Display panel

Abstract

The utility model discloses a display panel. The display panel comprises a base layer, a pixel limiting film arranged on the base layer and defining a light emitting opening part, an auxiliary electrode arranged on the pixel limiting film and defining an auxiliary electrode opening part overlapping the light emitting opening part, and a light emitting element comprising an anode, a cathode and a light emitting pattern, wherein the anode is arranged on the base layer and exposed by at least a part of the light emitting opening part, the cathode is arranged on the auxiliary electrode and the anode, and the light emitting pattern is arranged between the anode and the cathode and overlaps the light emitting opening part, and the auxiliary electrode directly contacts the light emitting pattern.

Description

Technical Field

[0001] This utility model relates to display panels, and more specifically, to display panels with improved display quality. Background Technology

[0002] Display devices that provide images to users, such as televisions, monitors, smartphones, and tablet computers, include display panels that display images. Various display panels are under development, including liquid crystal display panels, organic light emitting display panels, electrowetting display panels, and electrophoretic display panels.

[0003] An organic light-emitting display panel can include an anode, a cathode, and a light-emitting pattern. The light-emitting pattern can be separated in each light-emitting area, and the cathode can provide a common voltage to each light-emitting area. Utility Model Content

[0004] One objective of this invention is to provide a display panel with improved display quality in a display panel in which the light-emitting element is formed without the use of a metal mask.

[0005] The display panel according to this utility model includes: a base layer; a pixel defining film disposed on the base layer and defining a light-emitting opening; an auxiliary electrode disposed on the pixel defining film and defining an auxiliary electrode opening overlapping the light-emitting opening; and a light-emitting element including an anode, a cathode, and a light-emitting pattern, wherein the anode is disposed on the base layer and at least a portion is exposed by the light-emitting opening, the cathode is disposed on the auxiliary electrode and the anode, and the light-emitting pattern is disposed between the anode and the cathode and overlaps with the light-emitting opening, wherein the auxiliary electrode is in direct contact with the light-emitting pattern.

[0006] Its characteristic is that the cathode is in direct contact with the auxiliary electrode.

[0007] Its characteristic is that the cathode completely covers the upper surface of the auxiliary electrode.

[0008] Its characteristic is that the light-emitting pattern is arranged inside the opening of the auxiliary electrode.

[0009] Its characteristic is that the thickness of the auxiliary electrode is greater than the thickness of the cathode, and the auxiliary electrode is composed of one of copper (Cu), aluminum (Al), titanium (Ti), molybdenum (Mo), indium tin oxide (ITO), and indium zinc oxide (IZO).

[0010] Its characteristic may be that the auxiliary electrode has a conductivity at least higher than that of the cathode.

[0011] Its characteristic may be that the display panel further includes an inorganic encapsulation film disposed on the cathode.

[0012] The auxiliary electrode opening includes a first surface and a second surface with different widths in cross-section, the first surface being disposed on the second surface, and the width of the second surface being greater than the width of the first surface.

[0013] Its characteristic is that the first surface of the auxiliary electrode opening is separated from the light-emitting pattern.

[0014] Its characteristic may be that the luminescent pattern is in contact with a portion of the second surface.

[0015] Its feature is that a groove overlapping the pixel defining film is defined on the upper surface of the auxiliary electrode.

[0016] Its characteristic may be that a tip is defined on the first surface, protruding from the second surface toward the center of the auxiliary electrode opening.

[0017] Its characteristic may be that the tip overlaps with the light-emitting pattern.

[0018] The feature is that multiple light-emitting elements are provided, including: a first light-emitting element defining a first light-emitting region emitting light of a first color; a second light-emitting element defining a second light-emitting region emitting light of a second color different from the first color; and a third light-emitting element defining a third light-emitting region emitting light of a third color different from both the first and second colors; multiple light-emitting openings are provided, including: a first light-emitting opening overlapping the first light-emitting region; a second light-emitting opening overlapping the second light-emitting region; and a third light-emitting opening overlapping the third light-emitting region; and multiple auxiliary electrode openings are provided, including: a first auxiliary electrode opening overlapping the first light-emitting opening; a second auxiliary electrode opening overlapping the second light-emitting opening; and a third auxiliary electrode opening overlapping the third light-emitting opening.

[0019] The manufacturing method of the display panel according to the present invention includes the following steps: forming a pre-pattern including an anode, a light-emitting pattern and a sacrificial pattern on a base layer; forming an auxiliary electrode layer on a pixel defining film and the sacrificial pattern; forming a photoresist layer on the auxiliary electrode layer; etching the auxiliary electrode layer to form an auxiliary electrode; removing the photoresist layer; removing the sacrificial pattern; depositing a cathode on the upper surface of the light-emitting pattern and the auxiliary electrode; and forming an inorganic encapsulation film on the cathode.

[0020] Its characteristic is that, in the step of forming the pre-pattern, the sacrificial pattern and the luminescent pattern are formed through the same process.

[0021] Its characteristic may be that, in the step of forming the pre-pattern, the side surface of the sacrificial pattern is aligned with the side surface of the luminescent pattern.

[0022] Its characteristic may be that, in the step of forming the auxiliary electrode layer, the metal constituting the auxiliary electrode layer and the metal constituting the sacrificial pattern have different etching rates.

[0023] Its characteristic may be that, in the step of forming the photoresist layer, the photoresist layer overlaps with the pixel defining film.

[0024] Its characteristic may be that, in the step of forming the photoresist layer, a portion of the photoresist layer overlaps with the sacrificial pattern.

[0025] The electronic device according to this invention can provide images, including the display panel described above.

[0026] According to this invention, a metal layer is used as an auxiliary electrode in a display panel that does not utilize a metal mask to form the light-emitting element. This reduces the cathode resistance in medium to large-sized display panels, thereby reducing or preventing brightness spot defects. Furthermore, a separate process for forming the auxiliary electrode is unnecessary, thus reducing investment costs and time. Consequently, a display panel with improved display quality can be provided. Attached Figure Description

[0027] Figure 1a This is a perspective view of a display device according to an embodiment of the present invention.

[0028] Figure 1b This is an exploded perspective view of a display device according to an embodiment of the present invention.

[0029] Figure 2 This is a cross-sectional view of a display module according to an embodiment of the present invention.

[0030] Figure 3This is a plan view of a display panel according to an embodiment of the present invention.

[0031] Figure 4a and Figure 4b This is a plan view of a portion of the display area of ​​a display panel according to an embodiment of the present invention, enlarged.

[0032] Figure 5 This is a cross-sectional view of a display panel according to an embodiment of the present invention.

[0033] Figure 6 This is a cross-sectional view of a display panel according to an embodiment of the present invention.

[0034] Figure 7 This is a cross-sectional view of a display panel according to another embodiment of the present invention.

[0035] Figure 8 This is a cross-sectional view of a display panel according to another embodiment of the present invention.

[0036] Figures 9a to 9q This is a cross-sectional view showing a portion of the steps in a method of manufacturing a display panel according to an embodiment of the present invention.

[0037] Explanation of reference numerals in the attached figures

[0038] Detailed Implementation

[0039] In this specification, when it is mentioned that a constituent element (or region, layer, part, etc.) is "above", "connected to", or "integrated to" another constituent element (or region, layer, part, etc.), it means that it can be directly arranged to / connected to / integrated to the other constituent element (or region, layer, part, etc.), or a third constituent element (or region, layer, part, etc.) can be arranged between them.

