An anti-interference multilayer circuit board

Abstract

The utility model discloses an anti -interference multilayer circuit board relates to multilayer circuit board field. The utility model discloses a multilayer circuit board is constituted by first board body and second board body layering, and the utility model discloses an anti -interference mechanism is set up, and the interference -resistant mechanism inserts the block and side groove and forms the interference fit structure, and is fixed through bolt, has guaranteed the close combination of interference -resistant edge and board body edge, has effectively prevented the influence of outside electromagnetic signal and electrostatic etc. interference factor to circuit board internal circuit, and interference -resistant edge adopts nickel zinc ferrite composite material to make, and this material has good electromagnetic shielding effect, can absorb and reflect electromagnetic wave, further reduces the interference, simultaneously, the U type edge covering structure of interference -resistant edge and the polyimide insulating layer and copper foil shielding layer of the edge covering structure alternately laminated in edge covering structure, has formed multilayer shielding system, not only has strengthened the anti -interference ability, has provided good insulating property, has guaranteed the safe operation of circuit.

Description

Technical Field

[0001] This utility model relates to the field of multilayer circuit boards, specifically an anti-interference multilayer circuit board. Background Technology

[0002] Multilayer circuit boards are complex circuit carriers that alternately stack multiple layers of conductive patterns and insulating materials, and achieve interlayer electrical interconnection through metallized holes. They have high-density wiring capabilities, good electrical performance, and high reliability, and are widely used in electronic devices to meet the increasingly compact and high-performance circuit design requirements.

[0003] However, current multilayer circuit boards lack anti-interference performance, making them easily affected by external electromagnetic signals, static electricity, and other interference factors. This can lead to circuit signal distortion, bit errors, and other issues, causing abnormal operation of the entire electronic device, such as frequent device crashes, data transmission errors, and inability to perform functions properly. This seriously affects user experience and the lifespan of the device. Utility Model Content

[0004] Based on this, the purpose of this utility model is to provide an anti-interference multilayer circuit board to solve the technical problem that current multilayer circuit boards lack anti-interference performance and are easily affected by external electromagnetic signals, static electricity and other interference factors, resulting in circuit signal distortion, bit errors and other situations, which in turn cause the entire electronic device to malfunction, seriously affecting user experience and equipment lifespan.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an anti-interference multilayer circuit board, comprising a multilayer circuit board, which is composed of a first board body and a second board body stacked together, wherein side grooves are formed on the edges of the first board body and the second board body, and an anti-interference mechanism is provided in the side grooves;

[0006] The interference mechanism includes an insertion block, which forms an interference fit with the side groove. The insertion block has a mounting hole, and a bolt is rotatably connected in the mounting hole. The bolt is used to fix the insertion block to the side groove.

[0007] The outer side of the insertion block is provided with an anti-interference edge, and the top and bottom of the anti-interference edge are provided with a wrapping structure, which is used to wrap the edges of the first plate and the second plate respectively.

[0008] By adopting the above technical solutions, modular assembly of anti-interference components can be achieved, enhancing the integrity of circuit board edge protection.

[0009] Furthermore, the anti-interference edge is made of nickel-zinc ferrite composite material, and its cross-section has a U-shaped edge structure.

[0010] By adopting the above technical solution, the U-shaped nickel-zinc ferrite edging structure directionally absorbs high-frequency interference signals and blocks edge magnetic leakage.

[0011] Furthermore, the insertion blocks are provided in two sets, which are respectively embedded in the side grooves of the first plate and the second plate, and the contact surfaces of the two sets of insertion blocks are provided with interlocking serrated structures.

[0012] By adopting the above technical solution, the sawtooth meshing structure of the two sets of insert blocks prevents the shielding layer from breaking due to interlayer displacement.

[0013] Furthermore, a fixing hole and a copper pillar are provided through the first plate and the second plate, and the copper pillar is used to fix the first plate and the second plate. Small through holes arranged in a ring array are opened around the fixing hole.

[0014] By adopting the above technical solution, the copper pillar and the annular through hole work together to improve the interlayer conductivity stability and mechanical stress dispersion.

