A semiconductor test thermal control structure and a thermal control system thereof

Abstract

This utility model relates to the field of semiconductor and fiber optic communication technology, specifically to a semiconductor testing thermal control structure and its thermal control system. It includes a cooling unit and a heating unit. The heating unit is installed at the bottom of the cooling unit. A gap unit is provided between the bottom of the cooling unit and the top of the heating unit. A connecting pipe is connected to one side of the gap unit, and an adjustment unit is fixedly connected to the end of the connecting pipe. Both the adjustment unit and the gap unit have interconnected cavities filled with a working medium. A thermally conductive interface layer is provided at the bottom of the heating unit. The thermally conductive interface layer contacts the semiconductor under test, controlling the temperature during semiconductor testing. When the semiconductor temperature needs to be controlled at a low or high temperature, the heating unit plays a major role. A large amount of working medium is stored in the adjustment unit in a gas-liquid two-phase state. The heating unit adjusts its heating power output through its thermally conductive interface layer to regulate the semiconductor temperature during testing to meet the requirements of precise temperature control.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor and optical fiber communication technology, and in particular to a semiconductor testing thermal control structure and its thermal control system. Background Technology

[0002] In the field of optical communication technology, optical modules will be used more and more in harsh environments. Semiconductors are the fundamental driving force for the performance and evolution of optical transceiver modules. In systems with high reliability requirements, in order to ensure the performance of optical transceiver modules, the signal integrity, reliability and stability of optical transceiver modules must be tested and evaluated before leaving the factory. Variable temperature zone testing is the main means of verifying the performance and lifespan of optical transceiver modules.

[0003] In the prior art, patent CN106996994B discloses a temperature cycling test bench, a lower temperature control module for placing the product under test, an upper temperature control module that can move up and down and is arranged opposite to the lower temperature control module, and both the upper and lower temperature control modules, in the direction away from the product under test, include a thermally conductive insulating layer, a thermally conductive layer, and a semiconductor cooling layer in sequence, a first temperature sensor embedded in the thermally conductive layer of the upper and lower temperature control modules for acquiring the temperature information of the product under test, and a second temperature sensor embedded in the thermally conductive layer of the upper and lower temperature control modules for acquiring the temperature information of the semiconductor cooling layer.

[0004] The above structure uses upper and lower temperature control modules to test the product under test. The semiconductor cold chip cannot withstand the impact of high and low temperatures, and its cooling efficiency is low. The temperature control range cannot meet the temperature measurement needs of current high-power semiconductors and optical modules. Other traditional temperature control devices mostly use cold air as the working medium. They are large in size, consume a lot of energy, and have complex systems. Moreover, their cooling capacity does not match the low power consumption of the optical transceiver module. The overall thermal control is not accurate enough and is prone to a lot of waste. Utility Model Content

[0005] In view of this, the purpose of this utility model is to propose a semiconductor testing thermal control structure and its thermal control system to solve the problems of traditional environments that use cold air as the working medium, which are large in size, have high energy consumption, are complex, and whose cooling capacity does not match the low power consumption of the optical transceiver module, resulting in inaccurate overall thermal control and a lot of waste.

[0006] To achieve the above objectives, this utility model provides a semiconductor testing thermal control structure, including a cooling unit and a heating unit. The heating unit is installed at the bottom of the cooling unit, and a gap unit is provided between the bottom of the cooling unit and the top of the heating unit. A connecting pipe is connected to one side of the gap unit, and an adjustment unit is fixedly connected to the end of the connecting pipe. The adjustment unit is used to reduce heat leakage from the heating unit to the cooling unit and to regulate the temperature at the bottom of the heating unit.

[0007] Both the adjustment unit and the gap unit have interconnected cavities inside, which are filled with a working medium. The working medium contains both liquid and gas in the cavity.

[0008] The bottom of the heating unit is provided with a thermally conductive interface layer, which is used to contact the semiconductor under test.

