A plastic package mold
By designing molding molds with multi-specification mold cavity groups and guide channel structures, the problems of high cost and low efficiency for small and medium-sized enterprises have been solved, and efficient molding for diversified production has been achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- BEIJING HUAXIN MICRO SEMICON CO LTD
- Filing Date
- 2025-07-19
- Publication Date
- 2026-06-09
AI Technical Summary
Existing molding molds are expensive and cannot meet the diverse production needs of small and medium-sized enterprises. Frequent mold changes also lead to low production efficiency.
Design a molding die that includes a first mold cavity group and a second mold cavity group with different sizes and specifications. Through the push column and guide channel structure in the sprue, it can achieve simultaneous molding of multiple product specifications. The guide column and metal gasket reduce mold damage and control the flow of molding compound.
It reduces mold costs, improves production efficiency, adapts to the diversified production needs of small and medium-sized enterprises, and reduces the frequency of mold replacement and debugging time.
Smart Images
Figure CN224334817U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of chip processing technology, and in particular to a molding die. Background Technology
[0002] In the field of semiconductor molding and packaging, the semiconductor industry has achieved remarkable development with continuous technological advancements. Semiconductor products are widely used in numerous fields such as electronic equipment, communications, and computers, providing crucial support for the informatization and intelligentization of modern society. Molding and packaging, as a vital step in the semiconductor manufacturing process, plays a crucial role in protecting chips and improving their stability and reliability. However, current molding and packaging technologies primarily focus on meeting the needs of large-scale production and single-specification products, paying insufficient attention to the diverse production needs of small and medium-sized enterprises.
[0003] In traditional semiconductor molding processes, in order to achieve product molding, the usual practice is to design and manufacture a molding mold for each product specification separately, and then inject heated molding material into the mold cavity to achieve product molding.
[0004] Regarding the aforementioned technologies, existing molding compounds have significant drawbacks. For small and medium-sized enterprises (SMEs), due to their relatively small production scale and diverse product range, creating separate molds for each specification would result in exorbitant mold costs. This places considerable cost pressure on SMEs in market competition, limiting their development and product diversification. Furthermore, frequent mold changes increase debugging time and costs during production, reducing production efficiency. Utility Model Content
[0005] In order to simultaneously encapsulate chips of different specifications, this application provides an encapsulation mold.
[0006] This application provides a molding die, which adopts the following technical solution:
[0007] A molding die includes an upper mold box and a lower mold box that matches the upper mold box;
[0008] The lower mold box body is provided with a plurality of first mold cavity groups and second mold cavity groups. The first mold cavity groups and the second mold cavity groups are respectively located on both sides of the upper mold box body. The first mold cavity group includes a plurality of first mold cavity chambers, and the second mold cavity group includes a plurality of second mold cavity chambers. The internal dimensions of the first mold cavity chambers and the second mold cavity chambers are different. A plurality of pouring ports are provided between the second mold cavity group and the first mold cavity group. The pouring ports penetrate the lower mold box along a first direction.
[0009] The first mold cavity group and the second mold cavity group are distributed in multiple intervals along the second direction. Along the second direction, a first guide channel is connected between two adjacent first mold cavity groups, and each first guide channel is connected to a pouring port.
[0010] A jacking column is slidably disposed inside the pouring opening, and the jacking column slides within the pouring opening along a first direction.
[0011] By adopting the above technical solution, and by setting up a first mold cavity group and a second mold cavity group with different sizes and specifications, two different product specifications can be molded simultaneously by pouring molding compound into the pouring port. When pouring molding compound, one end of the pusher is located inside the pouring port to close the pouring port. The molding compound is poured from the pouring port on the top wall of the lower mold box. The pusher slides upward along the first direction, and the pusher further pushes the molding compound from the pouring port into the first guide groove. The molding compound in the first guide groove further flows into the first mold cavity for molding.
[0012] Optionally, the first mold cavity is provided with multiple spaced-apart spaces along a third direction, and the first mold cavity is provided with two spaced-apart spaces along a second direction. The first flow channel includes a first flow channel and a second flow channel. The length direction of the first flow channel is parallel to the third direction. Multiple second flow channels are connected to both sides of the first flow channel. Each second flow channel corresponds to one of the first mold cavities.