[0015] Furthermore, the edge-wrapping structure comprises alternating layers of polyimide insulating layer and copper foil shielding layer, with the edges of each layer extending beyond the bonding surface of the board to form a stepped covering structure.

[0016] By adopting the above technical solution, the stepped insulation-shielding composite edge banding eliminates electromagnetic leakage at the joint surface of the laminated plates.

[0017] Furthermore, a wedge-shaped buckle is provided on the inner side of the anti-interference edge, forming a two-way locking structure with the wedge-shaped grooves opened on the edges of the first plate and the second plate.

[0018] By adopting the above technical solution, the wedge-shaped buckle bidirectional locking structure resists the detachment of the shielding layer caused by external mechanical impact.

[0019] Furthermore, the outer surface of the copper pillar is provided with a spiral groove, and the spiral groove is filled with a conductive silicone layer.

[0020] By adopting the above technical solution, the spiral groove conductive silicone layer compensates for the deformation gap between the copper pillar and the plate.

[0021] Furthermore, an electromagnetic shielding film is provided between the first plate and the second plate, and the edge of the electromagnetic shielding film extends to the inner side of the edging structure to form a continuous shielding layer. An interface groove is provided on the second plate.

[0022] By adopting the above technical solution, the electromagnetic shielding film and the edge-wrapping structure form a full-area shielding network, and the interface slot has a built-in shielding extension section.

[0023] In summary, the present invention has the following main advantages:

[0024] 1. This utility model, by setting up an anti-interference mechanism, has an insertion block in the anti-interference mechanism that forms an interference fit with the side groove and is fixed by bolts, ensuring a tight fit between the anti-interference edge and the edge of the board. This effectively prevents external electromagnetic signals and static electricity from affecting the internal circuit of the circuit board. The anti-interference edge is made of nickel-zinc ferrite composite material, which has a good electromagnetic shielding effect and can absorb and reflect electromagnetic waves, further reducing interference. At the same time, the U-shaped edge structure of the anti-interference edge and the alternating layers of polyimide insulation layer and copper foil shielding layer in the edge structure form a multi-layer shielding system, which not only enhances the anti-interference capability but also provides good insulation performance, ensuring the safe operation of the circuit.

[0025] 2. This utility model, by setting wedge-shaped buckles and wedge-shaped grooves on the edge of the plate, forms a two-way locking structure, enhancing the connection stability between the anti-interference mechanism and the plate, and preventing loosening or detachment due to vibration or external force. The interlocking serrated structure between the insert blocks further improves the overall structural stability, and the electromagnetic shielding film between the plates extends to the inner side of the edge-wrapping structure, forming a continuous shielding layer, further enhancing the anti-interference effect. The interface groove facilitates connection with other electronic devices, while the presence of the electromagnetic shielding film ensures anti-interference performance at the interface. Attached Figure Description

[0026] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0027] Figure 2 This is a side view of the three-dimensional structure of the present invention;

[0028] Figure 3 This utility model Figure 1 Enlarged structural diagram at point A;

[0029] Figure 4 This utility model Figure 2 A magnified structural diagram at point B in the middle.

[0030] In the diagram: 1. Multilayer circuit board; 101. First board body; 102. Second board body; 103. Fixing hole; 104. Copper pillar; 105. Interface groove; 106. Side groove; 107. Through hole; 2. Anti-interference mechanism; 201. Insertion block; 202. Anti-interference edge; 203. Mounting hole; 204. Edge wrapping structure. Detailed Implementation

[0031] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0032] Example 1:

[0033] An anti-interference multilayer circuit board, such as Figure 1-4 As shown, it includes a multi-layer circuit board 1, which is composed of a first board body 101 and a second board body 102 stacked together. Side grooves 106 are opened on the edges of the first board body 101 and the second board body 102, and an anti-interference mechanism 2 is provided in the side grooves 106.