[0009] Preferably, both the cooling unit and the heating unit are rectangular metal block structures, with the top of the heating unit having a rough surface and the bottom of the heating unit having a smooth surface.

[0010] Preferably, the refrigeration unit has an internal working fluid flow channel with an S-shaped structure, and the two ends of the working fluid flow channel are respectively connected to a refrigerant inlet and a refrigerant outlet.

[0011] Preferably, an electric heating module is installed inside the heating unit and outside the regulating unit, and the electric heating module inside the regulating unit is provided with heat insulation material.

[0012] Preferably, the electric heating module is a heater, and a lead wire is fixedly connected to one side of the heater, and the lead wire is connected to an external power source.

[0013] Preferably, the internal cavity of the regulating unit is one of a cuboid or a cylinder, and the working medium inside the cavity is one of HFC, HFO, alcohol, ethanol, or R245fa.

[0014] Preferably, the distance between the connection point of the gap unit and the connecting pipe and the bottom surface of the gap unit is between 0.5 mm and 5 mm.

[0015] A semiconductor testing thermal control system is applied to the above-mentioned semiconductor testing thermal control structure. The thermal control system includes a cooling system, a heating system, and a regulating system, and the thermal control systems are all connected by pipelines.

[0016] The refrigeration system consists of a compressor, condenser, throttling device, refrigeration unit, and gas-liquid separator;

[0017] The heating system is a heating unit;

[0018] The regulating system consists of a gap unit and a regulating unit.

[0019] Preferably, the refrigeration unit and the throttling device are configured in multiple groups, with multiple refrigeration units connected in parallel, and each group of refrigeration units corresponding to each group of throttling devices.

[0020] Preferably, the refrigeration system is further provided with a refrigerant pump, which is located between the gas-liquid separator and the refrigeration unit, and the throttling device is located between the condenser and the gas-liquid separator.

[0021] The beneficial effects of this utility model are:

[0022] 1. The temperature of the semiconductor during testing is controlled by contacting the conductor under test through a thermally conductive interface. When the semiconductor temperature needs to be controlled at a low temperature, the gap unit mainly contains a gas-liquid two-phase working fluid. The cooling unit cools as needed, and the cooling capacity can be quickly transferred to the heating unit. A small amount of heating is used to control the temperature of the bottom surface of the heating unit. When the temperature is controlled at a high temperature, the heating unit plays a major role. At this time, the gap unit mainly contains a gaseous working fluid, and a large amount of working fluid is stored in the regulating unit in a gas-liquid two-phase state. The cooling unit cools or stops cooling as needed. The heating unit adjusts the heating power output through its thermally conductive interface to regulate the temperature of the semiconductor during testing to meet the requirements of precise temperature control.

[0023] Compared to traditional air cooling, the mainstream method of cooling via a cold plate significantly improves the temperature switching speed during semiconductor testing, thereby increasing testing efficiency.

[0024] By employing a gravity-type heat pipe with unidirectional thermal conductivity and a working fluid separation and adjustment unit, the space between the cooling and heating units is filled with gaseous working fluid during high-temperature testing. This reduces heat leakage from the heating unit to the cooling unit, eliminates the need for dynamic mechanical switching, and extends the service life of the test. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only for this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0027] Figure 2 This is a schematic diagram of the internal structure of the refrigeration unit of this utility model;

[0028] Figure 3 This is a schematic diagram of the internal structure of the heating unit of this utility model;

[0029] Figure 4 This is a schematic diagram of the connection structure between the adjustment unit and the gap unit of this utility model;

[0030] Figure 5 This is a schematic diagram of the refrigeration system of this utility model;

[0031] Figure 6This is a schematic diagram of the refrigerant pump in the refrigeration system of this utility model.

