A teaching device for a wafer load port

Abstract

The utility model discloses a demonstration device for wafer loading port. The demonstration device includes: the substrate, the first surface of substrate is provided with at least two wafer card slot analog block, the second surface of substrate is provided with wafer loading port fixed structure and sensing trigger module, the analog wafer is set up on wafer card slot analog block, and the first surface of analog wafer, substrate and wafer card slot analog block form demonstration space, and the first mark is set up on the analog wafer, the wafer transfer mechanism is used to take and shift analog wafer, and the wafer transfer mechanism includes manipulator, and the manipulator has demonstration executor, and demonstration executor can stretch into, stretch out demonstration space and move in demonstration space, and, the second mark is set up on demonstration executor, and the second mark and the first mark can be aligned under the specified gesture. Through alignment mark, improve calibration accuracy, and it is convenient for operator to identify positioning quickly, and improve semiconductor equipment debugging and calibration efficiency.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, and in particular to a teaching device for wafer loading ports. Background Technology

[0002] With the continued growth in demand for electronic products, the manufacturing scale of the semiconductor industry is constantly expanding. Semiconductor manufacturing processes are complex, placing higher demands on the precision, cleanliness, and stability of the wafer transport process. For example, in advanced chip manufacturing processes, the linewidth of circuits on wafers has shrunk to the nanometer level; any minute vibration, misalignment, or contamination can lead to chip quality problems. This not only requires wafer transport systems to have extremely high precision but also to operate in a cleanroom environment to ensure that the wafers are not subject to any possible contamination. To improve production efficiency, rapid teaching of the wafer transport loading ports is necessary.

[0003] Traditional production processes often rely on visual observation or the use of various measuring tools. This method is not only inefficient but also lacks accuracy, failing to meet the demands of modern large-scale production. Furthermore, while existing teaching-in technologies improve automation to some extent, they typically require additional measuring tools, increasing production costs. Moreover, the need to know relevant teaching parameters beforehand adds complexity to the operation. The teaching process itself is also time-consuming and requires skilled and experienced operators, making operator training challenging.

[0004] Therefore, there is an urgent need for a new teaching device that can simplify the teaching process, reduce reliance on operators, and improve the automation level and efficiency of the entire production process. Utility Model Content

[0005] The main objective of this invention is to provide a teaching device for wafer loading ports, thereby overcoming the shortcomings of the prior art.

[0006] To achieve the aforementioned objectives, the technical solution adopted by this utility model includes:

[0007] This utility model provides a teaching device for a wafer loading port, comprising:

[0008] A substrate, wherein at least two wafer slot simulation blocks are provided on the first surface of the substrate, and a wafer loading port fixing structure and a sensing trigger module are provided on the second surface of the substrate. The wafer loading port fixing structure is used to fix to the wafer loading port, and the sensing trigger module is used to trigger the sensor on the wafer loading port.

[0009] A simulated wafer is disposed on the wafer slot simulation block, and a teaching space is formed between the simulated wafer, the first surface of the substrate, and the wafer slot simulation block. A first mark is disposed on the simulated wafer.

[0010] A wafer transfer mechanism for picking up and transferring the simulated wafer includes a robotic arm with a teach pendant that can extend into and out of the teach space and move within the teach space. The teach pendant is provided with a second mark that can be aligned with the first mark in a specified posture.

[0011] The teach pendant actuator can be the end effector of a robot.

[0012] In some more specific embodiments, a first fixing structure is provided on the first surface of the substrate, the first fixing structure being used to fix the wafer slot simulation block on the first surface of the substrate.

[0013] In some more specific solutions, the wafer slot simulation block has a first mounting pin hole, which is opened from the surface of the wafer slot simulation block in a direction away from the surface of the wafer slot simulation block. The simulated wafer has a second mounting pin hole. When the projection of the center point of the first mounting pin hole and the second mounting pin hole in the vertical direction coincides, the simulated wafer is fixed on the wafer slot simulation block by a pin passing through the first mounting pin hole and the second mounting pin hole.

[0014] In some more specific solutions, a second fixing structure is provided on the second surface of the substrate, which is used to fix the sensing trigger module on the second surface of the substrate.

[0015] In some more specific solutions, the sensing trigger module includes at least three sensor trigger seats, which are arranged around the projection point of the center of the simulated wafer on the substrate, in accordance with SEMI standards.

