A heat dissipation device, domain controller and vehicle

Abstract

The utility model discloses an embodiment of a heat dissipation device, a domain controller and a vehicle, relate to the technical field of automobile electron heat dissipation. The heat dissipation device includes: the casing is equipped with the fan installation site on the first side surface of casing, is equipped with two or more than two heat dissipation rib plate on the first side portion of fan installation site, two or more than two heat dissipation rib plate is arranged side by side on the first side surface of casing, and forms the heat dissipation channel between adjacent heat dissipation rib plate, the heat dissipation fan subassembly is installed in fan installation site, wherein, at least part heat dissipation rib plate in two or more than two heat dissipation rib plate extends to the heat dissipation fan subassembly below, and with the air outlet of heat dissipation fan subassembly corresponds, can promote the air flow circulation speed to thereby promote the heat dissipation effect. The utility model is applicable to the domain controller heat dissipation scene.

Description

Technical Field

[0001] This utility model relates to the field of automotive electronic heat dissipation technology, and in particular to a heat dissipation device, a domain controller, and a vehicle. Background Technology

[0002] As automotive electronic architecture evolves from distributed to centralized systems, domain controllers are becoming increasingly integrated, significantly boosting computing power. However, this increased power consumption leads to severe chip overheating. Current domain controller cooling methods typically combine forced air cooling with natural cooling via heatsinks. However, when fans blow air, the airflow through ordinary heatsinks can create turbulent conditions, hindering effective cooling. Utility Model Content

[0003] In view of this, the present invention provides a heat dissipation device, a domain controller, and a vehicle, which can improve the heat dissipation effect.

[0004] In a first aspect, this utility model provides a heat dissipation device, comprising: a housing, a fan mounting position provided on a first side surface of the housing, two or more heat dissipation fins provided on the first side of the fan mounting position, the two or more heat dissipation fins being arranged side by side on the first side surface of the housing, and a heat dissipation channel being formed between adjacent heat dissipation fins; a heat dissipation fan assembly, the heat dissipation fan assembly being mounted on the fan mounting position; wherein at least a portion of the two or more heat dissipation fins extends below the heat dissipation fan assembly and corresponds to the air outlet of the heat dissipation fan assembly.

[0005] Optionally, the heat dissipation fins extending below the cooling fan assembly are arranged in an arc shape; an air guide channel corresponding to the air outlet of the cooling fan assembly is formed between adjacent heat dissipation fin extensions.

[0006] Optionally, it also includes: a duct cover plate, which covers the two or more heat dissipation fins so that the heat dissipation channel between at least a portion of the heat dissipation fins forms a closed heat dissipation channel.

[0007] Optionally, the air duct cover includes a fan pressing part, through which the cooling fan assembly is pressed into the fan mounting position.

[0008] Optionally, the cooling fan assembly includes: a fan body and a shock-absorbing sleeve wrapped around the fan body frame; the shock-absorbing sleeve is made of a flexible material.

[0009] Optionally, a heat dissipation column is also provided on the first side surface of the housing. The heat dissipation column is located below the cooling fan assembly and has a gap with the cooling fan assembly.

[0010] Secondly, this utility model embodiment also provides a domain controller, including: a control circuit board on which devices are disposed; a heat dissipation device disposed on the control circuit board; wherein the heat dissipation device is the heat dissipation device described in any of the first aspects above, and the housing is disposed on the control circuit board; a cover body connected to the housing, forming an accommodating space between the cover body and the housing, and the control circuit board being disposed in the accommodating space.

[0011] Optionally, a thermally conductive protrusion is provided on the second side surface of the housing, the thermally conductive protrusion corresponding to the device on the control circuit board.

[0012] Optionally, a thermally conductive flexible element is provided between the thermally conductive protrusion on the second side surface of the housing and the device on the control circuit board.

[0013] Thirdly, embodiments of the present invention also provide a vehicle, including a vehicle body, vehicle electronic components, and a domain controller as described in any of the second aspects, wherein the domain controller is installed in the vehicle body and the vehicle electronic components are communicatively connected to the domain controller.