[0034] The interference mechanism 2 includes an insertion block 201, which forms an interference fit with the side groove 106. The insertion block 201 is provided with a mounting hole 203, and a bolt is rotatably connected in the mounting hole 203. The bolt is used to fix the insertion block 201 to the side groove 106.

[0035] An anti-interference edge 202 is provided on the outer side of the insertion block 201, and an edge-wrapping structure 204 is provided on the top and bottom of the anti-interference edge 202. The edge-wrapping structure 204 is used to wrap the edges of the first plate 101 and the second plate 102 respectively. The side groove 106 is fixed to the insertion block 201 by an interference fit with the bolt, forming a mechanical and electromagnetic dual locking. The anti-interference edge 202 and the edge-wrapping structure 204 simultaneously cover the three edges of the plate, effectively blocking the intrusion path of external interference.

[0036] See Figure 3 , Figure 4 The anti-interference edge 202 is made of nickel-zinc ferrite composite material. Its cross-section has a U-shaped edge structure. The U-shaped nickel-zinc ferrite edge structure 202 utilizes the magnetic permeability characteristics of the material to attenuate electromagnetic waves. Its cross-sectional shape completely wraps around the non-connected edge of the plate, specifically suppressing common-mode interference.

[0037] Example 2:

[0038] See Figure 1 , Figure 4 The insertion block 201 is provided in two sets, which are respectively embedded in the side grooves 106 of the first plate 101 and the second plate 102. The contact surfaces of the two sets of insertion blocks 201 are provided with a sawtooth structure that meshes with each other. The two sets of insertion blocks 201 form a self-locking structure through the meshing of the sawtooth, which prevents the shielding gap caused by the misalignment between the plates 101 and 102, and ensures the continuous coverage of the anti-interference mechanism 2.

[0039] See Figure 1 , Figure 2A fixing hole 103 and a copper pillar 104 are provided through the first plate 101 and the second plate 102. The copper pillar 104 is used to fix the first plate 101 and the second plate 102. Small through holes 107 arranged in a ring array are opened around the fixing hole 103. The copper pillar 104 and the fixing hole 103 form a conductive path. The surrounding ring through holes 107 disperse mechanical stress and simultaneously form the physical support nodes of the electromagnetic shielding net.

[0040] See Figure 3 , Figure 4 The edge-wrapping structure 204 includes alternating layers of polyimide insulating layer and copper foil shielding layer. The edges of each layer extend beyond the joint surface of the board to form a stepped covering structure. The polyimide insulating layer blocks leakage current, the copper foil shielding layer reflects interference signals, and the stepped covering structure eliminates edge field leakage at the joint surface of the stacked boards.

[0041] See Figure 1 , Figure 2 The inner side of the anti-interference edge 202 is provided with a wedge-shaped buckle, which forms a two-way locking structure with the wedge-shaped grooves opened on the edges of the first plate 101 and the second plate 102. The wedge-shaped buckle and the wedge-shaped groove of the plate form a two-way engagement, which offsets the displacement of the edge-wrapping structure 204 caused by temperature deformation and maintains the complete contact of the shielding layer.

[0042] See Figure 1 , Figure 4 The outer surface of the copper pillar 104 is provided with a spiral groove, and the spiral groove is filled with a conductive silicone layer. The spiral groove increases the contact area between the copper pillar 104 and the conductive silicone. The elastic material compensates for the thermal expansion and contraction deformation between the layers and maintains a stable conductive path.

[0043] See Figure 3 , Figure 4 An electromagnetic shielding film is provided between the first plate 101 and the second plate 102. The edge of the electromagnetic shielding film extends to the inside of the edging structure 204 to form a continuous shielding layer. An interface groove 105 is provided on the second plate 102. The electromagnetic shielding film and the edging structure 204 form a continuous conductive layer. The interface groove 105 has a built-in shielding layer extension section to block external interference from entering from the connection port.

[0044] The implementation principle of this embodiment is as follows: First, the first plate 101 and the second plate 102 are stacked and aligned so that the side grooves 106 at the edges of the two form a continuous installation space.