[0013] By adopting the above technical solution, multiple first mold cavities are provided, which can realize the simultaneous encapsulation of multiple chips. By setting a first flow channel and a second flow channel, the encapsulating material enters the first flow channel and the second flow channel in sequence, and further enters the first mold cavity, which can realize the encapsulation of chips in multiple first mold cavities.
[0014] Optionally, along the second direction, a second guide channel is connected between two adjacent second mold cavities, and each second guide channel is correspondingly provided with one of the pouring ports.
[0015] By adopting the above technical solution and setting a second flow channel, the molding compound can flow into the first flow channel and the second flow channel simultaneously from the pouring port. The molding compound flowing into the second flow channel enters the second mold cavity, which can simultaneously encapsulate chips of different models.
[0016] Optionally, the second mold cavity is provided with multiple spaces along a third direction, and the second mold cavity is provided with two spaces along a second direction. The second guide channel includes a third flow channel and a fourth flow channel. The length direction of the third flow channel is parallel to the third direction. Multiple fourth flow channels are connected to both sides of the third flow channel. Each fourth flow channel is correspondingly provided with one second mold cavity.
[0017] By adopting the above technical solution, and by setting up a third flow channel and a fourth flow channel, the molding compound enters the third flow channel and the fourth flow channel sequentially from the pouring port and then enters the second mold cavity for molding, thereby realizing the molding of chips in multiple second mold cavities.
[0018] Optionally, it also includes a first flow guiding component, which includes a first flow guiding column and a third flow guiding groove. The first flow guiding column is rotatably connected to the side of the first flow groove near the pouring port. The first flow guiding column is parallel to a first direction along the rotation axis of the lower mold box, so that the direction of the third flow guiding groove is changed by the rotation of the first flow guiding column. When the first flow guiding column is rotated to a first position, the third flow guiding groove is connected to the first flow groove.
[0019] By adopting the above technical solution, and by setting the first guide column, when the molding compound is not required to enter the first mold cavity, the corresponding first guide column is rotated to make the third guide channel and the first flow channel misaligned, thus blocking the molding compound from entering the first flow channel. When the molding compound is required to enter the first mold cavity, the first guide column is rotated to make the third guide channel and the first flow channel connected, allowing the molding compound to enter the first flow channel from the third guide channel.
[0020] Optionally, the flow guiding assembly further includes a first rotating block. The first flow channel wall has a first receiving groove for accommodating the first rotating block. The first rotating block is fixedly connected to the bottom wall of the first flow guiding column. The bottom wall of the lower mold box has a first rotating groove for accommodating the first rotating block along a first direction. The first rotating groove communicates with the first receiving groove. The first rotating block is rotatably connected to the wall of the first rotating groove. The axis of the first rotating block and its rotation axis are both parallel to the first direction.
[0021] By adopting the above technical solution, by setting a first rotating block, rotating the first rotating block drives the first guide column to rotate, thereby controlling the flow direction of the molding compound in the first flow channel.
[0022] Optionally, a metal gasket is also included, which is disposed between the upper mold box and the lower mold box. The metal gasket has a plurality of placement positions that match the first mold cavity. Along the second direction, a first through groove is formed between two adjacent placement positions along the first direction. The first through groove is corresponding to the first flow groove in the first direction. Along the third direction, a plurality of through holes are formed between two adjacent first mold cavities along the first direction.
[0023] By adopting the above technical solution, the chip is placed on the corresponding placement position of the metal pad by setting a metal pad. The metal pad further reduces the pressure damage to the lower mold box when the upper mold box and the lower mold box are closed. The metal pad is provided with a first through groove and through hole to facilitate the overflow of molding compound so that the molding compound can flow under the chip.
[0024] Optionally, the top wall of the lower mold box is provided with a plurality of positioning members, and the positioning members are provided with positioning grooves along the first direction to accommodate the metal gasket.
[0025] By adopting the above technical solution, the positioning component is used to position the metal gasket on the lower mold box.
