A high-precision probe test table for SIP power module array layout

Abstract

This invention discloses a high-precision probe test stand for SIP power module array panels, including a support device, a motion bracket mounted on the support device, a test platform, a dual-axis adjustment device, an auxiliary observation device, a probe assembly, and a heat dissipation assembly. When testing a SIP-level power module array panel, the panel under test is first placed on the test platform. The dual-axis adjustment device is used to precisely move the auxiliary observation device above the test point. The position of the test point on the power module array panel is observed through the auxiliary observation device, and then the electrical performance of the test point is tested through the probe assembly. During the test, the operation of the heat dissipation assembly is controlled according to the equipment temperature to ensure stable equipment operation. This invention has advantages such as high-precision adjustment, wide test range, excellent heat dissipation design, and high structural compatibility, meeting the requirements for electrical performance testing of SIP-level power module array panels.

Description

Technical Field

[0001] This utility model belongs to the field of power module testing technology, and in particular to a high-precision probe test station for SIP power module array panelization. Background Technology

[0002] Due to their high integration and power density, SIP power modules require stringent precision, stability, and reliability in electrical performance testing. Existing manual test benches suffer from limitations such as small test range, inadequate heat dissipation design, and low structural compatibility, making it difficult to meet the high-precision testing needs of large-size SIP power module arrays. Utility Model Content

[0003] The purpose of this invention is to address the problems existing in the prior art by providing a device with high-precision adjustment, wide testing range, excellent heat dissipation design, and high structural compatibility for testing the electrical performance of SIP-level power module array panels.

[0004] The technical solution to achieve the purpose of this utility model is: a high-precision probe test stand for SIP power module array panelization, the test stand includes a support device, and a motion bracket, test platform, dual-axis adjustment device, auxiliary observation device, probe assembly and heat dissipation assembly installed on the support device;

[0005] The motion support is used to provide installation support for the dual-axis adjustment device and the auxiliary observation device;

[0006] The test platform is used to assemble SIP power module array panels;

[0007] The dual-axis adjustment device is used to adjust the auxiliary observation device to achieve two-dimensional planar motion, so that it can be accurately moved above the test point of the component under test on the SIP power module array panel.

[0008] The auxiliary observation device is used to observe whether the probe assembly contacts the test point of the component under test;

[0009] The probe assembly is used to measure the electrical performance parameters of the test point and transmit them to external testing instruments;

[0010] The heat dissipation component is used to dissipate heat from the power module array panel.

[0011] Furthermore, the support device includes a lower housing and a probe platform disposed on the lower housing, wherein the probe assembly is mounted on the probe platform.

[0012] Furthermore, the test platform is equipped with mounting components for assembling test fixtures of different sizes; the SIP power module array panel can be detachably mounted on the test fixture.

[0013] Furthermore, the test fixture has a hollow ring structure. When the SIP power module array panel is installed on the test fixture, all components on the SIP power module array panel are located above the hollow position of the hollow ring structure. At the same time, the test fixture has a certain thickness to meet the space requirements of components of different heights.

[0014] Furthermore, the dual-axis adjustment device includes an X-axis adjustment device and a Y-axis adjustment device; an XYZ coordinate system is established with the horizontal direction as the X-axis and the vertical direction as the Z-axis; the X-axis adjustment device is connected to the auxiliary observation device and fixedly installed on the motion support, and the auxiliary observation device moves along the X-axis direction by adjustment through the X-axis adjustment device; the Y-axis adjustment device is fixedly installed on the support device, and the test platform is movably installed on the support device and connected to the Y-axis adjustment device, and the test platform moves along the Y-axis direction by adjustment through the Y-axis adjustment device; the adjustment range of the auxiliary observation device and the test platform should ensure that the observation area of ​​the auxiliary observation device can cover the test platform.

[0015] Furthermore, after the position adjustment of the test platform is completed, it is locked to the support device using a locking device.

[0016] Furthermore, the support device is a U-shaped structure, and the test platform spans between the two arms of the U-shaped structure.