[0014] This utility model provides a heat dissipation device, a domain controller, and a vehicle. The heat dissipation device includes a heat dissipation fan assembly mounted on a fan mounting position on a first side of the housing and heat dissipation ribs disposed on the first side of the fan mounting. The heat dissipation ribs are arranged side by side, forming a heat dissipation channel between adjacent heat dissipation ribs, and some heat dissipation ribs extend to the bottom of the heat dissipation fan assembly, corresponding to the air outlet of the heat dissipation fan assembly. In this way, the airflow generated when the heat dissipation fan assembly is working extends directly from the heat dissipation channel below the air outlet of the heat dissipation fan assembly to the outside of the housing, increasing the airflow speed and thus improving the heat dissipation effect. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the heat dissipation device architecture provided in an embodiment of the present invention;

[0017] Figure 2 A schematic diagram of the structure of the heat dissipation device provided in an embodiment of the present invention after adding the air duct cover plate;

[0018] Figure 3 This is an exploded view of a heat dissipation device provided in an embodiment of the present invention;

[0019] Figure 4 This is a schematic diagram of the cooling fan assembly architecture provided in an embodiment of the present invention;

[0020] Figure 5 This is an exploded view of a cooling fan assembly provided in an embodiment of the present invention.

[0021] Figure 6 A perspective view of a heat dissipation device provided in an embodiment of the present invention, excluding the air duct cover and the heat dissipation fan assembly;

[0022] Figure 7 An exploded view of the domain controller provided in an embodiment of the present invention;

[0023] Figure 8 This is a schematic diagram of the second side surface structure of the housing of a heat dissipation device provided in an embodiment of the present invention;

[0024] Figure 9 This is a top view of the heat dissipation device provided in an embodiment of the present invention, after removing the air duct cover and the cooling fan assembly.

[0025] In the diagram: 1-House; 2-Fan mounting position; 3-Heat plate rib; 4-Heat fan assembly; 41-Fan body; 42-Shock damping sleeve; 5-Air duct cover; 51-Fan pressing part; 6-Heat column; 7-Control circuit board; 8-Heat-conducting flexible part; 9-Heat-conducting protrusion; 10-Cover. Detailed Implementation

[0026] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0027] It should be understood that the described embodiments are merely some embodiments of this utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0028] Example 1

[0029] See Figures 1-6As shown, this embodiment provides a heat dissipation device, including a housing 1, a fan mounting position 2 provided on a first side surface of the housing 1, two or more heat dissipation fins 3 provided on the first side of the fan mounting position 2, the two or more heat dissipation fins 3 arranged side by side on the first side surface of the housing 1, and a heat dissipation channel formed between adjacent heat dissipation fins 3; a heat dissipation fan assembly 4, the heat dissipation fan assembly 4 being mounted on the fan mounting position 2; wherein, at least a portion of the two or more heat dissipation fins 3 extend below the heat dissipation fan assembly 4 and corresponds to the air outlet of the heat dissipation fan assembly 4.

[0030] In this embodiment, the heat dissipation device includes a heat dissipation fan assembly 4 mounted on a fan mounting position 2 on the first side surface of the housing 1 and heat dissipation ribs 3 provided on the first side of the fan mounting position 2. The heat dissipation ribs 3 are arranged side by side, and a heat dissipation channel is formed between adjacent heat dissipation ribs 3. Some of the heat dissipation ribs 3 extend to the bottom of the heat dissipation fan assembly 4, corresponding to the air outlet of the heat dissipation fan assembly 4. When the heat dissipation fan assembly 4 is working, the airflow generated extends directly from the heat dissipation channel below the air outlet of the heat dissipation fan assembly 4 to the outside of the housing 1, thereby increasing the airflow speed and improving the heat dissipation effect.

[0031] It should be noted that the heat dissipation ribs 3 are not only installed on one side of the fan mounting position 2, but also around the cooling fan assembly 4. For example, the heat dissipation ribs 3 installed on the left and right sides of the fan mounting position 2 can be arranged horizontally side by side, and the heat dissipation ribs 3 installed on the upper and lower sides of the fan mounting position 2 can be arranged vertically side by side, so that the airflow generated by the air outlet of the cooling fan assembly 4 can spread to the surface of the housing 1 along the heat dissipation channels formed by each heat dissipation rib 3.