[0026] In summary, this application includes at least one of the following beneficial technical effects:
[0027] 1. This application, by setting up a first mold cavity group and a second mold cavity group with different sizes and specifications, can simultaneously achieve the molding of two different product specifications by pouring molding compound into the pouring gate. When pouring molding compound, one end of the pusher is located inside the pouring gate to close the pouring gate. The molding compound is poured from the pouring gate on the top wall of the lower mold box. The pusher slides upward along the first direction and pushes the molding compound from the pouring gate into the first guide groove. The molding compound in the first guide groove further flows into the first mold cavity for molding.
[0028] 2. This application uses a first guide column to control the direction of the molding compound entering the first flow channel, which facilitates the control of the opening and closing of the first flow channel according to the position and quantity of the chips;
[0029] 3. This application further reduces the damage to the lower mold box when the upper mold box and the lower mold box are closed by setting a metal gasket. Attached Figure Description
[0030] Figure 1 This is a schematic diagram of the overall structure of a molding die according to this application;
[0031] Figure 2 This is a schematic diagram of the structure of the first mold cavity and the first guide channel of this application;
[0032] Figure 3 This is a structural schematic diagram of the mold box in this application;
[0033] Figure 4 This application Figure 2 Enlarged view of section A;
[0034] Figure 5 This application Figure 2 Enlarged view of section B;
[0035] Figure 6This is a structural schematic diagram of the first and second flow guiding components from a first-view perspective.
[0036] Figure 7 This is a structural schematic diagram of the first and second flow guiding components from a second perspective in this application.
[0037] Figure 8 This is a schematic diagram of the structure of the first flow guiding component of this application.
[0038] Figure 9 This is a schematic diagram of the structure of the metal gasket in this application.
[0039] Figure 10 This is a schematic diagram of the structure of the buffer component in this application.
[0040] Explanation of reference numerals in the attached drawings: 1. Upper mold box; 11. Flow port; 2. Lower mold box; 21. First mold cavity group; 211. First mold cavity chamber; 22. Second mold cavity group; 221. Second mold cavity chamber; 23. Casting port; 24. First guide channel; 241. First flow channel; 2411. First receiving channel; 242. Second flow channel; 25. Second guide channel; 251. Third flow channel; 2511. Second receiving channel; 252. Fourth flow channel; 26. First rotating channel; 27. Second... 28. Rotating groove; 3. Third receiving groove; 4. Pushing column; 5. First flow guiding assembly; 6. First flow guiding column; 7. Third flow guiding groove; 8. First rotating block; 9. Second flow guiding assembly; 10. Second flow guiding column; 11. Fourth flow guiding groove; 12. Second rotating block; 13. Metal gasket; 14. Placement position; 15. First through groove; 26. Through hole; 37. Positioning component; 48. Positioning groove; 59. Buffer assembly; 20. Elastic component; 20. First buffer block; 21. Second buffer block. Detailed Implementation
[0041] The following is in conjunction with the appendix Figure 1-10 This application will be described in further detail.
[0042] This application discloses a molding die. For ease of description, this application introduces directional terms such as first direction, second direction, and third direction to form a three-dimensional reference direction. The directional terms used, such as "first direction, second direction, and third direction", can be specifically referred to in the figure, where the first direction is represented by X, the second direction by Y, and the third direction by Z. The first direction, the second direction, and the third direction are perpendicular to each other.
