inverter

Abstract

The application relates to the technical field of inverter manufacturing, in particular to an inverter, which comprises a circuit board provided with a connecting hole, a power module connected to the circuit board, and a heat dissipation module connected to one side of the power module away from the circuit board, wherein the heat dissipation module is provided with a positioning groove arranged close to the power module, and a temperature sensor is arranged in the positioning groove and connected to the circuit board through the connecting hole. The temperature sensor is directly arranged in the positioning groove and connected to the circuit board through the connecting hole, so that the reaction time of temperature monitoring is significantly shortened. Since the temperature sensor is closer to the power module, temperature changes can be detected more quickly, thereby realizing timely protection of the power module. In addition, the design of the heat dissipation module not only helps to effectively dissipate heat, but also provides support for the rapid response of the temperature sensor. Through the design, the reliability and service life of the inverter are significantly improved.

Description

Technical Field

[0001] This application relates to the field of inverter manufacturing technology, and more particularly to an inverter. Background Technology

[0002] An inverter is a power electronic device that converts direct current (DC) to alternating current (AC). It is widely used in various fields, such as solar photovoltaic systems, uninterruptible power supplies (UPS), electric vehicles, and renewable energy systems.

[0003] The power conversion section is the core of an inverter and typically requires effective temperature monitoring to prevent overheating. However, in existing technologies, due to structural design limitations, the junction temperature monitoring module used to monitor the power conversion section in traditional inverters is usually located far from the power module. This design results in a long response time for temperature monitoring, which may prevent timely protective measures from being taken, increasing the risk of damage to the power module. Utility Model Content

[0004] This application provides an inverter for shortening the response time of the junction temperature monitoring module, thereby providing more timely protection for the power conversion section.

[0005] To achieve the above objectives, this application adopts the following technical solution:

[0006] On the one hand, this application provides an inverter, including:

[0007] The circuit board has connection holes;

[0008] Power module, the power module is connected to the circuit board;

[0009] The heat dissipation module is connected to the side of the power module away from the circuit board. The heat dissipation module has a positioning groove, which is located near the power module.

[0010] The temperature sensor is located in the positioning slot and is connected to the circuit board through the connection hole.

[0011] In one possible implementation, the power module includes discrete components, an insulating pad, and a copper busbar. The insulating pad is disposed on the side of the heat dissipation module facing the circuit board. The discrete components are connected to the heat dissipation module, and the terminals of the discrete components are located between the insulating pad and the circuit board. The copper busbar is connected to the terminals of the discrete components.

[0012] In one possible implementation, the inverter also includes a capacitor, terminals including a positive terminal, a negative terminal and an output terminal, and a copper busbar including a positive copper busbar, a negative copper busbar and an output copper busbar. The positive terminal is connected to the positive terminal of the capacitor through the positive copper busbar, the negative terminal is connected to the negative terminal of the capacitor through the negative copper busbar, and the output terminal is connected to the output terminal of the inverter through the output copper busbar.

[0013] In one possible implementation, the heat dissipation module has multiple bosses, discrete components are connected to the bosses, and insulating pads are placed between adjacent bosses.

[0014] In one possible implementation, the thickness of the boss is greater than or equal to the thickness of the insulating pad.

[0015] In one possible implementation, the circuit board has conductive holes, and the inverter also includes a conductive structure, which includes a fixing member and an elastic conductive member. The fixing member is disposed on the circuit board to connect the circuit board and the elastic conductive member. The elastic conductive member is disposed facing the conductive holes. The power module includes signal pins, which are inserted into the conductive holes to abut against the elastic conductive member.

[0016] In one possible implementation, a plastic-coated component is provided outside the copper busbar, and the plastic-coated component has a support portion disposed in a conductive hole. The support portion abuts against the side of the signal needle away from the elastic conductive component, so as to support the signal needle when the signal needle abuts against the elastic conductive component.

[0017] In one possible implementation, the plastic-coated part is further provided with a guide portion for connecting the support portion, which is used to guide the insertion position of the signal needle.

[0018] In one possible implementation, the inverter further includes a housing, and the heat dissipation module includes a heat dissipation substrate. The housing has a heat dissipation cavity and a sealing groove. The sealing groove surrounds the heat dissipation cavity. The heat dissipation substrate covers the heat dissipation cavity and the sealing groove. The sealing groove is filled with sealant to connect the heat dissipation substrate and the housing.

[0019] In one possible implementation, the inverter further includes a sealing assembly, a capacitor housing, and a busbar. The housing and capacitor housing are provided with a sealing wall, and the sealing wall is provided with a sealing opening for the busbar to pass through. The sealing assembly includes a first sealing element and a second sealing element. The first sealing element is sealed and connected to one side of the sealing opening, and the busbar is inserted into the first sealing element. The second sealing element is located on the other side of the sealing opening and cooperates with the first sealing element to seal the busbar in the sealing opening.

