An optoelectronic coupler chip processing system

Abstract

This utility model discloses an optocoupler chip processing system, including a material conveying module, which is equipped with a control unit, a conveying unit, and a chip placement unit. The control unit is connected to both the conveying unit and the chip placement unit. The conveying unit is used to convey the chip to be processed. A wire bonding module is connected to the chip placement unit and is used to electrically connect the chip to be processed to a substrate to obtain an optocoupler chip. A dispensing module is connected to the wire bonding module and is used to dispense adhesive onto the optocoupler chip. According to the technical solution of this embodiment, the efficiency of the optocoupler chip processing system can be improved while ensuring the consistency of adhesive dispensing for the optocoupler chip.

Description

Technical Field

[0001] This utility model relates to the field of optocoupler manufacturing technology, and in particular to an optocoupler chip processing system. Background Technology

[0002] In the production process of optocouplers, the emitting chip of the optocoupler needs to be protected with silicone. However, in the existing technology, the dispensing device for optocouplers is mostly to place multiple dispensing ports side by side, which cannot effectively align the position of each dispensing port. When dispensing different models of emitting chips for optocouplers, it is impossible to ensure the consistency of dispensing during the optocoupler dispensing process, resulting in low efficiency of the optocoupler chip processing system. Utility Model Content

[0003] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes an optocoupler chip processing system that can effectively improve the efficiency of the optocoupler chip processing system.

[0004] On one hand, the optocoupler chip processing system according to an embodiment of the present invention includes:

[0005] The material conveying module includes a control unit, a conveying unit, and a chip placement unit. The control unit is connected to both the conveying unit and the chip placement unit. The conveying unit is used to convey the chips to be processed.

[0006] A wire bonding module is connected to the chip placement unit. The wire bonding module is used to electrically connect the chip to be processed to the substrate to obtain an optocoupler chip.

[0007] A dispensing module is connected to the wire bonding module and is used to dispense adhesive onto the optocoupler chip.

[0008] According to some embodiments of the present invention, the conveying unit includes a lifting mechanism, a telescopic mechanism, a suction device, and a placement mechanism. The lifting mechanism is connected to both the lifting mechanism and the suction device. The suction device is disposed on the upper part of the placement mechanism. The placement mechanism is provided with a placement platform, a fixing plate, and multiple limiting supports. The fixing plate is provided with multiple limiting grooves. Each of the multiple limiting supports is provided with a limiting part and a fixing part. The fixing part is disposed on the lower part of the fixing plate and connected to the placement platform. The limiting part passes through the limiting groove.

[0009] According to some embodiments of the present invention, the air suction device is provided with a first suction mechanism, a second suction mechanism, a third suction mechanism, a first connector, and a second connector. One end of the first suction mechanism is provided with a first through hole, and the other end of the first suction mechanism is provided with a second through hole. The first connector passes through the first through hole and is connected to one end of the second suction mechanism and the third suction mechanism respectively. The second connector passes through the second through hole and is connected to the other end of the second suction mechanism and the third suction mechanism respectively.

[0010] According to some embodiments of the present invention, the air suction device is further provided with a plurality of suction nozzles, all of which are disposed at the lower part of the first suction mechanism, the second suction mechanism and the third suction mechanism. The second suction mechanism and the third suction mechanism are each provided with a first air passage, a second air passage and a plurality of suction nozzle fixing members. The suction nozzle fixing members are sleeved outside the first air passage and the second air passage and are connected to the suction nozzles.

[0011] According to some embodiments of the present invention, the dispensing module includes a first body, a dispensing unit, and a gel input unit. The dispensing unit is disposed on the upper part of the first body and connected to the gel input unit. The gel input unit is provided with multiple gel input channels. The dispensing unit includes a first housing, multiple injection tubes, and multiple needles. The multiple injection tubes are all disposed inside the first housing. One end of each injection tube is connected to a needle, and the other end of each injection tube corresponds to a gel input channel.

[0012] According to some embodiments of the present invention, the first housing is provided with a plurality of adjustment grooves and a first fixing member, each of the glue injection tubes is provided with a second housing, the first housing is covered outside the second housing, and the first fixing member passes through the adjustment groove and is connected to the first housing.

[0013] According to some embodiments of the present invention, the second housing is provided with a plurality of limiting holes on the side near the first housing, and the first fixing member passes through the adjusting groove and is connected to the limiting holes.