[0043] Reference Figure 1 and Figure 2The molding die includes an upper mold box 1 and a lower mold box 2 that matches the upper mold box 1. The lower mold box 2 has multiple first mold cavity groups 21 and second mold cavity groups 22 on its body. The first mold cavity groups 21 and 22 are located on opposite sides of the upper mold box 1. Each first mold cavity group 21 includes multiple first mold cavity chambers 211, and each second mold cavity group 22 includes multiple second mold cavity chambers 221. The internal dimensions of the first mold cavity chambers 211 and 221 are different. Multiple pouring ports 23 are provided between the second mold cavity groups 22 and the first mold cavity groups 21, and the pouring ports 23 penetrate the lower mold box 2 along a first direction. The first mold cavity groups 21 and 22 are respectively located along a second direction. Multiple first mold cavity groups 21 are spaced apart. Along the second direction, a first guide channel 24 is connected between two adjacent first mold cavity groups 21. Each first guide channel 24 is connected to a pouring port 23. A pusher 3 is slidably disposed in the pouring port 23. The pusher 3 slides in the pouring port 23 along the first direction. When pouring the molding compound, one end of the pusher 3 is located in the pouring port 23 to close the pouring port 23. The molding compound is poured from the pouring port 23 on the top wall of the lower mold box 2. The pusher 3 slides upward along the first direction. The pusher 3 further pushes the molding compound from the pouring port 23 into the first guide channel 24. The molding compound in the first guide channel 24 further flows into the first mold cavity to form.
[0044] Reference Figure 2 By setting a first mold cavity group 21 and a second mold cavity group 22, with different sizes and specifications, two different product specifications can be simultaneously encapsulated by pouring molding compound into the pouring port 23.
[0045] Reference Figure 3 The upper mold box 1 also has a first mold cavity group 21 and a second mold cavity group 22 adapted to the lower mold box 2 on one side. The bottom wall of the upper mold box 1 has a flow port 11 along the first direction. The flow port 11 is correspondingly set with the pouring port 23. The sliding push column 3 along the first direction allows the molding material to further enter the two first mold cavities for molding.
[0046] Reference Figure 2 and Figure 4 In order to encapsulate multiple chips at once, multiple first mold chambers 211 are spaced apart along a third direction, and two first mold chambers 211 are spaced apart along a second direction in each first mold chamber group 21. Since there are multiple first mold chambers 211, in order to allow the molding compound to enter multiple first mold chambers 211, the first guide channel 24 includes a first flow channel 241 and a second flow channel 242. The length direction of the first flow channel 241 is parallel to the third direction, and multiple second flow channels 242 are connected to both sides of the first flow channel 241. Each second flow channel 242 corresponds to a first mold chamber 211. The molding compound enters the first flow channel 241 and the second flow channel 242 in sequence, and further enters the first mold chamber 211.
[0047] Reference Figure 2 and Figure 5 When the chip is encapsulated using the second mold cavity group 22, in order to allow the encapsulating material to enter the second mold cavity 221, a second guide channel 25 is connected between two adjacent second mold cavity groups 22 along the second direction. Each second guide channel 25 is corresponding to a casting port. Specifically, multiple second mold cavity groups 221 are spaced apart along the third direction, and two second mold cavity groups 221 are spaced apart along the second direction. The second guide channel 25 includes a third flow channel 251 and a fourth flow channel 252. The length direction of the third flow channel 251 is parallel to the third direction. Multiple fourth flow channels 252 are connected to both sides of the third flow channel 251. Each fourth flow channel 252 is corresponding to a second mold cavity 221. The encapsulating material enters the third flow channel 251 and the fourth flow channel 252 sequentially from the casting port 23 and then enters the second mold cavity 221 for molding.
[0048] Reference Figure 2 , Figure 4 and Figure 5 By setting multiple pouring ports 23, a first mold cavity group 21 and a second mold cavity group 22, the corresponding pusher 3 can be slid according to the number of chips to be encapsulated and the position of the chips in the first mold cavity group 21 and the second mold cavity group 22, so that the encapsulating material enters the corresponding first mold cavity 211 and the second mold cavity 221.
[0049] Reference Figure 6 When it is necessary to encapsulate chips placed in part of the first mold cavity 211, in order to prevent the encapsulating material from entering other first mold cavities 211 where no chips are placed, the encapsulation mold also includes a first flow guiding assembly 4. The first flow guiding assembly 4 includes a first flow guiding post 41, on which a third flow guiding groove 411 is formed. The first flow guiding post 41 is rotatably connected to the side of the first flow channel 241 near the pouring port 23. The first flow guiding post 41 is parallel to the first direction along the rotation axis of the lower mold box 2, so that the direction of the third flow guiding groove 411 is changed by the rotation of the first flow guiding post 41. The first flow guiding post 41 rotates to the first position. When the first flow channel 411 is in the second position, the third flow channel 411 is connected to the first flow channel 241. When the first flow column 41 is rotated to the second position, the third flow channel 411 is offset from the first flow channel 241. When the molding compound is not needed to enter the first mold cavity 211, the corresponding first flow column 41 is rotated to make the third flow channel 411 offset from the first flow channel 241, thus blocking the molding compound from entering the first flow channel 241. When the molding compound is needed to enter the first mold cavity 211, the first flow column 41 is rotated to make the third flow channel 411 and the first flow channel 241 connected, allowing the molding compound to enter the first flow channel 241 from the third flow channel 411.
