A piezoelectric ceramic precise positioning bonding device capable of preventing glue overflow

Abstract

This application discloses a bonding device for precise positioning of piezoelectric ceramics to prevent glue overflow, belonging to the technical field of bonding equipment. The device includes: a base, a placement mechanism, and a locking mechanism. The base has several through-holes in the first fixing holes. The placement mechanism includes a first placement plate and a second placement plate symmetrically arranged on the base. The first placement plate has at least one first placement groove, and the second placement plate has a second placement groove corresponding to the first placement groove. The first and second placement plates have second fixing holes. The locking mechanism is an inverted U-shaped structure composed of a first sidewall, a second sidewall, and a top wall. The top wall has a through-hole, and a movably connected locking rod is installed in the locking hole. The locking mechanism is sleeved on the top outer side of the placement mechanism. This device limits the position of the piezoelectric ceramic specimen, preventing displacement during bonding. It also collects overflowing glue to prevent the product from sticking to the bonding device, facilitating subsequent product removal.

Description

Technical Field

[0001] This application relates to a piezoelectric ceramic precise positioning bonding device that prevents glue overflow, belonging to the technical field of bonding equipment. Background Technology

[0002] Piezoelectric ceramics, with their unique piezoelectric and dielectric properties, are widely used in various fields such as electroacoustic devices, medical devices, aerospace, and structural health monitoring. During assembly, the precision and stability of the bonding process significantly impact the final performance and lifespan of the product. In actual bonding operations for piezoelectric ceramics, the ceramic specimens must be precisely positioned and fixed with adhesive. However, current bonding devices commonly used in the industry suffer from insufficient positioning accuracy and easy adhesive overflow, severely affecting product yield and assembly quality.

[0003] Currently, during the bonding process of piezoelectric ceramic specimens, some bonding fixtures are prone to damage to the piezoelectric ceramic specimens during the pressing process. Furthermore, the long-term lifting and lowering of the bonding fixtures can easily lead to displacement, resulting in poor quality of the manufactured products.

[0004] Furthermore, existing bonding devices do not have technical solutions or related bonding devices to address the problem of adhesive overflow. In practical applications, due to the difficulty in controlling the amount of adhesive applied and the uneven pressure distribution during bonding, adhesive easily overflows between adjacent piezoelectric ceramic specimens. The overflowing adhesive not only contaminates the surface of the workpiece and reduces product reliability, but may also cause the piezoelectric ceramic specimen to stick to the bonding device, making it difficult to remove the product.

[0005] In view of the technical problems of low positioning accuracy and damage to piezoelectric ceramic specimens in the existing technology, there is an urgent need for a bonding device that can achieve precise positioning of piezoelectric ceramics and effectively prevent damage to piezoelectric ceramic specimens, so as to overcome the shortcomings of the existing technology and improve the bonding quality and product yield of piezoelectric ceramics. Utility Model Content

[0006] To address the aforementioned issues, this application proposes a bonding device for precise positioning of piezoelectric ceramics that prevents adhesive overflow. By using symmetrically arranged first and second placement plates, along with corresponding first and second placement grooves, the piezoelectric ceramics can be bidirectionally positioned to prevent displacement during bonding and ensure positioning accuracy. Simultaneously, the first and second placement grooves provide circumferential protection for the piezoelectric ceramic specimens, effectively reducing the probability of damage and improving the electrical performance and assembly accuracy of the product.

[0007] According to one aspect of this application, a bonding device for precise positioning of piezoelectric ceramics that prevents adhesive overflow is provided, comprising:

[0008] A base, wherein a plurality of through first fixing holes are provided on the base;

[0009] A placement mechanism is provided on the base. The placement mechanism includes a first placement plate and a second placement plate arranged symmetrically. The first placement plate is provided with at least one first placement groove, and the second placement plate is provided with a second placement groove corresponding to the first placement groove. Each first placement groove and the second placement groove form a placement cavity. The first placement plate and the second placement plate are provided with a second fixing hole. The first placement plate and the second placement plate are connected to the base through a connector passing through the first fixing hole and the second fixing hole.

[0010] The locking mechanism is an inverted U-shaped structure composed of a first side wall, a second side wall, and a top wall. The top wall is provided with a through locking hole, and a locking rod is provided in the locking hole. The locking mechanism is sleeved on the top outer side of the placement mechanism.

[0011] Optionally, there are at least two placement mechanisms.

[0012] Optionally, each of the placement mechanisms includes at least two first placement slots and two second placement slots.