[0014] According to some embodiments of the present invention, a plurality of second fixing members are provided on the upper part of the first housing, and the second fixing members are provided with a first recessed portion, which is in contact with the upper part of the glue injection tube.

[0015] The optocoupler chip processing system according to the embodiments of the present invention has at least the following beneficial effects:

[0016] The material conveying module includes a control unit, a conveying unit, and a chip placement unit. The control unit is connected to both the conveying unit and the chip placement unit. The conveying unit is used to convey the chips to be processed. A wire bonding module is connected to the chip placement unit and is used to electrically connect the chips to the substrate to obtain the optocoupler chips. A dispensing module is connected to the wire bonding module and is used to dispense adhesive onto the optocoupler chips. According to the technical solution of this embodiment, the efficiency of the optocoupler chip processing system can be improved while ensuring the consistency of adhesive dispensing for the optocoupler chips.

[0017] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0018] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0019] Figure 1 This is a schematic diagram of the overall structure of the optocoupler chip processing system according to an embodiment of the present invention;

[0020] Figure 2 This is a schematic diagram of the dispensing module according to an embodiment of the present invention;

[0021] Figure 3 This is a schematic diagram of the conveying unit according to an embodiment of the present invention;

[0022] Figure 4 This is a schematic diagram of the placement mechanism according to an embodiment of the present utility model;

[0023] Figure 5 This is a schematic diagram of the air suction device according to an embodiment of the present utility model;

[0024] Figure 6 This is a schematic diagram of the structure of the first through hole and the second through hole in an embodiment of this utility model;

[0025] Figure 7 This is a structural schematic diagram of the second fixing member in an embodiment of the present utility model. Detailed Implementation

[0026] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.

[0027] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If "first" or "second" is used in the description, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0028] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0029] Reference Figure 1 and Figure 2 This utility model provides an optocoupler chip processing system, including a material conveying module 100, which is equipped with a control unit, a conveying unit 110, and a chip placement unit 120. The control unit is connected to both the conveying unit 110 and the chip placement unit 120. The conveying unit 110 is used to convey the chip to be processed. A wire bonding module is connected to the chip placement unit 120 and is used to electrically connect the chip to be processed to a substrate to obtain an optocoupler chip. A dispensing module 200 is connected to the wire bonding module and is used to dispense adhesive onto the optocoupler chip. According to the technical solution of this embodiment, the efficiency of the optocoupler chip processing system can be improved while ensuring the consistency of adhesive dispensing onto the optocoupler chip.

[0030] It should be noted that the control unit is connected to both the conveying unit 110 and the chip placement unit 120, enabling precise control of the entire material conveying process. Through unified control, the conveying speed of the conveying unit 110 and the placement position and method of the chip placement unit 120 can be flexibly adjusted according to different production needs, such as chip type and processing speed, improving the system's adaptability and production efficiency. For example, for chips of different sizes, the control unit adjusts the conveyor belt width and speed of the conveying unit 110 to ensure smooth and accurate chip delivery. Simultaneously, the automated conveying process can seamlessly integrate with the subsequent wire bonding module and dispensing module 200, improving production continuity and efficiency. For example, the conveying unit 110 can accurately deliver chips to designated positions on the wire bonding module according to predetermined time intervals and paths, preparing for subsequent wire bonding operations; the chip placement unit 120, connected to the control unit, can precisely place the chips to be processed in designated positions, providing accurate chip positioning for the wire bonding module, thereby improving the accuracy and reliability of wire bonding and reducing the occurrence of wire bonding errors.

[0031] The wire bonding module is connected to the chip placement unit 120, enabling timely and accurate acquisition of the placed chip, reducing waiting time and idle time during chip processing. Simultaneously, because the chip placement unit 120 provides accurate chip positioning, the wire bonding module can more precisely electrically connect the chip to the substrate, improving the electrical performance and stability of the optocoupler chip. For example, based on the chip position information provided by the chip placement unit 120, the wire bonding module precisely controls the position and length of the bonding wire, ensuring the quality of the electrical connection between the chip and the substrate. The wire bonding module electrically connects the chip to the substrate, realizing the basic functions of the optocoupler chip. High-quality wire bonding ensures stable and reliable signal transmission between the chip and the substrate, improving the performance and lifespan of the optocoupler chip.