[0032] The diagram is labeled as follows: 1. Refrigeration unit; 2. Gap unit; 3. Heating unit; 4. Adjustment unit; 5. Connecting pipe; 6. Thermal conductive layer; 7. Electric heating module; 8. Insulation material; 11. Working fluid flow channel; 12. Refrigerant inlet; 13. Refrigerant outlet; 31. Heater; 32. Lead wire; 91. Compressor; 92. Condenser; 93. Throttling device; 94. Gas-liquid separator; 95. Refrigerant pump; 941. Gas inlet of gas-liquid separator; 942. Gas outlet of gas-liquid separator; 943. Two-phase inlet of gas-liquid separator; 944. Liquid outlet of gas-liquid separator. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to specific embodiments.

[0034] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 As shown, a semiconductor testing thermal control structure includes a cooling unit 1 and a heating unit 3. The heating unit 3 is installed at the bottom of the cooling unit 1. A gap unit 2 is provided between the bottom of the cooling unit 1 and the top of the heating unit 3. A connecting pipe 5 is connected to one side of the gap unit 2. An adjustment unit 4 is fixedly connected to the end of the connecting pipe 5. The adjustment unit 4 is used to reduce heat leakage from the heating unit 3 to the cooling unit 1 and to adjust the temperature at the bottom of the heating unit 3.

[0035] Both the adjustment unit 4 and the gap unit 2 have interconnected cavities inside, which are filled with a working medium. The working medium contains both liquid and gas in the cavity.

[0036] A thermally conductive interface layer 6 is provided at the bottom of the heating unit 3, which is used to contact the semiconductor under test.

[0037] In this embodiment, the thermally conductive interface 6 contacts the conductor under test. This interface controls the temperature during semiconductor testing. When the semiconductor temperature needs to be controlled at a low temperature, the cooling unit 1 plays a major role. The cooling capacity generated by the cooling unit 1 is transferred to the working medium by converting the working gas filled in the gap unit 2 into liquid. The liquid working medium transfers the cooling capacity to the heating unit 3, and the heating adjustment of the heating unit 3 meets the requirements of precise temperature control.

[0038] When the semiconductor temperature needs to be controlled at a high temperature, the heating unit 3 plays a major role. At this time, the gap unit 2 mainly contains gaseous working fluid, and a large amount of working fluid is stored in the regulating unit 4 in a gas-liquid two-phase state. The cooling unit 1 uses the function of cooling or stopping cooling as needed. The heating unit 3 adjusts the heating power output and regulates the temperature of the semiconductor during testing through its thermally conductive interface layer 6. Compared with the traditional method of cooling by air, the mainstream method of cooling by cold plate is to greatly improve the temperature switching speed during semiconductor testing and improve testing efficiency.

[0039] As one implementation method, such as Figure 1 , Figure 2 , Figure 3 As shown, both the cooling unit 1 and the heating unit 3 are rectangular metal block structures. The top of the heating unit 3 has a rough surface, and the bottom of the heating unit 3 has a smooth surface.

[0040] In this embodiment, the bottom of the heating unit 3 is a smooth surface, mainly to reduce contact thermal resistance. Its surface is smooth and should be polished. The top of the heating unit 3 is a rough surface, and the upper surface exchanges heat with the working fluid, so it should be kept rough.

[0041] As one implementation method, such as Figure 1 , Figure 2 , Figure 3 As shown, the refrigeration unit 1 has a working fluid flow channel 11 inside. The working fluid flow channel 11 has an S-shaped structure, and the two ends of the working fluid flow channel 11 are respectively connected to the refrigerant inlet 12 and the refrigerant outlet 13.

[0042] In this embodiment, the refrigerant can be a phase change refrigerant or a single-phase refrigerant. The refrigerant is delivered to the interior of the refrigeration unit 1 through the refrigerant inlet 12 and the refrigerant outlet 13 to achieve the purpose of refrigeration unit 1.

[0043] As one implementation method, such as Figure 3 As shown, an electric heating module 7 is installed inside the heating unit 3 and outside the adjustment unit 4, and an insulation material 8 is provided outside the electric heating module 7 inside the adjustment unit 4.

[0044] In this embodiment, the electric heating module 7 inside the heating unit 3 performs heating, while the electric heating module 7 inside the regulating unit 4 is used to control the amount of liquid working fluid inside the regulating unit 4, thereby improving the system startup speed.