[0013] Optionally, there are at least two locking mechanisms, with one locking mechanism corresponding to each placement cavity.

[0014] Optionally, a plurality of parallel first overflow prevention grooves are provided on the side wall of the first placement groove along the length direction of the first placement groove, and the length direction of the first placement groove is perpendicular to the length direction of the first overflow prevention groove; a plurality of parallel second overflow prevention grooves are provided on the side wall of the second placement groove along the length direction of the second placement groove, and the length direction of the second placement groove is perpendicular to the length direction of the second overflow prevention groove.

[0015] Optionally, the bottom of the first placement slot is provided with a first groove along the length direction of the first placement slot, the first groove is perpendicular to the first overflow prevention slot, and the length of the first groove is equal to the length of the first placement slot; the bottom of the second placement slot is provided with a second groove along the length direction of the second placement slot, the second groove is perpendicular to the second overflow prevention slot, and the length of the second groove is equal to the length of the second placement slot.

[0016] Optionally, the locking rod includes a locking part and a fixing part, the locking part being movably connected to the locking hole, and the fixing part being used to press the piezoelectric ceramic specimen.

[0017] Optionally, the locking part is provided with an external thread on its outer side, and the locking hole is provided with an internal thread.

[0018] Optionally, both ends of the first placement plate and the second placement plate are provided with outwardly extending connecting portions, and the connecting portions are provided with second fixing holes.

[0019] Optionally, the second fixing hole is a U-shaped opening.

[0020] The beneficial effects that this application may produce include, but are not limited to:

[0021] 1. The bonding device for precise positioning of piezoelectric ceramics to prevent glue overflow provided in this application has a first placement plate, a second placement plate and corresponding first placement groove and second placement groove arranged symmetrically to form a bidirectional limit for the piezoelectric ceramic specimen to avoid displacement during the bonding process; at the same time, multiple placement mechanisms can realize the synchronous bonding of multiple piezoelectric ceramic workpieces, improving assembly efficiency.

[0022] 2. The bonding device for precise positioning of piezoelectric ceramics that prevents glue overflow provided in this application is equipped with multiple locking mechanisms, with one locking mechanism corresponding to each placement cavity. This enables independent and precise locking of each piezoelectric ceramic workpiece, avoiding uneven force and positioning misalignment when multiple workpieces are locked simultaneously, thereby further improving assembly efficiency and product quality.

[0023] 3. The piezoelectric ceramic precision positioning bonding device for preventing glue overflow provided in this application, with a first overflow groove and a second overflow groove, can collect the overflowing glue, avoid glue contamination of the workpiece surface, and at the same time prevent the product from sticking to the bonding device, making it easier to remove the product later.

[0024] 4. The bonding device for precise positioning of piezoelectric ceramics that prevents glue overflow provided in this application has a first groove and a second groove that can further accommodate excess glue, enhance the anti-overflow effect, and do not affect the normal placement and positioning of the piezoelectric ceramic specimen. At the same time, it can also facilitate the removal of the product and improve the bonding efficiency. Attached Figure Description

[0025] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0026] Figure 1 This is an overall schematic diagram of the bonding device for precise positioning of piezoelectric ceramics to prevent glue overflow, which is involved in the embodiments of this application.

[0027] Figure 2 This is a top view of the bonding device for precise positioning of piezoelectric ceramics to prevent glue overflow, as described in the embodiments of this application.

[0028] Figure 3 This is a bottom view of the bonding device for precise positioning of piezoelectric ceramics to prevent glue overflow, which is described in an embodiment of this application.

[0029] Figure 4 This is a side view of the bonding device for precise positioning of piezoelectric ceramics to prevent glue overflow, which is an embodiment of this application.

[0030] Figure 5 This is an overall schematic diagram of the first placement plate involved in an embodiment of this application;

[0031] Figure 6 This is an overall schematic diagram of the second placement plate involved in the embodiments of this application.

[0032] List of components and reference numerals:

[0033] 10. Base; 11. First fixing hole; 20. Placement mechanism; 21. First placement plate; 211. First placement groove; 212. First anti-overflow groove; 213. First recess; 214. Connecting part; 215. Second fixing hole; 22. Second placement plate; 221. Second placement groove; 222. Second anti-overflow groove; 223. Second recess; 30. Locking mechanism; 31. First side wall; 32. Second side wall; 33. Top wall; 34. Locking hole; 35. Locking rod; 351. Fixing part; 352. Locking part. Detailed Implementation

[0034] To more clearly illustrate the overall concept of this application, a detailed explanation is provided below with reference to the accompanying drawings.