[0020] The inverter provided in this application significantly shortens the temperature monitoring response time by connecting a heat dissipation module to the power module, setting a positioning slot on the heat dissipation module and placing the positioning slot close to the power module, and directly placing a temperature sensor in the positioning slot and connecting it to the circuit board through a connection hole. Because the temperature sensor is closer to the power module, temperature changes can be detected more quickly, thus enabling timely protection of the power module. Furthermore, the heat dissipation module design not only facilitates effective heat dissipation but also supports the rapid response of the temperature sensor. Through this design, the reliability and lifespan of the inverter are significantly improved. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the circuit board structure of the inverter provided in the embodiments of this application;

[0023] Figure 2 This is one of the structural schematic diagrams of the power module of the inverter provided in the embodiments of this application;

[0024] Figure 3 One of the schematic diagrams showing the connection between the circuit board and the power module of the inverter provided in this application embodiment;

[0025] Figure 4 This is a second schematic diagram of the power module structure of the inverter provided in the embodiments of this application;

[0026] Figure 5 This is a schematic diagram of the power module and heat dissipation module of the inverter provided in an embodiment of this application;

[0027] Figure 6 A second schematic diagram illustrating the connection between the circuit board and the power module of the inverter provided in this embodiment of the application;

[0028] Figure 7 A third schematic diagram illustrating the connection between the circuit board and the power module of the inverter provided in this embodiment of the application;

[0029] Figure 8 Fourth schematic diagram of the connection between the circuit board and the power module of the inverter provided in this application embodiment;

[0030] Figure 9 This is one of the structural schematic diagrams of the inverter housing and heat dissipation module provided in the embodiments of this application;

[0031] Figure 10 A second schematic diagram of the inverter housing and heat dissipation module provided in an embodiment of this application;

[0032] Figure 11 This is a schematic diagram of the casing and heat dissipation module of an inverter in the prior art.

[0033] Figure 12 This is one of the simulation diagrams of the flow field between the casing and the heat dissipation module of an inverter in the prior art;

[0034] Figure 13This is the second simulation diagram of the flow field between the casing and the heat dissipation module of an inverter in the prior art;

[0035] Figure 14 One of the simulation diagrams of the flow field between the inverter housing and the heat dissipation module provided in the embodiments of this application;

[0036] Figure 15 A second simulation diagram of the flow field between the inverter housing and the heat dissipation module provided in the embodiments of this application;

[0037] Figure 16 One of the structural schematic diagrams of the inverter housing, sealing assembly, and capacitor housing provided in the embodiments of this application;

[0038] Figure 17 A second schematic diagram of the inverter housing, sealing assembly, and capacitor housing provided in an embodiment of this application;

[0039] Figure 18 The third schematic diagram of the inverter housing, sealing assembly, and capacitor housing provided in the embodiments of this application.

[0040] Explanation of reference numerals in the attached figures:

[0041] 100-Inverter; 10-Circuit board; 11-Connection hole; 12-Conductive hole; 13-Conductive structure; 131-Fixing component; 132-Elastic conductive component; 20-Power module; 21-Discrete component; 211-Terminal; 212-Positive terminal; 213-Negative terminal; 214-Output terminal; 215-Signal pin; 22-Insulating pad; 23-Copper busbar; 231-Positive copper busbar; 232-Negative copper busbar; 233-Output copper busbar; 234-Plastic coated component; 235-Support part; 236-Guide part; 30-Heat dissipation module; 31-Positioning groove; 32-Boss; 33-Heat dissipation base plate; 34-Water inlet nozzle; 35-Water outlet nozzle; 40-Temperature sensor; 50-Capacitor; 51-Capacitor negative copper busbar; 60-Housing; 61-Heat dissipation cavity; 62-Sealing groove; 63-Sealing wall; 64-Sealing port; 70-Sealing assembly; 71-First sealing element; 72-Second sealing element; 80-Capacitor housing; 90-Busbar copper busbar. Detailed Implementation

[0042] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0043] An inverter is a power electronic device that converts direct current (DC) to alternating current (AC). It is widely used in various fields, such as solar photovoltaic systems, uninterruptible power supplies (UPS), electric vehicles, and renewable energy systems.

[0044] The power conversion section is the core of an inverter and typically requires effective temperature monitoring to prevent overheating. However, in existing technologies, due to structural design limitations, the junction temperature monitoring module used to monitor the power conversion section in traditional inverters is usually located far from the power module. This design results in a long response time for temperature monitoring, which may prevent timely protective measures from being taken, increasing the risk of damage to the power module.

[0045] To overcome the shortcomings of existing technologies, after repeated consideration and verification, the inventors discovered that by setting a positioning slot on the heat dissipation module near the power module and placing the temperature sensor in the slot, the response time for temperature monitoring can be significantly shortened. Because the temperature sensor is closer to the power module, temperature changes can be detected more quickly, thus enabling timely protection of the power module. Furthermore, the heat dissipation module design not only facilitates effective heat dissipation but also supports the rapid response of the temperature sensor. Through this design, the reliability and lifespan of the inverter are significantly improved.

[0046] In view of this, this application provides an inverter, comprising:

[0047] The circuit board has connection holes;

[0048] Power module, the power module is connected to the circuit board;

[0049] The heat dissipation module is connected to the side of the power module away from the circuit board. The heat dissipation module has a positioning groove, which is located near the power module.

