Smart card
By setting clearance grooves on the smart card's inner plate and filling the thickness difference with adhesive, the problem of easy damage to PCBA boards during the lamination process is solved, thus protecting electronic components and improving the yield of finished products.
CN224341892UActive Publication Date: 2026-06-09EZHOU XINAN INTELLIGENT TECH CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- EZHOU XINAN INTELLIGENT TECH CO LTD
- Filing Date
- 2025-06-24
- Publication Date
- 2026-06-09
AI Technical Summary
Technical Problem
During the lamination process of traditional smart cards, the electronic components on the PCBA board are easily damaged by direct compression, resulting in a low yield rate of finished products.
Method used
A recessed groove is created on the middle plate to accommodate the PCBA board, and the thickness difference is filled by an adhesive layer. The middle plate bears the pressure and protects the PCBA board from direct compression.
Benefits of technology
It effectively protects the electronic components on the PCBA board, improves the yield of finished products, and enhances the structural stability through the coating and shaping effect of the adhesive layer.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN224341892U_ABST
Abstract
This utility model relates to a smart card, comprising: a middle plate, a PCBA board located within the middle plate, a first adhesive layer attached to the front side of the middle plate, a second adhesive layer attached to the back side of the middle plate, a front panel attached to the front side of the first adhesive layer, and a back plate attached to the back side of the second adhesive layer. The middle plate has recessed grooves for accommodating the PCBA board. The first adhesive layer is attached to the front side of the middle plate and fills the recessed grooves to compensate for the thickness difference between the front side of the PCBA board and the front side of the middle plate. The second adhesive layer is attached to the back side of the middle plate and fills the recessed grooves to compensate for the thickness difference between the back side of the PCBA board and the back side of the middle plate. By utilizing the recessed grooves on the middle plate to accommodate the PCBA board, and by creating a thickness difference between the middle plate and the PCBA board, the adhesive layer covers and shapes the PCBA board to compensate for the thickness difference. During the pressing process, the middle plate bears the force to prevent the PCBA board from being directly subjected to compressive forces, thus protecting easily damaged electronic components.
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