[0035] To better understand the above-mentioned objectives, features, and advantages of this application, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0036] Many specific details are set forth in the following description in order to provide a full understanding of this application. However, this application may also be implemented in other ways different from those described herein. Therefore, the scope of protection of this application is not limited to the specific embodiments disclosed below.

[0037] Furthermore, it should be understood in the description of this application that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0038] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0039] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0040] In this application, unless otherwise expressly specified and limited, the "above" or "below" of the second feature can mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. In the description of this specification, references to terms such as "an embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described can be combined in any suitable manner in one or more embodiments or examples.

[0041] refer to Figure 1-6This application discloses an adhesive bonding device for precise positioning of piezoelectric ceramics to prevent glue overflow, comprising: a base 10, on which a plurality of through first fixing holes 11 are provided; and a placement mechanism 20, which is disposed on the base 10 and includes symmetrically arranged first placement plates 21 and second placement plates 22. The first placement plate 21 is provided with at least one first placement groove 211, and the second placement plate 22 is provided with a second placement groove 221 corresponding to the first placement groove 211. Each first placement groove 211 and second placement groove... 221 forms a placement cavity. The first placement plate 21 and the second placement plate 22 are provided with second fixing holes 215. The first placement plate 21 and the second placement plate 22 are connected to the base 10 through the first fixing hole 11 and the second fixing hole 215 by a connector. The locking mechanism 30 is an inverted U-shaped structure composed of the first side wall 31, the second side wall 32 and the top wall 33. The top wall 33 is provided with a through locking hole 34. A locking rod 35 is provided in the locking hole 34. The locking mechanism 30 is sleeved on the top outer side of the placement mechanism 20.

[0042] refer to Figure 1 During use, the placement mechanism 20 is fixedly connected to the second fixing hole 215 on the first placement plate 21 via a connector through the first fixing hole 11 on the base 10. Then, piezoelectric ceramic specimens are stacked sequentially from bottom to top in the first placement groove 211 in the first placement plate 21. After stacking, the second placement plate 22 is attached to the first placement plate 21, so that both the second placement groove 221 and the first placement groove 211 are attached to the piezoelectric ceramic specimens, thus achieving circumferential wrapping of the piezoelectric ceramic specimens. Then, the second placement plate 22 is fixedly connected to the base 10 using a connector. Then, the locking mechanism 30 is sleeved on the top outer side of the first placement plate 21 and the second placement plate 22. The locking rod 35 is rotated through the locking hole 34 on the top wall 33 to move closer to the first placement plate 21 and the second placement plate 22, thereby achieving vertical fixation of the piezoelectric ceramic specimens by the locking rod 35, enhancing the connection stability between adjacent piezoelectric ceramic specimens, and squeezing out excess glue.

[0043] This device, by attaching the first placement plate 21 and the second placement plate 22 together, enables the first placement groove 211 and the second placement groove 221 to work together to achieve circumferential wrapping and limiting of the piezoelectric ceramic specimen. Combined with the fixed connection between the placement mechanism 20 and the base 10, it can effectively prevent the stacked piezoelectric ceramic specimens from shifting circumferentially, while ensuring that multiple piezoelectric ceramic specimens are accurately aligned in the vertical direction, thus preventing misalignment and further improving the bonding stability of the device. At the same time, the locking mechanism 30 can compact the stacked piezoelectric ceramic specimens, enhancing the fit and connection stability between adjacent piezoelectric ceramic specimens, avoiding problems such as weak bonding and delamination caused by loose piezoelectric ceramic specimens during the bonding process, and improving the structural strength and service life of the final product.

[0044] Specifically, in this application, the piezoelectric ceramic specimen can also be assembled by first stacking the piezoelectric ceramic specimen in the first placement groove 211 of the first placement plate 21. After stacking, the second placement plate 22 is attached to the first placement plate 21 to fix the piezoelectric ceramic specimen circumferentially. Then, the combined placement mechanism 20 is placed on the bottom. The first placement plate 21 and the second placement plate 22 are fixedly connected to the base 10 by the connector. Then, the locking mechanism 30 is used for vertical fixation. The specific fixing method is the same as the above method and will not be described in detail here.

[0045] Specifically, the connector is not limited to any particular type; it can be a screw or any other connector, as long as it can achieve a fixed connection between the first placement plate 21 and the second placement plate 22 and the base 10.