[0016] Furthermore, at least three sensors are provided on the wafer loading port. The three sensors are arranged around the projection point of the center of the simulated wafer on the wafer loading port in accordance with the SEMI standard. When the projection of each sensor and each sensor trigger seat in the vertical direction coincides, the sensor trigger seat is pressed down and the sensor is triggered to determine the placement position of the substrate.

[0017] Preferably, the sensor trigger base is arranged in accordance with SEMI E47.1 and E1.9 standards, and the sensor trigger base is a sensing pressure plate.

[0018] In some more specific schemes, the first identifier includes at least a first feature and a second feature, the first feature and the second feature being a first line and a second line, respectively, the first line and the second line being perpendicular to each other and passing through the center of the simulated wafer, wherein the first line is parallel to the connecting extension line of the two wafer slot simulation blocks.

[0019] Furthermore, the second identifier includes at least a third feature, a fourth feature, and a fifth feature located in the same plane, wherein the third feature is located on the perpendicular bisector of the line connecting the fourth feature and the fifth feature, and is equidistant from the fourth feature and the fifth feature, respectively.

[0020] Furthermore, the third, fourth, and fifth features are respectively the first pattern, the second pattern, and the third pattern.

[0021] Furthermore, the teach pendant includes a U-shaped structure, which is provided with a third feature, a fourth feature, and a fifth feature.

[0022] In some more specific embodiments, the wafer loading port fixing structure includes a motion coupling pin seat and a snap fastener. The motion coupling pin seat is disposed on the second surface of the substrate, and a coupling pin is disposed on the wafer loading port. The motion coupling pin seat cooperates with the coupling pin to fix the substrate on the wafer loading port. The snap fastener is disposed on the second surface of the substrate, and a snap fastener groove is disposed on the wafer loading port. The snap fastener cooperates with the snap fastener groove to fix the substrate on the wafer loading port.

[0023] Preferably, the motion coupling pin seat conforms to the primary pin positioning parameters of the SEMI E57 standard, and the latch conforms to the dimensions and positioning parameters of E47.1.

[0024] Compared with the prior art, the advantages of this utility model include at least the following:

[0025] First, the teaching device for wafer loading ports provided by this utility model has an end effector that moves within the teaching space, so that the third, fourth, and fifth features on the end effector are aligned with the relative orientation of the first and second features on the simulated wafer. No additional parameters or gauges are required, the teaching operation is simple, the teaching time is saved, and the teaching process is easier to learn.

[0026] Secondly, in the teaching device for wafer loading ports provided by this utility model, when the third, fourth, and fifth features on the end effector are aligned with the relative orientation of the first and second features on the simulated wafer, the end effector contacts the bottom surface of the simulated wafer, saves the current teaching parameters, and is used to teach other robotic arms, so that the entire wafer loading system can automatically and accurately perform wafer picking and placing according to a predetermined program, which greatly improves the automation level and efficiency of the production process. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the structure of a teaching device for a wafer loading port provided in an embodiment of the present invention;

[0028] Figure 2 This is a front view schematic diagram of a teaching device for a wafer loading port provided in an embodiment of the present invention;

[0029] Figure 3 This is a schematic diagram of the marking features on the end effector provided in this embodiment of the utility model;

[0030] Figure 4 This is a schematic diagram of an end effector and a teaching device aligned according to an embodiment of the present invention;

[0031] Figure 5 This is a schematic diagram of an end effector and a teaching device aligned according to an embodiment of the present invention;

[0032] Figure 6 This is a schematic diagram of the teaching device provided in this embodiment of the invention at the wafer loading port.

[0033] Figure label:

[0034] 100. Substrate; 11. Wafer slot simulation block; 12. Simulated wafer; 121. First line; 122. Second line; 13. Sensor trigger seat; 14. Motion coupling pin seat; 15. Snap-fit; 200. End effector; 21. Third feature; 22. Fourth feature; 23. Fifth feature. Detailed Implementation

[0035] In view of the shortcomings of the prior art, the inventor of this case, through long-term research and extensive practice, has come up with the technical solution of this utility model. The following will further explain the technical solution, its implementation process, and its principles.

