A highland atmospheric pressure drinking water machine with a sleeve cooling

Abstract

The utility model discloses belong to low barometric pressure drinking water equipment technical field's a kind of casing cooling's plateau normal pressure drinking water machine, including boiling water tank, the top center position of boiling water tank is sealed and communicated with cooling casing pipe by pipe, the outer periphery of cooling casing pipe is provided with cooling cylinder, cooling cylinder is composed of outer cylinder and heat insulation layer, and heat dissipation cavity is arranged between outer cylinder and heat insulation layer, the outer periphery of cooling casing pipe is equipped with heat conduction block, the end of heat conduction block is provided with through slot, and one end of heat conduction block extending to the inside of heat dissipation cavity is equipped with semiconductor refrigeration piece, by setting multiple heat conduction blocks outside cooling casing pipe, and setting semiconductor refrigeration piece in the end of heat conduction block, then the refrigeration end and heat dissipation end of semiconductor refrigeration piece are isolated by heat insulation layer, the refrigeration end of semiconductor refrigeration piece is used to refrigerate heat conduction block, and the low temperature generated by refrigeration is transferred to cooling casing pipe by heat conduction block, to realize the purpose of the rapid cooling of the hot steam inside cooling casing pipe, greatly improve its cooling efficiency.

Description

Technical Field

[0001] This utility model belongs to the technical field of low-pressure drinking water equipment, specifically relating to a high-altitude atmospheric pressure drinking water machine with sleeve cooling. Background Technology

[0002] In high-altitude areas, due to the low air pressure, the boiling point of water cannot reach 100°C, making it impossible to fully sterilize and disinfect drinking water through conventional heating methods, which seriously affects the health of local residents.

[0003] According to patent number CN202121648041.3, a plateau atmospheric pressure water dispenser with sleeve cooling includes a condenser sleeve, which comprises an outer tube and an inner tube. The diameter of the outer tube is larger than that of the inner tube. The outer tube has an inlet and an outlet. The bottom of the inner tube is connected to a hot water tank. The water dispenser also includes a three-way pipe, with two channels connected to the inlet and outlet respectively, and a third channel connected to a heating system. The heating system includes several water-boiling buckets, each equipped with a heater. All the water-boiling buckets are connected in sequence, and one of them is connected to a water level balancing device. All the water-boiling buckets are connected to the top of the hot water tank through an energy-boosting system.

[0004] The above solution still has certain technical defects in actual use. Since the condenser jacket relies on the water in the outer tube for heat exchange and cooling, and the water temperature in the outer tube is limited, the heat exchange efficiency is low. Therefore, it is necessary to use a water cooling module for secondary cooling, which greatly reduces the cooling efficiency and easily leads to the discharge of a large amount of water vapor, resulting in water waste. To address this, we propose a jacket-cooled high-altitude atmospheric pressure water dispenser. Utility Model Content

[0005] The purpose of this invention is to provide a high-altitude atmospheric pressure water dispenser with sleeve cooling to solve the existing problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a high-altitude atmospheric pressure water dispenser with sleeve cooling, comprising a water tank, a cooling cylinder, and a cooling sleeve. The cooling sleeve is sealed and connected to the top center of the water tank via a conduit. The cooling sleeve has a spiral tube structure. A cooling cylinder is provided on the outer periphery of the cooling sleeve. The cooling cylinder consists of an outer cylinder and a heat insulation layer. The cooling sleeve is located inside the heat insulation layer within the cooling cylinder. A heat dissipation cavity is provided between the outer cylinder and the heat insulation layer. The heat dissipation cavity is not connected to the interior of the heat insulation layer. A heat-conducting block is provided on the outer periphery of the cooling sleeve. A through groove is provided at the end of the heat-conducting block. The heat-conducting block is fitted inside the cooling sleeve through the through groove and is in close contact with its outer wall. One end of the heat-conducting block extends through the heat insulation layer into the interior of the heat dissipation cavity. A semiconductor refrigeration chip is fixedly installed at the end of the heat-conducting block extending into the heat dissipation cavity. The cooling end of the semiconductor refrigeration chip is embedded in the end of the heat-conducting block and fixedly connected to it. The heat dissipation end of the semiconductor refrigeration chip is located inside the heat dissipation cavity.

[0007] Preferably, a heat insulation sleeve is provided around the outer periphery of the heat-conducting block, and the heat insulation sleeve wraps around the outer periphery of the heat-conducting block and also wraps around the cooling end of the semiconductor refrigeration chip.

[0008] Preferably, an air intake fan is fixedly installed at the bottom of one side of the outer cylinder of the cooling cylinder, and the air intake fan is in communication with the interior of the heat dissipation cavity.

[0009] Preferably, an exhaust fan communicating with the interior of the heat dissipation cavity is provided at the top of the other side of the outer cylinder of the cooling cylinder.