[0017] Furthermore, the auxiliary observation device employs a CCD microscope.

[0018] Furthermore, there are several probe assemblies, all mounted on the support device and distributed circumferentially along the test platform; each probe assembly includes a magnetic probe holder and a BNC connector, the magnetic probe holder is used to detect the electrical performance parameters of the component under test, and the BNC connector is used to connect external test instruments and probes on the magnetic probe holder.

[0019] Furthermore, the heat dissipation component includes a switch and several sets of fans. The switch controls the operation of the fans according to the temperature of the SIP power module array panel to prevent the temperature of the power module array panel from exceeding a preset temperature threshold that would affect the test accuracy.

[0020] Compared with the prior art, the significant advantages of this utility model are:

[0021] (1) High-precision testing: Equipped with X-axis and Y-axis dual-axis adjustment devices, the probe position can be precisely controlled and adjusted to meet the high-precision positioning test requirements of the tiny pins or solder joints of the SIP power module and improve test consistency.

[0022] (2) Wide testing range: With the dual-axis adjustment device of X-axis and Y-axis, the auxiliary observation device can observe a certain large range (30cm×60cm) to meet the testing needs of SIP power module panels of different sizes.

[0023] (3) Optimized structure: The bakelite underbox is insulated to avoid leakage interference; the probe platform surface is plated with hard chrome to enhance wear resistance and corrosion resistance and extend equipment life.

[0024] (4) Heat dissipation protection: Active heat dissipation can be used to address the issue of module overheating during testing, ensuring the stability of the testing environment and avoiding the impact of temperature on the performance of the SIP power module.

[0025] The present invention will now be described in further detail with reference to the accompanying drawings. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of a high-precision probe test station used for SIP power module array panelization in one embodiment.

[0027] Figure 2 This is a schematic diagram of the assembly of the test fixture and the test platform in one embodiment.

[0028] Figure 3 This is a schematic diagram of the assembly of the power module array panel, test fixture, and test platform in one embodiment.

[0029] Figure 4 This is a schematic diagram of the cross-sectional structure of a high-precision probe test stage used for SIP power module array panelization in one embodiment. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0031] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0032] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0033] In one embodiment, combined Figure 1 A high-precision probe test stand for SIP power module array panelization is provided. The test stand includes a support device 1, and a motion bracket 2, a test platform 3, a dual-axis adjustment device 4, an auxiliary observation device 5, a probe assembly 6 and a heat dissipation assembly 7 mounted on the support device 1.

[0034] The motion support 2 is used to provide installation support for the dual-axis adjustment device 4 and the auxiliary observation device 5;

[0035] The test platform 3 is used to assemble the SIP power module array panel 9;

[0036] The dual-axis adjustment device 4 is used to adjust the auxiliary observation device 5 to achieve two-dimensional planar motion, so that it can be accurately moved above the test point of the component under test on the SIP power module array panel 9.

[0037] The auxiliary observation device 5 is used to observe whether the probe assembly 6 contacts the test point of the component under test;

[0038] The probe assembly 6 is used to measure the electrical performance parameters of the test point and transmit them to external testing instruments;

[0039] The heat dissipation component 7 is used to dissipate heat from the power module array panel 9.

[0040] Furthermore, in one embodiment, the support device includes a lower housing 1.1 and a probe platform 1.2 disposed on the lower housing 1.1, on which the probe assembly 6 is mounted.

[0041] Preferably, in some embodiments, the lower housing 1.1 is made of bakelite material to provide stable support and insulation protection, preventing external electromagnetic interference from affecting the test results.

[0042] Preferably, in some embodiments, the probe platform 1.2 is made of 45 steel with a chrome-plated surface, which has good mechanical strength and wear resistance.

[0043] Furthermore, in one embodiment, the motion support 2 is made of aluminum and can withstand an external force of at least 500N, so that it will not be displaced or deformed due to the external force.

[0044] Furthermore, in one embodiment, the test platform 3 is provided with mounting components for assembling test fixtures 8 of different sizes; the SIP power module array panel 9 is detachably mounted on the test fixture 8.