[0050] Reference Figure 6 , Figure 7 and Figure 8 In order to make the first guide column 41 rotate, the first flow channel 241 has a first receiving channel 2411 on its side wall to accommodate the first guide column 41. The first guide assembly 4 includes a first rotating block 42, which is fixedly connected to the bottom wall of the first guide column 41. The bottom wall of the lower mold box 2 has a first rotating channel 26 along the first direction to accommodate the first rotating block 42. The first rotating channel 26 is connected to the first receiving channel 2411. The first rotating block 42 is rotatably connected to the channel wall of the first rotating channel 26. The axis of the first rotating block 42 and the axis of rotation are both parallel to the first direction. In this embodiment, the cross-sections of the first guide column 41 and the first rotating block 42 are both circular. Rotating the first rotating block 42 drives the first guide column 41 to rotate.
[0051] Reference Figure 6 and Figure 7 When it is necessary to encapsulate chips placed in part of the second mold cavity 221, in order to prevent the encapsulating material from entering other second mold cavities 221 without chips, the encapsulation mold also includes a second flow guiding assembly 5. The second flow guiding assembly 5 includes a second flow guiding column 51, on which a fourth flow guiding groove 511 is formed. The second flow guiding column 51 is rotatably connected to the side of the second flow channel 242 near the pouring port 23. The second flow guiding column 51 is parallel to the first direction along the rotation axis of the lower mold box 2, so that the direction of the fourth flow guiding groove 511 is changed by the rotation of the second flow guiding column 51. When the second flow guiding column 51 rotates to the first position, the direction of the fourth flow guiding groove 511 is changed. 1. When the second guide column 51 is rotated to the second position, the fourth guide column 511 is offset from the third flow channel 251. In this embodiment, the cross-section of the second guide column 51 is circular. When the molding compound is not needed to enter the second mold cavity 221, the corresponding second guide column 51 is rotated so that the fourth guide column 511 is offset from the third flow channel 251, blocking the molding compound from entering the second flow channel 242. When the molding compound is needed to enter the second mold cavity 221, the second guide column 51 is rotated so that the fourth guide column 511 and the third flow channel 251 are connected, so that the molding compound enters the third flow channel 251 from the fourth guide column 511.
[0052] Reference Figure 6 and Figure 7To enable the second guide column 51 to rotate, the side wall of the third flow channel 251 is provided with a second receiving channel 2511 to accommodate the second guide column 51. The second guide assembly 5 includes a second rotating block 52, which is fixedly connected to the bottom wall of the second guide column 51. The bottom wall of the lower mold box 2 is provided with a second rotating channel 27 along the first direction to accommodate the second rotating block 52. The second rotating channel 27 is connected to the second receiving channel 2511. The second rotating block 52 is rotatably connected to the wall of the second rotating channel 27. The axis of the second rotating block 52 and the axis of rotation are both parallel to the first direction. In this embodiment, the cross-sections of the second guide column 51 and the second rotating block 52 are both circular. Rotating the second rotating block 52 drives the second guide column 51 to rotate.
[0053] Reference Figure 6 and Figure 7 When only one type of chip needs to be encapsulated, the first rotating block 42 or the second rotating block 52 is rotated to the second position to control the flow direction of the encapsulating material in the first flow channel 241 or the third flow channel 251, so that only one side of the product is encapsulated.