[0032] Furthermore, the dispensing module 200 is connected to the wire bonding module, enabling timely dispensing of adhesive to the optocoupler chip after the wire bonding operation. Simultaneously, the dispensing module 200 can perform targeted dispensing based on the results of the wire bonding module's operation, improving the accuracy and effectiveness of the dispensing. For example, the dispensing module 200 can precisely adjust the dispensing position and amount according to the position and number of wires, ensuring the chip is adequately protected and fixed. The dispensing module 200's application of adhesive to the optocoupler chip protects both the chip and the wires, preventing external environmental factors (such as moisture and dust) from affecting the chip and electrical connections, thus improving the chip's reliability and stability. Simultaneously, the dispensing also helps to fix the chip to the substrate, further enhancing the chip's mechanical strength and reducing potential loosening and damage during use.

[0033] Reference Figure 3 and Figure 4 The conveying unit 110 includes a lifting mechanism 130, a telescopic mechanism 140, a suction device 150, and a placement mechanism 160. The lifting mechanism 130 is connected to both the lifting mechanism 130 and the suction device 150. The suction device 150 is located on the upper part of the placement mechanism 160. The placement mechanism 160 is provided with a placement platform 161, a fixing plate 162, and multiple limiting supports 163. The fixing plate 162 is provided with multiple limiting grooves 164. Each of the multiple limiting supports 163 is provided with a limiting part 165 and a fixing part 166. The fixing part 166 is located on the lower part of the fixing plate 162 and is connected to the placement platform 161. The limiting part 165 passes through the limiting groove 164.

[0034] It should be noted that the lifting mechanism 130 is connected to both the telescopic mechanism 140 and the air suction device 150, enabling the air suction device 150 to be adjusted vertically. Simultaneously, in conjunction with the telescopic mechanism 140, the air suction device 150 can move flexibly in three-dimensional space, improving the conveying unit 110's ability to grasp and place chips at different positions, and enhancing the system's adaptability and flexibility. When picking up chips, it effectively ensures that the air suction device 150 is in close contact with the chip surface, improving the stability and reliability of the picking process and reducing the risk of chips falling or being damaged.

[0035] The telescopic mechanism 140 cooperates with the lifting mechanism 130 to enable the air suction device 150 to move horizontally. After picking up the chip at the chip storage location, the telescopic mechanism 140 moves the air suction device 150 to a designated position in the wire bonding module or other processing modules, achieving automated chip delivery. By setting the telescopic mechanism 140, the conveying unit 110 can adjust the horizontal position of the air suction device 150 in both confined spaces and large working areas, ensuring that the chip can be accurately delivered to the required location, thereby improving the system's versatility.

[0036] The air suction device 150 is positioned above the placement mechanism 160, facilitating the suction and release of chips placed on the mechanism 160. This arrangement allows the air suction device 150 to directly act on the chips, reducing the movement distance and interference factors during suction and placement, thus improving operational stability and accuracy. The air suction device 150 utilizes air pressure difference to suction the chips, offering the advantage of less damage to the chip surface compared to other gripping methods (such as mechanical grippers). For some surface-sensitive chips, the air suction device 150 can achieve reliable gripping and transport without damaging the chip, improving chip yield.

[0037] The placement stage 161 provides a stable surface for chip placement. During chip transport and handling, the placement stage 161 can withstand the weight of the chip and maintain its horizontal position, providing a good foundation for subsequent operations (such as suction by the pneumatic suction device 150, wire bonding, etc.). The fixing plate 162 is provided with multiple limiting grooves 164, which work in conjunction with multiple limiting supports 163 to precisely position the chip. The limiting grooves 164 effectively limit the movement range of the limiting supports 163, thereby ensuring that the chip placed on the placement mechanism 160 is accurately positioned. The limiting part 165 passes through the limiting grooves 164, limiting the chip under the constraint of the fixing plate 162, ensuring the chip's positioning accuracy, and also buffering the impact on the chip during placement and transport to a certain extent, protecting the chip from damage. Simultaneously, the multiple limiting supports 163 can limit the chip from multiple directions, further improving the stability and accuracy of chip placement.

[0038] Reference Figure 5 The air suction device 150 is provided with a first suction mechanism 151, a second suction mechanism 152, a third suction mechanism 153, a first connector 154, and a second connector 155. One end of the first suction mechanism 151 is provided with a first through hole 156, and the other end of the first suction mechanism 151 is provided with a second through hole 157. The first connector 154 passes through the first through hole 156 and is connected to one end of the second suction mechanism 152 and the third suction mechanism 153 respectively. The second connector 155 passes through the second through hole 157 and is connected to the other end of the second suction mechanism 152 and the third suction mechanism 153 respectively.