[0040] The same reference numerals refer to the same constituent elements. Furthermore, in the drawings, the thickness, proportions, and dimensions of the constituent elements are exaggerated for the purpose of effectively illustrating the technical content. "And / or" includes more than one combination that can be defined by all relevant constituent elements.

[0041] The terms "first," "second," etc., may be used when describing multiple constituent elements, but the constituent elements are not limited to these terms. These terms are used only to distinguish one constituent element from another. For example, without departing from the scope of this utility model, a first constituent element may be named a second constituent element, and similarly, a second constituent element may be named a first constituent element. Unless otherwise expressly stated in the context, singular expressions include plural expressions.

[0042] Furthermore, terms such as "below," "below," "above," and "on top" are used to describe the relationships between the constituent elements shown in the accompanying drawings. These terms are relative concepts and are explained based on the directions shown in the drawings.

[0043] Terms such as “including” or “having” should be understood as specifying the presence of features, figures, steps, operations, constituent elements, components or combinations thereof described in the specification, rather than pre-excluding the presence or additional possibilities of one or more other features or figures, steps, operations, constituent elements, components or combinations thereof.

[0044] Unless otherwise defined, all terms used in this specification (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. Furthermore, terms such as those defined in common dictionaries shall be interpreted as having the same meaning as they have in the context of the relevant art, and shall not be interpreted as having overly ideal or formal meanings unless expressly defined herein.

[0045] The embodiments of the present invention will now be described with reference to the accompanying drawings.

[0046] Figure 1a This is a perspective view of a display device DD according to an embodiment of the present invention. Figure 1b This is an exploded perspective view of a display device DD according to an embodiment of the present invention.

[0047] In one embodiment, the display device DD can be a large electronic device such as a television, monitor, or external billboard. Alternatively, the display device DD can be a small to medium-sized electronic device such as a personal computer, laptop computer, personal digital terminal, car navigation unit, game console, smartphone, tablet computer, and camera. However, this is exemplary, and other display devices can be used without departing from the concept of this invention. Figure 1a and Figure 1b The illustration exemplarily depicts a scenario where the display device DD is a tablet computer device.

[0048] Reference Figure 1aand Figure 1b The display device DD can display an image IM on a display surface FS that is parallel to both the first direction DR1 and the second direction DR2, facing a third direction DR3. The third direction DR3 can be the normal direction of the plane defined by the first direction DR1 and the second direction DR2. The image IM can include both dynamic and static images. Figure 1a In the illustration, the clock window and icon are shown as an example of an image IM. The display surface FS that displays the image IM can correspond to the front surface of the display device DD.

[0049] In this embodiment, the front surface (or upper surface) and back surface (or lower surface) of each component are defined based on the direction of the displayed image IM. The front surface and back surface may face each other on a third direction DR3, and the normal directions of the front surface and back surface may be parallel to the third direction DR3. Furthermore, the directions indicated by the first direction DR1 to the third direction DR3 are relative concepts and can be converted to other directions. In this specification, "on a plane" may refer to the situation when viewed on the third direction DR3.

[0050] The display device DD may include a window WP, a display module DM, and a housing HAU. The window WP and the housing HAU can be combined to form the appearance of the display device DD and protect the display module DM.

[0051] The window WP may include an optically transparent insulating material. For example, the window WP may include glass or plastic. The front surface of the window WP may define the display surface FS of the display device DD. The display surface FS may include a transmissive region TA and a bezel region BZA. The transmissive region TA may be an optically transparent region. For example, the transmissive region TA may be a region with a visible light transmittance of approximately 90% or more.

[0052] The border region BZA can be a region with relatively low light transmittance compared to the transmissive region TA. The border region BZA can define the shape of the transmissive region TA. The border region BZA can be adjacent to and surround the transmissive region TA. However, this is an exemplary illustrated scenario; the border region BZA of the window WP may only be partially adjacent to one side of the transmissive region TA, and the border region BZA in the window WP may also be omitted. Additionally, although not illustrated, the window WP may include at least one functional layer selected from an anti-fingerprint layer, a hard coating layer, and an anti-reflective layer, but is not limited to any particular embodiment.

[0053] The display module DM can be arranged at the bottom of the window WP. The display module DM can be the component that actually generates the image IM. The image IM generated by the display module DM is displayed on the display surface IS of the display module DM and can be recognized by the user from the outside through the transmission area TA.

[0054] The display module DM may include a display area DA and a non-display area NDA. The display area DA may be an area activated by an electrical signal. The non-display area NDA may be adjacent to the display area DA. The non-display area NDA may surround the display area DA. As the non-display area NDA is covered by the border area BZA, it may not be recognizable from the outside.

[0055] The housing HAU can be combined with the window WP. The housing HAU can be combined with the window WP to provide a predetermined internal space. The display module DM can be accommodated in the internal space.

[0056] The housing HAU can include materials with relatively high rigidity. For example, the housing HAU can include multiple frames and / or plates made of glass, plastic, or metal, or combinations thereof. The housing HAU can stably protect the structure of the display device DD housed within the internal space from external impacts.

[0057] Figure 2 This is a cross-sectional view of a display module DM according to an embodiment of the present invention.

[0058] Reference Figure 2 The display module DM may include a display panel DP and an input sensor INS. Although not shown separately, a display device DD (see reference 1) according to an embodiment of the present invention is shown. Figure 1a It may also include a protective component disposed on the lower surface of the display panel DP or an anti-reflective component and / or a window component disposed on the upper surface of the input sensor INS.

[0059] The display panel DP can be a light-emitting display panel. For example, the display panel DP can be an organic light-emitting display panel or an inorganic light-emitting display panel. The light-emitting layer in an organic light-emitting display panel can include organic light-emitting materials. The light-emitting layer in an inorganic light-emitting display panel can include quantum dots, quantum rods, or micro LEDs. However, this is exemplary and not particularly limited thereto. Hereinafter, the display panel DP is described as an organic light-emitting display panel.

[0060] The display panel DP may include a base layer BL, a circuit element layer DP-CL disposed on the base layer BL, a display element layer DP-OLED, and a thin-film encapsulation layer TFE. The input sensor INS may be directly disposed on the thin-film encapsulation layer TFE. In this specification, "component A is directly disposed on component B" means that no adhesive layer is disposed between component A and component B. However, this is an exemplary illustrated scenario; the input sensor INS may be attached to the display panel DP by a separate adhesive layer, or it may be disposed within the display panel DP, or it may be omitted, and is not limited to any particular embodiment.

[0061] The base layer BL can be a substrate layer used to form the circuit element layer DP-CL, the display element layer DP-OLED, and the thin-film encapsulation layer TFE. The base layer BL has insulating properties. For example, the base layer BL may include at least one plastic film. The base layer BL may include a plastic substrate, glass substrate, metal substrate, or organic / inorganic composite material substrate, etc., as a flexible substrate. Figure 1b The display area DA and the non-display area NDA described herein can be defined identically in the base layer BL.

[0062] The circuit element layer DP-CL is disposed on the base layer BL. The circuit element layer DP-CL may include at least one circuit element and an insulating layer. The insulating layer includes at least one inorganic layer and at least one organic layer. The circuit element includes signal lines, pixel driving circuits, etc.

[0063] The display element layer DP-OLED is disposed on the circuit element layer DP-CL. The display element layer DP-OLED may include a light-emitting element ED (see reference). Figure 5 A light-emitting element (ED) may include an anode, an intermediate layer, and a cathode.

[0064] The thin-film encapsulation layer (TFE) may include multiple thin films. These films may include inorganic and / or organic layers, each of which may be a single layer or multiple layers. The TFE encapsulation layer can protect the light-emitting element (ED) or improve the luminous efficiency of the ED.