[0045] Next, the insertion block 201 of the anti-interference mechanism 2 is aligned with the side groove 106 and inserted with an interference fit, and then axially fixed by the bolt in the mounting hole 203;

[0046] Subsequently, the anti-interference edge 202 on the outside of the insertion block 201 synchronously covers the non-connected edge of the plate body through a U-shaped cross section, and the top and bottom edge covering structures 204 cover the outer extension area of ​​the joint surface of the first plate body 101 and the second plate body 102 respectively.

[0047] When the two sets of insert blocks 201 are assembled, the serrated structure of their contact surfaces achieves self-locking engagement;

[0048] Meanwhile, copper pillars 104 are installed in the fixing holes 103 that penetrate the plate, and an interlayer conductive path is established through the conductive silicone layer in the spiral groove, forming a continuous shielding layer in conjunction with the electromagnetic shielding film set between the plates.

[0049] Ultimately, the nickel-zinc ferrite material of the anti-interference edge 202, the insulation-shielding composite layer of the edge-wrapping structure 204, and the wedge-shaped snap-locking structure work together to achieve all-round electromagnetic interference suppression of the multilayer circuit board.

[0050] Although embodiments of the present invention have been shown and described, these specific embodiments are merely explanations of the present invention and are not intended to limit the invention. The specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions, and variations to the embodiments as needed without departing from the principles and spirit of the present invention, provided that such modifications, substitutions, and variations are within the scope of the claims of the present invention and are protected by patent law.

Claims

1. A multilayer circuit board with anti-interference capability, characterized in that: The circuit board includes a multilayer circuit board (1), which is composed of a first board body (101) and a second board body (102) stacked together. The edges of the first board body (101) and the second board body (102) are provided with side grooves (106), and an anti-interference mechanism (2) is provided in the side grooves (106). The interference mechanism (2) includes an insertion block (201), which forms an interference fit with the side groove (106). The insertion block (201) has an installation hole (203) and a bolt is rotatably connected in the installation hole (203). The bolt is used to fix the insertion block (201) and the side groove (106). The outer side of the insertion block (201) is provided with an anti-interference edge (202), and the top and bottom of the anti-interference edge (202) are provided with a binding structure (204), and the binding structure (204) is used to wrap the edges of the first plate (101) and the second plate (102) respectively.

2. The anti-interference multilayer circuit board according to claim 1, characterized in that: The anti-interference edge (202) is made of nickel-zinc ferrite composite material, and its cross-section has a U-shaped edge structure.

3. The anti-interference multilayer circuit board according to claim 1, characterized in that: The insertion block (201) is provided in two sets, which are respectively embedded in the side grooves (106) of the first plate (101) and the second plate (102). The contact surfaces of the two sets of insertion blocks (201) are provided with a sawtooth structure that meshes with each other.

4. The anti-interference multilayer circuit board according to claim 1, characterized in that: A fixing hole (103) and a copper pillar (104) are provided through the first plate (101) and the second plate, and the copper pillar (104) is used to fix the first plate (101) and the second plate (102). Small through holes (107) arranged in a ring array are opened around the fixing hole (103).

5. The anti-interference multilayer circuit board according to claim 1, characterized in that: The edge-covering structure (204) includes alternating layers of polyimide insulating layer and copper foil shielding layer, with the edges of each layer extending beyond the bonding surface of the board to form a stepped covering structure.

6. The anti-interference multilayer circuit board according to claim 1, characterized in that: The inner side of the anti-interference edge (202) is provided with a wedge-shaped buckle, which forms a two-way locking structure with the wedge-shaped grooves opened on the edges of the first plate (101) and the second plate (102).

7. The anti-interference multilayer circuit board according to claim 4, characterized in that: The outer surface of the copper pillar (104) is provided with a spiral groove, and the spiral groove is filled with a conductive silicone layer.

8. The anti-interference multilayer circuit board according to claim 1, characterized in that: An electromagnetic shielding film is provided between the first plate (101) and the second plate (102), and the edge of the electromagnetic shielding film extends to the inner side of the edging structure (204) to form a continuous shielding layer. An interface groove (105) is provided on the second plate (102).

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