[0050] The temperature sensor is located in the positioning slot and is connected to the circuit board through the connection hole.

[0051] By connecting the heat dissipation module to the power module, incorporating a positioning slot on the heat dissipation module and placing it close to the power module, and directly mounting the temperature sensor within this slot and connecting it to the circuit board via a connection hole, the response time for temperature monitoring is significantly shortened. Because the temperature sensor is closer to the power module, temperature changes can be detected more quickly, enabling timely protection of the power module. Furthermore, the heat dissipation module design not only facilitates efficient heat dissipation but also supports the rapid response of the temperature sensor. This design significantly improves the reliability and lifespan of the inverter.

[0052] The contents of this application will now be described in detail with reference to the accompanying drawings, so that those skilled in the art can have a clearer and more detailed understanding of the contents of this application.

[0053] Figure 1 This is a schematic diagram of the circuit board structure of the inverter provided in an embodiment of this application. Figure 2 This is one of the structural schematic diagrams of the power module of the inverter provided in the embodiments of this application. Figure 3 This is one of the schematic diagrams showing the connection between the circuit board and the power module of the inverter provided in the embodiments of this application. Figure 4 This is a second schematic diagram of the power module of the inverter provided in the embodiments of this application. Figure 5 This is a schematic diagram of the power module and heat dissipation module of the inverter provided in an embodiment of this application. Figure 6 This is a second schematic diagram showing the connection between the circuit board and the power module of the inverter provided in this embodiment of the application. Figure 7 This is the third schematic diagram showing the connection between the circuit board and the power module of the inverter provided in this application embodiment. Figure 8 The fourth schematic diagram shows the connection between the circuit board and the power module of the inverter provided in the embodiments of this application. Figure 9 This is one of the structural schematic diagrams of the inverter housing and heat dissipation module provided in the embodiments of this application. Figure 10 This is the second schematic diagram of the inverter housing and heat dissipation module provided in the embodiments of this application. Figure 11 This is a schematic diagram of the casing and heat dissipation module of an inverter in the prior art. Figure 12 This is one of the simulation diagrams of the flow field between the casing and the heat dissipation module of an inverter in the prior art. Figure 13 This is the second simulation diagram of the flow field between the casing and the heat dissipation module of an inverter in the prior art. Figure 14 This is one of the simulation diagrams of the flow field between the inverter housing and the heat dissipation module provided in the embodiments of this application. Figure 15 This is the second simulation diagram of the flow field between the inverter housing and the heat dissipation module provided in the embodiments of this application. Figure 16This is one of the structural schematic diagrams of the inverter housing, sealing assembly, and capacitor housing provided in the embodiments of this application. Figure 17 This is the second schematic diagram of the inverter housing, sealing assembly, and capacitor housing provided in the embodiments of this application. Figure 18 The third schematic diagram of the inverter housing, sealing assembly, and capacitor housing provided in the embodiments of this application.

[0054] The following sections will provide a detailed description of the specific structure of the inverter and various possible implementation methods.

[0055] like Figure 1 , Figure 2 and Figure 3 As shown, this application embodiment provides an inverter 100, including a circuit board 10, a power module 20, a heat dissipation module 30, and a temperature sensor 40. The circuit board 10 is connected to the power module 20 and the temperature sensor 40. The heat dissipation module 30 is connected to the power module 20 and is used to dissipate heat from the power module 20. The temperature sensor 40 is used to sense the temperature of the power module 20 to monitor the junction temperature of the power module 20.

[0056] In one possible implementation, the circuit board 10 is provided with a connection hole 11. The connection hole 11 is used to connect the temperature sensor 40.

[0057] In one possible implementation, circuit board 10 is a PCBA (Printed Circuit Board Assembly).

[0058] In one possible implementation, the connection hole 11 is a welding through hole for passing through the pin of the temperature sensor 40 and for welding and fixing connection.

[0059] In one possible implementation, the power module 20 is an IGBT (Insulated Gate Bipolar Transistor) power module.

[0060] In one possible implementation, the heat dissipation module 30 is connected to the side of the power module 20 away from the circuit board 10.

[0061] In one possible implementation, the heat dissipation module 30 is welded to the power module 20, thereby improving the heat dissipation effect on the power module 20.

[0062] In one possible implementation, the heat dissipation module 30 is provided with a positioning slot 31, which is located adjacent to the power module 20. A temperature sensor 40 is located in the positioning slot 31. The positioning slot 31 is positioned as a junction temperature monitoring point.

[0063] In one possible implementation, the arrangement of the power modules 20 is designed according to actual needs, thereby determining the location of the positioning slot 31.

[0064] Temperature sensor 40 is used to quickly monitor temperature changes, thereby protecting the junction temperature of power module 20 from exceeding the specified value and preventing power module 20 from overheating and failing.

[0065] In one possible implementation, the temperature sensor 40 is an NTC (Negative Temperature Coefficient) / PTC (Positive Temperature Coefficient) thermistor sensor, with the NTC / PTC temperature sensing head placed in the positioning slot 31.

[0066] In one possible implementation, NTC should select components with small time constants.