[0045] Preferably, in some embodiments, in combination with Figure 3 The test fixture 8 has a hollow ring structure. When the SIP power module array panel 9 is installed on the test fixture 8, all components on the SIP power module array panel 9 are located above the hollow position of the hollow ring structure. At the same time, the test fixture 8 has a certain thickness to meet the space requirements of components of different heights.

[0046] Here, the test fixture 8 adopts a hollow ring structure because if it is mounted on a plane, in order to avoid affecting the components, it is also necessary to open grooves on the plane that match the components. By adopting the method of this utility model, the complexity of the device is reduced, while improving the universality of the device.

[0047] More preferably, the test fixture 8 adopts, but is not limited to, a U-shaped structure, and the fixture height is designed to be 12mm, leaving enough space to meet the adaptability of height components on the SIP power module array panel 9.

[0048] Preferably, in some embodiments, in combination with Figure 2 The mounting components are, but are not limited to, riveting devices. The riveting devices include first riveting holes 3.1 arranged in an array on the test platform 3, and second riveting holes 8.1 on the test fixture 8 that are fitted one-to-one with the first riveting holes 3.1.

[0049] More preferably, the test fixture 8 also includes PIN pins 8.2 for binding the SIP power module array panel 9, so as to realize the positioning and assembly of the SIP power module array panel 9, the test fixture 8, and the test platform 3.

[0050] Further, in one embodiment, the dual-axis adjustment device 4 includes an X-axis adjustment device 4.1 and a Y-axis adjustment device 4.2; an XYZ coordinate system is established with the horizontal direction as the X-axis and the vertical direction as the Z-axis; the X-axis adjustment device 4.1 is connected to the auxiliary observation device 5 and fixedly installed on the motion support 2, and the auxiliary observation device 5 moves along the X-axis direction by adjusting the X-axis adjustment device 4.1; the Y-axis adjustment device 4.2 is fixedly installed on the support device 1, and the test platform 3 is movably installed on the support device 1 and connected to the Y-axis adjustment device 4.2, and the test platform 3 moves along the Y-axis direction by adjusting the Y-axis adjustment device 4.2; the adjustment range of the auxiliary observation device 5 and the test platform 3 should ensure that the observation area of ​​the auxiliary observation device 5 can cover the test platform 3, and ensure that all test points on the power module array panel 9 can be observed.

[0051] Preferably, in some embodiments, the X-axis adjustment device 4.1 and the Y-axis adjustment device 4.2 adopt, but are not limited to, a hand-cranked guide rail slide module with a locking structure; other existing adjustment devices that can achieve the above functions are also acceptable.

[0052] Preferably, in some embodiments, after the position adjustment of the test platform 3 is completed, it is locked to the support device 1 by a locking device. Here, the locking device can be, but is not limited to, bolts, buckles, etc., or other locking solutions in the prior art that can achieve the above function.

[0053] Preferably, in some embodiments, the support device 1 is a U-shaped structure, and the test platform 3 is straddling the two arms of the U-shaped structure, providing a certain amount of movement space for the test platform 3.

[0054] Furthermore, in one embodiment, the auxiliary observation device 5 employs a CCD microscope to perform high-magnification observation of the contact between the probe and the component under test on the SIP power module array panel 9 during the test, ensuring that the probe accurately contacts the test point and improving test accuracy.

[0055] Here, the relative position of the CCD microscope and the test point is adjusted according to the test point position of the SIP power module array panel 9 under test. The CCD microscope focuses on the test point through its own height and magnification adjustment device and displays the image on the external display.

[0056] Preferably, in some embodiments, the magnification range of the CCD microscope is 7-45x to meet the requirements for accurate observation of test points of components of different sizes.

[0057] Preferably, in some embodiments, the adjustment size limit of the X-axis adjustment device 4.1 is 60cm, and the adjustment size limit of the Y-axis adjustment device 4.2 is 30cm, that is, the size adjustment range of the CCD microscope on the X and Y axes is 60cm×30cm.

