A double-lamp-cup LED packaging structure and an LED lamp
By adopting a dual-cup design in the LED packaging structure, bonding green and blue light chips separately, and setting a red phosphor layer on the blue light chip, the problem of poor consistency of white LEDs in the prior art is solved, and efficient and stable white LED production is achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- DONGGUAN FURIYUANLEI TECH CO LTD
- Filing Date
- 2025-04-25
- Publication Date
- 2026-06-02
AI Technical Summary
Existing LED packaging structures produce white LEDs with poor consistency by using phosphor glue made from a mixture of green and red phosphors. Furthermore, random errors exist in the phosphor mixing ratio, affecting luminous efficacy and color rendering.
A dual-lamp cup structure is adopted, with a green light chip and a blue light chip fixed in the first inner lamp cup and the second inner lamp cup, respectively. A red phosphor layer is set on the blue light chip to replace the green phosphor. White light is obtained by mixing the light from the green light chip and the blue light chip, avoiding random errors in the mixing ratio of phosphor.
It improves the luminous efficacy consistency and energy conversion efficiency of white LEDs, reduces the uncertainty of phosphor mixing ratio, enhances resistance to thermal quenching, and improves the color rendering index.
Smart Images
Figure CN224319829U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of LED lighting technology, and in particular to a dual-lamp cup LED packaging structure and an LED lamp. Background Technology
[0002] Existing LED packaging structures typically use a substrate as a carrier, with the LED chip bonded to the bottom of the lamp cup. A fluorescent adhesive, a mixture of green and red phosphors, is then applied to the top of the LED chip using a dispensing machine. When the LED chip operates, the green and red phosphors are excited to emit green and red light, which, according to the RGB three-primary-color principle, mix to produce a white LED, achieving high color gamut backlighting. This method has a simple manufacturing process and can effectively improve backlight purity, achieving a higher color gamut. However, the production process requires strict control over the mixing ratio of green and red phosphors and the adhesive when preparing the fluorescent adhesive. Random errors that are difficult to overcome exist between different batches, making it difficult to guarantee the consistency of LED packaging structure performance across batches in actual production.
[0003] Therefore, existing technologies still need to be improved and developed. Utility Model Content
[0004] In view of the shortcomings of the prior art, the purpose of this utility model is to provide a dual-lamp cup LED packaging structure and LED lamp to solve the problem that the existing LED packaging structure obtains three primary colors of light by exciting a fluorescent adhesive made of two colors of phosphors, resulting in poor consistency of white LEDs.
[0005] The technical solution of this utility model is as follows:
[0006] A dual-cup LED packaging structure includes a support body and a light-emitting chip:
[0007] The support body is provided with a lamp cup structure and a material wall located inside the lamp cup structure;
[0008] The two ends of the material wall are respectively connected to the side wall of the lamp cup structure to form the first inner lamp cup and the second inner lamp cup;
[0009] The light-emitting chip includes a green light chip and a blue light chip, which are located in the first inner lamp cup and the second inner lamp cup, respectively. A red fluorescent layer is disposed on the blue light chip.
[0010] In a further embodiment of this invention, the bottom of the first inner lamp cup is provided with a first positive electrode functional area and a first negative electrode functional area, and a first isolation strip is provided between the first positive electrode functional area and the first negative electrode functional area.
[0011] In a further embodiment of this invention, the bottom of the second inner lamp cup is provided with a second positive electrode functional area and a second negative electrode functional area, and a second isolation strip is provided between the second positive electrode functional area and the second negative electrode functional area.
[0012] In a further embodiment of this invention, the green light chip is flip-mounted at the bottom of the first inner lamp cup, and the blue light chip is flip-mounted at the bottom of the second inner lamp cup.
[0013] In a further embodiment of this invention, the green or blue light chip has a size of 1020*5252 mils.
[0014] In a further embodiment of this invention, the top of the first inner lamp cup and the second inner lamp cup are semi-circular structures with a first diameter, and the bottom of the first inner lamp cup and the second inner lamp cup are semi-circular structures with a second diameter. The first diameter is larger than the second diameter, and the semi-circular structures with the first diameter and the second diameter are coaxially arranged in the vertical direction.
[0015] In a further improvement of this invention, a transparent adhesive layer is provided on the fluorescent adhesive and the green light chip.
[0016] Based on the same inventive concept, this utility model also provides an LED lamp, which includes the above-described dual-lamp cup LED packaging structure.