[0065] An input sensor INS is disposed on the display panel DP. The input sensor INS acquires the coordinate information of external input. The input sensor INS may have a multi-layer structure. The input sensor INS may include a single layer or multiple layers of conductive layers. In addition, the input sensor INS may include a single layer or multiple layers of insulating layers. In this embodiment, the input sensor INS can sense external input capacitively. However, this is exemplary and not limited to this. For example, in one embodiment, the input sensor INS may also sense external input by electromagnetic induction or pressure sensing. In another embodiment of this invention, the input sensor INS may be omitted.

[0066] Figure 3 This is a plan view of a display panel according to an embodiment of the present invention. For ease of explanation, in Figure 3 The diagram below briefly illustrates a portion of the components of a display panel (DP).

[0067] Reference Figure 3 The display panel DP may include pixels PX, signal lines SGL, driving circuit GDC, and pad PLD. The display panel DP may include pixels PX, signal lines SGL electrically connected to the pixels PX, driving circuit GDC, and pad PLD.

[0068] Pixels PX can be arranged in the display area DA. Pixels PX can be arranged along a first direction DR1 and a second direction DR2. Pixels PX can include multiple pixel rows extending along the first direction DR1 and arranged along the second direction DR2, and multiple pixel columns extending along the second direction DR2 and arranged along the first direction DR1.

[0069] Each pixel PX may include a light-emitting element and pixel circuitry for driving the light-emitting element. The light-emitting element may include an organic light-emitting diode (OLED), and the pixel circuitry may include at least one transistor and a capacitor connected to the light-emitting element.

[0070] The signal line SGL may include gate line GL, data line DL, power line PL, and control signal line CSL. Each of the gate lines GL can be connected to a corresponding pixel in pixel PX, and each of the data lines DL can be connected to a corresponding pixel in pixel PX. The power line PL can be electrically connected to pixel PX. The control signal line CSL can be connected to the drive circuit GDC to provide control signals to the drive circuit GDC.

[0071] The driving circuit GDC may include a gate driving circuit. The gate driving circuit can generate a gate signal and sequentially output the generated gate signal to the gate line GL. The gate driving circuit can also output another control signal to the pixel driving circuit.

[0072] The pad portion PLD can be a portion connecting to a circuit board (not shown). The pad portion PLD can include pixel pads D-PDs, which can be pads used to connect the flexible circuit board to the display panel DP. Each of the pixel pads D-PDs can be connected to a corresponding signal line in the signal line SGL. One of the pixel pads D-PDs is connected to the control signal line CSL to transmit control signals to the drive circuit GDC. A portion of the pixel pads D-PDs is connected to the data line DL to transmit data signals to each of the pixels PX.

[0073] In addition, the pad portion PLD may also include an input pad. The input pad can be used to connect the circuit board to the input sensor INS (see reference). Figure 2 The input pad can be placed on the input sensor INS (see reference). However, it is not limited to this; the input pad can also be placed on the input sensor INS (see reference). Figure 2 The circuit board is connected to the pixel pad D-PD. Alternatively, the input sensor INS (see...) Figure 2 The input pad can be omitted, and it is not necessary to further include it.

[0074] Figure 4a and Figure 4b This is an enlarged plan view of a portion of a display panel according to an embodiment of the present invention. Figure 4a and Figure 4b The enlarged illustration shows the display panel DP (see reference). Figure 2 It is part of the display area DA. Figure 4a The diagram is from the display module DM (reference). Figure 1b The display surface IS (refer to) Figure 1b The plane of the pixel-defined film PDL, as observed later, is shown above. Figure 4b The diagram is from the display module DM (reference). Figure 1b The display surface IS (refer to) Figure 1b The plane of the auxiliary electrode SE observed on the screen.

[0075] Reference Figure 4a and Figure 4b The display area DA may include a first light-emitting area PXA-R, a second light-emitting area PXA-G, a third light-emitting area PXA-B, and a peripheral area NPXA. The peripheral area NPXA may be the area surrounding the first light-emitting area PXA-R to the third light-emitting area PXA-B. The first light-emitting area PXA-R to the third light-emitting area PXA-B may each correspond to the area emitting light provided from the light-emitting element.

[0076] The first emitting region PXA-R to the third emitting region PXA-B can each provide a first color light to a third color light with different colors from each other. For example, the first color light can be red light, the second color light can be green light, and the third color light can be blue light. However, the examples of the first color light to the third color light are not necessarily limited to the examples described above.

[0077] The peripheral area NPXA can set the boundary between the first light-emitting area PXA-R and the third light-emitting area PXA-B, and can prevent color mixing between the first light-emitting area PXA-R and the third light-emitting area PXA-B.

[0078] Each of the first light-emitting areas PXA-R to the third light-emitting areas PXA-B can be configured as multiple, and can be repeatedly arranged in a predetermined pattern within the display area DA. For example, the first light-emitting areas PXA-R and the third light-emitting areas PXA-B can be arranged alternately along the first direction DR1 to form a "first group". The second light-emitting areas PXA-G can be arranged along the first direction DR1 to form a "second group". The "first group" and the "second group" can each be configured as multiple, and the "first group" and the "second group" can be arranged alternately along the second direction DR2.

[0079] A second luminescent region PXA-G can be arranged separately from a first luminescent region PXA-R or a third luminescent region PXA-B in the fourth direction DR4. The fourth direction DR4 can be defined as the direction between the first direction DR1 and the second direction DR2.

[0080] in addition, Figure 4a and Figure 4b The illustration exemplarily depicts the arrangement of the first light-emitting regions PXA-R to the third light-emitting regions PXA-B, but is not limited to this, and can be arranged in various configurations. In one embodiment, the first light-emitting regions PXA-R to the third light-emitting regions PXA-B can have the pentylene pattern shown in Figure 4. ® Arrangement pattern. Alternatively, the first luminescent region PXA-R to the third luminescent region PXA-B can also have a stripe arrangement or a diamond pixel arrangement. ® Arrangement pattern.

[0081] The first luminous region PXA-R to the third luminous region PXA-B can have various shapes on a plane. For example, the first luminous region PXA-R to the third luminous region PXA-B can have polygonal, circular, or elliptical shapes. Figure 4a , Figure 4bThe illustrations exemplarily depict a first light-emitting region PXA-R and a third light-emitting region PXA-B having a quadrilateral shape (or a rhombus shape) on a plane, and a second light-emitting region PXA-G having an octagonal shape.

[0082] The first luminescent region PXA-R to the third luminescent region PXA-B may have the same shape as each other on a plane, or at least some of them may have different shapes from each other. Figure 4a and Figure 4b An exemplary illustration shows a first light-emitting region PXA-R and a third light-emitting region PXA-B having the same shape as each other on a plane, and a second light-emitting region PXA-G having a different shape from the first light-emitting region PXA-R and the third light-emitting region PXA-B.

[0083] At least a portion of the first emitting region PXA-R to the third emitting region PXA-B may have different areas on a plane. In one embodiment, the area of ​​the first emitting region PXA-R emitting red light may be larger than the area of ​​the second emitting region PXA-G emitting green light, and may be smaller than the area of ​​the third emitting region PXA-B emitting blue light. However, the size relationship of the areas of the first emitting region PXA-R to the third emitting region PXA-B according to the emitted light color is not limited to this, and can be determined according to the display module DM (refer to...). Figure 2 The design becomes diverse. Furthermore, it is not limited to this; the first light-emitting region PXA-R to the third light-emitting region PXA-B can also have the same area on the plane.