[0058] Preferably, in some embodiments, the adjustment accuracy of the X-axis adjustment device 4.1 and the Y-axis adjustment device 4.2 is 50µm, which can achieve high-precision positioning of the probe in the horizontal direction.

[0059] Furthermore, in one embodiment, a plurality of probe assemblies 6 are provided, all mounted on the support device 1 and distributed circumferentially along the test platform 3 (specifically, for the support device 1, which is a U-shaped structure, the plurality of probe assemblies 6 are distributed along the U-shaped contour); each probe assembly 6 includes a magnetic probe holder 6.1 and a BNC connector 6.2, the magnetic probe holder 6.1 being used to detect the electrical performance parameters of the component under test, and the BNC connector 6.2 being used to connect external test instruments and probes on the magnetic probe holder 6.1 to ensure the stability and reliability of signal transmission.

[0060] Preferably, in some embodiments, the magnetic probe holder 6.1 is mounted on the probe platform 1.2 by means of, but not limited to, magnetic adsorption, to ensure the stability of the probe during the testing process and prevent probe displacement from causing testing errors.

[0061] Preferably, in some embodiments, the magnetic force of the magnetic probe holder 6.1 is between 10-20N to ensure stable adsorption, and the probe head size of the magnetic probe holder 6.1 is φ0.25mm, which meets the testing requirement of the minimum size of the PAD being φ0.5mm.

[0062] Preferably, in some embodiments, the BNC connector 6.2 is made of a material with specific shielding properties, which ensure that the influence of external electromagnetic interference on the test signal is less than or equal to 5% within the frequency range of 1 GHz to 10 GHz Hertz.

[0063] Furthermore, in one embodiment, combined with Figure 4 The heat dissipation component 7 includes a switch 7.1 and several sets of fans 7.2. The switch 7.1 controls the operation of the fans 7.2 according to the temperature of the power module array panel 9 to prevent the temperature of the power module array panel 9 from exceeding a preset temperature threshold that affects the test accuracy.

[0064] Preferably, in some embodiments, there are three sets of cooling fans 7.2, with a fan speed range of 1000-3000 rpm, to ensure that the temperature of the equipment is kept within a preset temperature range during the testing process, wherein the preset temperature range is 20℃-40℃.

[0065] Preferably, in some embodiments, the support device 1 is a U-shaped structure, and the heat dissipation component 7 is installed at the bottom of the U-shaped structure.

[0066] Here, the form of the heat dissipation component is not limited to that described above; any other existing device that can achieve the above heat dissipation function is acceptable.

[0067] The working principle of this high-precision probe test station for SIP power module array panels is as follows: When testing SIP and packaged power supplies, the SIP power module array panel 9 to be tested is first placed in the test fixture 8 corresponding to the module size on the test platform 3. The CCD microscope 5 is precisely moved above the test point using the X-axis adjustment device 4.1 and the Y-axis adjustment device 4.2. The test point position of the component under test on the SIP power module array panel 9 is observed through the CCD microscope 5. Then, the test point is measured through the probes on the magnetic probe holder 6.1. After connecting the test instrument through the BNC connector 6.2, the test program is started, and the probes are brought into contact with the test points to perform electrical performance testing. During the test, the switch 7.1 controls the operation of the fan 7.2 according to the equipment temperature to ensure stable operation of the equipment.

[0068] In summary, this utility model has advantages such as high-precision adjustment, wide testing range, perfect heat dissipation design, and high structural compatibility, which meet the electrical performance testing requirements of SIP-level power module array panels.

[0069] It should be noted that for components not specifically defined in the above text, any structural solution that can achieve the corresponding function in the existing technology is acceptable.

[0070] It should also be noted that the above-mentioned settings, installations, connections, and fixations can be made using, but are not limited to, bolts, threads, etc. Any existing fixed or movable connection scheme can be adapted, as long as the corresponding function can be achieved.

[0071] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model without departing from its spirit and scope should be included within the protection scope of this utility model.