[0045] As one implementation method, such as Figure 2 , Figure 3 , Figure 4 As shown, the electric heating module 7 is a heater 31, and a lead wire 32 is fixedly connected to one side of the heater 31. The lead wire 32 is connected to an external power source.

[0046] In this embodiment, the heater 31 is driven by an external power source to generate heat inside the heating unit 3 and the regulating unit 4, respectively.

[0047] As one implementation method, such as Figure 4 As shown, the internal cavity of the regulating unit 4 is either a cuboid or a cylinder, and the working medium inside the cavity is either HFC, HFO, alcohol, ethanol, or R245fa.

[0048] The distance between the connection point of the gap unit 2 and the connecting pipe 5 and the bottom surface of the gap unit 2 is between 0.5mm and 5mm.

[0049] In this embodiment, when the working medium inside the cavity is R245fa, the regulating unit 4 is placed completely below the refrigeration unit 1, and its outer surface does not directly contact the refrigeration unit 1 or the heating unit 3. The amount of liquid working medium in the regulating unit 4 is controlled by adding an electric heating module 7 to improve the system start-up speed, and heat leakage loss is reduced by adding insulation material 8 to the outer surface of the electric heating module 7.

[0050] This specification also provides a semiconductor testing thermal control system as described above. The thermal control system includes a cooling system, a heating system, and a regulating system, all of which are connected by pipelines.

[0051] The refrigeration system consists of a compressor 91, a condenser 92, a throttling device 93, a refrigeration unit 1, and a gas-liquid separator 94;

[0052] The heating system is heating unit 3;

[0053] The adjustment system consists of gap unit 2 and adjustment unit 4.

[0054] The refrigeration unit 1 and the throttling device 93 can be configured as multiple groups, with multiple refrigeration units 1 connected in parallel, and each group of refrigeration units 1 corresponding to each group of throttling devices 93.

[0055] The gas-liquid separator 94 is internally equipped with a gas inlet 941 and a gas outlet 942.

[0056] In this embodiment, the gaseous refrigerant R134a is drawn in through the suction port of the compressor 91, compressed, and discharged through the exhaust port to the inlet of the condenser 92. After condensation, the refrigerant becomes a liquid. After being throttled by the throttling device 93, it becomes a two-phase gas-liquid mixture. It enters the refrigeration unit 1 through the refrigerant inlet 12, and then leaves the refrigeration unit 1 through the refrigerant outlet 13. It enters the gas inlet 941 of the gas-liquid separator. The refrigerant is separated in the gas-liquid separator 94, and the gaseous refrigerant returns to the suction port of the compressor 91 through the gas outlet 942 of the gas-liquid separator to form a cycle.

[0057] In this embodiment, a refrigerant pump 95 is also provided inside the refrigeration system. The refrigerant pump 95 is located between the gas-liquid separator 94 and the refrigeration unit 1, and the throttling device 93 is located between the condenser 92 and the gas-liquid separator 94.

[0058] The interior of the gas-liquid separator 94 differs from the previous embodiment, and is provided with a gas inlet 941, a gas outlet 942, a gas-liquid two-phase inlet 943, and a liquid outlet 944.

[0059] Gaseous refrigerant R134a is drawn in through the suction port of compressor 91, compressed, and discharged through the discharge port to the inlet of condenser 92. After condensation, the refrigerant becomes liquid. After being throttled by throttling device 93, it becomes a two-phase gas-liquid mixture. It is discharged into gas-liquid separator 94 through two-phase inlet 943. The separated liquid refrigerant leaves the liquid phase outlet 944 of the gas-liquid separator. After being pressurized by refrigerant pump 95, it enters refrigeration unit 1 through refrigerant inlet 12 and then leaves refrigeration unit 1 through refrigerant outlet 13. This refrigerant is separated in gas-liquid separator 94. The gaseous refrigerant returns to the suction port of compressor 91 through gas outlet 942 of gas-liquid separator, forming a cycle.