[0036] Please refer to Figures 1-2A teaching device for a wafer loading port includes: a substrate 100, a simulated wafer 12, and a wafer transfer mechanism. A first fixing structure and two wafer slot simulation blocks 11 are provided on a first surface of the substrate 100. The first fixing structure is used to fix the wafer slot simulation blocks 11 on the first surface of the substrate. The wafer slot simulation blocks 11 are used to place the simulated wafer 12 on the first surface. A second fixing structure, three sensor trigger seats 13, three motion coupling pin seats 14, and a latch 15 are provided on a second surface of the substrate 100. The second fixing structure is used to fix the sensor trigger seats 13 on the second surface of the substrate. The sensor trigger seats 13 are used to trigger sensors on the wafer loading port. The three motion coupling pin seats 14 and the latches 15 are all used to fix to the wafer loading port to ensure the stability and accuracy of the wafer during the transfer process.

[0037] A simulated wafer 12 is disposed on a wafer slot simulation block 11. The simulated wafer 12, the first surface of the substrate 100, and the wafer slot simulation block 11 together constitute a teaching space. In addition, a first mark is provided on the simulated wafer 12 for subsequent identification and alignment.

[0038] The wafer transfer mechanism is responsible for picking up and transferring the aforementioned analog wafer 12. The wafer transfer mechanism includes an end effector 200. The end effector 200 is capable of extending into and out of the teaching space and moving flexibly within the teaching space. A second marker is provided on the end effector 200. This second marker can be aligned with a first marker on the analog wafer 12 in a specific orientation.

[0039] In this design, the wafer slot simulation block 11 can be mounted on the first surface of the substrate 100 via a first fixing structure. This first fixing structure includes, but is not limited to, soldering, screw fixing, or snap-fit ​​connection. The wafer slot simulation block 11 has a first mounting pin hole, which is formed from the surface of the wafer slot simulation block 11 in a direction away from its surface. The simulated wafer 12 has a second mounting pin hole. When the center points of the first and second mounting pin holes coincide in the vertical direction, a pin passes through both holes to fix the simulated wafer 12 onto the wafer slot simulation block 11. The wafer slot simulation block 11 conforms to SEMI E1.9 standard Layer 1 or meets dimensions from 1 to 25. The main function of this wafer slot simulation block 11 is to simulate the height and center point of the wafer. To ensure accuracy, two wafer slot simulation blocks 11 are used to fix the simulation wafer 12, ensuring that the scale on the simulation wafer 12 is accurately positioned in both the horizontal and vertical directions, thereby ensuring the simulation wafer 12 is stably fixed and preventing displacement during the teaching process.

[0040] In this design, the simulated wafer 12 is circular, maintaining the shape of a real wafer to ensure accuracy during the simulation process. Scales with a precision of 0.5 mm or finer are engraved on the surface of the simulated wafer 12. For ease of reading, these scales use different line lengths at different locations, such as 0.5 mm, 1 mm, 5 mm, and 10 mm. Furthermore, to further improve reading accuracy, numbers are engraved every 1 cm for precise measurement. The simulated wafer 12 is typically made of a transparent material for easy observation, and its surface is designed with a first marking. The purpose of this first marking is to provide a clearly visible calibration target for the end effector 200 during the debugging and calibration of semiconductor equipment. By observing the relative position of the end effector 200 with respect to the first marking on the simulated wafer 12, the operator can quickly and accurately adjust the equipment's position to ensure precise calibration. The first marking includes a first line 121 and a second line 122. The first line 121 and the second line 122 are perpendicular to each other, and their intersection point is located precisely at the center of the simulated wafer 12. The first line 121 is also parallel to the extension line connecting the two wafer slot simulation blocks 11 on the simulation wafer 12, which helps to improve the accuracy of the calibration process and also makes it easier for operators to quickly identify and locate visually, thereby effectively improving the efficiency of the entire semiconductor equipment debugging and calibration.

[0041] Please refer to Figures 3-4 The end effector 200 can be understood as the end of a robotic arm, capable of extending into and out of a teaching space to perform teaching activities within that space. A second identifier is provided on the surface of the end effector 200, including a third feature 21, a fourth feature 22, and a fifth feature 23. The third feature 21 is located on the perpendicular bisector of the line connecting the fourth feature 22 and the fifth feature 23, and is equidistant from both the fourth feature 22 and the fifth feature 23. The end effector 200 includes a U-shaped structure, on which the third feature 21, the fourth feature 22, and the fifth feature 23 are provided. Please refer to... Figure 5 In other embodiments, the end effector 200 may include a rectangular structure. The rectangular structure is provided with a third feature 21, a fourth feature 22, and a fifth feature 23.