[0067] By connecting the heat dissipation module 30 to the power module 20, and setting a positioning groove 31 on the heat dissipation module 30 so that the positioning groove 31 is close to the power module 20, and by directly placing the temperature sensor 40 in the positioning groove 31 and connecting it to the circuit board 10 through the connection hole 11, the junction temperature monitoring point is close to the power module 20, thus significantly shortening the temperature monitoring response time. Because the temperature sensor 40 is closer to the power module 20, temperature changes can be detected more quickly, thereby achieving timely protection of the power module 20. Furthermore, the design of the heat dissipation module 30 not only helps in the effective dissipation of heat but also supports the rapid response of the temperature sensor 40. Through this design, the reliability and service life of the inverter 100 are significantly improved. Moreover, the above structural design requires no additional structural components; it involves simple processing based on existing structural components, resulting in lower costs and facilitating large-scale mass production.

[0068] like Figure 4 and Figure 5 As shown, in one possible implementation, the power module 20 includes discrete components 21, an insulating pad 22, and a copper busbar 23. The insulating pad 22 is disposed on the side of the heat dissipation module 30 facing the circuit board 10. The discrete components 21 are connected to the heat dissipation module 30, and the terminals 211 of the discrete components 21 are located between the insulating pad 22 and the circuit board 10. The copper busbar 23 is connected to the terminals 211 of the discrete components 21.

[0069] The use of insulating pad 22 helps to provide electrical insulation between the terminals 211 and copper busbar 23 of the heat dissipation module 30 and the discrete components 21, avoiding potential short-circuit risks and improving the safety and reliability of the entire inverter 100 system. At the same time, insulating pad 22 allows heat to be effectively conducted to the heat dissipation module 30, which helps to keep the temperature of the discrete components 21 within a safe range and prevent overheating damage.

[0070] By directly connecting the insulating pad 22 to the discrete components 21 on the heat dissipation module 30, this layout reduces the distance between components, effectively reducing the space in the height direction, making the entire power module 20 more compact and saving space.

[0071] The use of copper busbar 23 provides a low-resistance electrical connection, reducing power loss and improving system efficiency. The high conductivity of copper busbar 23 helps to better manage current flow, especially in high-power applications. By securely connecting discrete components 21 to the heat dissipation module 30 and electrically connecting them using copper busbar 23, the mechanical stability of the entire structure is enhanced, helping to maintain component integrity under vibration or shock conditions.

[0072] In one possible implementation, the inverter 100 further includes a capacitor 50. Terminal 211 includes a positive terminal 212, a negative terminal 213, and an output terminal 214. The copper busbar 23 includes a positive copper busbar 231, a negative copper busbar 232, and an output copper busbar 233. The positive terminal 212 is connected to the positive terminal of the capacitor 50 via the positive copper busbar 231. The negative terminal 213 is connected to the negative terminal of the capacitor 50 via the negative copper busbar 232. The output terminal 214 is connected to the output terminal of the inverter 100 via the output copper busbar 233.

[0073] Capacitor 50 serves as both an energy storage and filter in the circuit. Connected to its positive and negative terminals via positive copper busbar 231 and negative copper busbar 232, capacitor 50 effectively smooths input voltage fluctuations, reducing the impact of voltage spikes and transient changes on the circuit, thereby improving the output voltage stability of inverter 100. The presence of capacitor 50 also helps reduce the ripple amplitude in the DC voltage, which is crucial for the output quality of inverter 100. By reducing ripple, inverter 100 can provide a cleaner AC output.

[0074] The use of positive copper busbar 231, negative copper busbar 232, and output copper busbar 233 provides a low-resistance current path, reducing power loss during current conduction. The high conductivity of copper busbar 23 ensures efficient current transmission between connection points, improving overall system efficiency. Using copper busbar 23 to connect terminals 211 and capacitor 50 simplifies circuit wiring design and reduces cable usage. This structure not only simplifies installation but also reduces the risk of system failure due to cable faults. Connecting via copper busbar 23 reduces the number of solder joints and contact points, lowering the risk of poor contact and thus improving the overall reliability and durability of the system.

[0075] The copper busbar 23 not only facilitates efficient current conduction but also aids in heat dissipation to some extent. Due to copper's high thermal conductivity, the copper busbar 23 can assist in heat dissipation, further enhancing the system's thermal management capabilities and extending component lifespan.

[0076] In one possible implementation, capacitor 50 is further provided with a negative copper busbar 51. The negative copper busbar 51 is connected to the negative copper busbar 232, thereby connecting the negative terminal 213 to the negative terminal of capacitor 50.

[0077] In one possible implementation, the positive copper busbar 231 is the positive copper busbar of the capacitor 50, and the positive terminal 212 is directly connected to the capacitor 50 through the positive copper busbar.

[0078] In one possible implementation, the heat dissipation module 30 has multiple bosses 32. Discrete components 21 are connected to the bosses 32. Insulating pads 22 are disposed between adjacent bosses 32.

[0079] The structure of the bosses 32 provides a robust mounting base, allowing the discrete components 21 to be securely fixed to the heat dissipation module 30. This mechanical stability helps maintain the integrity of the components under vibration or shock conditions, reducing the likelihood of failure. The design of the bosses 32 increases the surface area of ​​the heat dissipation module 30, which helps to dissipate heat more effectively. The discrete components 21 are directly mounted on these bosses 32, ensuring that heat is rapidly conducted to the heat dissipation module 30, thereby improving heat dissipation efficiency.