[0046] Specifically, the number of the first placement slot 211 on the first placement plate 21 and the second placement slot 221 on the second placement plate 22 is not specifically limited in this application. Those skilled in the art can choose according to the actual situation. In this embodiment, the number of the first placement slot 211 and the second placement slot 221 are both 5.

[0047] Specifically, the number of placement mechanisms 20 in this application is not specifically limited. Those skilled in the art can select according to the actual situation. In this embodiment, the number of placement mechanisms 20 is 1.

[0048] In one implementation, there are at least two placement mechanisms 20.

[0049] This setup allows for the simultaneous positioning, stacking, and bonding of multiple sets of piezoelectric ceramic specimens, significantly improving bonding efficiency. Furthermore, the positioning, locking, and adhesive application processes for each set of piezoelectric ceramic specimens do not interfere with each other, effectively preventing interference, misalignment, and contamination during processing, ensuring bonding accuracy and product consistency. The number of placement mechanisms 20 can also be adjusted according to actual working conditions to adapt to different scales of operations. If one placement mechanism 20 malfunctions or requires maintenance, the remaining placement mechanisms 20 can continue to operate normally, improving the overall continuity and reliability of the device.

[0050] Specifically, when there are two placement mechanisms 20, and each placement mechanism 20 has only one first placement slot 211 and one second placement slot 221, the first placement plate 21 in the first placement mechanism 20 can be fixed to the base 10 by a connector. Then, piezoelectric ceramic specimens are stacked along the first placement slot 211 from bottom to top with adhesive. After stacking, the second placement plate 22 is attached to the first placement plate 21, so that the first placement slot 211 and the second placement slot 221 fix the first group of piezoelectric ceramic specimens circumferentially. Then, the locking mechanism 30 is sleeved on the top of the placement mechanism 20. The piezoelectric ceramic specimen is fixed vertically by rotating the locking rod 35. Then, the first placement plate 21 in the second placement mechanism 20 is fixed to the base 10 by the connector. Then, the piezoelectric ceramic specimens are stacked from bottom to top along the first placement groove 211. After stacking, the second placement plate 22 is attached to the first placement plate 21 to fix the piezoelectric ceramic specimen circumferentially by the first placement groove 211 and the second placement groove 221. Then, the locking mechanism 30 is sleeved on the top of the placement mechanism 20, and the locking rod 35 is rotated to fix the second set of piezoelectric ceramic specimens vertically.

[0051] Those skilled in the art will understand that, in this application, the two placement mechanisms 20 can also first apply adhesive to the first placement groove 211 of the first placement plate 21 in the first placement mechanism 20 and the second placement mechanism 20 and stack the piezoelectric ceramic specimens in sequence, and then attach them with the second placement plate 22 respectively to obtain the assembled placement mechanism 20. Then, it is placed on the base 10 and fixedly connected by the connector to complete the bonding, and then other process steps are carried out.

[0052] refer to Figure 2 In one embodiment, each placement mechanism 20 includes at least two first placement slots 211 and second placement slots 221.

[0053] This setup enables simultaneous positioning and bonding of multiple piezoelectric ceramic specimens, significantly improving processing efficiency. It ensures that the piezoelectric ceramic specimens do not interfere with each other during stacking, gluing, and bonding, guaranteeing bonding accuracy and product consistency. At the same time, it can effectively improve space utilization, achieve high-density and high-efficiency bonding operations, and reduce production costs.

[0054] Specifically, when using a placement mechanism 20 containing two first placement slots 211 and two second placement slots 221, piezoelectric ceramic specimens are sequentially coated with adhesive and stacked from bottom to top in the first and second first placement slots 211. After stacking, the second placement plate 22 is attached to the first placement plate 21, thereby circumferentially fixing the two sets of piezoelectric ceramic specimens in the two first placement slots 211 and two second placement slots 221. Then, a locking mechanism 30 is used to lock the piezoelectric ceramic specimens in the first placement cavity formed by the first and second placement slots 211 and 221. Subsequently, a second locking mechanism 30 is used to lock the piezoelectric ceramic specimens in the second placement cavity formed by the second first placement slots 211 and 221, thereby achieving bonding of the piezoelectric ceramic specimens.

[0055] Those skilled in the art will understand that when the placement mechanism 20 contains 3, 4, 5 or more first placement slots 211 and second placement slots 221, the assembly and bonding are also carried out in the above manner. First, the piezoelectric ceramic specimens are applied with adhesive and stacked in each of the first placement slots 211. Then, the piezoelectric ceramic specimens are fixed circumferentially by the second placement slots 221 in the second placement plate 22. Afterwards, a corresponding number of locking mechanisms 30 are fitted according to the number of placement cavities formed by the first placement slots 211 and the second placement slots 221 to achieve vertical locking and fixing.