[0042] In this design, three sensor trigger seats 13 are evenly spaced in a circle around the projection point of the center of the simulated wafer 12 onto the substrate 100. Specifically, at least three sensors are provided on the wafer loading port, and these three sensors are evenly spaced in a circle around the projection point of the center of the simulated wafer onto the wafer loading port, ensuring uniform coverage and accurate measurement. When the projection of each sensor onto its corresponding sensor trigger seat in the vertical direction is completely aligned, the sensor trigger seat is pressed downwards, triggering the corresponding sensor. This action is to accurately determine the placement position of the substrate. In this way, the system can detect and feedback teaching parameters, thereby ensuring accurate substrate positioning. To further improve system compatibility and standardization, the design of these sensor trigger seats follows the layout requirements of SEMI E47.1 and E1.9 standards. In addition, the sensor trigger seats are designed as sensing pressure plates, which not only improves the trigger sensitivity but also enhances the stability and reliability of the system.

[0043] In this design, coupling pins are provided on the wafer loading port. These coupling pins are used for precise motion coupling with the motion coupling pin holder 14. Through this coupling method, the motion coupling pin holder 14 can tightly engage with the coupling pins, thereby firmly fixing the substrate to the wafer loading port. Furthermore, to further enhance the fixing effect between the substrate and the wafer loading port, a latch 15 is specifically provided on the second surface of the substrate. Simultaneously, a corresponding latching groove is provided on the wafer loading port. The size and position of the latching groove match the latch 15, allowing the latch 15 to tightly engage with the latching groove. It is worth noting that the design of the motion coupling pin holder 14 follows the primary pin positioning parameters defined in the SEMI E57 standard, ensuring a precise fit between the motion coupling pin holder 14 and the coupling pin. Similarly, the design of the latch 15 also follows the dimensions and positioning parameters specified in the E47.1 standard, ensuring a precise fit between the latch 15 and the latching groove. This dual fixing mechanism further ensures the stability of the substrate on the wafer loading port.

[0044] The teaching pendant disclosed in this utility model is mainly applied to wafer transfer equipment, especially the EFEM front-end transfer module. The EFEM front-end transfer module typically includes key components such as a robotic arm and a wafer loading port. The core function of this teaching pendant is to visualize the various parameters required for setting and adjusting the robotic arm when picking up and placing wafers. During normal operation of the EFEM equipment, the wafer is usually placed in an opaque, closed container, making teaching the robotic arm quite difficult. Due to the lack of scales and direct visual references, traditional teaching methods result in significant errors, affecting operational accuracy. To solve this problem, this teaching pendant simulates the bottom fixing interface of the closed container and the wafer's position within it, allowing for the visual setting of robotic arm parameters in an open environment using a teaching fixture. This way, when the robotic arm returns to the closed container environment, the set parameters take effect immediately, ensuring operational continuity and accuracy. It is important to emphasize that "teaching" in this teaching pendant is a technical term specifically referring to the process of setting robotic arm parameters, and is not intended for educational purposes.

[0045] The specific teaching process is as follows:

[0046] First, manually place the teaching pendant on the wafer loading port, then start the teaching software interface and begin the teaching program. At this time, the wafer loading port will automatically engage latch 15 to ensure the stability of the device. Next, the gate opener on the port will open, forming a wafer pick-and-place channel to allow the robotic arm to smoothly pick up and place wafers.

[0047] Please refer to Figures 4-5 Under the control of the robotic arm, the end effector 200 moves to the teaching space. The operator needs to carefully observe the relative positions of the third feature 21, the fourth feature 22, and the fifth feature 23 on the end effector 200 with the first line 121 and the second line 122 on the simulated wafer 12. By adjusting the robot's rotation and R-axis, the fourth feature 22 and the fifth feature 23 on the end effector 200 are aligned with the second line 122.

[0048] After aligning the horizontal crosshairs, the next step is to adjust the robot's X-axis. Continue observing until the third feature 21 on the end effector 200 aligns with the first line 121 on the simulated wafer 12. After aligning the vertical crosshairs, the final step is to adjust the robot's Z-axis until the end effector 200 contacts the bottom surface of the simulated wafer 12. The accuracy of this action is directly related to the correct loading of the wafer and is a crucial step in the entire teaching process. Once the end effector 200 has correctly contacted the bottom surface of the simulated wafer 12, the operator needs to save the current teaching parameters. These teaching parameters will be used for subsequent automated operations to ensure that the robot can repeatedly perform precise pick-and-place actions.