[0084] In addition, the display module DM of this utility model (see reference) Figure 2 The shape, area, and arrangement of the first light-emitting area PXA-R to the third light-emitting area PXA-B can be determined based on the color of the emitted light or the display module DM (see reference). Figure 2 The size and composition of the components are designed to be diverse and not limited to Figure 4a and Figure 4b The example shown.

[0085] Reference Figure 4a In a pixel-defined film (PDL), a light-emitting opening (PDL-OP) can be defined. The light-emitting opening (PDL-OP) can correspond to each light-emitting region. Each of the light-emitting regions can be substantially defined by a light-emitting opening (PDL-OP). A detailed explanation of this will follow.

[0086] Reference Figure 4bAn auxiliary electrode opening SE-OP can be defined within the auxiliary electrode SE. The auxiliary electrode opening SE-OP can correspond to the light-emitting opening PDL-OP. That is, the auxiliary electrode opening SE-OP can have a shape similar to the light-emitting opening PDL-OP in a plane. The auxiliary electrode opening SE-OP can have an area similar to or substantially the same as the area of ​​the light-emitting opening PDL-OP.

[0087] Figure 5 This is a cross-sectional view of a display panel DP according to an embodiment of the present invention, along... Figure 3 A cross-sectional view taken from the I-I' line.

[0088] The display panel (DP) can include a base layer (BL), a circuit element layer (DP-CL), and a display element layer (DP-OLED).

[0089] The display panel (DP) can include multiple insulating layers and semiconductor patterns, conductive patterns, signal lines, etc. The insulating, semiconductor, and conductive layers are formed by methods such as coating and deposition. Then, the insulating, semiconductor, and conductive layers can be selectively patterned using photolithography and etching. This method can be used to form semiconductor patterns, conductive patterns, signal lines, etc., included in the circuit element layer (DP-CL) and the display element layer (DP-OLED).

[0090] The circuit element layer DP-CL can be arranged on the base layer BL. The circuit element layer DP-CL may include a buffer layer BFL, a transistor TR, a signal transmission line SCL, first insulating layers 10 to fifth insulating layers 50, an upper electrode EE, and multiple connection electrodes CNE1 and CNE2. For ease of explanation, in... Figure 5 The diagram illustrates the transistor TR, signal transmission line SCL, and multiple connection electrodes CNE1 and CNE2 in the driving element, and also shows the first insulating layer 10 to the fifth insulating layer 50 stacked sequentially. However, this is an exemplary illustration; the configuration or arrangement of the driving elements constituting the circuit element layer DP-CL can be varied and is not limited to any particular embodiment.

[0091] A buffer layer (BFL) can be disposed on the base layer (BL). The buffer layer (BFL) can improve the adhesion between the base layer (BL) and the semiconductor pattern. The buffer layer (BFL) may include a silicon oxide layer and / or a silicon nitride layer. In the case where the buffer layer (BFL) includes a silicon oxide layer and a silicon nitride layer, the two layers can be stacked alternately.

[0092] The transistor TR, multiple connecting electrodes CNE1, CNE2, and first insulating layers 10 to fifth insulating layers 50 can be disposed on the buffer layer BFL. The first insulating layers 10 to fifth insulating layers 50 can be inorganic or organic layers.

[0093] A first insulating layer 10 can be disposed on a buffer layer BFL. The first insulating layer 10 can cover the source region SE', active region AC, drain region DE, and signal transmission line SCL of the transistor TR disposed on the buffer layer BFL. The gate electrode GT of the transistor TR can be disposed on the first insulating layer 10. A second insulating layer 20 can be disposed on the first insulating layer 10 and cover the gate electrode GT. An upper electrode EE can be disposed on the second insulating layer 20. A third insulating layer 30 can be disposed on the second insulating layer 20 and cover the upper electrode EE.

[0094] A transistor TR may include a semiconductor pattern and a gate electrode GT.

[0095] Semiconductor patterns can be disposed on the buffer layer BFL. The semiconductor patterns can include polycrystalline silicon. However, they are not limited to this; the semiconductor patterns can also include amorphous silicon or metal oxide. Figure 5 The semiconductor pattern shown is only a partial illustration; at least one semiconductor pattern may also be arranged within the multiple light-emitting regions PXA-R, PXA-G, and PXA-B (see Figure 4). The semiconductor pattern may include multiple regions divided according to conductivity.

[0096] The semiconductor pattern may include a source region SE', an active region AC, and a drain region DE. The active region AC may be a region with a conductivity relatively lower than that of the source region SE' and the drain region DE. The source region SE' and the drain region DE may be arranged such that the active region AC is placed between them and separated from each other.

[0097] The gate electrode GT can be disposed between the first insulating layer 10 and the second insulating layer 20. The gate electrode GT is arranged to overlap with the active region AC in the semiconductor pattern. In this embodiment, the top gate structure of the transistor TR is illustrated exemplary. However, this is an exemplary illustrated case, and the gate electrode GT can also be disposed on the underside of the semiconductor pattern, and is not limited to any particular embodiment.

[0098] The signal transmission line (SCL) can be conductive. In this embodiment, the signal transmission line (SCL) and the semiconductor pattern are arranged on the same layer. For example, the signal transmission line (SCL) can be formed simultaneously with the semiconductor pattern. In this case, the signal transmission line (SCL) can be formed into a highly conductive region by performing a doping process on the semiconductor pattern. By simultaneously forming the semiconductor pattern of the signal transmission line (SCL) and the transistor (TR), the process can be simplified and the process cost reduced. However, this is an exemplary illustration, and the signal transmission line (SCL) can be formed by patterning a conductive material such as a metal different from the semiconductor pattern, or it can be formed on a layer different from the semiconductor pattern, and is not limited to any one embodiment.

[0099] In this embodiment, the circuit element layer DP-CL may further include an upper electrode EE. The upper electrode EE is disposed between the second insulating layer 20 and the third insulating layer 30. The second insulating layer 20 may be a layer covering the transistor TR.

[0100] The upper electrode EE may at least partially overlap with the gate electrode GT. The upper electrode EE may form a capacitor with the gate electrode GT. The capacitor may be a storage capacitor constituting a pixel circuit. According to the present invention, by further including the upper electrode EE, the capacitor and the transistor TR can be arranged to overlap in a plane, thereby improving the integration of the pixel circuit and making the design of high-resolution display panels easier. However, this is an exemplary illustrated scenario, and the capacitor may be formed at a location that does not overlap with the transistor TR, or the upper electrode EE and the gate electrode GT may not form a capacitor, or the upper electrode EE may be omitted, and the invention is not limited to any particular embodiment.

[0101] The first connecting electrode CNE1 is disposed between the third insulating layer 30 and the fourth insulating layer 40. The third insulating layer 30 covers the upper electrode EE. The third insulating layer 30 can be an inorganic layer, and the fourth insulating layer 40 can be an organic layer, but is not limited thereto. The first connecting electrode CNE1 can penetrate from the first insulating layer 10 to the third insulating layer 30 and be connected to the signal transmission line SCL.

[0102] The second connecting electrode CNE2 is disposed between the fourth insulating layer 40 and the fifth insulating layer 50. The second connecting electrode CNE2 can penetrate the fourth insulating layer 40 and be connected to the signal transmission line SCL. The signal flowing in the signal transmission line SCL can be transmitted to the display element layer DP-OLED through the first connecting electrode CNE1 and the second connecting electrode CNE2.