[0054] Reference Figure 9 To further improve the molding effect, the molding die also includes a metal gasket 6, which is disposed between the upper mold box 1 and the lower mold box 2. The metal gasket 6 has multiple placement positions 61 that match the first mold cavity 211. Along the second direction, a first through groove 62 is formed between two adjacent placement positions 61 along the first direction. The first through groove 62 is correspondingly disposed with the first flow groove 241 in the first direction. Along the third direction, multiple through holes 63 are formed between two adjacent first mold cavities 211 along the first direction. That is to say, the metal gasket 6 is a hollow mesh gasket. By setting the metal gasket 6, the chip is placed on the placement position 61 corresponding to the metal gasket 6. The metal gasket 6 further reduces the pressure damage to the lower mold box 2 when the upper mold box 1 and the lower mold box 2 are closed. The metal gasket 6 has the first through groove 62 and through holes 63 to facilitate the overflow of molding material so that the molding material can flow under the chip. In this embodiment, the metal gasket 6 is rectangular.
[0055] Referring to the figure, in order to further position the metal gasket 6, the top wall of the lower mold box 2 is provided with multiple positioning members 7. One end of the positioning member 7 is fixedly connected to the top wall of the lower mold box 2, and the multiple positioning members 7 are provided with positioning grooves 71 for accommodating the metal gasket 6 through the first direction, so that the metal gasket 6 is positioned by the positioning members 7.
[0056] Reference Figure 9 Similarly, the lower mold box 2 is also provided with a metal gasket 6 on the top wall of the second mold cavity 221. The placement position 61 of the metal gasket 6 corresponds to the second mold cavity 221. The metal gasket 6 in the second mold cavity 221 has the same function as the metal gasket 6 in the first mold cavity 211.
[0057] Reference Figure 10 When the upper mold box 1 and the lower mold box 2 are closed, in order to further reduce the pressure damage of the upper mold box 1 on the lower mold box 2, the molding die also includes a buffer assembly 8. In this embodiment, there are four buffer assemblies 8, including an elastic element 81, a first buffer block 82, and a second buffer block 83. The top wall of the lower mold box 2 is provided with a third receiving groove 28 along the first direction. One end of the elastic element 81 is fixedly connected to the bottom wall of the third receiving groove 28, and the other end is fixedly connected to the first buffer block 82. The extension and retraction direction of the elastic element 81 is parallel to the first direction. Under recoverable deformation, the elastic element 81 has the function of driving the first buffer block 82. The first buffer block 82 moves away from the third receiving groove 28. The second buffer block 83 is fixedly connected to the bottom wall of the upper mold box 1. The second buffer block 83 is correspondingly arranged with the third receiving groove 28. When the elastic member 81 is in normal state, the first buffer block 82 is located outside the third receiving groove 28. When the upper mold box 1 and the lower mold box 2 are closed, the second buffer block 83 applies pressure to the first buffer block 82. Under the action of the elastic member 81, the first buffer block 82 is pressed into the third receiving groove 28, and the second buffer block 83 is located in the third receiving groove 28 to reduce the impact force of the upper mold box 1 on the lower mold box 2.
[0058] The implementation principle of a molding die in this application embodiment is as follows: By setting a first mold cavity group 21 and a second mold cavity group 22 with different sizes and specifications, molding material can be poured into the pouring port 23 to simultaneously achieve molding of two different product specifications. When pouring molding material, a component spacer is placed above the first mold cavity 211, and one end of the pusher 3 is located inside the pouring port 23 to close the pouring port 23. The molding material is poured from the pouring port 23 on the top wall of the lower mold box 2. The pusher 3 slides upward along the first direction, and the pusher 3 further pushes the molding material from the pouring port 23 into the first guide groove 24. The molding material in the first guide groove 24 further flows into the first mold cavity and contacts the chip through the first through groove 62 and through hole 63 of the metal spacer 6. The molding material also further enters the first mold cavity 211 corresponding to the upper mold box 1 and the lower mold box 2, thereby realizing chip molding.
[0059] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.