[0080] The insulating pad 22 provides electrical insulation, helping to prevent electrical interference and short-circuit risks between discrete components 21, thus improving the safety and reliability of the circuit. Located between adjacent bosses 32, the insulating pad 22 not only provides electrical insulation but also thermal insulation, preventing heat conduction between adjacent discrete components 21, thereby reducing the risk of heat buildup and ensuring that the temperature of each discrete component 21 remains within a safe range.

[0081] By integrating the boss 32 and the insulating pad 22 on the heat dissipation module 30, the entire design is more compact and saves space, which helps to achieve the miniaturization of the inverter 100 and makes it suitable for space-constrained applications.

[0082] By using insulating pad 22 to ensure the air gap between the terminals 211 of discrete component 21 and heat dissipation module 30, the height of the discrete component 21 and the base surface of heat dissipation module 30 can be effectively reduced, thus reducing the height of power module 20 and the thickness of boss 32 of heat dissipation module 30. At the same time, insulating pad 22 needs to meet certain CTI (Comparative Tracking Index) requirements to prevent creepage problems caused by insulating pad 22.

[0083] In one possible implementation, the insulating pad 22 with adhesive backing is first attached to the heat dissipation module 30, and then the discrete component 21 is soldered to the boss 32 of the heat dissipation module 30.

[0084] In one possible implementation, the heat dissipation module 30 includes a heat dissipation substrate 33. A boss 32 is provided on the side of the heat dissipation substrate 33 facing the power module 20.

[0085] In one possible implementation, the heat dissipation module 30 is a water-cooled module, and the heat dissipation substrate 33 is a water-cooled plate.

[0086] In one possible implementation, multiple insulating pads 22 are provided, and the multiple insulating pads 22 are respectively provided between the bosses 32 or on the side of the heat dissipation substrate 33.

[0087] In one possible implementation, the insulating pad 22 is designed as a single unit, thereby reducing assembly time and improving assembly efficiency.

[0088] In one possible implementation, the thickness of the boss 32 is greater than or equal to the thickness of the insulating pad 22.

[0089] Since the boss 32 is in direct contact with the discrete device 21, and its thickness is greater than or equal to the thickness of the insulating pad 22, it ensures that the heat generated by the discrete device 21 can be quickly conducted to the heat dissipation module 30, which helps to improve heat dissipation efficiency and prevent the discrete device 21 from overheating.

[0090] The presence of insulating pad 22 provides necessary electrical isolation to prevent electrical interference and short circuit risks between discrete components 21. The thickness of boss 32 is greater than or equal to the thickness of insulating pad 22, ensuring electrical isolation without affecting heat conduction.

[0091] Since the thickness of the boss 32 is greater than or equal to the thickness of the insulating pad 22, it is easier to ensure close contact between the discrete device 21 and the boss 32 during manufacturing and assembly, thereby improving production efficiency and product consistency.

[0092] like Figure 6 , Figure 7 and Figure 8 As shown, in one possible implementation, the circuit board 10 is provided with a conductive hole 12. The inverter 100 also includes a conductive structure 13. The conductive structure 13 includes a fixing member 131 and a flexible conductive member 132. The fixing member 131 is disposed on the circuit board 10 to connect the circuit board 10 and the flexible conductive member 132. The flexible conductive member 132 is disposed facing the conductive hole 12. The power module 20 includes a signal pin 215, which is inserted into the conductive hole 12 to abut against the flexible conductive member 132.

[0093] The flexible conductive element 132 provides a stable and reliable electrical connection. Due to its elastic properties, it can provide sufficient contact pressure when the signal pin 215 is inserted, ensuring good electrical contact, reducing contact resistance, improving the reliability of signal transmission, and reducing the possibility of signal distortion and interference. The flexible conductive element 132 can absorb mechanical stress caused by vibration, thermal expansion, or mechanical shock, helping to prevent the connection between the signal pin 215 and the flexible conductive element 132 from loosening or breaking, thereby improving the durability and reliability of the system.

[0094] Because the elastic conductive element 132 can automatically adjust to accommodate the insertion of the signal pin 215, the requirements for the position and height of the signal pin are not high, making the assembly process simpler and faster. This design eliminates the need for separate soldering of the signal pin 215, while also relaxing the tolerance requirements for the position of the signal pin 215, reducing machining difficulty, decreasing the need for precise alignment, and improving production efficiency. This design allows for easy insertion and removal of the signal pin 215 when needed, facilitating maintenance and component replacement without complex soldering or disassembly processes, reducing maintenance costs and time. This not only reduces the complexity of the manufacturing process but also reduces the risk of failure due to poor soldering.

[0095] This connection method allows for more flexible component placement in the design of circuit board 10, adapting to different circuit configurations and design requirements.

[0096] In one possible implementation, the conductive structure 13 is surface-mounted onto the circuit board 10.

