Electronic component housing for preventing oxidation of enameled wire welding points

Abstract

This utility model relates to the field of electrical component container technology, specifically an electronic component housing for preventing oxidation of enameled wire solder joints. It includes a substrate and a top cover for use. A component slot is formed on the side of the top cover facing the substrate, and an adhesive reservoir is also formed on the same side, with the adhesive reservoir's sidewall connected to the component slot's sidewall. A connecting slot is also formed on the side of the top cover facing the substrate, with its opposite sides connecting to the sidewalls of the component slot and the adhesive reservoir, respectively. Soldering points are located on the side of the substrate facing the top cover, directly opposite the adhesive reservoir. Multiple soldering points are distributed on both sides of the substrate. Two adhesive reservoirs are located on either side of the component slot, directly opposite the soldering points on both sides of the substrate. This design ensures sufficient adhesive application without overflowing and affecting the appearance, improves the connection stability between the substrate and the top cover, and increases the product yield.

Description

Technical Field

[0001] This utility model relates to the field of electrical component container technology, specifically to an electronic component housing for preventing oxidation of enameled wire solder joints. Background Technology

[0002] Electronic components are the hardware foundation of modern society's intelligence and automation. They mainly consist of internal circuit structures and external housings, with the housing comprising a substrate and a top cover. During assembly, the circuit structure is soldered to the substrate using resistance welding. The top cover is then inverted, and adhesive is injected into it. The substrate and top cover are then snapped together, completing the assembly of the electronic component. However, in actual production, the amount of adhesive injected is often unstable. If the amount of adhesive injected is too little, the connection between the substrate and the top cover is not stable enough, and after long-term use, the substrate and top cover are prone to separation. If the amount of adhesive injected is too much or the adhesive overflows unevenly, the adhesive will overflow from the gap between the substrate and the top cover. Since electronic components are too small, the overflowing adhesive is difficult to clean, so electronic components with overflowing adhesive are considered defective products. Therefore, there is an urgent need for an electronic component housing that can ensure sufficient adhesive without overflowing and affecting the appearance. Utility Model Content

[0003] The present invention aims to provide an electronic component housing for preventing oxidation of enameled wire solder joints, which allows for sufficient glue application without glue overflow affecting the appearance, improves the connection stability between the substrate and the top cover, and increases the product qualification rate.

[0004] This utility model provides the following basic solution:

[0005] An electronic component housing for preventing oxidation of enameled wire solder joints includes a substrate and a top cover for use. The top cover has a device slot on the side facing the substrate, and an adhesive reservoir on the side facing the substrate for holding adhesive is also provided. The side wall of the adhesive reservoir facing the device slot is connected to the side wall of the device slot.

[0006] Furthermore, a connecting groove is provided on the side of the top cover facing the substrate, and the two sides of the connecting groove are respectively connected to the side walls of the device groove and the adhesive groove.

[0007] Furthermore, the edges of the adjacent sidewalls of the adhesive container are rounded.

[0008] Furthermore, a solder joint is provided on the side of the substrate facing the top cover, and the solder joint is directly opposite the adhesive tank.

[0009] Furthermore, there are multiple solder joints distributed on both sides of the substrate, and two adhesive reservoirs located on both sides of the device reservoir, respectively, and directly opposite the solder joints on both sides of the substrate.

[0010] Furthermore, a locking block is provided on the side of the top cover facing the substrate. The locking blocks are located at both ends of the top cover, and a locking slot is provided at both ends of the substrate. The locking slot connects the top surface and the bottom surface of the substrate, and the locking blocks and the locking slot are used in conjunction.

[0011] Furthermore, the card block is equipped with a guide section.

[0012] Furthermore, the guide section has inclined surfaces on the sides facing the bottom and wall of the card slot, and the inclined surfaces slope from the bottom or wall of the card slot toward the card block along the direction from the top cover toward the base plate.

[0013] Furthermore, another welding point is provided on the side of the substrate away from the top cover, and observation grooves are provided on both sides of the substrate, which connect the top and bottom surfaces of the substrate.