[0049] After completing these steps, the operator again manipulates the loading port through the software interface, moving it to the initial default position and opening latch 15 to remove the teaching device that has completed the teaching task. At this point, the entire teaching process is complete. The entire wafer loading system can then automatically and accurately perform wafer loading and unloading according to a predetermined program, greatly improving the automation level and efficiency of the production process.

[0050] A schematic diagram of the teaching device at the wafer loading port provided in this embodiment of the utility model is shown below. Figure 6 As shown.

[0051] It should be understood that the above embodiments are merely illustrative of the technical concept and features of this utility model, and are intended to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be included within the scope of protection of this utility model.

Claims

1. A teaching pendant for a wafer loading port, characterized in that, include: A substrate, wherein at least two wafer slot simulation blocks are provided on the first surface of the substrate, and a wafer loading port fixing structure and a sensing trigger module are provided on the second surface of the substrate. The wafer loading port fixing structure is used to fix to the wafer loading port, and the sensing trigger module is used to trigger the sensor on the wafer loading port. A simulated wafer is disposed on the wafer slot simulation block, and a teaching space is formed between the simulated wafer, the first surface of the substrate, and the wafer slot simulation block. A first mark is disposed on the simulated wafer. A wafer transfer mechanism for picking up and transferring the simulated wafer includes a robotic arm with a teach pendant that can extend into and out of the teach space and move within the teach space. The teach pendant is provided with a second mark that can be aligned with the first mark in a specified posture.

2. The teaching device for a wafer load port according to claim 1, wherein, A first fixing structure is provided on the first surface of the substrate, and the first fixing structure is used to fix the wafer slot simulation block on the first surface of the substrate.

3. The teaching device for a wafer load port according to claim 1, wherein, The wafer slot simulation block has a first mounting pin hole, which is opened from the surface of the wafer slot simulation block in a direction away from the surface of the wafer slot simulation block. The simulated wafer has a second mounting pin hole. When the projection of the center point of the first mounting pin hole and the second mounting pin hole in the vertical direction coincides, the simulated wafer is fixed on the wafer slot simulation block by passing a pin through the first mounting pin hole and the second mounting pin hole.

4. The teaching device for a wafer load port according to claim 1, wherein, A second fixing structure is provided on the second surface of the substrate, and the second fixing structure is used to fix the sensing trigger module on the second surface of the substrate.

5. The teaching device for a wafer load port according to claim 1, wherein, The sensing trigger module includes at least three sensor trigger seats, which are arranged around the projection point of the center of the simulated wafer on the substrate, in accordance with SEMI standards.

6. The teaching device for a wafer load port according to claim 5, wherein, At least three sensors are provided on the wafer loading port. These three sensors are arranged around the projection point of the center of the simulated wafer onto the wafer loading port, following SEMI standards. When the vertical projection of each sensor coincides with that of its trigger seat, the trigger seat is pressed down, triggering the sensor to determine the placement position of the substrate. And / or, the sensor trigger seat is a sensing pressure plate.

7. The teaching device for a wafer load port according to claim 1, wherein The first identifier includes at least a first feature and a second feature, wherein the first feature and the second feature are respectively a first line and a second line, the first line and the second line are perpendicular to each other and pass through the center of the simulated wafer, wherein the first line is parallel to the connection extension line of the two wafer slot simulation blocks.

8. The teaching device for a wafer load port according to claim 7, wherein, The second identifier includes at least a third feature, a fourth feature, and a fifth feature located in the same plane. The third feature is located on the perpendicular bisector of the line connecting the fourth and fifth features and is equidistant from both the fourth and fifth features. And / or, the third feature, the fourth feature, and the fifth feature are respectively the first pattern, the second pattern, and the third pattern.

9. The teaching device for a wafer load port according to claim 8, wherein, The teaching executor comprises a U-shaped structure provided with a third feature, a fourth feature and a fifth feature.

10. The teaching device for a wafer load port according to claim 1, wherein, The wafer loading port fixing structure comprises a motion coupling pin seat and a buckle, the motion coupling pin seat is arranged on the second surface of the base plate, the wafer loading port is provided with a coupling pin, the motion coupling pin seat is matched with the coupling pin to fix the base plate on the wafer loading port, and the buckle is arranged on the second surface of the base plate, the wafer loading port is provided with a buckle slot, and the buckle is matched with the buckle slot to fix the base plate on the wafer loading port.

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