[0017] This utility model provides a dual-lamp-cup LED packaging structure and an LED lamp. The dual-lamp-cup LED packaging structure includes a support body and a light-emitting chip. The support body is provided with a lamp cup structure and a material wall located inside the lamp cup structure. The two ends of the material wall are respectively connected to the sidewalls of the lamp cup structure to form a first inner lamp cup and a second inner lamp cup. The light-emitting chip includes a green light chip and a blue light chip, which are respectively located inside the first inner lamp cup and the second inner lamp cup. Compared with the prior art, the beneficial effects of this utility model are:
[0018] This invention involves fixing the green and blue light chips, then adding and encapsulating a red fluorescent layer to obtain a high color gamut white LED chip. This invention eliminates the need for mixing and proportioning the fluorescent adhesive, making the production of high color gamut white LED chips more stable and solving the problem of random errors in the mixing ratio of fluorescent adhesive in existing technologies, thus increasing the consistency of LED chip production. Attached Figure Description
[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.
[0020] Figure 1 This is a schematic diagram of an existing LED packaging structure.
[0021] Figure 2 This is a top view of the bracket body of a dual-lamp cup LED packaging structure provided in some preferred embodiments of this utility model.
[0022] Figure 3 This is a left view of a dual-lamp cup LED packaging structure provided in some preferred embodiments of this utility model.
[0023] Figure 4 This is a right view of a dual-lamp cup LED packaging structure provided in some preferred embodiments of this utility model.
[0024] Figure 5 This is a front view of a dual-lamp cup LED packaging structure provided in some preferred embodiments of this utility model.
[0025] Figure 6 This is a top view of a dual-lamp cup LED packaging structure provided in some preferred embodiments of this utility model.
[0026] The following are the markings in the attached diagram: 1. Support body; 11. Lamp cup structure; 111. Side wall; 112. First inner lamp cup; 1121. First positive electrode functional area; 1122. First negative electrode functional area; 1123. First isolation strip; 113. Second inner lamp cup; 1131. Second positive electrode functional area; 1132. Second negative electrode functional area; 1133. Second isolation strip; 12. Material wall; 2. Light-emitting chip; 11. Lamp cup structure; 21. Green light chip; 22. Blue light chip; 31. Red fluorescent layer; 32. Transparent adhesive layer. Detailed Implementation
[0027] This utility model provides a dual-lamp cup LED packaging structure and an LED lamp. To make the purpose, technical solution, and effects of this utility model clearer and more explicit, the following describes this utility model in further detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are merely illustrative of this utility model and are not intended to limit this utility model.
[0028] In the implementation methods and claims, unless otherwise specified in the text, the terms "a," "an," "the," and "the" may also include plural forms. If the embodiments of this utility model involve descriptions of "first," "second," etc., such descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features.
[0029] It should be further understood that the term "comprising" as used in this specification means the presence of the stated features, integers, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. It should be understood that when we say an element is "connected" or "coupled" to another element, it can be directly connected or coupled to the other element, or there may be intermediate elements. Furthermore, "connected" or "coupled" as used herein can include wireless connections or wireless coupling. The term "and / or" as used herein includes all or any unit and all combinations of one or more associated listed items.
[0030] It will be understood by those skilled in the art that, unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It should also be understood that terms such as those defined in general dictionaries should be understood to have the same meaning as in the context of the prior art, and should not be interpreted in an idealized or overly formal sense unless specifically defined as herein.
[0031] Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.
[0032] With the development of LED lighting technology, the application fields of LED devices are becoming increasingly widespread. To meet the growing demand for high brightness and high color gamut, existing technologies are increasingly demanding improvements in cost reduction, brightness enhancement, and color gamut. Existing high color gamut LED packaging structures, such as... Figure 1As shown. In the prior art, high color gamut LEDs typically use a support as a carrier, and the light-emitting chip 2 is mounted upright or flip-chip at the bottom of the lamp cup using a die bonder. For example, the light-emitting chip 2 is a blue light-emitting chip 22. When the blue light-emitting chip 22 is mounted upright, its positive and negative electrode pads are located on the upper surface, and its substrate is located on the lower surface. Insulating thermally conductive adhesive is used to bond the blue light-emitting chip 22, and wire bonding connects the positive electrode pad of the blue light-emitting chip 22 to the positive electrode pad of the support, and the negative electrode pad of the blue light-emitting chip 22 to the negative electrode pad of the support, resulting in relatively low heat generation. When flip-chip mounted, the substrate of the blue light-emitting chip 22 is located on the upper surface, and the positive and negative electrode pads of the blue light-emitting chip 22 are fixed to the positive and negative functional areas of the support using conductive silver paste, avoiding the electrodes from blocking the emitted light.