[0014] The beneficial effects of the basic scheme:

[0015] 1. The component slot is used to accommodate the circuit structure. During assembly, the top cover is inverted with the component slot facing upwards. Adhesive is applied to the adhesive reservoir on the top cover, and the circuit structure is placed on the substrate. The leads in the circuit structure are soldered to the solder points on the substrate using resistance welding. For example, when the electronic component is a network filter, the coil is placed on the substrate, and the coil's leads are enameled wires. The ends of the enameled wires are soldered to the solder points. After soldering, the substrate is snapped onto the top cover, sealing the component slot on the top cover. At this point, the bottom surface of the top cover abuts against the top surface of the substrate, and the adhesive fills the adhesive reservoir, covering the solder points. The connection between the adhesive reservoir and the component slot allows excess adhesive to overflow into the component slot, preventing it from affecting the appearance of the electronic components and thus improving the production yield. Simultaneously, compared to a flat surface, the adhesive reservoir effectively increases the contact area between the adhesive and the top cover, thereby improving the connection stability between the substrate and the top cover.

[0016] 2. In most electronic components, the leads in the circuit structure are made of enameled wire, a type of conductor with an insulating layer on its surface. Before soldering, the insulation layer at the ends of the enameled wire needs to be removed to achieve electrical connection with other metal terminals. In practical applications, it has been found that during long-term use, the solder joints where the enameled wire is soldered to the substrate will oxidize, leading to functional failure and reduced lifespan of the electronic components. The inventors discovered that resistance welding of the enameled wire to the solder joint leaves the joint exposed after soldering, making it prone to oxidation during the use of the electronic components, leading to the aforementioned problem. In this solution, the adhesive tank faces the solder joint. The enameled wire passes through the connection between the adhesive tank and the component slot and is soldered to the joint. After the adhesive covers the solder joint, it overflows into the component slot under the guidance of the connecting slot and the enameled wire. This adhesive coverage of the solder joint prevents oxidation of the enameled wire solder joint, thereby improving the lifespan of the electronic components. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of an embodiment of the electronic component housing for preventing oxidation of enameled wire solder joints according to the present invention;

[0018] Figure 2 This is a schematic diagram of the substrate structure of an embodiment of the electronic component housing for preventing oxidation of enameled wire solder joints according to this utility model;

[0019] Figure 3 This is a schematic diagram of the top cover of an embodiment of the electronic component housing for preventing oxidation of enameled wire solder joints according to this utility model;

[0020] Figure 4 This is a top view of the top cover of an embodiment of the electronic component housing for preventing oxidation of enameled wire solder joints according to the present invention;

[0021] Figure 5 This is a schematic diagram of the structure of a network filter, an embodiment of the electronic component housing for preventing oxidation of enameled wire solder joints according to this utility model. Detailed Implementation

[0022] The following detailed description illustrates the specific implementation method:

[0023] The reference numerals in the accompanying drawings include: substrate 1, top cover 2, device slot 3, solder joint 4, observation slot 5, card slot 6, adhesive slot 7, connection slot 8, card block 9, guide part 10.

[0024] Example

[0025] Housings for electronic components used to prevent oxidation of enameled wire solder joints, as shown in the attached document. Figure 1 As shown, the system includes a substrate 1 and a top cover 2 for use together. The top cover 2 has a device slot 3 on the side facing the substrate 1, that is, the bottom surface of the top cover 2 has a device slot 3. The bottom surface of the top cover 2 abuts against the top surface of the substrate 1, and the substrate 1 can close the device slot 3. The device slot 3 is provided to provide space for the circuit structure that realizes the function of electronic components.

[0026] As attached Figure 2As shown, the substrate 1 has a solder joint 4 on the side facing the top cover 2, and another solder joint 4 on the side of the substrate 1 away from the top cover 2. There are multiple solder joints 4 distributed on both sides of the substrate 1. That is, both the top and bottom surfaces of the substrate 1 have solder joints 4. The solder joints 4 on the top surface of the substrate 1 are distributed on both sides of the top surface, and the solder joints 4 on the bottom surface of the substrate 1 are distributed on both sides of the bottom surface. The substrate 1 is a structure of electronic components in the prior art. This solution does not involve any improvement to the internal circuit structure of the substrate 1, so it will not be described in detail. The solder joints 4 on the top surface of the substrate 1 are used for electrical connection with the internal circuit structure of the electronic components via resistance welding. The solder joints 4 on the bottom surface of the substrate 1 are used for electrical connection between the electronic components and the pads of the circuit board. The internal circuit structure of the electronic components and the pads of the circuit board are both prior art. This solution does not involve any improvement to their structure, so it will not be described in detail.