[0103] The display element layer DP-OLED can be arranged on the circuit element layer DP-CL. The display element layer DP-OLED may include a pixel defining film PDL, an auxiliary electrode SE, and a light-emitting element ED.

[0104] A pixel-defining film (PDL) can be disposed on the fifth insulating layer 50 of the circuit element layer DP-CL. A light-emitting opening (PDL-OP) can be defined (or has) in the pixel-defining film PDL. The light-emitting opening (PDL-OP) can correspond to the anode AE, and the pixel-defining film PDL can expose at least a portion of the anode AE ​​through the light-emitting opening (PDL-OP).

[0105] The pixel-defined film (PDL) may include inorganic insulating materials. For example, it may include silicon nitride (SiNx, or silicon nitride).

[0106] The light-emitting element ED may include an anode AE ​​(or a first electrode), a light-emitting pattern EP, and a cathode CE (or a second electrode).

[0107] The anode AE ​​can be disposed on the fifth insulating layer 50 of the circuit element layer DP-CL. The anode AE ​​can be a transmissive electrode, a semi-transmissive electrode, or a reflective electrode. The anode AE ​​can be connected to the second connecting electrode CNE2 via a connection contact hole CNT-3 defined through the fifth insulating layer 50. Therefore, the anode AE ​​can be electrically connected to the signal transmission line SCL through the first connecting electrode CNE1 and the second connecting electrode CNE2, thereby being electrically connected to the corresponding circuit element. The anode AE ​​can include a single-layer structure or a multi-layer structure. The anode AE ​​can include multiple layers containing ITO and Ag. For example, the anode AE ​​can include a layer L1 containing ITO (hereinafter, the lower ITO layer), a layer L2 containing Ag disposed on the lower ITO layer (hereinafter, the Ag layer), and a layer L3 containing ITO disposed on the Ag layer (hereinafter, the upper ITO layer). However, it is not limited to this, the anode AE ​​can also be configured as a single layer.

[0108] The luminescent pattern EP can be disposed on the anode AE. The luminescent pattern EP may include a luminescent layer containing a luminescent material. The luminescent pattern EP may also include a hole injection layer (HIL) and a hole transport layer (HTL) disposed between the anode AE ​​and the luminescent layer, and may further include an electron transport layer (ETL) and an electron injection layer (EIL) disposed on the luminescent layer. The luminescent pattern EP may be referred to as an "organic layer" or an "intermediate layer."

[0109] The light-emitting pattern EP can be disposed inside the light-emitting opening PDL-OP and the auxiliary electrode opening SE-OP, which will be described later. However, this is an exemplary illustrated case and is not limited thereto. The light-emitting pattern EP can cover a portion of the upper surface of the pixel-defining film PDL.

[0110] The cathode (CE) can be arranged on the light-emitting pattern (EP). At least a portion of the cathode (CE) can be arranged within the auxiliary electrode opening (SE-OP). Figure 5 The illustration exemplarily depicts a scenario where the cathode (CE) is arranged within the light-emitting opening (PDL-OP) and the auxiliary electrode opening (SE-OP), but is not limited thereto. For example, the cathode (CE) may be arranged only within the auxiliary electrode opening (SE-OP).

[0111] The cathode CE can completely cover the upper surface of the auxiliary electrode SE. More specifically, the cathode CE can completely cover the first surface IS1 of the auxiliary electrode opening SE-OP, the second surface IS2 of the auxiliary electrode opening SE-OP, and the lower surface of the tip TIP defined in the auxiliary electrode SE.

[0112] The cathode (CE) can be conductive. For the cathode (CE), as long as it can be conductive (such as a metal, a transparent conductive oxide (TCO), or a conductive polymer), it can be formed using a variety of materials. For example, the cathode (CE) can include silver (Ag), magnesium (Mg), lead (Pb), copper (Cu), or compounds thereof.

[0113] The auxiliary electrode SE can be disposed on the pixel-defining film PDL. The auxiliary electrode SE can be in direct contact with the light-emitting pattern EP. More specifically, the auxiliary electrode SE can be in direct contact with both side surfaces of the light-emitting pattern EP.

[0114] A groove GRV overlapping the surrounding region NPXA can be defined on the upper surface of the auxiliary electrode SE. The groove GRV can be a portion defined on the upper surface of the auxiliary electrode SE and recessed towards the pixel defining film PDL. The groove GRV can be formed overlapping the pixel defining film PDL on a plane.

[0115] An auxiliary electrode opening SE-OP, overlapping with the light-emitting opening PDL-OP, can be formed in the auxiliary electrode SE. The auxiliary electrode opening SE-OP can be defined by the inner surface of the auxiliary electrode SE. The inner surface can form a step difference in the cross-section. That is, the inner surface of the auxiliary electrode opening SE-OP can be divided into a first surface IS1 and a second surface IS2 forming a step difference. Compared to the second surface IS2, the first surface IS1 can be further away from the pixel-defining film PDL and separated from it. The second surface IS2 can be separated from the light-emitting pattern EP in the cross-section.

[0116] Compared to the first surface IS1, the second surface IS2 can be located closer to the pixel-defining film PDL. The second surface IS2 can be located below the first surface IS1. At least a portion of the second surface IS2 can contact the light-emitting pattern EP. The width of the auxiliary electrode opening SE-OP defined by the first surface IS1 can be different from the width of the auxiliary electrode opening SE-OP defined by the second surface IS2. The width of the auxiliary electrode opening SE-OP defined by the second surface IS2 can be greater than the width of the auxiliary electrode opening SE-OP defined by the first surface IS1.

[0117] A tip (TIP) can be defined in the auxiliary electrode opening SE-OP. That is, the first surface IS1 can define a tip TIP that protrudes from the second surface IS2 toward the center of the auxiliary electrode opening SE-OP. The tip TIP can overlap with the light-emitting pattern EP in a plane, or it can be separated from the light-emitting pattern EP in a cross-section.

[0118] The auxiliary electrode SE can have a thickness greater than that of the cathode CE. Furthermore, the auxiliary electrode SE can have a conductivity at least higher than that of the cathode CE. The auxiliary electrode SE can include a conductive material. For example, the conductive material can include metals, transparent conductive oxides (TCOs), or combinations thereof. For example, metals can include gold (Au), silver (Ag), aluminum (Al), magnesium (Mg), lithium (Li), molybdenum (Mo), titanium (Ti), copper (Cu), or alloys thereof. Transparent conductive oxides can include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (Zinc Oxide), indium oxide (Indium Oxide), indium gallium oxide (Indium Gallium Oxide), indium gallium zinc oxide (IGZO), or aluminum zinc oxide (Aluminum Zinc Oxide).

[0119] The auxiliary electrode SE can be in direct contact with the cathode CE, and the auxiliary electrode SE and the cathode CE can be electrically connected to each other. The auxiliary electrode is arranged in the peripheral area NPXA, therefore it can be configured without thickness limitations. By using this auxiliary electrode SE to reduce the resistance of the cathode CE of the display panel DP, brightness spot defects that may occur as the area of ​​the display area DA increases can be reduced or prevented. Furthermore, since the auxiliary electrode SE is in contact with the cathode CE during its formation, separate connection processes such as laser drilling or forming contact holes can be omitted. Therefore, the process can be simplified and process costs reduced.

[0120] The display element layer of a DP-OLED can also include an inorganic encapsulation film, TFE'. Figure 5 The illustration exemplarily depicts a DP-OLED display element layer including an inorganic encapsulation film TFE', but the embodiment is not limited thereto, and the inorganic encapsulation film TFE' may also be omitted.