[0060] Each refrigeration unit 1 is equipped with a refrigerant pump 95 or multiple refrigeration units 1 share a refrigerant pump 95, which is placed between the liquid phase outlet 944 and the gas inlet 941 of the gas-liquid separator to meet the thermal control needs of multiple semiconductor tests.

[0061] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of the present invention (including the claims) is limited to these examples; within the framework of the present invention, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of the different aspects of the present invention as described above, which are not provided in the details for the sake of brevity.

[0062] This utility model is intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A semiconductor testing thermal control structure, characterized in that, It includes a refrigeration unit (1) and a heating unit (3). The heating unit (3) is installed at the bottom of the refrigeration unit (1). A gap unit (2) is provided between the bottom of the refrigeration unit (1) and the top of the heating unit (3). A connecting pipe (5) is connected to one side of the gap unit (2). An adjustment unit (4) is fixedly connected to the end of the connecting pipe (5). The adjustment unit (4) is used to reduce heat leakage from the heating unit (3) to the refrigeration unit (1) and to adjust the temperature at the bottom of the heating unit (3). The adjustment unit (4) and the gap unit (2) are both provided with interconnected cavities, which are filled with working medium. The working medium contains both liquid and gas in the cavity. The bottom of the heating unit (3) is provided with a thermally conductive interface layer (6), which is used to contact the semiconductor under test.

2. The semiconductor testing thermal control structure according to claim 1, characterized in that, Both the refrigeration unit (1) and the heating unit (3) are rectangular metal block structures. The top of the heating unit (3) is rough, and the bottom of the heating unit (3) is smooth.

3. The semiconductor testing thermal control structure according to claim 2, characterized in that, The refrigeration unit (1) has a working fluid flow channel (11) inside. The working fluid flow channel (11) has an S-shaped structure, and the two ends of the working fluid flow channel (11) are respectively connected to the refrigerant inlet (12) and the refrigerant outlet (13).

4. The semiconductor testing thermal control structure according to claim 1, characterized in that, Electric heating modules (7) are installed inside the heating unit (3) and outside the adjustment unit (4), and heat insulation material (8) is provided outside the electric heating module (7) of the adjustment unit (4).

5. A semiconductor testing thermal control structure according to claim 4, characterized in that, The electric heating module (7) is a heater (31), and a lead wire (32) is fixedly connected to one side of the heater (31). The lead wire (32) is connected to an external power source.

6. The semiconductor testing thermal control structure according to claim 5, characterized in that, The internal cavity of the regulating unit (4) is either a cuboid or a cylinder, and the working medium inside the cavity is either HFC, HFO, alcohol, ethanol, or R245fa.

7. A semiconductor testing thermal control structure according to claim 1, characterized in that, The distance between the connection point of the gap unit (2) and the connecting pipe (5) and the bottom surface of the gap unit (2) is between 0.5 mm and 5 mm.

8. A semiconductor testing thermal control system, applied to the semiconductor testing thermal control structure as described in any one of claims 1-7, characterized in that, The thermal control system includes a refrigeration system, a heating system, and a regulating system, all of which are connected by pipes. The refrigeration system consists of a compressor (91), a condenser (92), a throttling device (93), a refrigeration unit (1), and a gas-liquid separator (94); The heating system is a heating unit (3); The adjustment system consists of a gap unit (2) and an adjustment unit (4).

9. A semiconductor testing thermal control system according to claim 8, characterized in that, The refrigeration unit (1) and the throttling device (93) are both set in multiple groups, and the multiple refrigeration units (1) are connected in parallel. Each group of refrigeration units (1) corresponds to each group of throttling devices (93).

10. A semiconductor testing thermal control system according to claim 8, characterized in that, The refrigeration system is also equipped with a refrigerant pump (95), which is located between the gas-liquid separator (94) and the refrigeration unit (1). The throttling device (93) is located between the condenser (92) and the gas-liquid separator (94).

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