Server heat sink and immersion liquid-cooled server
By introducing a heat-conducting structure into the server heat sink and conducting heat exchange with the casing, combined with convection heat exchange, the problem of insignificant heat dissipation effect in the existing technology is solved, achieving more efficient heat dissipation and equipment reliability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN YIWANKE DATA EQUIP TECH CO LTD
- Filing Date
- 2025-04-22
- Publication Date
- 2026-06-02
AI Technical Summary
Improvements to existing server heat sinks based on convection heat transfer have failed to significantly enhance heat dissipation, especially in single-phase immersion liquid-cooled servers, where traditional methods rely primarily on fluid convection and lack the combination of conduction heat transfer.
A heat-conducting structure is introduced into the server heat sink. Through conduction heat exchange between the heat-conducting structure and the heat sink body and the shell, combined with convection heat exchange, the conduction heat exchange mode is increased. The heat-conducting structure is made of elastic material to adapt to assembly and buffer external stress.
The heat exchange capacity of the heat sink is improved, the chip temperature is reduced, and the heat dissipation effect is enhanced. The elastic material buffer structure adapts to assembly and external stress, thereby improving the reliability of the equipment.
Smart Images
Figure CN224317991U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of server technology, and in particular to server heat sinks and immersion liquid-cooled servers. Background Technology
[0002] Heat transfer mechanics indicates that there are three main modes of heat exchange: conduction, convection, and radiation. Currently, the heat exchange mechanism of chip heat sinks in air-cooled servers and single-phase immersion liquid-cooled servers primarily relies on fluid convection; the former uses air convection, while the latter uses coolant convection. Existing designs typically improve chip heat exchange by altering the thickness, number, and spacing of the heat sink fins. However, since these structural changes still operate on the basis of convective heat transfer, the overall improvement in heat exchange efficiency is not significant. Utility Model Content
[0003] The main purpose of this invention is to propose a server heat sink and an immersion liquid-cooled server, which adds conduction heat transfer to the traditional convection heat transfer, thereby improving the heat transfer capacity of the heat sink and improving the heat dissipation effect of the chip.
[0004] To achieve the above objectives, this utility model proposes a server heat sink, comprising:
[0005] A heat dissipation body is provided for placement within the server chassis, and the heat dissipation body is designed to contact the server's heat-generating components; and,
[0006] A heat-conducting structure, with one end in the first direction abutting against the heat dissipation body and the other end abutting against the server casing, wherein at least a portion of the heat-conducting structure is made of an elastic material;
[0007] The heat from the heating element is transferred to the outer casing through the heat dissipation body and the heat conduction structure for heat exchange with the external environment.
[0008] In one embodiment, the thermally conductive structure includes:
[0009] The first heat-conducting component abuts against the heat dissipation body;
[0010] A second heat-conducting component, disposed opposite to the first heat-conducting component and located on the side of the first heat-conducting component facing away from the heat dissipation body, is used to abut against the server casing; and,
[0011] A thermally conductive buffer is provided, wherein the thermally conductive buffer is made of an elastic material and is disposed between the first thermally conductive component and the second thermally conductive component.
[0012] In one embodiment, multiple thermally conductive buffers are provided.
[0013] In one embodiment, the end face of the first heat-conducting element facing the heat dissipation body is provided with a groove;
[0014] The end corresponding to the heat dissipation body is embedded in the groove to fix the heat dissipation body.
[0015] In one embodiment, the first heat-conducting element and / or the second heat-conducting element are provided with heat dissipation channels.
[0016] In one embodiment, the heat dissipation body includes:
[0017] The substrate is used to contact the server's heat-generating components;
[0018] Multiple heat dissipation fins are disposed on the substrate and arranged at intervals along the second direction.
[0019] In one embodiment, a groove is provided at one end of the heat-conducting structure in the first direction;
[0020] The ends of the multiple heat dissipation fins are all engaged in the groove and abut against the wall of the groove.
[0021] In one embodiment, the substrate has a first mounting side and a second mounting side disposed opposite to each other in a first direction;
[0022] The plurality of heat dissipation fins include a plurality of first heat dissipation fins and a plurality of second heat dissipation fins arranged alternately. The plurality of first heat dissipation fins are connected to the first mounting side, and the plurality of second heat dissipation fins are connected to the second mounting side. The end of each second heat dissipation fin is in contact with the end of each of the two adjacent first heat dissipation fins.