[0097] In one possible implementation, the copper busbar 23 is provided with a plastic coating 234. The plastic coating 234 is provided with a support portion 235. The support portion 235 is disposed in the conductive hole 12 and abuts against the side of the signal pin 215 away from the elastic conductive member 132, so as to support the signal pin 215 when the signal pin 215 abuts against the elastic conductive member 132.

[0098] Above the power module 20 is a plastic-coated part 234 of the copper busbar 23 that connects to the terminal 211 of the power module 20. The part of the plastic-coated part 234 near the signal terminal 211 is the support part 235 of the signal pin 215.

[0099] The plastic-coated component 234 is typically made of insulating material, providing additional electrical insulation protection to prevent short circuits or electrical interference between the copper busbar 23 and other conductive components. The material properties of the plastic-coated component 234 provide some shock absorption, further reducing the impact of vibration on the signal pin 215 and electrical connections.

[0100] By providing support on the back of the signal pin 215, stable contact pressure between the signal pin 215 and the elastic conductive element 132 is ensured. This stable contact pressure helps reduce contact resistance and improves the reliability of signal transmission. The support portion 235 provides mechanical support for the signal pin 215, preventing displacement or bending when subjected to external forces or vibrations. This stability helps maintain the reliability of the electrical connection and reduces connection failures caused by mechanical stress. The plastic coating 234 and the support portion 235 provide a degree of protection for the signal pin 215, preventing damage during insertion or operation, extending the service life of the signal pin 215, and reducing the frequency of maintenance and replacement.

[0101] The design of the plastic-coated part 234 and the support part 235 makes the insertion and fixation of the signal pin 215 simpler and faster, reduces the need for precise alignment, and improves production efficiency. This design allows the signal pin 215 to be easily inserted and removed when needed, facilitating maintenance and component replacement without a complicated disassembly process.

[0102] In one possible implementation, the plastic-coated part 234 is further provided with a guide part 236 that connects to the support part 235, and the guide part 236 is used to guide the insertion position of the signal pin 215.

[0103] The guide section 236 provides a clear path for the insertion of the signal pin 215, reducing the need for precise alignment. This makes the assembly process faster and simpler, reduces the error rate in the production process, and improves production efficiency. The guide section 236 ensures that the signal pin 215 can be accurately inserted into the conductive hole 12, avoiding poor connection or damage caused by improper insertion angle or positional misalignment. This design reduces insertion errors and improves system reliability. The accurate insertion position ensures good contact between the signal pin 215 and the elastic conductive element 132, reduces contact resistance, and improves the reliability and efficiency of signal transmission.

[0104] The guide portion 236 provides physical guidance during the insertion of the signal pin 215, reducing friction and collision between the signal pin 215 and surrounding structures, protecting the signal pin 215 and the elastic conductive element 132, and extending their service life. By ensuring the correct insertion position of the signal pin 215, the guide portion 236 helps maintain the mechanical stability of the signal pin 215, preventing it from shifting or bending when subjected to external forces or vibrations.

[0105] During installation, the circuit board 10 is installed from top to bottom. The metal sheet of the elastic conductive element 132 first contacts the signal pin 215 and the support portion 235 of the plastic-coated component 234. Then, the elastic conductive element 132 begins to elastically deform, pressing down on the signal pin 215. During the downward installation of the circuit board 10, the elastic conductive element 132 contacts the signal pin 215, and the signal pin 215 contacts the support portion 235. Since the coefficient of friction between metals is less than that between metal and plastic, the downward pressure during assembly will not move the signal pin 215 downward, thus preventing damage to the signal pin 215 and the power module 20. Simultaneously, due to the difference in the coefficient of friction, when the circuit board 10 vibrates, the contact point between the elastic conductive element 132 and the signal pin 215 will slide relative to each other, unlike when welding the signal pin 215, where the force generated by vibration is transmitted to the root of the signal pin 215, thus preventing damage.

[0106] like Figure 9 , Figure 10 As shown, in one possible implementation, the inverter 100 further includes a housing 60. The heat dissipation module 30 includes a heat dissipation substrate 33. The housing 60 is provided with a heat dissipation cavity 61 and a sealing groove 62. The sealing groove 62 is disposed around the heat dissipation cavity 61, and the heat dissipation substrate 33 covers the heat dissipation cavity 61 and the sealing groove 62. The sealing groove 62 is filled with sealant to connect the heat dissipation substrate 33 and the housing 60.

[0107] The heat dissipation cavity 61 provides a dedicated space for the heat dissipation substrate 33, allowing heat to be conducted more effectively from the heat dissipation substrate 33 to the heat dissipation medium. This design helps improve the heat dissipation efficiency of the inverter 100 and prevents overheating. The design of the sealing groove 62 and the sealant helps prevent heat from being unintentionally lost from the heat dissipation cavity 61, ensuring that heat is effectively conducted away through the heat dissipation medium and improving heat dissipation efficiency.

[0108] The sealing groove 62 is filled with sealant, providing an effective seal to prevent dust, moisture, and other contaminants from entering the heat dissipation cavity 61 and internal components. This improves the environmental adaptability of the inverter 100, making it suitable for use in harsh conditions. The use of sealant also creates a strong connection between the heat dissipation base plate 33 and the housing 60, reducing the risk of component loosening or displacement due to vibration or impact, thereby improving the overall reliability of the system. This design simplifies the installation and securing of the heat dissipation base plate 33, reduces the need for additional fasteners, and allows for easier disassembly and resealing during maintenance.