Claims

1. A high-precision probe test station for SIP power module array panelization, characterized in that, The test bench includes a support device (1), a motion bracket (2), a test platform (3), a dual-axis adjustment device (4), an auxiliary observation device (5), a probe assembly (6), and a heat dissipation assembly (7) mounted on the support device (1); The motion support (2) is used to provide mounting support for the dual-axis adjustment device (4) and the auxiliary observation device (5); The test platform (3) is used to assemble the SIP power module array panel (9); The dual-axis adjustment device (4) is used to adjust the auxiliary observation device (5) to achieve two-dimensional planar motion, so that it can be accurately moved above the test point of the component under test on the SIP power module array panel (9); The auxiliary observation device (5) is used to observe whether the probe assembly (6) contacts the test point of the component under test; The probe assembly (6) is used to measure the electrical performance parameters of the test point and transmit them to an external testing instrument; The heat dissipation component (7) is used to dissipate heat from the power module array panel (9).

2. The high-precision probe test station for SIP power module array panelization according to claim 1, characterized in that, The support device includes a lower housing (1.1) and a probe platform (1.2) disposed on the lower housing (1.1), on which the probe assembly (6) is mounted.

3. The high-precision probe test station for SIP power module array panelization according to claim 1, characterized in that, The test platform (3) is equipped with mounting components for assembling test fixtures (8) of different sizes; the SIP power module array panel (9) can be detachably mounted on the test fixture (8).

4. The high-precision probe test station for SIP power module array panelization according to claim 3, characterized in that, The test fixture (8) has a hollow ring structure. When the SIP power module array panel (9) is installed on the test fixture (8), all components on the SIP power module array panel (9) are located above the hollow position of the hollow ring structure. At the same time, the test fixture (8) has a certain thickness to meet the space requirements of components of different heights.

5. The high-precision probe test station for SIP power module array panelization according to claim 1, characterized in that, The dual-axis adjustment device (4) includes an X-axis adjustment device (4.1) and a Y-axis adjustment device (4.2); an XYZ coordinate system is established with the horizontal direction as the X-axis and the vertical direction as the Z-axis; the X-axis adjustment device (4.1) is connected to the auxiliary observation device (5) and fixedly installed on the motion support (2), and the auxiliary observation device (5) is adjusted by the X-axis adjustment device (4.1) to move along the X-axis direction; the Y-axis adjustment device (4.2) is fixedly installed on the support device (1), and the test platform (3) is movably installed on the support device (1) and connected to the Y-axis adjustment device (4.2), and the test platform (3) is adjusted by the Y-axis adjustment device (4.2) to move along the Y-axis direction; the adjustment range of the auxiliary observation device (5) and the test platform (3) should be able to ensure that the observation area of ​​the auxiliary observation device (5) can cover the test platform (3).

6. The high-precision probe test station for SIP power module array panelization according to claim 5, characterized in that, After the position adjustment of the test platform (3) is completed, it is locked to the support device (1) by the locking device.

7. The high-precision probe test station for SIP power module array panelization according to claim 5, characterized in that, The support device (1) is a U-shaped structure, and the test platform (3) is connected between the two arms of the U-shaped structure.

8. The high-precision probe test station for SIP power module array panelization according to claim 1, characterized in that, The auxiliary observation device (5) is a CCD microscope.

9. The high-precision probe test station for SIP power module array panelization according to claim 1, characterized in that, There are several probe assemblies (6), all of which are installed on the support device (1) and distributed around the test platform (3). Each probe assembly (6) includes a magnetic probe holder (6.1) and a BNC connector (6.2). The magnetic probe holder (6.1) is used to detect the electrical performance parameters of the component under test, and the BNC connector (6.2) is used to connect external test instruments and probes on the magnetic probe holder (6.1).

10. The high-precision probe test station for SIP power module array panelization according to claim 1, characterized in that, The heat dissipation component (7) includes a switch (7.1) and several sets of fans (7.2). The switch (7.1) controls the operation of the fans (7.2) according to the temperature of the SIP power module array panel (9) to prevent the temperature of the power module array panel (9) from exceeding a preset temperature threshold that affects the test accuracy.

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