[0033] The inventors discovered that in existing technologies, after the blue LED chip 22 is die-bonded to the bottom of the lamp cup, a fluorescent adhesive 30, composed of a mixture of green and red phosphors, is applied to the top of the blue LED chip 22 using a dispensing machine and then baked to cure. When the LED is working, the blue light emitted by the blue LED chip excites the green phosphor in the fluorescent adhesive 30 to emit green light, and the red phosphor to emit red light. According to the RGB three-primary-color principle, red, green, and blue light mix to produce white light, thus obtaining a high color gamut LED. However, during the production and processing of the fluorescent adhesive 30, the mixing ratio of green phosphor, red phosphor, and adhesive affects the overall luminous efficacy and color rendering index of the LED packaging structure: increasing the proportion of green phosphor can improve the luminous efficacy, but the color rendering index is lower; increasing the proportion of red phosphor can significantly improve the color rendering index, compensating for the color rendering spectrum of the excitation light from the green phosphor. During the production process, due to random errors in the mixing ratio during the processing of each batch of LED packaging structures, it is impossible to guarantee the consistency of the luminous effect of each batch of LED packaging structures. Furthermore, due to the broad excitation spectrum of red phosphors, some of the green light generated by green phosphors when excited by blue light is absorbed a second time by the red phosphors and re-excited into red light, resulting in energy loss and thus reducing energy conversion efficiency. Simultaneously, the stability of the excitation light from the phosphor-based fluorescent adhesive 30 is lower than that of the light-emitting chip 2. The luminous intensity of most phosphors decreases with increasing temperature, exhibiting thermal quenching. Green phosphors, in particular, are highly sensitive to high-temperature environments and require encapsulation structures for long-term use in high-temperature environments, severely impacting the practical performance of white LEDs.
[0034] Please refer to the above as well. Figure 2 and Figure 6Based on the aforementioned technical problems in the existing technology, this utility model proposes a dual-lamp-cup LED packaging structure, including a bracket body 1 and a light-emitting chip 2; the bracket body 1 is provided with a lamp cup structure 11 and a material wall 12 located inside the lamp cup structure 11; the two ends of the material wall 12 are respectively connected to the side wall 111 of the lamp cup structure 11 to form a first inner lamp cup 112 and a second inner lamp cup 113; the light-emitting chip 2 includes a green light chip 21 and a blue light chip 22, the green light chip 21 and the blue light chip 22 are respectively located inside the first inner lamp cup 112 and the second inner lamp cup 113, and a red phosphor layer 31 is provided on the blue light chip 22.
[0035] Specifically, Figure 2 The above figure is a front view of the bracket body 1 in this utility model. Figure 2 The following figure is a top view of the bracket body 1 in this utility model. The bracket body 1 can be a semi-plated bracket or a fully plating bracket, and the material of the bracket body 1 can be copper, iron, aluminum or ceramic; the lamp cup structure 11 can be a lamp cup type, a flat-top type or other special type; the material of the material wall 12 can be plastic insulating material. The height of the material wall 12 is less than the depth of the lamp cup structure 11, and the two ends of the material wall 12 are respectively connected to the side wall 111 of the lamp cup structure 11, dividing the lamp cup structure 11 into two symmetrical parts: a first inner lamp cup 112 and a second inner lamp cup 113. The first inner lamp cup 112 and the second inner lamp cup 113 have the same area. The first inner lamp cup 112 is located on the left side of the bracket body 1, and the second inner lamp cup 113 is located on the right side of the bracket body 1. A green light chip 21 is fixed in the first inner lamp cup 112 by die bonding, and a blue light chip 22 is fixed in the second inner lamp cup 113. The green light chip 21 has a size of 1020*5252 mils and can be used to emit light with a wavelength of 447.5-460nm; the blue light chip 22 has a size of 1020*5252 mils and can be used to emit light with a wavelength of 520-540nm. This invention replaces the green phosphor with the green light chip 21. Because the thermal stability of the green light chip 21 is superior to that of the green phosphor, the overall working performance stability of the LED package chip is improved. It also solves the problem of random errors in the mixing ratio of the phosphor adhesive 31 in the prior art, and the green light emitted by the green light chip 21 and the light generated by the blue light chip 22 exciting the red phosphor layer 31 will not interfere with each other. The light-emitting chip 2 in the LED packaging structure can also be a green light chip 21 and a purple light chip. The green light chip 21 is die-bonded in the first inner lamp cup 112, and the purple light chip is die-bonded in the second inner lamp cup 113. The purple light emitted by the purple light chip excites the red phosphor layer 31, which avoids the generation of a large amount of high-energy short-wave blue light and has a better blue light protection effect.