[0023] In one embodiment, the heat dissipation body and the heat-conducting structure are arranged in a first direction, and the side of the heat dissipation body in the first direction is used to contact the heat-generating element of the server; and / or,
[0024] The material of the heat-conducting structure includes metal.
[0025] This utility model also proposes an immersion liquid-cooled server, comprising:
[0026] A chassis that can be immersed in a liquid cooling medium, the chassis including a housing and a cover, wherein a heating element is disposed inside the housing;
[0027] A server heat sink includes a heat dissipation body and a heat conduction structure. The heat dissipation body is housed inside the enclosure and is used to contact the heat-generating elements of the server. One end of the heat conduction structure in a first direction abuts against the heat dissipation body, and the other end abuts against the cover, for transferring the heat from the heat-generating elements to the cover for heat exchange with the liquid cooling medium.
[0028] In this invention, both the heat dissipation body and the heat-conducting structure are located inside the server chassis. The heat dissipation body is the heat exchange portion of the radiator, dissipating heat from the heat-generating elements through convection. The heat-conducting structure abuts against the heat dissipation body and the server casing, thus performing conductive heat exchange. The heat from the heat-generating elements is transferred to the heat dissipation body, with some heat transferred through convection and some conducted to the server casing through the heat-conducting structure. The casing has a large heat dissipation area, improving the heat dissipation effect. Since the casing is in direct contact with the external environment and has a lower temperature, the conductive heat exchange provides a more significant cooling effect. The combination of convection and conductive heat exchange enhances the radiator's heat exchange capacity. Furthermore, a portion of the heat-conducting structure is made of elastic material, providing a buffering effect to accommodate the chassis assembly process and alleviate external stresses on the chassis. Attached Figure Description
[0029] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.
[0030] Figure 1 A schematic diagram of a server heat sink embodiment provided by this utility model;
[0031] Figure 2 for Figure 1 3D exploded view of a server heatsink;
[0032] Figure 3 for Figure 1 Top view of a server heatsink;
[0033] Figure 4 A schematic diagram of another embodiment of the server heat sink provided by this utility model;
[0034] Figure 5 A schematic diagram of the structure of an embodiment of the immersion liquid-cooled server provided by this utility model;
[0035] Figure 6 for Figure 5 A schematic diagram showing the flow direction of the liquid cooling medium when a submersible liquid-cooled server is submerged.
[0036] Explanation of icon numbers:
[0037] 100. Server heat sink; 1. Heat sink body; 11. Base; 12. Heat sink fins; 12a. First heat sink fin; 12b. Second heat sink fin; 2. Thermal conduction structure; 21. First thermal conduction component; 211. Groove; 22. Second thermal conduction component; 23. Thermal conduction buffer component; 200. Chassis; 210. Housing; 220. Cover; 300. Chip.
[0038] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation
[0039] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0040] It should be noted that if the embodiments of this utility model involve directional indication, the directional indication is only used to explain the relative positional relationship and movement of each component in a specific posture. If the specific posture changes, the directional indication will also change accordingly.
[0041] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.
[0042] Heat transfer mechanics indicates that there are three main modes of heat exchange: conduction, convection, and radiation. Currently, the heat exchange mechanism of chip heat sinks in air-cooled servers and single-phase immersion liquid-cooled servers primarily relies on fluid convection; the former uses air convection, while the latter uses coolant convection. Changing the thickness, number, and spacing of the heat sink fins still operates on the basis of convective heat transfer, and the overall improvement in heat exchange efficiency is not significant.
[0043] Meanwhile, single-phase immersion liquid cooling is becoming increasingly widespread in data center server applications. Server single-phase immersion liquid cooling refers to immersing the server in a coolant, with a pump driving the flow of the coolant to remove the heat generated during server operation. Because the physical properties of the air medium used in traditional air cooling differ from those of the coolant medium in single-phase immersion liquid cooling, optimizing the heat sinks of electronic devices in liquid cooling can result in better heat exchange performance.
[0044] This invention provides a server heat sink and an immersion liquid-cooled server. Based on traditional convection heat transfer, it adds conduction heat transfer. This structure can further optimize the heat dissipation of the chip during single-phase immersion liquid cooling of the server, effectively reduce the chip operating temperature, and improve the reliability of chip operation.
