Infrared heat welding structure

Abstract

The utility model discloses an infrared heat welding structure, including infrared line elevating module, infrared line welding frame, air pipe and pressure rod, infrared line welding frame installs on the drive end of infrared line elevating module, a plurality of pressure rods are distributed in the inside of infrared line welding frame along vertical direction in the form of matrix arrangement, the upper end of pressure rod is connected with spring, and spring and infrared line welding frame are elastically connected, and the lower end of pressure rod is connected with ceramic pressure disc, and the inside fixed of infrared line welding frame has infrared lamp, and infrared lamp is between pressure rod, and air pipe is located at the four around of infrared line welding frame, and infrared line welding frame's front and back side all have air outlet cavity, and air pipe communicates with air outlet cavity. The infrared heat welding structure is through the pressure rod of elastic installation and press the ceramic pressure disc of high temperature resistance on the silicon wafer of need heat welding, and the silicon wafer is fixed, and the infrared lamp is heated to the welding point and welding wire, and forms the wind wall of air blowing in front and back while guaranteeing the pressure, and the internal heating condition is not affected by outside.

Description

Technical Field

[0001] This utility model relates to the technical field of silicon wafer string bonding, and in particular to an infrared thermal bonding structure. Background Technology

[0002] Photovoltaic silicon wafers are the core and most valuable component of a solar power generation system. Their function is to convert solar energy into electrical energy, which is then stored in batteries or used directly as a power source. In BC cells (back-contact cells, which can be combined with various circuits), the solder joints on the silicon wafers are heated at high temperatures to connect with the solder wires during string bonding. Conventional structures suffer from poor ventilation and lack of wafer stability. Utility Model Content

[0003] One objective of this invention is to provide an infrared thermal welding structure in which a high-temperature resistant ceramic plate is pressed onto a silicon wafer by an elastic pressure rod for stability, and high-temperature thermal welding is performed by an infrared lamp. The front and rear air outlets form an air wall to protect the interior.

[0004] To achieve this objective, the present invention adopts the following technical solution:

[0005] An infrared thermal welding structure includes an infrared lifting module, an infrared welding frame, an air duct, and pressure rods. The infrared welding frame is mounted on the drive end of the infrared lifting module. A plurality of pressure rods are arranged in a matrix and distributed vertically inside the infrared welding frame. A spring is connected to the upper end of each pressure rod, and the spring is elastically connected to the infrared welding frame. A ceramic pressure plate is connected to the lower end of each pressure rod. Infrared lamps are fixed inside the infrared welding frame and are located between the pressure rods. The air duct is located around the infrared welding frame. The front and rear sides of the infrared welding frame have air outlet chambers, and the air duct communicates with the air outlet chambers.

[0006] As a preferred technical solution, an mounting plate is installed inside the infrared welding frame, the middle part of the pressure rod passes through the mounting plate, and the spring is located above the mounting plate.

[0007] As a preferred technical solution, the mounting plate is provided with air blowing holes, which are located between the pressure rods. The infrared welding frame has air blowing channels distributed inside, and the air blowing channels are connected to the air blowing holes.

[0008] As a preferred technical solution, an exhaust fan is installed at the upper end of the infrared welding frame.

[0009] As a preferred technical solution, a guide plate is provided at the lower end of the air outlet cavity, and an air guide hole is formed between the inner side of the guide plate and the lower end of the infrared welding frame.

[0010] As a preferred technical solution, the infrared lifting module is equipped with a lifting motor, the drive end of the lifting motor is connected to a lifting screw, the upper end of the infrared welding frame is connected to a lifting nut, and the lifting screw and the lifting nut are threadedly connected.

[0011] As a preferred technical solution, the infrared lifting module is provided with a lifting slide rail, and the upper end of the infrared welding frame is provided with a lifting slider, which slides on the lifting slide rail.

[0012] As a preferred technical solution, an electrical control box is fixed to the upper end of the infrared welding frame.

[0013] The beneficial effects of this utility model are as follows: It provides an infrared thermal welding structure in which a high-temperature resistant ceramic pressure plate is pressed onto the silicon wafer to be thermally welded by a spring-loaded pressure rod, which helps to fix the silicon wafer and facilitates the infrared lamp to heat and weld the welding point and welding wire. While ensuring pressure, the front and rear air blowers form a wind wall to protect the internal heating condition from external influences. Attached Figure Description

[0014] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments.

[0015] Figure 1 This is a schematic diagram of the overall structure of an infrared thermal welding structure as described in the embodiment;

[0016] Figure 2 This is a partial perspective view of an infrared thermal welding structure as described in the embodiment;

[0017] Figure 3 This is a partial cross-sectional view of an infrared thermal welding structure as described in the embodiment.

[0018] Figures 1 to 3 middle:

[0019] 1. Infrared lifting module; 2. Infrared welding frame; 3. Air duct; 4. Pressure rod; 5. Spring; 6. Ceramic pressure plate; 7. Infrared lamp; 8. Air outlet cavity; 9. Mounting plate; 10. Air blowing hole; 11. Air blowing channel; 12. Exhaust fan; 13. Air guide plate; 14. Air guide hole; 15. Lifting motor; 16. Electrical control box. Detailed Implementation

[0020] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0021] like Figures 1 to 3 As shown in this embodiment, an infrared thermal welding structure includes an infrared lifting module 1, an infrared welding frame 2, an air duct 3, and pressure rods 4. The infrared welding frame 2 is installed on the drive end of the infrared lifting module 1. Several pressure rods 4 are arranged in a matrix and distributed vertically inside the infrared welding frame 2. The upper end of the pressure rod 4 is connected to a spring 5, which is elastically connected to the infrared welding frame 2. The lower end of the pressure rod 4 is connected to a ceramic pressure plate 6. Infrared lamps 7 are fixed inside the infrared welding frame 2 and are located between the pressure rods 4. The air duct 3 is located around the infrared welding frame 2. The front and rear sides of the infrared welding frame 2 have air outlet cavities 8, and the air duct 3 is connected to the air outlet cavities 8.