[0109] In one possible implementation, the heat dissipation module 30 further includes a water inlet nozzle 34 and a water outlet nozzle 35. The water inlet nozzle 34 and the water outlet nozzle 35 are respectively disposed on the housing 60 and are respectively connected to the heat dissipation cavity 61.

[0110] like Figure 11 , Figure 12 , Figure 13 As shown, in the prior art, a sealing ring is used to seal the water channels of the heat dissipation module 30. Sealing the water channels with a sealing ring requires reserving the depth of the sealing groove, which prevents the height of the corresponding sealing position from being lowered. This results in two bends in the cooling water circuit at the inlet and outlet, which seriously affects the overall flow resistance of the water circuit.

[0111] like Figure 14 and Figure 15 As shown, by replacing the dimensional defects of traditional sealing rings with a sealant connection, the depth of the sealing groove can be reduced by using sealant to connect the heat dissipation substrate 33 and the housing 60, achieving basic sealing requirements and improving the corresponding sealing feature height. Furthermore, the positions of the inlet nozzle 34 and outlet nozzle 35 can be optimized, thereby achieving straight-in and straight-out water flow.

[0112] The reduced sealing height allows for optimization of the relative positions of the water inlet and outlet, enabling a straight-in / straight-out design and improving the flow resistance and heat dissipation performance of the cooling water circuit. By eliminating the bends in the existing water channels, the space previously occupied by these bends is freed up, improving the water channel height characteristics and optimizing flow resistance and pressure drop. This results in an optimized overall layout and improved performance of the inverter 100.

[0113] like Figure 16 , Figure 17 and Figure 18As shown, in one possible implementation, the inverter 100 further includes a sealing assembly 70, a capacitor housing 80, and a busbar copper bus 90. The housing 60 and capacitor housing 80 are provided with sealing walls 63. The sealing walls 63 have sealing openings 64 for the busbar copper bus 90 to pass through. The sealing assembly 70 includes a first sealing member 71 and a second sealing member 72. The first sealing member 71 is sealingly connected to one side of the sealing opening 64, and the busbar copper bus 90 is inserted into the first sealing member 71. The second sealing member 72 is located on the other side of the sealing opening 64 and cooperates with the first sealing member 71 to seal the busbar copper bus 90 within the sealing opening 64.

[0114] The sealing assembly 70, through the cooperation of the first seal 71 and the second seal 72, ensures the airtightness of the busbar copper bus 90 as it passes through the sealing opening 64. This design effectively prevents dust, moisture, and other contaminants from entering the housing 60, protecting the internal electronic components. The effective sealing of the sealing opening 64 reduces the impact of the external environment on the internal components, thereby improving the overall reliability and durability of the system, especially under harsh environmental conditions. This design allows the busbar copper bus 90 to be easily inserted or removed when needed, simplifying the installation and maintenance process and reducing downtime and maintenance costs.

[0115] The seals provide electrical insulation, preventing accidental electrical contact between the busbar copper bus 90 and the housing 60 or other components, reducing the risk of leakage and short circuits. The seal material is typically elastic, which can absorb vibration and noise, reducing the mechanical vibration and noise generated by the inverter 100 during operation and improving the equipment's quietness.

[0116] In one possible implementation, the first seal 71, the second seal 72, and the sealing wall 63 are all interference fits, and the first seal 71, the second seal 72, and the busbar copper bus 90 are also interference fits, thereby ensuring the reliability of sealing and positioning.

[0117] The sealing of the window on the side of the capacitor cavity in the capacitor housing 80 is achieved by the cooperation of the first sealing element 71 and the second sealing element 72.

[0118] In one possible implementation, the busbar 90 is the copper busbar of capacitor 50.

[0119] In one possible implementation, the sealing assembly 70 allows for flexible installation with windows on the side walls. Utilizing the housing 60 as the potting housing for the capacitor 50 reduces costs and improves space utilization. To optimize the arrangement of the busbar copper bus 90 to the simplest and most efficient level, windows need to be opened successively on the bottom and sides of the traditional potting cover. These windows can lead to leakage problems during the potting process. The flexible structure of the first sealant 71 and the second sealant 72 solves this problem, facilitating installation and demonstrating significant effectiveness. After assembly, it prevents leakage of the capacitor potting compound.

[0120] The inverter 100 provided in this embodiment includes a circuit board 10, a power module 20, a heat dissipation module 30, and a temperature sensor 40. The circuit board 10 has a connection hole 11. The power module 20 is connected to the circuit board 10. The heat dissipation module 30 is connected to the side of the power module 20 away from the circuit board 10, and the heat dissipation module 30 has a positioning groove 31, which is located adjacent to the power module 20. The temperature sensor 40 is disposed in the positioning groove 31 and is connected to the circuit board 10 through the connection hole 11.