[0039] It should be noted that the air suction device 150 is equipped with a first suction mechanism 151, a second suction mechanism 152, and a third suction mechanism 153. The coordinated operation of multiple suction mechanisms provides greater suction force. For chips that are heavy or have difficult-to-adhere surfaces, multiple suction mechanisms ensure more reliable suction, reduce the risk of the chip falling during the suction process, and improve the success rate and stability of suction. For example, when handling large and heavy optocoupler chips, a single suction mechanism may not provide sufficient suction force to stably grip the chip. This embodiment effectively suctions the chip by setting multiple suction mechanisms to work simultaneously. Furthermore, different suction mechanisms can suction from different positions on the chip, making the chip more evenly stressed during suction, thereby reducing tilting or deformation caused by uneven stress and improving suction accuracy. When placing the chip, it can also be placed more accurately at the target position, ensuring the accuracy and reliability of subsequent processing (such as wire bonding, dispensing, etc.). For example, the second suction mechanism 152 and the third suction mechanism 153 can respectively suction air from both sides of the chip, working in conjunction with the first suction mechanism 151 to keep the chip in a horizontal state during the suction and placement process, avoiding processing errors caused by chip tilting.

[0040] The first connecting member 154 passes through the first through hole 156 and is connected to one end of the second suction mechanism 152 and the third suction mechanism 153, respectively. This connection method realizes the mechanical connection and force transmission between the suction mechanisms, ensuring that the various suction mechanisms can work together and maintain a stable relative position during the suction process. At the same time, the first connecting member 154 can also play a certain supporting role, enhancing the overall structural strength of the air suction device 150 and making it less prone to deformation or damage during operation. For example, during the movement of the air suction device 150, the first connecting member 154 can ensure that the second suction mechanism 152 and the third suction mechanism 153 will not be displaced by external forces, thus affecting the suction effect. The second connecting member 155 passes through the second through hole 157 and is connected to the other end of the second suction mechanism 152 and the third suction mechanism 153, respectively, further strengthening the connection and stability between the suction mechanisms. In conjunction with the first connecting member 154, the second connecting member 155 forms a stable frame structure, enabling the air suction device 150 to withstand greater external forces and pressures during operation. Furthermore, the second connector 155 can also adjust the relative positions between the suction mechanisms to accommodate chips of different sizes and shapes. For example, by adjusting the position of the second connector 155, the distance between the second suction mechanism 152 and the third suction mechanism 153 can be changed, thereby better adapting to the suction needs of chips of different sizes.

[0041] Reference Figure 5 and Figure 6The air suction device 150 is also provided with multiple suction nozzles 158. The multiple suction nozzles 158 are all located at the lower part of the first suction mechanism 151, the second suction mechanism 152 and the third suction mechanism 153. The second suction mechanism 152 and the third suction mechanism 153 are each provided with a first air passage, a second air passage and multiple suction nozzle 158 fixing members. The suction nozzle 158 fixing members are sleeved outside the first air passage and the second air passage and connected to the suction nozzles 158.

[0042] It should be noted that different chips may have different sizes and shapes, and the layout of multiple suction nozzles 158 can better accommodate various types of chips. By rationally arranging the position and number of suction nozzles 158, it is ensured that the air suction device 150 can stably pick up chips of different specifications. For some irregularly shaped chips, multiple suction nozzles 158 can provide suction from different positions, ensuring the balance and stability of the chip during the suction process.

[0043] Both the second suction mechanism 152 and the third suction mechanism 153 are equipped with a first airway and a second airway. This multi-airway design optimizes the airflow system. Different airways can control the suction pressure and flow rate of the suction nozzle 158 in different areas, allowing for flexible adjustments based on the characteristics of the chip and suction requirements. For example, for some chips with sensitive surfaces, the suction pressure of the corresponding suction nozzle 158 can be reduced by adjusting the parameters of the first and second airways, thus avoiding damage to the chip surface.

[0044] Furthermore, the nozzle 158 fixing component is sleeved outside the first and second air passages and connected to the nozzle 158, which can firmly fix the nozzle 158 and prevent it from loosening or falling off during operation. During the frequent movement and chip suction of the air suction device 150, the nozzle 158 fixing component can always keep the nozzle 158 in a stable position, avoiding any impact on chip suction accuracy due to loosening of the nozzle 158. The nozzle 158 fixing component also makes the replacement and maintenance of the nozzle 158 more convenient. When the nozzle 158 wears or is damaged due to prolonged use, it can be easily removed from the fixing component for replacement without requiring complex disassembly and reassembly of the entire air suction device 150.