[0036] Please also refer to Figures 4 to 6 A red fluorescent layer 31 is disposed on the blue light chip 22. The red fluorescent layer is formed by curing red fluorescent adhesive. Further, the red fluorescent adhesive is KSF (K2SiF6:Mn4+) red fluorescent adhesive 31, which is applied to the surface of the blue light chip 22 by a dispensing machine. The preparation and proportioning method of the red fluorescent adhesive 31 is existing technology and will not be described in detail here. When the red fluorescent adhesive is applied into the second inner lamp cup 113, the blue light chip 22 can more effectively excite the electron transition of the red fluorescent layer 31 to the excited state, so that the red fluorescent layer 31 emits red light. After the red light leaves the second inner lamp cup 113, it mixes with the green light emitted by the green light chip 21 in the first inner lamp cup 112 to obtain white light, which has a higher energy conversion efficiency. Meanwhile, since green phosphors are more sensitive to high-temperature environments and are prone to thermal quenching, and the stability of the light excited by phosphors and the phosphor adhesive 31 further prepared from phosphors is lower than that of the light-emitting chip 2, this utility model replaces green phosphors with green light chip 21 to improve the overall thermal quenching resistance of the LED packaging structure.
[0037] Furthermore, some preferred embodiments of this utility model include further details such as... Figures 2 to 6 As shown, the tops of the first inner lamp cup 112 and the second inner lamp cup 113 are semi-circular structures with a first diameter, and the bottoms of both are semi-circular structures with a second diameter. The first diameter is larger than the second diameter, and the semi-circular structures with the first and second diameters are coaxially arranged in the vertical direction. The first inner lamp cup 112 and the second inner lamp cup 113 are respectively provided with a first side and a second side at an angle. In this embodiment of the invention, the lamp cup structure 11 is generally an inverted frustum shape; however, the lamp cup structure 11 can also be a rectangular structure, and this is not limited here. The first inner lamp cup 112 is formed by the first side, the material wall 12 and the bottom of the lamp cup. The second inner lamp cup 113 is formed by the second side, the material wall 12 and the bottom of the lamp cup. The inner wall of the first inner lamp cup 112 or the second inner lamp cup 113 can be covered with a layer of highly reflective material by electroplating, which can reflect the light emitted by the green light chip 21 and the blue light chip 22, reduce the loss of light radiation flux, and improve the light output efficiency of the LED chip.
[0038] Specifically, the internal space of the lamp cup structure 11 is a frustum of a cone with a cup mouth of a first diameter and a cup bottom of a second diameter, and the first diameter is larger than the second diameter; therefore, the cross-sectional diameter of the side wall 111 is larger closer to the cup mouth, so that the side wall 111 has a certain tilt angle relative to the cup bottom plane, thereby increasing the total amount of light emitted from the cup mouth of the lamp cup structure 11. The lamp cup structure 11 is divided by the material wall 12 into a first inner lamp cup 112 and a second inner lamp cup 113 of equal area. The bottom of the first inner lamp cup 112 is provided with a first positive electrode functional area 1121 and a first negative electrode functional area 1122, and a first isolation strip 1123 is provided between the first positive electrode functional area 1121 and the first negative electrode functional area 1122. The bottom of the second inner lamp cup 113 is provided with a second positive electrode functional area 1131 and a second negative electrode functional area 1132, and a second isolation strip 1133 is provided between the second positive electrode functional area 1131 and the second negative electrode functional area 1132. The green light chip is flip-mounted at the bottom of the first inner lamp cup, and the blue light chip is flip-mounted at the bottom of the second inner lamp cup.