[0045] Please refer to Figures 1 to 2 The server heat sink 100 includes a heat sink body 1 and a heat conduction structure 2. The heat sink body 1 is installed inside the server chassis 200 and is used to contact the heat-generating components of the server. One end of the heat conduction structure 2 in a first direction abuts against the heat sink body 1, and the other end abuts against the server casing. At least part of the heat conduction structure is made of an elastic material. The heat of the heat-generating components is transferred to the casing through the heat sink body 1 and the heat conduction structure 2 for heat exchange with the external environment.
[0046] In this invention, both the heat dissipation body 1 and the heat-conducting structure 2 are located inside the server chassis 200. The heat dissipation body 1 is the heat exchange part of the radiator, dissipating heat from the heat-generating elements through convection heat transfer. The heat-conducting structure 2 abuts against the heat dissipation body 1 and the server casing, thus performing conduction heat transfer. The heat from the heat-generating elements is transferred to the heat dissipation body 1, partly through convection heat transfer and partly through the heat-conducting structure 2 to the server casing. The casing has a large heat dissipation area, which improves the heat dissipation effect. The conduction heat transfer provides a more significant heat dissipation effect. The heat exchange capacity of the radiator is improved by combining convection and conduction heat transfer. Furthermore, part of the material of the heat-conducting structure 2 is elastic, which can form a certain buffer effect, thereby adapting to the assembly process of the chassis 200 and alleviating the external stress on the chassis 200.
[0047] This invention does not limit the environment in which the chassis 200 is located. Since the external temperature of the chassis 200 is lower than its internal temperature, the temperature of the outer shell of the chassis 200 is even lower, which is beneficial for heat exchange. When the server is in a single-phase immersion liquid-cooled environment, the outer shell of the chassis 200 is in direct contact with the liquid cooling medium, and can carry away the heat of the outer shell during the flow of the cooling medium.
[0048] Considering the heat conduction requirements of the heat-conducting structure 2, it is preferable to use a metal, such as an aluminum alloy, as the material of the heat-conducting structure 2, which has better thermal conductivity. In other examples, the heat-conducting structure 2 can also be made of a conventional material.
[0049] The heat-generating element can be chip 300 or other electronic devices inside the server that generate heat during operation. Taking chip 300 as an example, the relevant structural coordination will be explained.
[0050] The specific form of the heat-conducting structure 2 is not limited; it can be set as a linear structure or an irregular structure depending on its orientation relative to the heat dissipation body 1. Please refer to... Figure 2 In some embodiments, the heat-conducting structure 2 includes a first heat-conducting element 21, a second heat-conducting element 22, and a heat-conducting buffer 23. The first heat-conducting element 21 abuts against the heat dissipation body 1, thereby enabling direct heat conduction with the heat dissipation body 1. The second heat-conducting element 22 is disposed opposite to the first heat-conducting element 21 and is located on the side of the first heat-conducting element 21 facing away from the heat dissipation body 1, for abutting against the server shell, thereby enabling direct heat conduction with the shell. The heat-conducting buffer 23 is disposed between the first heat-conducting element 21 and the second heat-conducting element 22, and the material of the heat-conducting buffer 23 is elastic. On the one hand, it plays a role in heat conduction, transferring the heat from the first heat-conducting element 21 to the second heat-conducting element 22. On the other hand, it plays a buffering role. Since the heat-conducting structure 2 directly abuts against the heat dissipation body 1 and the shell, it not only forms a heat transfer path but also a force conduction path when the shell is subjected to external force. Through the buffering effect of the heat-conducting buffer 23, the liquid stress on the shell when immersed in the liquid cooling medium can be relieved, preventing damage to the heat sink and the chip 300.
[0051] This invention does not limit the specific form of the thermally conductive buffer 23; it can be a thermally conductive spring or a metal foam, such as aluminum foam or copper foam. This structure is formed through a foaming process to create a porous metal structure, where the pores absorb impact, and the metal matrix 11 provides efficient heat conduction.
[0052] Please refer to Figures 2 to 3 In this embodiment, multiple thermally conductive buffers 23 are provided, and the multiple thermally conductive buffers 23 are arranged circumferentially so that they can be evenly distributed throughout the entire plane.
[0053] In addition, considering the cooperation between the heat-conducting structure 2 and the heat dissipation body 1, a groove 211 is provided at one end of the heat-conducting structure 2 in the first direction. This groove 211 serves as a positioning fit, allowing the end of the heat dissipation body 1 to be inserted. When the heat-conducting structure 2 is composed of a first heat-conducting element 21, a second heat-conducting element 22, and a heat-conducting buffer element 23, a groove 211 is provided on the end face of the first heat-conducting element 21 facing the heat dissipation body 1, so that the corresponding end of the heat dissipation body 1 is embedded in the groove 211, thereby achieving a fixing effect. The groove 211 creates a concave structure in a part of the first heat-conducting element 21, which can engage the heat dissipation body 1 and its corresponding part, thereby preventing the heat-conducting structure 2 and the heat dissipation body 1 from shifting during the cooperation process.