[0056] Furthermore, those skilled in the art will understand that when there are 3, 4, 5 or more placement mechanisms 20, the installation steps of the placement mechanism 20 described above are repeated to achieve the fixed bonding of multiple sets of piezoelectric ceramic specimens.

[0057] refer to Figure 2 In one implementation, there are at least two locking mechanisms 30, with one locking mechanism 30 corresponding to each placement cavity.

[0058] Under this setting, multiple piezoelectric ceramic specimens can be independently locked and pressurized separately, so that the adhesive is squeezed out evenly and the thickness of the adhesive layer is more consistent, improving the bonding quality and product stability. This avoids the loosening or displacement of some piezoelectric ceramic specimens due to uneven pressure applied by a single locking mechanism, ensuring the bonding positioning accuracy.

[0059] Specifically, the number of locking mechanisms 30 is the same as the number of the first placement slot 211 and the second placement slot 221.

[0060] refer to Figure 2 and Figure 5In one embodiment, a plurality of parallel first overflow grooves 212 are provided on the side wall of the first placement groove 211 along the length direction of the first placement groove 211, and the length direction of the first placement groove 211 is perpendicular to the length direction of the first overflow grooves 212; a plurality of parallel second overflow grooves 222 are provided on the side wall of the second placement groove 221 along the length direction of the second placement groove 221, and the length direction of the second placement groove 221 is perpendicular to the length direction of the second overflow grooves 222.

[0061] This setup provides space for excess adhesive, preventing contamination of the piezoelectric ceramic specimen surface and electrode area, ensuring a clean appearance. It also avoids uneven adhesive thickness caused by localized adhesive buildup, improving bonding consistency and structural stability between piezoelectric ceramic specimens. Furthermore, it reduces adhesion between the piezoelectric ceramic specimen and the bonding device, facilitating product removal.

[0062] refer to Figure 5 and Figure 6 In one embodiment, a first groove 213 is provided at the bottom of the first placement groove 211 along the length direction of the first placement groove 211. The first groove 213 is perpendicular to the first overflow groove 212, and the length of the first groove 213 is equal to the length of the first placement groove 211. A second groove 223 is provided at the bottom of the second placement groove 221 along the length direction of the second placement groove 221. The second groove 223 is perpendicular to the second overflow groove 222, and the length of the second groove 223 is equal to the length of the second placement groove 221.

[0063] This setup further expands the capacity for excess adhesive, significantly improving the anti-overflow effect. It ensures that overflowing adhesive is evenly distributed along its length, preventing uneven adhesive layer thickness caused by localized adhesive buildup. It also prevents adhesive overflow from contaminating the piezoelectric ceramic specimens, guaranteeing the bonding accuracy of the piezoelectric ceramic specimens and ensuring consistency with the final product. Furthermore, it facilitates subsequent handling of residual adhesive, improving the ease of device maintenance.

[0064] refer to Figure 4 In one embodiment, the locking rod 35 includes a locking part 352 and a fixing part 351. The locking part 352 is movably connected to the locking hole 34, and the fixing part 351 is used to press the piezoelectric ceramic specimen.

[0065] With this setting, the locking force can be applied directly and evenly to the piezoelectric ceramic specimen, avoiding the dispersion or offset of the locking force, ensuring that each layer of piezoelectric ceramic specimen is tightly bonded during bonding. At the same time, the fixing part 351 cooperates with the inner wall of the placement cavity to form a reliable limit on the piezoelectric ceramic specimen, further improving the positioning accuracy and preventing circumferential offset during the bonding process.

[0066] In one embodiment, the locking part 352 is provided with an external thread on its outer side, and the locking hole 34 is provided with an internal thread.

[0067] In this configuration, the locking rod 35 is screwed in and out via a threaded connection. The adjustment process is smooth and controllable, allowing for precise control of the clamping force on the piezoelectric ceramic specimens. This prevents the locking rod 35 from loosening, ensuring a tight fit between the piezoelectric ceramic specimens and improving bonding reliability. Furthermore, the threaded connection method is simple to operate, allowing for flexible adjustment of the clamping depth based on the thickness of the piezoelectric ceramic specimens and the number of stacked layers, enhancing the adaptability and flexibility of the device.