[0027] Observation slots 5 are provided on both sides of the substrate 1, connecting the top and bottom surfaces of the substrate 1. The observation slots 5 are arc-shaped, and the number of observation slots 5 is the same as the number of solder points 4 on the side of the substrate 1 away from the top cover 2, with their positions corresponding one-to-one. The setting of the observation slots 5 makes it easy to observe the soldering status when electronic components are soldered to the pads, thereby determining whether the soldering between the electronic components and the pads is stable.

[0028] The substrate 1 has slots 6 at both ends, which connect the top and bottom surfaces of the substrate 1. The bottom and sides of the slots 6 are rounded. The rounded corners serve two purposes: first, to reduce collision damage to the substrate 1 and the top cover 2 during assembly; and second, to guide the assembly process of the substrate 1 and the top cover 2, making them easier to position and assemble.

[0029] As attached Figure 3 , 4 As shown, the top cover 2 has an adhesive-containing groove 7 on the side facing the substrate 1, that is, the bottom surface of the top cover 2 also has an adhesive-containing groove 7 for holding adhesive, and the side wall of the adhesive-containing groove 7 facing the device groove 3 is connected to the side wall of the device groove 3. Specifically, the top cover 2 also has a connecting groove 8 on the side facing the substrate 1, that is, the bottom surface of the top cover 2 also has a connecting groove 8, the depth of the connecting groove 8 is less than the depth of the adhesive-containing groove 7, and the two sides of the connecting groove 8 are respectively connected to the side walls of the device groove 3 and the adhesive-containing groove 7. In this embodiment, after the top cover 2 and the substrate 1 are fastened together, the distance from the bottom of the connecting groove 8 to the substrate 1 is less than the distance from the adhesive-containing groove 7 to the substrate 1.

[0030] Solder point 4 is directly opposite the adhesive reservoir 7. In this embodiment, there are two adhesive reservoirs 7, located on both sides of the device reservoir 3, and directly opposite the solder points 4 on both sides of the substrate 1. In other embodiments, there are multiple adhesive reservoirs 7, each corresponding to a solder point 4.

[0031] In this design, the connecting groove 8 connects the component groove 3 and the adhesive reservoir 7. During the fastening process, the adhesive in the adhesive reservoir 7 can overflow into the component groove 3 along the connecting groove 8, thus preventing adhesive overflow. At the same time, the adhesive in the adhesive reservoir 7 can cover the solder joint 4, achieving oxidation prevention for the enameled wire solder joint 4.

[0032] The edges of the adjacent sidewalls of the glue container 7 are provided with another rounded corner. In this solution, the rounded corners of the edges of the glue container 7 make it easier for the glue to fill the glue container 7 compared with the right angle.

[0033] The top cover 2 has a locking block 9 on the side facing the substrate 1, that is, the bottom surface of the top cover 2 has a locking block 9. There are two locking blocks 9, which are located at the two ends of the top cover 2 respectively. The locking blocks 9 and the locking slots 6 are used in conjunction, and the two locking blocks 9 correspond to the two locking slots 6 respectively. Specifically, the locking block 9 has a guide part 10. The guide part 10 has inclined surfaces on the sides facing the bottom and wall of the locking slot 6. The inclined surfaces slope from the bottom or wall of the locking slot 6 towards the locking block 9 in the direction from the top cover 2 towards the substrate 1.

[0034] In this design, the design of the locking block 9 and the locking slot 6 facilitates the locking block 9 to be positioned by the locking slot 6 during engagement, thereby enabling quick and accurate engagement of the top cover 2 and the base plate 1. The guide portion 10 guides the locking block 9 during engagement of the top cover 2 and the base plate 1. The inclined surface of the guide portion 10 makes it smoother, reducing the risk of collision damage during engagement and facilitating the guidance of the locking block 9, allowing it to easily slide into the locking slot 6.

[0035] The specific implementation process is as follows: Taking the application of this solution to a network filter as an example, see attached... Figure 5 As shown, during assembly, the top cover 2 is inverted, with the component slot 3 facing upwards. Glue is applied to the adhesive groove 7 on the top cover 2, and the circuit structure (i.e., the coil) is placed on the substrate 1. The leads in the circuit structure are soldered to the solder points 4 on the substrate 1 by resistance welding. After welding, the substrate 1 is fastened to the top cover 2, and the substrate 1 closes the component slot 3 on the top cover 2. At this time, the bottom surface of the top cover 2 abuts against the top surface of the substrate 1, and the glue fills the adhesive groove 7.