[0039] Specifically, the first positive electrode functional region 1121, the second positive electrode functional region 1131, the first negative electrode functional region 1122, and the second negative electrode functional region 1132 are respectively positive electrode pads and negative electrode pads. The green light chip 21 and the blue light chip 22 are respectively flip-chip mounted in the first inner lamp cup 112 and the second inner lamp cup 113. One end of the positive electrode pad of the green light chip 21 is die-bonded to the first positive electrode functional region 1121, and one end of the negative electrode pad of the green light chip 21 is die-bonded across the isolator to the first negative electrode functional region 1122. One end of the positive electrode pad of the blue light chip 22 is located on the second positive electrode functional region 1131, and one end of the negative electrode pad of the blue light chip 22 is located on the second negative electrode functional region 1132. When the first positive terminal and the second positive terminal are respectively connected to the positive terminal of an external power supply through the bracket, and the first negative terminal and the second negative terminal are connected to the negative terminal of an external power supply through the bracket, the green light chip 21 and the blue light chip 22 work and emit green light and blue light respectively.
[0040] Furthermore, please refer to the following: Figures 4 to 6A red fluorescent layer 31 is disposed on the blue LED chip 22, which is formed by curing KSF (K2SiF6:Mn4+) red fluorescent adhesive. The LED encapsulation structure can use red fluorescent adhesive with an excitation wavelength of 629-631nm to prepare the red fluorescent layer 31, and encapsulate the blue LED chip 22 and the second inner lamp cup 113. The red fluorescent adhesive is prepared by mixing KSF red phosphor with adhesive, and is dispensed into the second inner lamp cup 113 using a dispensing machine, and then cured to obtain the red fluorescent layer 31. The height of the red fluorescent layer 31 is less than or equal to the height of the material wall 12. In a further embodiment of some preferred embodiments, the KSF red phosphor is 5K01 phosphor, and the adhesive can be a two-component, heat-curing silicone elastomer material used for LED encapsulation, resulting in high light transmittance, high refractive index, and excellent thermal stability after curing. To further improve the color rendering index of the excitation light of the red fluorescent layer 31, the ratio of KSF red phosphor to adhesive during the preparation process should be greater than 1:2. Due to the Stokes shift, the fluorescence emission wavelength is always greater than the excitation wavelength. The excitation wavelength of the KSF red powder in the red fluorescent layer 31 is in the range of 250-500 nm. That is, when the wavelength of the light incident on the red fluorescent layer 31 falls within the 250-500 nm range, the excitation efficiency of the red fluorescent layer 31 can meet the process requirements. The blue light emitted by the blue light chip 22 used in this invention has a wavelength of 445-460 nm, and the green light emitted by the green light chip 21 generally has a wavelength of 520-570 nm. Therefore, by applying the red fluorescent adhesive into the second inner lamp cup 113 to form the red fluorescent layer 31, the excitation of the red fluorescent layer 31 by the blue light chip 22 can more effectively excite the electrons of the material to the excited state, resulting in higher energy conversion efficiency.
[0041] Furthermore, a transparent adhesive layer 32 is disposed on the fluorescent adhesive 31 and the green light chip 21. The transparent adhesive layer 32 can be one of epoxy resin, silicone, polyurethane adhesive, acrylic adhesive, thermally conductive adhesive, or optical adhesive. The transparent adhesive is encapsulated above the first inner lamp cup 112 and the second inner lamp cup 113 using a dispensing machine, and then cured to obtain the transparent adhesive layer 32. The transparent adhesive layer 32 is located above the red fluorescent layer 31 and the green light chip 21, respectively. The height of the transparent adhesive layer 32 is greater than the height of the material wall 12, thus encapsulating the lamp cup structure 11 to obtain a complete LED encapsulation structure.
[0042] Specifically, when the LED packaging structure is working, the KSF red phosphor in the phosphor 31 is excited solely by the blue light emitted from the blue light chip 22, and mixes with the remaining blue light after excitation to obtain magenta light. When the magenta light is emitted from the second inner lamp cup 113, it mixes with the green light emitted from the green light chip 21 in the first inner lamp cup 112 to obtain white light. This reduces the secondary absorption and re-excitation of blue-green light obtained by green phosphor excitation by red phosphor in the prior art, reduces the interference of green light on the red phosphor excitation process, and improves energy conversion efficiency.
[0043] Based on the same inventive concept, this utility model also provides an LED lamp, which includes the aforementioned dual-lamp-cup LED packaging structure. Specific embodiments are as described in the dual-lamp-cup LED packaging structure description and will not be repeated here.