[0068] In one embodiment, both ends of the first placement plate 21 and the second placement plate 22 are provided with outwardly extending connecting portions 214, and the connecting portions 214 are provided with second fixing holes 215.

[0069] This configuration has two advantages: First, it increases the assembly contact area between the placement mechanism 20 and the base 10, making the overall installation of the placement mechanism 20 more stable and effectively preventing shaking or displacement during locking and pressing, thus ensuring the positioning accuracy of the piezoelectric ceramic. Second, the connecting parts 214 extending at both ends make the force more balanced, which can disperse the force generated during locking and bonding, reduce the deformation of the first placement plate 21 and the second placement plate 22, and improve the overall structural strength and service life of the device.

[0070] In one implementation, the second fixing hole 215 is a U-shaped opening.

[0071] The various embodiments in this specification are described in a progressive manner. Similar or identical parts between embodiments can be referred to interchangeably. Each embodiment focuses on describing the differences from other embodiments. In particular, the system embodiments are basically similar to the method embodiments, so the description is relatively simple; relevant parts can be referred to the descriptions in the method embodiments.

[0072] The above description is merely an embodiment of this application and is not intended to limit the scope of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of the claims of this application.

Claims

1. A piezoelectric ceramic precise positioning bonding device to prevent glue overflow, characterized in that, include: A base, wherein a plurality of through first fixing holes are provided on the base; A placement mechanism is provided on the base. The placement mechanism includes a first placement plate and a second placement plate arranged symmetrically. The first placement plate is provided with at least one first placement groove, and the second placement plate is provided with a second placement groove corresponding to the first placement groove. Each first placement groove and the second placement groove form a placement cavity. The first placement plate and the second placement plate are provided with a second fixing hole. The first placement plate and the second placement plate are connected to the base through a connector passing through the first fixing hole and the second fixing hole. The locking mechanism is an inverted U-shaped structure composed of a first side wall, a second side wall, and a top wall. The top wall is provided with a through locking hole, and a locking rod is provided in the locking hole. The locking mechanism is sleeved on the top outer side of the placement mechanism.

2. The piezoelectric ceramic precise positioning bonding device for preventing glue overflow according to claim 1, characterized in that, There are at least two placement mechanisms.

3. The piezoelectric ceramic precise positioning bonding device for preventing glue overflow according to claim 2, characterized in that, Each of the placement mechanisms includes at least two first placement slots and two second placement slots.

4. The piezoelectric ceramic precise positioning bonding device for preventing glue overflow according to claim 1, characterized in that, There are at least two locking mechanisms, with one locking mechanism corresponding to each placement cavity.

5. The piezoelectric ceramic precise positioning bonding device for preventing glue overflow according to claim 4, characterized in that, The first placement slot has several parallel first overflow prevention slots arranged on its sidewall along the length direction of the first placement slot, and the length direction of the first placement slot is perpendicular to the length direction of the first overflow prevention slot; the second placement slot has several parallel second overflow prevention slots arranged on its sidewall along the length direction of the second placement slot, and the length direction of the second placement slot is perpendicular to the length direction of the second overflow prevention slot.

6. The piezoelectric ceramic precise positioning bonding device for preventing glue overflow according to claim 5, characterized in that, The bottom of the first placement slot has a first groove along the length of the first placement slot, the first groove is perpendicular to the first overflow prevention slot, and the length of the first groove is equal to the length of the first placement slot; the bottom of the second placement slot has a second groove along the length of the second placement slot, the second groove is perpendicular to the second overflow prevention slot, and the length of the second groove is equal to the length of the second placement slot.

7. The piezoelectric ceramic precise positioning bonding device for preventing glue overflow according to claim 1, characterized in that, The locking rod includes a locking part and a fixing part. The locking part is movably connected to the locking hole, and the fixing part is used to press the piezoelectric ceramic specimen.

8. The adhesive bonding device for precise positioning of piezoelectric ceramics to prevent glue overflow according to claim 7, characterized in that, The locking part is provided with external threads on the outside, and the locking hole is provided with internal threads.

9. The adhesive bonding device for precise positioning of piezoelectric ceramics to prevent glue overflow according to claim 1, characterized in that, Both ends of the first placement plate and the second placement plate are provided with outwardly extending connecting portions, and the connecting portions are provided with second fixing holes.

10. The adhesive bonding device for precise positioning of piezoelectric ceramics to prevent glue overflow according to claim 9, characterized in that, The second fixing hole is a U-shaped opening.

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