[0036] The connection between the adhesive reservoir 7 and the component reservoir 3 allows excess adhesive to overflow into the component reservoir 3, preventing it from affecting the appearance of electronic components and thus improving the production yield of electronic components. Simultaneously, compared to a flat surface, the adhesive reservoir 7 effectively increases the contact area between the adhesive and the top cover 2, thereby improving the connection stability between the substrate 1 and the top cover 2.

[0037] In most electronic components, the leads of the circuit structure are made of enameled wire. For example, in network filters, enameled wire is a type of conductor with an insulating layer on its surface. Before soldering, the insulation layer at the ends of the enameled wire needs to be removed to achieve electrical connection with other metal terminals.

[0038] The inventors discovered that the solder joint 4 between the enameled wire and the substrate 1 is exposed, making it prone to oxidation during the use of electronic components, leading to functional failure. In this solution, the adhesive reservoir 7 is positioned directly opposite the solder joint 4. The enameled wire passes through the connection between the adhesive reservoir 7 and the device slot 3, and is soldered to the solder joint 4. After covering the solder joint 4, the adhesive, guided by the connecting slot 8 and the enameled wire, overflows into the device slot 3, covering the solder joint 4 and preventing oxidation, thereby improving the service life of the electronic components.

[0039] The above descriptions are merely embodiments of this utility model. Commonly known structures and characteristics are not described in detail here. Those skilled in the art are aware of all common technical knowledge in the field prior to the application date or priority date, are knowledgeable of all existing technologies in that field, and possess the ability to apply conventional experimental methods prior to that date. Therefore, those skilled in the art can, based on the guidance provided in this application, improve and implement this solution in conjunction with their own capabilities. Typical known structures or methods should not be obstacles for those skilled in the art to implement this application. It should be noted that those skilled in the art can make several modifications and improvements without departing from the structure of this utility model. These modifications and improvements should also be considered within the scope of protection of this utility model, and will not affect the effectiveness of the implementation of this utility model or the practicality of the patent. The scope of protection claimed in this application should be determined by the content of its claims, and the specific embodiments described in the specification can be used to interpret the content of the claims.

Claims

1. An electronic component housing for preventing oxidation of enameled wire solder joints, comprising a mating substrate and a top cover, wherein a component groove is formed on the side of the top cover facing the substrate, characterized in that: The top cover also has an adhesive reservoir on the side facing the substrate, which is connected to the side wall of the device slot.

2. The electronic component housing for preventing oxidation of enameled wire solder joints according to claim 1, characterized in that: A connecting groove is also provided on the side of the top cover facing the substrate, and the two sides of the connecting groove are respectively connected to the side walls of the device groove and the adhesive groove.

3. The electronic component housing for preventing oxidation of enameled wire solder joints according to claim 1, characterized in that: The edges of the adjacent sidewalls of the adhesive container are rounded.

4. The electronic component housing for preventing oxidation of enameled wire solder joints according to claim 1, characterized in that: The substrate has solder joints on the side facing the top cover, and the solder joints are directly opposite the adhesive tank.

5. The electronic component housing for preventing oxidation of enameled wire solder joints according to claim 4, characterized in that: There are multiple solder joints distributed on both sides of the substrate. There are two adhesive reservoirs located on both sides of the device reservoir and directly opposite the solder joints on both sides of the substrate.

6. The electronic component housing for preventing oxidation of enameled wire solder joints according to any one of claims 1-5, characterized in that: The top cover has a locking block on the side facing the substrate. The locking blocks are located at both ends of the top cover. The substrate has a slot at both ends. The slot connects the top and bottom surfaces of the substrate. The locking blocks and slots work together.

7. The electronic component housing for preventing oxidation of enameled wire solder joints according to claim 6, characterized in that: The card block is equipped with a guide section.

8. The electronic component housing for preventing oxidation of enameled wire solder joints according to claim 7, characterized in that: The guide section has inclined surfaces on the sides facing the bottom and wall of the card slot. The inclined surfaces slope from the bottom or wall of the card slot toward the card block along the direction from the top cover toward the base plate.

9. The electronic component housing for preventing oxidation of enameled wire solder joints according to claim 8, characterized in that: Another soldering point is provided on the side of the substrate away from the top cover, and observation slots are provided on both sides of the substrate, which connect the top and bottom surfaces of the substrate.

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