[0054] However, it should be understood that the application scenarios of this heat sink structure are not limited to liquid cooling environments; it can also be used in air cooling environments. It primarily improves the heat dissipation effect of the chip 300 through heat conduction and convection. In air cooling environments, heat dissipation channels are provided on the first heat-conducting element 21 and / or the second heat-conducting element 22. This allows airflow to pass through the heat dissipation channels and the gap between the first and second heat-conducting elements 21 and 22, thus conducting heat without affecting the air cooling effect.
[0055] The heat dissipation channel can be a through groove or a through hole; this utility model does not limit the type of channel.
[0056] This utility model does not limit the specific structural form of the heat dissipation body 1. For some embodiments, please refer to... Figures 1 to 2 The heat dissipation body 1 includes a base 11 and multiple heat dissipation fins 12. The base 11 is used to contact the heat-generating components of the server. The multiple heat dissipation fins 12 are disposed on the base 11 and arranged at intervals along a second direction. There are gaps between adjacent heat dissipation fins 12 to facilitate convection heat dissipation. It should be understood that the number of multiple heat dissipation fins 12 is not limited and needs to be reasonably set according to the size of the chip 300, the heat dissipation requirements, and the installation space of the chassis 200.
[0057] It should be noted that the second direction is perpendicular to the first direction. In actual local cases, the arrangement direction of the heat dissipation fins 12 can be set to the front-back direction or the horizontal direction. This utility model does not limit this.
[0058] Based on the above embodiments, when a groove 211 is provided on the heat-conducting structure 2, the ends of multiple heat dissipation fins 12 are all locked in the groove 211 and abut against the wall of the groove 211, thereby achieving the positioning and assembly effect of embedding and fitting.
[0059] In another embodiment, please refer to Figure 4The base 11 has a first mounting side and a second mounting side arranged opposite each other in a first direction. Multiple heat dissipation fins 12 include multiple alternating first heat dissipation fins 12a and multiple second heat dissipation fins 12b. The multiple first heat dissipation fins 12a are connected to the first mounting side, and the multiple second heat dissipation fins 12b are connected to the second mounting side. The corresponding end of each second heat dissipation fin 12b contacts the corresponding ends of two adjacent first heat dissipation fins 12a. In this structure, the partial overlap of the first heat dissipation fins 12a and the second heat dissipation fins 12b can improve the compressive strength of the structure, thereby enabling it to withstand greater liquid pressure when the server is immersed in the liquid cooling medium. Simultaneously, because the outer walls of the first heat dissipation fins 12a and the second heat dissipation fins 12b are in contact, heat can be transferred between the first heat dissipation fins 12a and the second heat dissipation fins 12b, thereby increasing the heat dissipation area and improving the heat dissipation effect. Controlled flow allows heat to be carried away through the gaps between two adjacent first heat dissipation fins 12a and between two adjacent second heat dissipation fins 12b. At the same time, this structure can also increase the size of the heat sink in the first direction to a certain extent, thereby compensating for the situation where the size of the heat conduction structure 2 remains unchanged due to the excessive internal space of the chassis 200.
[0060] Based on the above embodiments, the first heat dissipation fin 12a and the second heat dissipation fin 12b only need to be in contact with each other, without needing to be connected to each other. The first mounting side and the second mounting side can be set as two independent structures, and a spring buffer structure can be set between them.
[0061] Please refer to Figure 5 The heat dissipation body 1 and the heat conduction structure 2 are arranged in the first direction, and the side of the heat dissipation body 1 in the first direction is used to contact the heat-generating components of the server; that is, the chip 300 is transferred to the outer casing through a straight heat conduction path, which can improve the heat transfer effect and reduce the diffusion of heat inside the chassis 200.
[0062] This utility model also provides an immersion liquid-cooled server, which includes the server heat sink 100 of the above embodiments. The specific structure of the server heat sink 100 is as described in the above embodiments. Since this immersion liquid-cooled server adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, and will not be described in detail here.