[0045] Reference Figure 2 The dispensing module 200 includes a first body 210, a dispensing unit 220, and a gel input unit 230. The dispensing unit 220 is disposed on the upper part of the first body 210 and connected to the gel input unit 230. The gel input unit 230 is provided with multiple gel input channels 231. The dispensing unit 220 includes a first housing 221, multiple injection tubes 222, and multiple needles 223. The multiple injection tubes 222 are all disposed inside the first housing 221. One end of the injection tube 222 is connected to the needle 223, and the other end of the injection tube 222 corresponds to the gel input channel 231.

[0046] It should be noted that the gel input unit 230 provides gel to the dispensing unit 220, which performs the dispensing operation. The two work closely together, thereby improving dispensing efficiency and production continuity. In the production process of optocoupler chips, the dispensing process can be completed quickly and accurately, accelerating the entire production flow. The gel input unit 230 is equipped with multiple gel input channels 231, enabling the dispensing module 200 to handle multiple different types of gels simultaneously. Multiple gel input channels 231 can deliver different gels separately and can be flexibly switched according to production requirements, thereby improving the adaptability and flexibility of the dispensing module 200. Multiple gel input channels 231 ensure a stable gel supply, avoiding dispensing interruptions or unstable quality due to insufficient gel supply. For example, in continuous production, even if one channel experiences a temporary blockage or supply problem, the other channels can continue to supply gel, ensuring the normal operation of the dispensing process.

[0047] Reference Figure 2 The first housing 221 is provided with multiple adjustment grooves 224 and a first fixing member 225. Each injection tube 222 is provided with a second housing 226. The first housing 221 covers the outside of the second housing 226. The first fixing member 225 passes through the adjustment groove 224 and is connected to the first housing 221.

[0048] It should be noted that the first housing 221 is provided with multiple adjustment slots 224. When the second housing 226 of each dispensing tube 222 is engaged with the first housing 221, the position of the dispensing tube 222 can be adjusted through the adjustment slots 224. During the dispensing process of optocoupler chips, different chips may have different dispensing position requirements, or the position of the dispensing tube 222 may need to be fine-tuned according to actual conditions during production. The existence of the adjustment slots 224 allows operators to easily move the dispensing tube 222, ensuring its needle 223 is aligned with the precise dispensing position on the chip, thus improving dispensing accuracy and flexibility.

[0049] For example, when producing different models of optocoupler chips, the position of the dispensing tube 222 is adjusted by adjusting the groove 224 to accommodate different dispensing layouts on the chip. Different types of dispensing tubes 222 may have different sizes and shapes. The setting of the adjusting groove 224 provides convenience for installing and using dispensing tubes 222 of different specifications. According to the specific size of the dispensing tube 222, it can be adaptively installed and fixed within the range of the adjusting groove 224, thereby enhancing the adaptability of the dispensing unit 220 to different dispensing tubes 222.

[0050] After adjusting the position of the dispensing tube 222, the dispensing tube 222 is firmly fixed inside the first housing 221 by the first fixing member 225 to ensure that the dispensing tube 222 will not be displaced due to vibration, external force or other factors during the dispensing process, thereby ensuring the accuracy and consistency of dispensing.

[0051] Reference Figure 2 The second housing 226 is provided with multiple limiting holes on the side near the first housing 221, and the first fixing member 225 passes through the adjustment groove 224 and is connected to the limiting holes.

[0052] It should be noted that the limiting hole provides a precise connection position for the first fixing member 225, ensuring the accurate installation position of the second housing 226 within the first housing 221. This allows the needle 223 to accurately align with the area to be glued on the optocoupler chip during dispensing, improving dispensing accuracy and consistency, and reducing inaccurate dispensing positions caused by installation deviations. After the first fixing member 225 is connected to the limiting hole, it effectively restricts the movement and shaking of the second housing 226 within the first housing 221. During the dispensing process, even under certain external forces or vibrations, the dispensing tube 222 remains stable and will not shift or loosen, thus ensuring the stability of dispensing quality and avoiding problems such as uneven gel application and inaccurate dispensing volume caused by shaking of the dispensing tube 222.