[0121] The inorganic encapsulation film TFE' can be disposed on the DP-OLED display element layer. The inorganic encapsulation film TFE' protects the DP-OLED display element layer from foreign matter such as moisture, oxygen, and dust particles. The inorganic encapsulation film TFE' can have a single-layer structure or a multi-layer structure stacked on a third-direction DR3. In other words, the inorganic encapsulation film TFE' can be configured as a single-layer inorganic film or can have a multi-layer inorganic film stacked structure. The inorganic encapsulation film TFE' protects the DP-OLED display element layer from moisture and oxygen. The inorganic encapsulation film TFE' can include silicon nitride layers, silicon oxide nitride layers, silicon oxide layers, titanium oxide layers, or aluminum oxide layers, etc.

[0122] The inorganic encapsulation film TFE' can cover the groove GRV defined in the auxiliary electrode SE. The inorganic encapsulation film TFE' can cover the upper surface of the tip TIP, the first surface IS1 of the auxiliary electrode opening SE-OP, and the second surface IS2 of the auxiliary electrode opening SE-OP.

[0123] Figure 6 This is a cross-sectional view of a display panel DP according to an embodiment of the present invention. Hereinafter, when referring to... Figure 6 When making an explanation, regarding the relationship with Figure 5 The same / similar components described herein shall be referred to by the same / similar reference numerals, and repeated descriptions shall be omitted.

[0124] Reference Figure 6 The first light-emitting element ED1, the second light-emitting element ED2, and the third light-emitting element ED3 can be respectively arranged in the first light-emitting opening PDL-OP1, the second light-emitting opening PDL-OP2, and the third light-emitting opening PDL-OP3. The first light-emitting element ED1 to the third light-emitting element ED3 are illustrated exemplarily as emitting light of different colors, so the first light-emitting region PXA-R to the third light-emitting region PXA-B can be regions that display different lights from each other.

[0125] The auxiliary electrode opening SE-OP may include a first auxiliary electrode opening SE-OP1, a second auxiliary electrode opening SE-OP2, and a third auxiliary electrode opening SE-OP3 that overlap with the first light-emitting opening PDL-OP1 to the third light-emitting opening PDL-OP3, respectively.

[0126] Reference Figure 6 The auxiliary electrode SE may include a groove GRV that overlaps with the surrounding region NPXA. The groove GRV may be a portion defined on the upper surface of the auxiliary electrode SE and recessed towards the pixel defining film PDL. The groove GRV may be formed overlapping with the pixel defining film PDL.

[0127] The auxiliary electrode SE may include a tip TIP that protrudes toward the first light-emitting region PXA-R to the third light-emitting region PXA-B, respectively. The tip TIP may be a portion defined on the inner surface of the auxiliary electrode SE as described above and protruding toward the center of the first light-emitting region PXA-R to the third light-emitting region PXA-B.

[0128] exist Figure 6 The illustration exemplarily depicts the auxiliary electrode SE being disposed in both the region between the first light-emitting region PXA-R and the second light-emitting region PXA-G, and the region between the second light-emitting region PXA-G and the third light-emitting region PXA-B. However, it is not limited to this; the auxiliary electrode SE may be disposed only in the region between the first light-emitting region PXA-R and the second light-emitting region PXA-G, or only in the region between the second light-emitting region PXA-G and the third light-emitting region PXA-B.

[0129] Figure 7 This is a cross-sectional view of a display panel DP according to another embodiment of the present invention. Hereinafter, when referring to... Figure 7 When making an explanation, regarding the relationship with Figure 5 and Figure 6 The same / similar components described herein shall be referred to by the same / similar reference numerals, and repeated descriptions shall be omitted.

[0130] Reference Figure 7 The auxiliary electrode opening SE-OP can have a shape with a uniform width in cross-section. That is, the auxiliary electrode opening SE-OP can have... Figure 5 The shape shown is where the tip (TIP) or step difference has been removed. In this case, the inner surface of the auxiliary electrode opening (SE-OP) can be configured as a surface without a step difference. The inner surface of the auxiliary electrode opening (SE-OP) can be aligned in a row with the side surface of the light-emitting pattern (EP) in the cross-section.

[0131] Additionally, the inner surface of the auxiliary electrode opening SE-OP may include a portion that does not contact the light-emitting pattern EP. That is, the inner surface may include a portion that contacts the light-emitting pattern EP in cross-section and a portion exposed from the light-emitting pattern EP.

[0132] Reference Figure 7The auxiliary electrode SE may include a recessed groove GRV that overlaps with the surrounding region NPXA. The recessed groove GRV may be a portion defined on the upper surface of the auxiliary electrode SE and recessed towards the pixel defining film PDL. The recessed groove GRV may be formed overlapping with the pixel defining film PDL. The recessed groove GRV may overlap with the pixel defining film PDL but not with the light-emitting opening PDL-OP defined in the pixel defining film PDL.

[0133] The upper surface SE-US of the auxiliary electrode SE can be separated from the upper surface EP-US of the light-emitting pattern EP by a predetermined distance G1. The upper surface SE-US of the auxiliary electrode SE can protrude from the upper surface EP-US of the light-emitting pattern EP.

[0134] The cathode CE can completely cover the upper surface SE-US of the auxiliary electrode SE and the upper surface EP-US of the light-emitting pattern EP. In this case, as a step difference is formed between the adjacent areas of the auxiliary electrode SE and the light-emitting pattern EP, the cathode CE can also include the portion that forms the step difference.

[0135] Figure 8 This is a cross-sectional view of a display panel DP according to another embodiment of the present invention. Hereinafter, when referring to... Figure 8 When making an explanation, regarding the relationship with Figure 5 and Figure 6 The same / similar components described herein shall be referred to by the same / similar reference numerals, and repeated descriptions shall be omitted.

[0136] Reference Figure 8 The auxiliary electrode opening SE-OP can have a shape with a uniform width in cross-section. That is, the auxiliary electrode opening SE-OP can have... Figure 5 The shape shown is where the tip (TIP) or step difference has been removed. In this case, the inner surface of the auxiliary electrode opening (SE-OP) can be configured as a surface without a step difference. The inner surface of the auxiliary electrode opening (SE-OP) can be aligned in a row with the side surface of the light-emitting pattern (EP) in the cross-section.

[0137] Additionally, the inner surface of the auxiliary electrode opening SE-OP may include a portion that does not contact the light-emitting pattern EP. That is, the inner surface may include a portion that contacts the light-emitting pattern EP in cross-section and a portion exposed from the light-emitting pattern EP.

[0138] Reference Figure 8 The upper surface SE-US of the auxiliary electrode SE can be a flat surface. That is, the upper surface SE-US of the auxiliary electrode SE can have a straight line shape along the first direction DR1 or the second direction DR2 in the cross section, and has a shape without the aforementioned groove GRV, etc. The upper surface SE-US of the auxiliary electrode SE may not form a stepped difference.

[0139] The upper surface SE-US of the auxiliary electrode SE can be separated from the upper surface EP-US of the light-emitting pattern EP by a predetermined distance G2. The upper surface SE-US of the auxiliary electrode SE can protrude from the upper surface EP-US of the light-emitting pattern EP. The inner surface of the auxiliary electrode opening SE-OP may include a portion that does not contact the light-emitting pattern EP. More specifically, due to the inner surface of the auxiliary electrode opening SE-OP that does not contact the light-emitting pattern EP, a step difference can be formed between the adjacent regions of the auxiliary electrode SE and the light-emitting pattern EP.