[0032] Optionally, in some embodiments, see Figure 1 As shown, the extensions of the heat dissipation fins 3 extending below the cooling fan assembly 4 are arranged in an arc shape; air guide channels corresponding to the air outlets of the cooling fan assembly 4 are formed between adjacent extensions of the heat dissipation fins 3. Through this structure, an arc-shaped air guide channel is formed at the air outlet of the cooling fan assembly 4. This arc-shaped air guide channel conforms to the airflow direction, and the arc-shaped design of the flow channel avoids the formation of vortex zones due to sudden height changes, thus preventing local resistance losses and greatly improving airflow efficiency and heat dissipation. Furthermore, the air outlet of the heat dissipation fins 3 below the cooling fan assembly 4 is arc-shaped, while the area around the cooling fan assembly 4 is straight-lined. This effectively reduces wind resistance, increases airflow speed, and allows the airflow from the fan to flow smoothly and evenly through the heat dissipation channels between the heat dissipation fins 3.

[0033] Optionally, in some embodiments, the heat dissipation device further includes: a duct cover 5, which covers the two or more heat dissipation fins 3, so that the heat dissipation channels between at least a portion of the heat dissipation fins 3 form a closed heat dissipation channel. Furthermore, the longitudinal height of the area on the heat dissipation fins 3 covered by the duct cover 5 is lower than the uncovered area. This stepped height difference design allows for accurate positioning of the duct cover 5, facilitating the fixing of the duct cover 5 to the housing 1 with screws.

[0034] See Figures 2-3 As shown, the air duct cover 5 partially covers the heat dissipation ribs 3. The longitudinal height of the area on the heat dissipation ribs 3 covered by the air duct cover 5 is lower than the uncovered area. The air duct cover 5 is fixed to the housing 1 by screws, so that the heat dissipation channel formed between the covered heat dissipation ribs 3 is closed from top to bottom. When the cooling fan is working, the airflow direction is restricted, so that the airflow can only flow inside the heat dissipation channel. Furthermore, since the heat dissipation ribs 3 extend to the bottom of the cooling fan assembly 4, they can effectively guide the airflow generated from the fan outlet along the heat dissipation air duct, reduce the turbulent flow of the airflow, improve the smoothness of the airflow and the airflow efficiency, thereby helping to increase the heat dissipation efficiency.

[0035] Optionally, in some embodiments, see Figure 3 As shown, the air duct cover 5 includes a fan pressing part 51, through which the cooling fan assembly 4 is pressed into the fan mounting position 2.

[0036] See Figures 4-5 As shown, the cooling fan assembly 4 includes: a fan body 41 and a shock-absorbing sleeve 42 that wraps around the fan body frame; the shock-absorbing sleeve 42 is made of a flexible material, such as rubber or silicone.

[0037] For details, please refer to Figures 2-5 As shown, the air duct cover 5 covering the heat dissipation plate rib 3 also includes a fan pressing part 51 covering the fan assembly. The fan pressing part 51 presses the heat dissipation fan assembly 4 onto the fan mounting position 2, so that the heat dissipation fan assembly 4 does not need to be fixed with screws, which facilitates the disassembly and replacement of the heat dissipation fan assembly 4. Furthermore, since the fan body 41 is wrapped by the shock-absorbing sleeve 42, the fan body 42 pressed and fixed on the housing 1 has no direct hard contact with the housing 1. At the same time, since the shock-absorbing sleeve 42 is made of a flexible material, it can reduce the noise when the fan is working.

[0038] Further, see Figure 3 As shown, the cooling fan assembly 4 is horizontally mounted directly above the housing 1 of the heat dissipation device. Compared with the method of mounting the fan on the side and blowing air horizontally, this can effectively reduce the overall height of the device and improve the applicability of the product.

[0039] Optionally, in some embodiments, a heat dissipation column 6 is further provided on the first side surface of the housing 1. The heat dissipation column 6 is located below the cooling fan assembly 4 and has a gap with the cooling fan assembly 4.