[0053] Reference Figure 7 The upper part of the first housing 221 is provided with a plurality of second fasteners 227, and the second fasteners 227 are provided with a first recess 228, which is in contact with the upper part of the glue injection tube 222.

[0054] It should be noted that multiple second fixing members 227 are disposed on the upper part of the first housing 221, and the first recess 228 is fitted against the upper part of the dispensing tube 222, which can fix and constrain the dispensing tube 222 from above. During the dispensing process, the dispensing tube 222 may be affected by the internal pressure generated by the gel flow and external vibrations. The second fixing members 227 can effectively prevent the dispensing tube 222 from shaking or displacing under these factors. Furthermore, when installing the dispensing tube 222, simply align the upper part of the dispensing tube 222 with the first recess 228 and then fix it with the second fixing members 227. When disassembling, loosening the second fixing members 227 allows the dispensing tube 222 to be easily removed, facilitating maintenance, cleaning, or replacement of the dispensing tube 222.

[0055] In the description of this specification, references to terms such as "one embodiment," "further embodiment," "some specific embodiments," or "some examples," etc., indicate that a specific feature, structure, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0056] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A photocoupler chip processing system, characterized in that, include: The material conveying module includes a control unit, a conveying unit, and a chip placement unit. The control unit is connected to both the conveying unit and the chip placement unit. The conveying unit is used to convey the chips to be processed. A wire bonding module is connected to the chip placement unit. The wire bonding module is used to electrically connect the chip to be processed to the substrate to obtain an optocoupler chip. A dispensing module is connected to the wire bonding module and is used to dispense adhesive onto the optocoupler chip.

2. The optocoupler chip processing system according to claim 1, characterized in that, The conveying unit includes a lifting mechanism, a telescopic mechanism, a suction device, and a placement mechanism. The lifting mechanism is connected to both the lifting mechanism and the suction device. The suction device is located on the upper part of the placement mechanism. The placement mechanism includes a placement platform, a fixing plate, and multiple limiting supports. The fixing plate has multiple limiting grooves. Each of the multiple limiting supports has a limiting part and a fixing part. The fixing part is located on the lower part of the fixing plate and connected to the placement platform. The limiting part passes through the limiting groove.

3. The optocoupler chip processing system according to claim 2, characterized in that, The air suction device is provided with a first suction mechanism, a second suction mechanism, a third suction mechanism, a first connector, and a second connector. One end of the first suction mechanism is provided with a first through hole, and the other end of the first suction mechanism is provided with a second through hole. The first connector passes through the first through hole and is connected to one end of the second suction mechanism and the third suction mechanism, respectively. The second connector passes through the second through hole and is connected to the other end of the second suction mechanism and the third suction mechanism, respectively.

4. The optocoupler chip processing system according to claim 3, characterized in that, The air suction device is also provided with multiple suction nozzles, which are all located at the lower part of the first suction mechanism, the second suction mechanism and the third suction mechanism. The second suction mechanism and the third suction mechanism are each provided with a first air passage, a second air passage and multiple suction nozzle fixing members. The suction nozzle fixing members are sleeved on the outside of the first air passage and the second air passage and are connected to the suction nozzles.

5. The optocoupler chip processing system according to claim 1, characterized in that, The dispensing module includes a first body, a dispensing unit, and a gel input unit. The dispensing unit is disposed on the upper part of the first body and connected to the gel input unit. The gel input unit is provided with multiple gel input channels. The dispensing unit includes a first housing, multiple injection tubes, and multiple needles. The multiple injection tubes are all disposed inside the first housing. One end of each injection tube is connected to a needle, and the other end of each injection tube corresponds to a gel input channel.

6. The optocoupler chip processing system according to claim 5, characterized in that, The first housing is provided with multiple adjustment slots and a first fixing member. Each of the glue injection tubes is provided with a second housing. The first housing covers the outside of the second housing. The first fixing member passes through the adjustment slot and is connected to the first housing.

7. The optocoupler chip processing system according to claim 6, wherein the second housing is provided with a plurality of limiting holes on the side near the first housing, and the first fixing member passes through the adjustment groove and is connected to the limiting holes.

8. The optocoupler chip processing system according to claim 5, characterized in that, The upper part of the first housing is provided with a plurality of second fixing members, and the second fixing members are provided with a first recessed portion, which is in contact with the upper part of the glue injection tube.

Images