[0063] For details, please refer to Figures 5 to 6The immersion liquid-cooled server also includes a chassis 200, which can be immersed in a liquid cooling medium. The chassis 200 includes a housing 210 and a cover 220. A heat-generating element is installed inside the housing 210, and a server heat sink 100 is installed inside the housing 210. A heat-conducting structure 2 abuts against the cover 220 to transfer the heat from the heat-generating element to the cover 220 for heat exchange with the liquid cooling medium.
[0064] When the heat sink is liquid-cooled, the heat generated by the chip 300 is transferred to the heat sink. Part of the heat is carried away by the coolant flowing through the heat sink fins 12, and part of the heat is transferred to the cover 220 through the heat conduction structure 2. In the immersion environment, the cooling medium flows in from one side of the chassis 200 and flows out from the other side. During this process, it passes through the cover 220 to exchange heat and carry away the heat transferred from the heat sink.
[0065] In the technical solution of this embodiment, based on convection heat transfer, heat is conducted through the heat-conducting structure 2, thereby transferring heat to the cover 220 of the chassis 200. In immersion liquid cooling, the entire server chassis 200 is immersed in the liquid cooling environment. The coolant flowing through the cover 220 will carry away the heat conducted to the cover 220, thereby utilizing the wide contact area between the cover 220 and the coolant for heat dissipation, so that the cover 220 can also function as a heat sink.
[0066] The above are merely preferred embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent structural transformations made based on the inventive concept of this utility model and the contents of this utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this utility model.
Claims
1. A server heat sink, characterized in that, include: A heat dissipation body is installed inside the server chassis, and the heat dissipation body is used to contact the heat-generating components of the server; as well as, A heat-conducting structure, with one end in the first direction abutting against the heat dissipation body and the other end abutting against the server casing, wherein at least a portion of the heat-conducting structure is made of an elastic material; The heat from the heating element is transferred to the outer casing through the heat dissipation body and the heat conduction structure for heat exchange with the external environment.
2. The server heat sink as described in claim 1, characterized in that, The thermally conductive structure includes: The first heat-conducting component abuts against the heat dissipation body; A second heat-conducting component, disposed opposite to the first heat-conducting component and located on the side of the first heat-conducting component facing away from the heat dissipation body, is used to abut against the server casing; and, A thermally conductive buffer is provided, wherein the thermally conductive buffer is made of an elastic material and is disposed between the first thermally conductive component and the second thermally conductive component.
3. The server heat sink as described in claim 2, characterized in that, The thermally conductive buffer is provided in multiple forms; and / or, The thermally conductive buffer is configured as a thermally conductive spring.
4. The server heat sink as described in claim 2, characterized in that, The end face of the first heat-conducting component facing the heat dissipation body is provided with a groove; The end corresponding to the heat dissipation body is embedded in the groove to fix the heat dissipation body.
5. The server heat sink as described in claim 2, characterized in that, The first heat-conducting component and / or the second heat-conducting component are provided with heat dissipation channels.
6. The server heat sink as described in claim 1, characterized in that, The heat dissipation body includes: The substrate is used to contact the heat-generating components of the server; Multiple heat dissipation fins are disposed on the substrate and arranged at intervals along the second direction.
7. The server heat sink as described in claim 6, characterized in that, The heat-conducting structure has a groove at one end in the first direction; The ends of the multiple heat dissipation fins are all engaged in the groove and abut against the wall of the groove.
8. The server heat sink as described in claim 6, characterized in that, The substrate has a first mounting side and a second mounting side disposed opposite to each other in a first direction; The plurality of heat dissipation fins include a plurality of first heat dissipation fins and a plurality of second heat dissipation fins arranged alternately. The plurality of first heat dissipation fins are connected to the first mounting side, and the plurality of second heat dissipation fins are connected to the second mounting side. The end of each second heat dissipation fin is in contact with the end of each of the two adjacent first heat dissipation fins.
9. The server heat sink as described in claim 1, characterized in that, The heat dissipation body and the heat-conducting structure are arranged in a first direction, and the side of the heat dissipation body in the first direction is used to contact the heat-generating element of the server; and / or, The material of the heat-conducting structure includes metal.
10. An immersion liquid-cooled server, characterized in that, include: The chassis is capable of being submerged in liquid cooling medium. The chassis includes a housing and a cover, and the heating element is installed inside the housing. ； The server heat sink as described in any one of claims 1-9 is disposed inside the housing, and the heat-conducting structure abuts against the cover, for transferring the heat of the heating element to the cover for heat exchange with the liquid cooling medium.