[0140] The cathode CE can completely cover the upper surface SE-US of the auxiliary electrode SE and the upper surface EP-US of the light-emitting pattern EP. In this case, as a step difference is formed between the adjacent areas of the auxiliary electrode SE and the light-emitting pattern EP, the cathode CE can also include the portion that forms the step difference.

[0141] Figures 9a to 9q This is a cross-sectional view illustrating a portion of the steps in a method for manufacturing a display panel (DP) according to an embodiment of the present invention. (When described...) Figures 9a to 9q Then, refer to Figure 1 to... Figure 8 Identical or similar components are described using the same or similar reference numerals, and repeated descriptions are omitted.

[0142] pass Figures 9a to 9q The resulting display panel DP can correspond to Figure 6 DP display panel.

[0143] Reference Figure 9a The manufacturing method of the display panel DP of this utility model may include the step of providing a pre-display panel DP-I. In this embodiment, the pre-display panel DP-I may include a base layer BL, a circuit element layer DP-CL, an anode AE, and a pixel defining film PDL.

[0144] An anode AE ​​can be formed by sequentially stacking a first to a third conductive layer through a coating / deposition process, and then patterning the stacked conductive layers in one step. For example, ITO, Al, and ITO can be sequentially deposited on the entire surface of the circuit element layer DP-CL, and then patterned using a mask to form the anode AE. However, this is an exemplary illustration, and the number of layers constituting the anode AE ​​is not limited, nor is it limited to any particular embodiment.

[0145] Although not illustrated, the circuit element layer DP-CL can be formed by a general circuit element manufacturing process, which involves forming an insulating layer, a semiconductor layer, and a conductive layer by means of coating, deposition, etc., and selectively patterning the insulating layer, semiconductor layer, and conductive layer by means of photolithography and etching processes to form semiconductor patterns, conductive patterns, signal lines, etc.

[0146] Then, refer to Figure 9b The first light-emitting layer EP-R can be formed on the pre-display panel DP-I.

[0147] Reference Figure 9c A first sacrificial layer SL1 can be formed on the first light-emitting layer EP-R. The first sacrificial layer SL1 can be formed by thermal evaporation of a metallic material. Accordingly, the first sacrificial layer SL1 can include a metal capable of thermal evaporation. More specifically, the first sacrificial layer SL1 can include aluminum (Al), silver (Ag), gold (Au), or titanium (Ti). However, the embodiments are not limited to this.

[0148] Reference Figure 9d and Figure 9e The manufacturing method of the display panel DP of this invention may include the steps of forming a first sacrificial pattern SP1 and a first light-emitting pattern EP1. The first sacrificial layer SL1 and the first light-emitting layer EP-R can be etched using a first photoresist layer PR1 as a mask to form the first sacrificial pattern SP1 and the first light-emitting pattern EP1. In this case, the steps of forming the first sacrificial pattern SP1 and forming the first light-emitting pattern EP1 can be performed simultaneously. That is, the first sacrificial pattern SP1 and the first light-emitting pattern EP1 can be patterned using a single mask in a single process.

[0149] The first sacrificial pattern SP1 can be patterned into a shape that overlaps with the first luminescent region PXA-R. The first luminescent pattern EP1 can be patterned into the same shape as the first sacrificial pattern SP1.

[0150] The first sacrificial pattern SP1 formed by etching the first sacrificial layer SL1 can overlap with the first light-emitting region PXA-R. The first light-emitting pattern EP1 formed by etching the first light-emitting layer EP-R can overlap with the first light-emitting region PXA-R. The two sides of the first light-emitting pattern EP1 and the two sides of the first sacrificial pattern SP1 can be aligned in a row.

[0151] Reference Figure 9f A second light-emitting layer EP-G can be formed on the first sacrificial pattern SP1, the pixel-defined film PDL, and the anode AE.

[0152] Reference Figure 9g This may include the step of forming a second sacrificial layer SL2 on the second luminescent layer EP-G.

[0153] The second sacrificial layer SL2 may include a metal capable of thermal evaporation. More specifically, the second sacrificial layer SL2 may include aluminum (Al), silver (Ag), gold (Au), or titanium (Ti). However, the embodiments are not limited to this.

[0154] Reference Figure 9h and Figure 9i The manufacturing method of the display panel DP of this invention may include the steps of forming a second sacrificial pattern SP2 and a second light-emitting pattern EP2. The second sacrificial layer SL2 and the second light-emitting layer EP-G can be etched using a second photoresist layer PR2 as a mask to form the second sacrificial pattern SP2 and the second light-emitting pattern EP2. In this case, the steps of forming the second sacrificial pattern SP2 and forming the second light-emitting pattern EP2 can be performed simultaneously. That is, the second sacrificial pattern SP2 and the second light-emitting pattern EP2 can be patterned using a single mask in a single process.

[0155] The second sacrificial pattern SP2 can be patterned into a shape that overlaps with the second luminescent region PXA-G. The second luminescent pattern EP2 can be patterned into the same shape as the second sacrificial pattern SP2.

[0156] Reference Figure 9j The manufacturing method of the display panel DP of this utility model may include utilizing and through Figures 9b to 9i The same process is used to form the third sacrificial pattern SP3 and the third emitting pattern EP3. A photoresist (PR) pattern can be used as a mask to etch the third sacrificial layer and the third emitting layer to form the third sacrificial pattern SP3 and the third emitting pattern EP3. In this case, the steps of forming the third sacrificial pattern SP3 and the third emitting pattern EP3 can be performed simultaneously. That is, the third sacrificial pattern SP3 and the third emitting pattern EP3 can be patterned using a single mask in a single process.

[0157] The third sacrificial pattern SP3 can be patterned into a shape that overlaps with the third luminous region PXA-B. The third luminous pattern EP3 can be patterned into the same shape as the third sacrificial pattern SP3.

[0158] The upper surfaces of the first sacrificial pattern SP1, the second sacrificial pattern SP2, and the third sacrificial pattern SP3 can be formed on the same layer. Furthermore, the upper surfaces of the first luminescent pattern EP1, the second luminescent pattern EP2, and the third luminescent pattern EP3 can also be formed on the same layer. However, the embodiments are not limited to this.

[0159] Reference Figure 9k The manufacturing method of the display panel DP of this invention may include the step of forming an auxiliary electrode layer SEL on a pixel defining film PDL and a first sacrificial pattern SP1 to a third sacrificial pattern SP3. The auxiliary electrode layer SEL may be formed to completely cover the upper surface of the pixel defining film PDL and the first sacrificial pattern SP1 to a third sacrificial pattern SP3.

[0160] The auxiliary electrode layer (SEL) can be formed by depositing / coating a conductive material. For example, the conductive material can include metals, transparent conductive oxides (TCOs), or combinations thereof. Metals can include gold (Au), silver (Ag), aluminum (Al), magnesium (Mg), lithium (Li), molybdenum (Mo), titanium (Ti), copper (Cu), or alloys thereof. Transparent conductive oxides can include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (Zinc Oxide), indium oxide (Indium Oxide), indium gallium oxide (Indium Gallium Oxide), indium gallium zinc oxide (IGZO), or aluminum zinc oxide (Aluminum Zinc Oxide).

[0161] A groove GRV overlapping the surrounding region NPXA can be defined on the upper surface of the auxiliary electrode layer SEL. The groove GRV can be a portion defined on the upper surface of the auxiliary electrode layer SEL and recessed towards the pixel defining film PDL. The groove GRV can be formed between the sacrificial patterns SP1, SP2, and SP3, and can be formed overlapping the pixel defining film PDL on a plane.