[0121] By connecting the heat dissipation module 30 to the power module 20, and providing a positioning slot 31 on the heat dissipation module 30, with the positioning slot 31 positioned close to the power module 20, and by directly placing the temperature sensor 40 in the positioning slot 31 and connecting it to the circuit board 10 through the connection hole 11, the response time for temperature monitoring is significantly shortened. Because the temperature sensor 40 is closer to the power module 20, temperature changes can be detected more quickly, thus enabling timely protection of the power module 20. Furthermore, the design of the heat dissipation module 30 not only facilitates effective heat dissipation but also supports the rapid response of the temperature sensor 40. Through this design, the reliability and lifespan of the inverter 100 are significantly improved.

[0122] It should be noted that the terms "one embodiment," "embodiment," "exemplary embodiment," "some embodiments," etc., mentioned in the specification indicate that the described embodiment may include a specific feature, structure, or characteristic, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Moreover, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments, whether explicitly described or not, is within the knowledge scope of those skilled in the art.

[0123] Generally speaking, terms should be understood at least in part by their use in context. For example, at least in part by context, the term "one or more" as used in the text can be used to describe any feature, structure, or characteristic of the singular meaning, or a combination of features, structures, or characteristics of the plural meaning. Similarly, at least in part by context, terms such as "a" or "the" can also be understood to convey either singular or plural usage.

[0124] It should be readily understood that the terms “on,” “above,” and “on top of” in this application should be interpreted in the broadest possible sense, such that “on” means not only “directly on something” but also “on something” with an intermediate feature or layer therebetween, and that “above” or “on top of” means not only “on something” but also “on something” without an intermediate feature or layer therebetween (i.e., directly on something).

[0125] Furthermore, for ease of explanation, spatially relative terms such as "below," "below," "under," "above," and "above" may be used to describe the relationship of one element or feature relative to other elements or features as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation other than those shown in the figures. The device may have other orientations (rotated 90° or in other orientations), and the spatially relative descriptive terms used herein may be interpreted accordingly.

[0126] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. An inverter, characterized by comprising: include: Circuit board, the circuit board having connection holes; A power module, which is connected to the circuit board; A heat dissipation module is connected to the side of the power module away from the circuit board. The heat dissipation module is provided with a positioning groove, which is located adjacent to the power module. A temperature sensor is disposed in the positioning groove and connected to the circuit board through the connection hole.

2. The inverter of claim 1, wherein, The power module includes discrete components, an insulating pad, and a copper busbar. The insulating pad is disposed on the side of the heat dissipation module facing the circuit board. The discrete components are connected to the heat dissipation module, and the terminals of the discrete components are located between the insulating pad and the circuit board. The copper busbar is connected to the terminals of the discrete components.

3. The inverter of claim 2, wherein, The inverter also includes a capacitor, and the terminals include a positive terminal, a negative terminal, and an output terminal. The copper busbar includes a positive copper busbar, a negative copper busbar, and an output copper busbar. The positive terminal is connected to the positive terminal of the capacitor through the positive copper busbar, the negative terminal is connected to the negative terminal of the capacitor through the negative copper busbar, and the output terminal is connected to the output terminal of the inverter through the output copper busbar.

4. The inverter of claim 2, wherein, The heat dissipation module has multiple bosses, the discrete components are connected to the bosses, and the insulating pads are disposed between adjacent bosses.

5. The inverter of claim 4, wherein, The thickness of the boss is greater than or equal to the thickness of the insulating pad.

6. The inverter of claim 2, wherein, The circuit board is provided with conductive holes, and the inverter further includes a conductive structure. The conductive structure includes a fixing member and an elastic conductive member. The fixing member is disposed on the circuit board to connect the circuit board and the elastic conductive member. The elastic conductive member is disposed facing the conductive holes. The power module includes a signal pin, which is inserted into the conductive holes to abut against the elastic conductive member.

7. The inverter of claim 6, wherein, The copper busbar is provided with a plastic coating, and the plastic coating is provided with a support portion. The support portion is disposed in the conductive hole and abuts against the side of the signal needle away from the elastic conductive element, so as to support the signal needle when the signal needle abuts against the elastic conductive element.

8. The inverter of claim 7, wherein, The plastic-coated part is also provided with a guide portion that connects to the support portion, and the guide portion is used to guide the insertion position of the signal pin.

9. The inverter of claim 1, wherein, The inverter also includes a housing, and the heat dissipation module includes a heat dissipation substrate. The housing is provided with a heat dissipation cavity and a sealing groove. The sealing groove is arranged around the heat dissipation cavity. The heat dissipation substrate covers the heat dissipation cavity and the sealing groove. The sealing groove is filled with sealant to connect the heat dissipation substrate and the housing.

10. The inverter of claim 3, wherein, The inverter further includes a sealing assembly, a capacitor housing, and a busbar. The housing and the capacitor housing are provided with a sealing wall, and the sealing wall is provided with a sealing opening for the busbar to pass through. The sealing assembly includes a first sealing element and a second sealing element. The first sealing element is sealed and connected to one side of the sealing opening, and the busbar is inserted into the first sealing element. The second sealing element is located on the other side of the sealing opening and cooperates with the first sealing element to seal the busbar in the sealing opening.

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