[0010] Preferably, the bottom of the hot water tank is provided with an energy-boosting device, and the top of the energy-boosting device extends through a conduit to the top of the inside of the hot water tank and is sealed and connected to it.

[0011] Preferably, the bottom of the energy-boosting device is provided with a heating tank, and the top of the heating tank is sealed and connected to the bottom of the energy-boosting device through a conduit.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] 1. By setting multiple heat-conducting blocks on the outside of the cooling jacket and placing a semiconductor refrigeration chip at the end of the heat-conducting block, and then isolating the cooling end and heat dissipation end of the semiconductor refrigeration chip by a heat insulation layer, the cooling end of the semiconductor refrigeration chip is used to cool the heat-conducting block, and the low temperature generated by the cooling is transferred to the cooling jacket through the heat-conducting block, thereby achieving the purpose of rapidly cooling the hot steam inside the cooling jacket and greatly improving its cooling efficiency.

[0014] 2. By utilizing the heat insulation layer inside the cooling cylinder, the cooling end and heat dissipation end of the refrigeration chip are isolated, and an independent heat dissipation cavity is formed between the outer cylinder and the heat insulation layer. Combined with the intake fan and exhaust fan, the heat dissipation end of the refrigeration chip is cooled, thereby ensuring the stability of the refrigeration chip. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0016] Figure 2 This is a multi-angle structural schematic diagram of the present invention;

[0017] Figure 3 This is a schematic diagram of the cooling cylinder and condenser sleeve structure of this utility model;

[0018] Figure 4 This is a schematic diagram of the internal structure of the cooling cylinder of this utility model.

[0019] In the diagram: 1. Hot water tank; 2. Cooling cylinder; 3. Outer cylinder; 4. Insulation layer; 5. Cooling sleeve; 6. Heat dissipation cavity; 7. Heat-conducting block; 8. Insulation sleeve; 9. Through slot; 10. Semiconductor cooling chip; 11. Cooling end; 12. Heat dissipation end; 13. Intake fan; 14. Exhaust fan; 15. Heating tank; 16. Energy booster. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Please see Figure 1-4This utility model provides a technical solution for a high-altitude atmospheric pressure water dispenser with sleeve cooling: it includes a hot water tank 1, a cooling cylinder 2, and a cooling sleeve 5. The top center of the hot water tank 1 is sealed with the cooling sleeve 5 through a conduit. The cooling sleeve 5 has a spiral tube structure. The cooling cylinder 2 is arranged around the outer periphery of the cooling sleeve 5. The cooling cylinder 2 consists of an outer cylinder 3 and a heat insulation layer 4. The cooling sleeve 5 is located inside the heat insulation layer 4 inside the cooling cylinder 2. A heat dissipation cavity 6 is provided between the outer cylinder 3 and the heat insulation layer 4. The heat dissipation cavity 6 is not connected to the interior of the heat insulation layer 4. A heat-conducting block 7 is provided on the outer periphery of the cooling sleeve 5. A through groove 9 is provided at the end of the heat-conducting block 7. The heat-conducting block 7 is sleeved inside the cooling sleeve 5 through the through groove 9 and is in close contact with its outer wall. One end of the heat-conducting block 7 extends through the heat insulation layer 4 into the interior of the heat dissipation cavity 6. A semiconductor cooling chip 10 is fixedly installed at the end of the heat-conducting block 7 that extends into the heat dissipation cavity 6. The cooling end 11 of the semiconductor cooling chip 10 is embedded in the end of the heat-conducting block 7 and fixedly connected to it. The heat dissipation end 12 of the semiconductor cooling chip 10 is placed inside the heat dissipation cavity 6.

[0022] Specifically, a heat insulation sleeve 8 is provided around the outer periphery of the heat-conducting block 7. The heat insulation sleeve 8 wraps around the outer periphery of the heat-conducting block 7 and also wraps around the cooling end 11 of the semiconductor cooling chip 10.

[0023] Specifically, an intake fan 13 is fixedly installed at the bottom of one side of the outer cylinder 3 of the cooling cylinder 2, and the intake fan 13 is connected to the interior of the heat dissipation cavity 6.

[0024] Specifically, an exhaust fan 14 communicating with the interior of the heat dissipation cavity 6 is provided at the top of the other side of the outer cylinder 3 of the cooling cylinder 2.

[0025] Specifically, the bottom of the hot water tank 1 is provided with an energy-boosting device 16, and the top of the energy-boosting device 16 extends through a conduit to the top of the inside of the hot water tank 1 and is sealed and connected to its interior.

[0026] Specifically, a heating tank 15 is provided at the bottom of the energy-boosting device 16, and the top of the heating tank 15 is sealed and connected to the bottom of the energy-boosting device 16 through a conduit.