[0040] For details, please refer to Figure 2 , Figure 3 and Figure 6 As shown, 12 heat sinks 6 are also provided on the first side surface of the housing 1 at the fan mounting position 2. The heat sinks 6 are located below the cooling fan assembly 4. The heat dissipated by the internal chip is transferred from the housing 1 to the heat sinks 6. The fan blows air towards the heat sinks 6, and the heat sinks 6 generate hot airflow that flows out of the heat dissipation channel together with the hot airflow generated by the housing 1 and the heat sink rib 2 when the fan is working. Through the combined action of the housing 1, the heat sink rib 3 and the heat sinks 6, the heat dissipation area is increased, thereby quickly dissipating heat and improving heat dissipation efficiency.

[0041] The heat dissipation device provided in this embodiment, compared with ordinary heat dissipation ducts, greatly improves airflow efficiency by forming a complete duct extending to the bottom of the heat dissipation fan assembly 4, thereby improving heat dissipation efficiency. In addition, the heat dissipation fan assembly 4 is pressed onto the housing 1 by the duct cover plate 5. Compared with direct screw tightening, it can effectively avoid the vibration noise generated by the fan operation, reduce the noise level, and make the fan replacement convenient, thus extending the service life of the equipment.

[0042] Example 2

[0043] This embodiment also provides a domain controller, see below. Figure 7 As shown, the domain controller includes: a control circuit board 7, on which devices are disposed; a heat dissipation device disposed on the control circuit board 7; wherein the heat dissipation device is the heat dissipation device described in the aforementioned embodiment 1, and the housing 1 covers the control circuit board 7; it also includes: a cover 10, which is connected to the housing 1, and an accommodating space is formed between the cover 10 and the housing 1, and the control circuit board 7 is disposed in the accommodating space.

[0044] See Figure 7 and Figure 8 As shown, a heat-conducting protrusion 9 is provided on the second side surface of the housing 1, and the heat-conducting protrusion 9 corresponds to the device on the control circuit board 7.

[0045] A thermally conductive flexible element 8 is provided between the thermally conductive protrusion 9 on the second side surface of the housing 1 and the devices on the control circuit board 7. The thermally conductive flexible element 8 rapidly conducts heat generated by the devices on the control circuit board 7 to the housing 1, avoiding direct hard contact between the thermally conductive protrusion 9 and the devices, and enhancing the heat conduction effect. Preferably, the thermally conductive flexible element 8 is made of thermally conductive silicone grease, liquid metal, or a thermally conductive pad.

[0046] Specifically, the domain controller includes a control circuit board 7 and a heat dissipation device covering the control circuit board 7. A cooling fan assembly 4 and a heat dissipation rib 3 are provided on the first side surface of the heat dissipation device housing 1, and a thermally conductive protrusion 9 is provided on the second side surface. Devices such as chips are provided on the control circuit board 7. When the chip is working, it generates heat. The heat is carried to the surface of the housing 1 and the heat dissipation rib 3 through the thermally conductive protrusion 9. The cooling fan generates airflow and actively pushes the airflow through the surface of the housing 1 and the surface of the heat dissipation rib 3 to form a hot airflow. The airflow is sealed by the air duct cover 5, so that the hot airflow is discharged from the air duct, which helps to dissipate heat and improves the heat dissipation effect.

[0047] Optionally, in some embodiments, see Figure 9 As shown, the thermally conductive protrusion 9 and the heat dissipation column 6 are integrally formed on the housing 1. In the above structure, since the thermally conductive protrusion 9, the heat dissipation column 6 and the entire housing 1 are integrally formed, the heat generated by the devices on the control circuit board 7 is transferred to the thermally conductive protrusion 9 through the thermally conductive flexible part 8 in contact with the devices, and further transferred to the heat dissipation column 6. The fan blows air towards the heat dissipation column 6, increasing the heat dissipation area and improving the heat dissipation efficiency.

[0048] It should be noted that when there is a similar protruding obstacle structure on the housing 1, such as when some devices on the control circuit board 7 need to protrude into the heat dissipation air duct, the obstacle structure needs to be treated with a ramp guide. The ramp structure can guide the airflow to transition smoothly, reduce separation and eddies, reduce air resistance, and ensure the smoothness of airflow. At the same time, the airflow may generate noise when it impacts the obstacle structure. The ramp treatment can reduce the impact sound and reduce the noise generated during heat dissipation.