[0044] Based on the same inventive concept, this utility model also discloses a method for preparing the above-mentioned dual-cup LED packaging structure, which includes:
[0045] Step 1: Design and injection mold the bracket body, add an insulating material wall inside the bracket body, and divide the lamp cup structure into two parts;
[0046] Step 2: Install a green LED chip in the first inner lamp cup of the bracket body and a blue LED chip in the second inner lamp cup of the bracket body.
[0047] Step 3: Using a dispensing machine, apply a layer of red fluorescent adhesive to the LED lamp cup structure and cure the red fluorescent adhesive to obtain a red fluorescent layer.
[0048] Step 4: Apply a layer of transparent adhesive above the lamp cup. The green light emitted by the green light chip mixes with the blue light from the blue light chip and excites the red phosphor layer mixed with KSF red phosphor to obtain red light, thus obtaining an LED packaging structure that can be used for high color gamut LED chips.
[0049] This utility model provides a dual-lamp-cup LED packaging structure and an LED lamp. The dual-lamp-cup LED packaging structure includes a support body and a light-emitting chip. The support body is provided with a lamp cup structure and a material wall located inside the lamp cup structure. The two ends of the material wall are respectively connected to the sidewalls of the lamp cup structure to form a first inner lamp cup and a second inner lamp cup. The light-emitting chip includes a green light chip and a blue light chip, which are respectively located inside the first inner lamp cup and the second inner lamp cup. Compared with the prior art, the beneficial effects of this utility model are:
[0050] After the green and blue light chips are fixed, a red fluorescent layer made of KSF red phosphor mixed with glue is added and then encapsulated to obtain a high color gamut white light LED. Compared with using a blue light chip, green phosphor and red phosphor to obtain white light LEDs, this invention reduces the mixing ratio of phosphors, making the production of high color gamut white light LEDs more stable and increasing the consistency of LED production.
[0051] By setting up a dual-lamp cup LED packaging structure, the green light will only mix with the magenta light excited by the red fluorescent layer after it leaves the opening of the first inner lamp cup in the forward direction. This prevents the green light emitted by the green light chip from exciting the red fluorescent layer, effectively overcoming the secondary absorption of green light by the red fluorescent layer. This significantly improves the color rendering index while also increasing the energy conversion efficiency and excitation efficiency.
[0052] Replacing the green phosphor, which is more sensitive to high-temperature environments and prone to thermal quenching at high temperatures, with a more stable green light chip demonstrates stronger resistance to thermal quenching.
[0053] It should be understood that the application of this utility model is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.
Claims
1. A dual-cup LED packaging structure, comprising a support body and a light-emitting chip, characterized in that: The support body is provided with a lamp cup structure and a material wall located inside the lamp cup structure; The two ends of the material wall are respectively connected to the side wall of the lamp cup structure to form the first inner lamp cup and the second inner lamp cup; The light-emitting chip includes a green light chip and a blue light chip, which are located in the first inner lamp cup and the second inner lamp cup, respectively. A red fluorescent layer is disposed on the blue light chip.
2. The dual-cup LED packaging structure according to claim 1, characterized in that, The bottom of the first inner lamp cup is provided with a first positive electrode functional area and a first negative electrode functional area, and a first isolation strip is provided between the first positive electrode functional area and the first negative electrode functional area.
3. The dual-cup LED packaging structure according to claim 1, characterized in that, The bottom of the second inner lamp cup is provided with a second positive electrode functional area and a second negative electrode functional area, and a second isolation strip is provided between the second positive electrode functional area and the second negative electrode functional area.
4. A dual-cup LED packaging structure according to claim 2 or 3, characterized in that, The green light chip is flip-mounted at the bottom of the first inner lamp cup, and the blue light chip is flip-mounted at the bottom of the second inner lamp cup.
5. The dual-cup LED packaging structure according to claim 1, characterized in that, The green or blue light chip has a size of 1020*5252 mils.
6. The dual-cup LED packaging structure according to claim 1, characterized in that, The top of the first inner lamp cup and the second inner lamp cup are semi-circular structures with a first diameter, and the bottom of the first inner lamp cup and the second inner lamp cup are semi-circular structures with a second diameter. The first diameter is larger than the second diameter, and the semi-circular structures with the first diameter and the second diameter are coaxially arranged in the vertical direction.
7. The dual-cup LED packaging structure according to claim 1, characterized in that, A transparent adhesive layer is disposed on the red fluorescent layer and the green light chip.
8. An LED lighting fixture, characterized in that, Includes the dual-cup LED packaging structure as described in any one of claims 1 to 7.