[0027] In this embodiment, during use, tap water is injected into the heating tank 15 through a water pipe on one side of the top, and then heated. The generated hot steam enters the energy-enhancing device 16 through a top conduit for reheating, thereby ensuring that the water reaches 100°C under low pressure. The steam in the energy-enhancing device 16 is then guided into the hot water tank 1 through a conduit at the top of the hot water tank 1, allowing the steam to enter the cooling sleeve 5 through a conduit at the top of the hot water tank 1, and spiral upwards along the path inside the cooling sleeve 5, thereby increasing the path of the hot steam in the cooling sleeve 5. At this time, the cooling end 11 of the semiconductor cooling chip 10 cools the heat-conducting block 7, and the low temperature of the heat-conducting block 7 cools the cooling sleeve 5, thereby achieving rapid cooling. The purpose of cooling is to significantly improve the efficiency of cooling compared to using tap water for heat exchange and then water cooling. By setting a heat insulation sleeve 8 around the heat-conducting block 7, the heat-conducting block 7 is wrapped to prevent the loss of low temperature from the heat-conducting block 7 and reduce the cooling effect. In conjunction with the heat insulation layer 4 set in the cooling cylinder 2, the heat diffused from the heat dissipation end 12 of the semiconductor refrigeration chip 10 is isolated to avoid affecting the cooling efficiency of the cooling sleeve 5. At the same time, the intake fan 13 and the exhaust fan 14 are used to draw in external air from the bottom of the heat dissipation cavity 6 and exhaust the high-heat air inside the heat dissipation cavity 6 from the top of the heat dissipation cavity 6 to achieve the purpose of heat dissipation of the heat dissipation end 12 of the semiconductor refrigeration chip 10 and ensure the stable operation of the semiconductor refrigeration chip 10.

[0028] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, the phrase "comprising an element defined as..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0029] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-altitude atmospheric pressure water dispenser with sleeve cooling, comprising a hot water tank (1), a cooling cylinder (2), and a cooling sleeve (5), characterized in that: The top center of the hot water tank (1) is sealed with a cooling sleeve (5) via a conduit. The cooling sleeve (5) has a spiral tube structure. A cooling cylinder (2) is provided on the outer periphery of the cooling sleeve (5). The cooling cylinder (2) consists of an outer cylinder (3) and a heat insulation layer (4). The cooling sleeve (5) is located inside the heat insulation layer (4) within the cooling cylinder (2). A heat dissipation cavity (6) is provided between the outer cylinder (3) and the heat insulation layer (4). The heat dissipation cavity (6) is not connected to the interior of the heat insulation layer (4). A heat-conducting block (7) is provided on the outer periphery of the cooling sleeve (5). A through groove (9) is provided at the end of the heat block (7). The heat-conducting block (7) is sleeved inside the cooling sleeve (5) through the through groove (9) and in close contact with its outer wall. One end of the heat-conducting block (7) extends through the heat insulation layer (4) into the interior of the heat dissipation cavity (6). A semiconductor cooling chip (10) is fixedly installed at the end of the heat-conducting block (7) that extends into the heat dissipation cavity (6). The cooling end (11) of the semiconductor cooling chip (10) is embedded in the end of the heat-conducting block (7) and fixedly connected to it. The heat dissipation end (12) of the semiconductor cooling chip (10) is placed inside the heat dissipation cavity (6).

2. A high-altitude atmospheric pressure water dispenser with sleeve cooling according to claim 1, characterized in that: The heat-conducting block (7) is fitted with a heat-insulating sleeve (8) around its outer periphery. The heat-insulating sleeve (8) wraps around the outer periphery of the heat-conducting block (7) and also wraps around the cooling end (11) of the semiconductor cooling chip (10).

3. A high-altitude atmospheric pressure water dispenser with sleeve cooling according to claim 1, characterized in that: An air intake fan (13) is fixedly installed on the bottom of one side of the outer cylinder (3) of the cooling cylinder (2), and the air intake fan (13) is connected to the interior of the heat dissipation cavity (6).

4. A high-altitude atmospheric pressure water dispenser with sleeve cooling according to claim 1, characterized in that: An exhaust fan (14) communicating with the interior of the heat dissipation cavity (6) is provided on the top of the other side of the outer cylinder (3) of the cooling cylinder (2).

5. A high-altitude atmospheric pressure water dispenser with sleeve cooling according to claim 1, characterized in that: The bottom of the hot water tank (1) is provided with an energy-boosting device (16), and the top of the energy-boosting device (16) extends through a conduit to the top of the inside of the hot water tank (1) and is sealed and connected to its interior.

6. A high-altitude atmospheric pressure water dispenser with sleeve cooling according to claim 5, characterized in that: The bottom of the power-enhancing device (16) is provided with a heating tank (15), and the top of the heating tank (15) is sealed and connected to the bottom of the power-enhancing device (16) through a conduit.

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