circuit board electroplating is always consistent with the length of the circuit board. This allows the telescopic plating component 10 for circuit board electroplating to adapt to multiple types of circuit boards, thus avoiding the problem in the prior art that the plating component can only adapt to a single type of circuit board. This makes it easier for the telescopic plating component 10 for circuit board electroplating to adapt to multiple types of circuit boards for plating processing, thereby making the telescopic plating component 10 for circuit board electroplating have better adaptability to the plating of circuit boards.

[0049] The embodiments described above are merely illustrative of several implementations of this disclosure, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the disclosed patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this disclosure, and these all fall within the protection scope of this disclosure. Therefore, the protection scope of this patent should be determined by the appended claims.

Claims

1. A telescopic plating assembly for electroplating circuit boards, used for connection to a target, characterized in that, include: A plating plate is used to connect to the flying target; The plating-coating movable part is slidably connected to the plating-coating plate body; Adjusting fasteners are movably connected to the plating plate and the plating movable part, respectively. The adjusting fasteners are used to adjust the extension length of the plating movable part relative to the plating plate. When the adjusting fasteners press against the plating movable part, they are used to fix the plating movable part to the plating plate.

2. The telescopic plating assembly for circuit board electroplating according to claim 1, characterized in that, The plating plate includes a plating mounting part and a plating extension part connected to each other. The plating mounting part is used to connect to the target. The plating movable part is slidably connected to the plating extension part. The adjusting fixing part is movably connected to the plating extension part. The adjusting fixing part is used to adjust the extension length of the plating movable part relative to the plating extension part. When the adjusting fixing part is pressed against the plating movable part, it is used to fix the plating movable part to the plating extension part.

3. The telescopic plating assembly for circuit board electroplating according to claim 2, characterized in that, The plating extension is provided with an anti-deviation positioning post, and the plating movable part is provided with an anti-deviation waist-shaped hole. The anti-deviation positioning post passes through the anti-deviation waist-shaped hole and is slidably connected to the plating movable part.

4. The telescopic plating assembly for circuit board electroplating according to claim 3, characterized in that, The plating mounting part, the plating extension part, and the anti-deviation positioning post are integrally formed structures.

5. The telescopic plating assembly for circuit board electroplating according to claim 3, characterized in that, The plating extension is provided with a connecting through hole, which communicates with the anti-deviation waist-shaped hole. The adjusting and fixing component includes an adjusting bolt and a fixing nut. The adjusting bolt passes through the anti-deviation waist-shaped hole and the connecting through hole in sequence. One end of the adjusting bolt abuts against the plating movable part, and the other end of the adjusting bolt is threadedly connected to the fixing nut. The fixing nut abuts against the side of the plating extension away from the plating movable part. The adjusting bolt is rotatably connected to the plating plate and slidably connected to the plating movable part.

6. The telescopic plating assembly for circuit board electroplating according to claim 5, characterized in that, The adjusting bolt is equipped with a pressure washer, which presses against the plating movable part.

7. The telescopic plating assembly for circuit board electroplating according to claim 5, characterized in that, The adjusting bolt has a hand-tightening part at the end opposite to the fixing nut.

8. The telescopic plating assembly for circuit board electroplating according to claim 2, characterized in that, The plating mounting section is provided with a first anti-detachment groove.

9. The telescopic plating assembly for circuit board electroplating according to claim 1, characterized in that, The plating-coated movable part is a one-piece molded structure.

10. The telescopic plating assembly for circuit board electroplating according to claim 1, characterized in that, The plating section is equipped with a second anti-detachment groove.

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