[0162] Reference Figure 9l and Figure 9m The manufacturing method of the display panel DP of this utility model includes the following steps: forming a third photoresist layer PR3 on the auxiliary electrode layer SEL; using the third photoresist layer PR3 as a mask to etch the auxiliary electrode layer SEL; and removing the third photoresist layer PR3.

[0163] In the step of forming the third photoresist layer PR3, the third photoresist layer PR3 can be formed by patterning a pre-prepared photoresist layer (not shown) using a photomask. The third photoresist layer PR3 can overlap with the pixel-defining film PDL. The third photoresist layer PR3 can be disposed within a groove GRV defined by the upper surface of the auxiliary electrode layer SEL. A portion of the third photoresist layer PR3 can overlap with the first sacrificial patterns SP1 to the third sacrificial patterns SP3. Figure 9l In the illustration, a portion of the third photoresist layer PR3 is exemplarily shown to overlap with the first sacrificial patterns SP1 to the third sacrificial patterns SP3, but is not limited thereto. For example, the third photoresist layer PR3 may overlap only with the pixel-defined film PDL.

[0164] Reference Figure 9mIn the step of etching the auxiliary electrode layer SEL, the auxiliary electrode SE can be formed by etching the auxiliary electrode layer SEL exposed by the third photoresist layer PR3. At this time, the etching process can be performed by dry etching or wet etching. As a portion of the third photoresist layer PR3 overlaps with the first sacrificial patterns SP1 to the third sacrificial patterns SP3, a portion of the upper surface of the first sacrificial patterns SP1 to the third sacrificial patterns SP3 can be covered by the unetched auxiliary electrode SE.

[0165] Reference Figure 9n and Figure 9o The manufacturing method of the display panel DP of this utility model may include the step of removing the sacrificial patterns SP1, SP2, and SP3.

[0166] Reference Figure 9o As the third photoresist layer PR3 and the first sacrificial pattern SP1 to the third sacrificial pattern SP3 are removed, the tip TIP and groove GRV of the auxiliary electrode SE can be exposed.

[0167] Reference Figure 9o As the first sacrificial patterns SP1 to SP3 are removed by the etching process, the second surface IS2 of the auxiliary electrode opening SE-OP corresponding to the side surfaces of the removed first sacrificial patterns SP1 to SP3 can be exposed. The tip TIP of the auxiliary electrode SE can be separated from the light-emitting pattern EP by the second surface IS2 of the auxiliary electrode opening SE-OP. The lower surface of the tip TIP can be separated from the upper surface EP-US of the light-emitting pattern EP by a predetermined distance G3.

[0168] The metal constituting the auxiliary electrode SE can have different etching rates than the metal constituting the sacrificial patterns SP1, SP2, and SP3 for a specific etchant (or etch gas). That is, the material constituting the auxiliary electrode can have a predetermined etching selectivity ratio with the material constituting the sacrificial patterns. For example, for the auxiliary electrode SE, as long as it is a material such as copper (Cu), aluminum (Al), titanium (Ti), molybdenum (Mo), or indium tin oxide (ITO), which has an etching selectivity ratio with the sacrificial patterns SP1, SP2, and SP3, it can be formed using a variety of conductive materials, and is not limited to any one embodiment.

[0169] Reference Figure 9pThe manufacturing method of the display panel DP of this invention may include the step of depositing a cathode CE on the upper surface of the light-emitting pattern EP and the auxiliary electrode SE. The cathode CE can completely cover the upper surface of the light-emitting pattern EP and the auxiliary electrode SE. The cathode CE can cover both the first surface IS1 and the second surface IS2 of the auxiliary electrode opening SE-OP. The tip TIP defined in the auxiliary electrode SE can be completely covered by the cathode CE.

[0170] In one embodiment, prior to the deposition of the cathode (CE), a baking process may be included to sufficiently heat the upper surfaces of the light-emitting pattern (EP) and the auxiliary electrode (SE). This removes foreign matter such as moisture, oxygen, and dust particles from the upper surfaces of the EP and SE, thereby enabling uniform deposition of the cathode (CE). The baking process can be performed below the glass transition temperature (Tg). The glass transition temperature (Tg) represents the temperature at which the glass-liquid transition occurs.

[0171] Reference Figure 9q The manufacturing method of the display panel DP of this utility model may include the step of forming an inorganic encapsulation film TFE' on the cathode CE.

[0172] The inorganic encapsulation film TFE' protects the DP-OLED display element layer from foreign matter such as moisture, oxygen, and dust particles. The inorganic encapsulation film TFE' can have a single-layer structure or a multi-layer structure stacked on a third-direction DR3. In other words, the inorganic encapsulation film TFE' can be configured as a single-layer inorganic film or have a multi-layer inorganic film stacked structure. The inorganic encapsulation film TFE' protects the DP-OLED display element layer from moisture and oxygen. The inorganic encapsulation film TFE' can include silicon nitride layers, silicon oxide nitride layers, silicon oxide layers, titanium oxide layers, or aluminum oxide layers, etc.

[0173] The above description refers to preferred embodiments of the present invention. However, those skilled in the art or with general knowledge of the art will understand that various modifications and alterations can be made to the present invention without departing from the concept and technical scope of the invention as described in the claims. Therefore, the technical scope of the present invention is not limited to the contents described in the detailed description, but should be determined by the claims.

Claims

1. A display panel, characterized in that, include: base layer; A pixel-defining film is disposed on the base layer and has light-emitting openings defined thereon; An auxiliary electrode is disposed on the pixel defining film and has an auxiliary electrode opening that overlaps with the light-emitting opening. A light-emitting element includes an anode, a cathode, and a light-emitting pattern. The anode is disposed on the base layer and at least partially exposed by the light-emitting opening. The cathode is disposed on the auxiliary electrode and the anode. The light-emitting pattern is disposed between the anode and the cathode and overlaps with the light-emitting opening. The auxiliary electrode is in direct contact with the light-emitting pattern.

2. The display panel as described in claim 1, characterized in that, The cathode is in direct contact with the auxiliary electrode.

3. The display panel as described in claim 1, characterized in that, The cathode completely covers the upper surface of the auxiliary electrode.

4. The display panel as described in claim 1, characterized in that, The luminescent pattern is arranged inside the opening of the auxiliary electrode.

5. The display panel as described in claim 1, characterized in that, The thickness of the auxiliary electrode is greater than the thickness of the cathode. The auxiliary electrode is composed of one of copper, aluminum, titanium, molybdenum, indium tin oxide, and indium zinc oxide.

6. The display panel as described in claim 1, characterized in that, The auxiliary electrode has a conductivity at least higher than that of the cathode.

7. The display panel as described in claim 1, characterized in that, Also includes: An inorganic encapsulation film is disposed on the cathode.

8. The display panel as described in claim 1, characterized in that, The auxiliary electrode opening includes a first surface and a second surface with different widths in cross-section, the first surface being disposed on the second surface, and the width of the second surface being greater than the width of the first surface.

9. The display panel as described in claim 8, characterized in that, The first surface of the auxiliary electrode opening is separated from the light-emitting pattern. The luminescent pattern is in contact with a portion of the second surface. A groove overlapping the pixel defining film is defined on the upper surface of the auxiliary electrode.

10. The display panel as claimed in claim 8, characterized in that, A pointed portion protruding from the second surface toward the center of the auxiliary electrode opening is defined on the first surface. The tip overlaps with the luminescent pattern.

Images