[0049] Optionally, in some embodiments, an opening is provided on the first side surface of the housing 1 above the fan mounting position 2, and the cooling fan assembly 4 is electrically connected to the control circuit board 7 through the opening. With the above structure and the fan pressing part 51, the faulty fan can be replaced without disassembling the control circuit board 7, the housing 1, and the air duct cover 5.

[0050] Furthermore, the air duct cover 5 is fixed to the housing 1, covering the connection position between the cooling fan assembly 4 and the control circuit board 7, thereby effectively preventing external splashes of water or falling metal objects from damaging the cooling fan assembly 4 or the domain controller as a whole, making it suitable for harsher working environments.

[0051] Optionally, in some embodiments, the domain controller further includes a temperature monitoring unit electrically connected to the control circuit board. The temperature control unit monitors the chip temperature on the control circuit board. When the chip temperature is detected to be rising, the program automatically adjusts the fan speed to increase the speed and improve heat dissipation efficiency; conversely, when the temperature monitoring unit detects a decrease in chip temperature, the program controls the fan speed to decrease, achieving energy saving and noise reduction.

[0052] This embodiment also provides a vehicle, including: a vehicle body, vehicle electronic components, and the aforementioned domain controller, wherein the domain controller is installed in the vehicle body, and the vehicle electronic components are communicatively connected to the domain controller.

[0053] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0054] In the description of this utility model, it should be understood that the directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this utility model. The directional terms "inner" and "outer" refer to the inner and outer contours of each component itself.

[0055] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0056] The various embodiments in this specification are described in a related manner. The same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on describing the differences from other embodiments.

[0057] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A heat dissipation device, characterized in that, include: The housing has a fan mounting position on the first side surface of the housing, and two or more heat dissipation fins are provided on the first side of the fan mounting position. The two or more heat dissipation fins are arranged side by side on the first side surface of the housing, and heat dissipation channels are formed between adjacent heat dissipation fins. A cooling fan assembly, wherein the cooling fan assembly is mounted on the fan mounting position; In this embodiment, at least a portion of the two or more heat dissipation fins extends below the cooling fan assembly and corresponds to the air outlet of the cooling fan assembly.

2. The heat dissipation device according to claim 1, characterized in that, The heat dissipation fins extending below the cooling fan assembly are arranged in an arc shape; An airflow channel is formed between adjacent heat dissipation fin extensions, corresponding to the air outlet of the cooling fan assembly.

3. The heat dissipation device according to claim 1, characterized in that, Also includes: A duct cover plate is provided over two or more heat dissipation fins to form a closed heat dissipation channel between at least a portion of the heat dissipation fins.

4. The heat dissipation device according to claim 3, characterized in that, The air duct cover includes a fan pressing part, through which the cooling fan assembly is pressed into the fan mounting position.

5. The heat dissipation device according to claim 4, characterized in that, The cooling fan assembly includes: a fan body and a shock-absorbing sleeve that wraps around the fan body frame; the shock-absorbing sleeve is made of a flexible material.

6. The heat dissipation device according to claim 1, characterized in that, A heat dissipation column is also provided on the first side surface of the housing. The heat dissipation column is located below the cooling fan assembly and has a gap with the cooling fan assembly.

7. A domain controller, characterized in that, include: A control circuit board, on which components are provided; A heat dissipation device is disposed on the control circuit board; wherein the heat dissipation device is the heat dissipation device according to any one of claims 1-6, and the housing is disposed on the control circuit board; A cover body is connected to the housing, and an accommodating space is formed between the cover body and the housing, wherein the control circuit board is disposed in the accommodating space.

8. The domain controller according to claim 7, characterized in that, A thermally conductive protrusion is provided on the second side surface of the housing, and the thermally conductive protrusion corresponds to the device on the control circuit board.

9. The domain controller according to claim 8, characterized in that, A thermally conductive flexible element is provided between the thermally conductive protrusion provided on the second side surface of the housing and the device on the control circuit board.

10. A vehicle, characterized in that, It includes a vehicle body, vehicle electronic components, and a domain controller as described in any one of claims 7-9, wherein the domain controller is installed in the vehicle body and the vehicle electronic components are communicatively connected to the domain controller.

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