Claims
1. A molding die, characterized in that:
1. Includes an upper mold box (1) and a lower mold box (2) that matches the upper mold box (1); The lower mold box (2) body is provided with a plurality of first mold cavity groups (21) and second mold cavity groups (22). The first mold cavity groups (21) and the second mold cavity groups (22) are respectively located on both sides of the upper mold box (1) body. The first mold cavity group (21) includes a plurality of first mold cavity chambers (211), and the second mold cavity group (22) includes a plurality of second mold cavity chambers (221). The inner dimensions of the first mold cavity chambers (211) and the second mold cavity chambers (221) are different. A plurality of pouring ports (23) are provided between the second mold cavity group (22) and the first mold cavity group (21). The pouring ports (23) penetrate the lower mold box (2) along a first direction. The first mold cavity group (21) and the second mold cavity group (22) are distributed in multiple intervals along the second direction. Along the second direction, a first guide channel (24) is connected between two adjacent first mold cavity groups (21), and each first guide channel (24) is connected to a pouring port (23). A jacking column (3) is slidably disposed inside the pouring opening (23), and the jacking column (3) slides inside the pouring opening (23) along a first direction.
2. The molding die according to claim 1, characterized in that: The first mold cavity (211) is provided with a plurality of spaced-apart spaces along a third direction, and the first mold cavity (211) is provided with two spaced-apart spaces along a second direction. The first guide groove (24) includes a first flow groove (241) and a second flow groove (242). The length direction of the first flow groove (241) is parallel to the third direction. The first flow groove (241) is connected to a plurality of second flow grooves (242) on both sides. Each second flow groove (242) corresponds to one first mold cavity (211).
3. A molding die according to claim 1, characterized in that: Along the second direction, a second guide channel (25) is connected between two adjacent second mold cavity groups (22), and each second guide channel (25) is correspondingly provided with a pouring port (23).
4. A molding die according to claim 3, characterized in that: The second mold cavity (221) is provided with multiple spaces along the third direction, and the second mold cavity (221) is provided with two spaces along the second direction. The second guide channel (25) includes a third flow channel (251) and a fourth flow channel (252). The length direction of the third flow channel (251) is parallel to the third direction. Multiple fourth flow channels (252) are connected on both sides of the third flow channel (251). Each fourth flow channel (252) is correspondingly provided with one second mold cavity (221).
5. A molding die according to claim 2, characterized in that: It also includes a first flow guiding component (4), which includes a first flow guiding column (41). The first flow guiding column (41) has a third flow guiding groove (411). The first flow guiding column (41) is rotatably connected to the side of the first flow channel (241) near the pouring port (23). The first flow guiding column (41) is parallel to the first direction along the rotation axis of the lower mold box (2), so that the direction of the third flow guiding groove (411) is changed by the rotation of the first flow guiding column (41). When the first flow guiding column (41) rotates to the first position, the third flow guiding groove (411) is connected to the first flow channel (241).
6. A molding die according to claim 5, characterized in that: The flow guiding assembly further includes a first rotating block (42). The first flow channel (241) has a first receiving groove (2411) for accommodating the first rotating block (42) on its wall. The first rotating block (42) is fixedly connected to the bottom wall of the first flow guiding column (41). The bottom wall of the lower mold box (2) has a first rotating groove (26) for accommodating the first rotating block (42) along the first direction. The first rotating groove (26) is connected to the first receiving groove (2411). The first rotating block (42) is rotatably connected to the wall of the first rotating groove (26). The axis of the first rotating block (42) and its rotation axis are both parallel to the first direction.
7. A molding die according to any one of claims 1-6, characterized in that: It also includes a metal gasket (6), which is disposed between the upper mold box (1) and the lower mold box (2). The metal gasket (6) has a plurality of placement positions (61) that match the first mold cavity (211). Along the second direction, a first through groove (62) is provided between two adjacent placement positions (61) along the first direction. The first through groove (62) is corresponding to the first flow groove (241) in the first direction. Along the third direction, a plurality of through holes (63) are provided between two adjacent first mold cavities (211) along the first direction.
8. A molding die according to claim 7, characterized in that: The lower mold box (2) has a plurality of positioning parts (7) on its top wall, and the positioning parts (7) have positioning grooves (71) for accommodating the metal gasket (6) along the first direction.