[0022] The silicon wafer with the welding wire is placed below the infrared welding frame 2. Driven by the infrared lifting module 1, the infrared welding frame 2 moves downward, and the ceramic pressure plate 6 presses against the welding point of the silicon wafer. The spring 5 begins to contract, ensuring that each ceramic pressure plate 6 can fix and hold the silicon wafer. Then, the infrared lamp 7 is turned on to perform high-temperature hot welding on the welding point of the silicon wafer, so that the welding wire under the silicon wafer melts onto the silicon wafer. At the same time, during the hot welding process, the air duct 3 provides airflow, and under the action of the air outlet 8, an air wall is formed at the front and rear ends of the infrared welding frame 2, so that the external environment cannot affect the internal heating.

[0023] An mounting plate 9 is installed inside the infrared welding frame 2. The middle part of the pressure rod 4 passes through the mounting plate 9. The spring 5 is located above the mounting plate 9. The pressure rod 4 is squeezed and raised under the action of the silicon wafer. The spring 5 retracts above the mounting plate 9. When the silicon wafer does not contact the pressure rod 4, the upper end of the pressure rod 4 is stuck on the mounting plate 9 and will not fall off.

[0024] The mounting plate 9 is provided with air blowing holes 10, which are located between the pressure rods 4. The infrared welding frame 2 has air blowing channels 11 distributed inside, which are connected to the air blowing holes 10. The air blowing holes 10 blow air into the interior of the infrared welding frame 2 to accelerate the hot welding process.

[0025] An exhaust fan 12 is installed at the upper end of the infrared welding frame 2, which is responsible for drawing air out of the infrared welding frame 2 from above.

[0026] A guide plate 13 is provided at the lower end of the air outlet cavity 8. An air guide hole 14 is formed between the inner side of the guide plate 13 and the lower end of the infrared welding frame 2. The air duct 3 blows air into the air outlet cavity 8. Under the guidance of the guide plate 13, the air blows downward from the air guide hole 14, thereby forming a vertical air wall to protect the internal heating of the infrared welding frame 2.

[0027] The infrared lifting module 1 is equipped with a lifting motor 15, and the driving end of the lifting motor 15 is connected to a lifting screw. The upper end of the infrared welding frame 2 is connected to a lifting nut. The lifting screw and the lifting nut are connected by a threaded transmission. The infrared lifting module 1 is equipped with a lifting slide rail, and the upper end of the infrared welding frame 2 is equipped with a lifting slider. The lifting slider slides on the lifting slide rail. When hot welding is required, the lifting motor 15 provides power to make the lifting screw rotate. The infrared welding frame 2 with the lifting nut descends along the lifting slide rail, and the ceramic pressure plate 6 can then press on the silicon wafer. After the hot welding is completed, the infrared welding frame 2 rises, and the pressure rod 4 drives the ceramic pressure plate 6 away from the silicon wafer, so that the silicon wafer can be output and taken away.

[0028] An electrical control box 16 is fixed to the upper end of the infrared welding frame 2. The electrical control box 16 is responsible for electrically controlling the above actions to complete the automation process.

[0029] It should be stated that the above-described specific embodiments are merely preferred embodiments of this utility model and the technical principles applied thereto. Within the scope of the technology disclosed in this utility model, any variations or substitutions that are easily conceived by those skilled in the art should be covered within the protection scope of this utility model.

Claims

1. An infrared thermal welding structure, characterized in that, The device includes an infrared lifting module, an infrared welding frame, air ducts, and pressure rods. The infrared welding frame is mounted on the drive end of the infrared lifting module. Several pressure rods are arranged in a matrix and distributed vertically inside the infrared welding frame. The upper end of each pressure rod is connected to a spring, which is elastically connected to the infrared welding frame. The lower end of each pressure rod is connected to a ceramic pressure plate. Infrared lamps are fixed inside the infrared welding frame and are located between the pressure rods. The air ducts are located around the infrared welding frame. The infrared welding frame has air outlet chambers on both the front and rear sides, and the air ducts communicate with the air outlet chambers.

2. The infrared thermal welding structure according to claim 1, characterized in that, An mounting plate is installed inside the infrared welding frame, the middle part of the pressure rod passes through the mounting plate, and the spring is located above the mounting plate.

3. The infrared thermal welding structure according to claim 2, characterized in that, The mounting plate is provided with air blowing holes, which are located between the pressure rods. The interior of the infrared welding frame is provided with air blowing channels, which are connected to the air blowing holes.

4. The infrared thermal welding structure according to claim 1, characterized in that, An exhaust fan is installed at the upper end of the infrared welding frame.

5. The infrared thermal welding structure according to claim 1, characterized in that, An air guide plate is provided at the lower end of the air outlet cavity, and an air guide hole is formed between the inner side of the air guide plate and the lower end of the infrared welding frame.

6. The infrared thermal welding structure according to claim 1, characterized in that, The infrared lifting module is equipped with a lifting motor, the drive end of which is connected to a lifting screw. The upper end of the infrared welding frame is connected to a lifting nut, and the lifting screw and the lifting nut are connected by a threaded transmission.

7. The infrared thermal welding structure according to claim 1, characterized in that, The infrared lifting module is equipped with a lifting slide rail, and the upper end of the infrared welding frame is equipped with a lifting slider, which slides on the lifting slide rail.

8. The infrared thermal welding structure according to claim 1, characterized in that, An electrical control box is fixed to the upper end of the infrared welding frame.

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