Variable wafer positioning support and polishing apparatus
By designing a variable wafer positioning bracket, compatibility with wafers of different thicknesses and patterns is achieved, solving the problem of the limited application scenarios of existing brackets, improving the applicability and moisturizing effect of the equipment, and reducing costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHANGHAI IND U TECH RES INST
- Filing Date
- 2025-05-07
- Publication Date
- 2026-06-12
AI Technical Summary
Existing wafer scaffolds are not compatible with both ordinary and special wafers, especially thinner special wafers, which are prone to breakage during adsorption and have limited applicability.
A variable wafer positioning bracket was designed, including a positioning base and a liftable support platform. The lifting component enables adaptation to wafers of different thicknesses and patterns. When the support platform is raised, it supports thinner wafers together with the annular base plate. When it is lowered, it gives way to the patterned area, making it compatible with two types of wafers.
This expands the applicable scenarios for wafer supports, prevents damage to thinner wafers, improves moisture retention, and reduces the cost of purchasing different equipment.
Smart Images
Figure CN224347629U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of wafer processing technology, and in particular to a variable wafer positioning bracket and grinding equipment. Background Technology
[0002] Wafer grinding equipment is crucial for reducing wafer thickness and improving flatness and planarity in semiconductor manufacturing. It is widely used in chip packaging, 3DIC stacking, and back-side processing (such as back-side light transmission and back-side metallization). Before and after the wafer is transferred to the grinding chamber, the wafer carrier, acting as a support, needs to work with the grinding head to either attach the wafer to the grinding head or unload it from the wafer carrier. For example... Figure 1 As shown, during the grinding process, the patterned side of the ordinary wafer 2 needs to face downwards. To prevent the wafer support 1 from scratching the pattern on the wafer, the wafer support 1 is generally designed to be concave, with only the edge contacting the wafer to protect the pattern. However, for special wafers 3 without patterns and with a thickness smaller than that of standard wafers, the wafer support 1 is extremely prone to breakage due to its thinness and lack of support in the middle when the wafer is attached to the grinding head.
[0003] Therefore, the wafer supports used in existing grinding equipment can only meet the requirements of ordinary wafers, but cannot meet the requirements of thinner special wafers. For special wafers, other types of wafer supports are also required. In other words, the existing wafer supports have a relatively limited range of applications and cannot meet the positioning requirements of various wafers. Utility Model Content
[0004] One objective of the first aspect of this utility model is to provide a variable wafer positioning bracket with a wider range of applications.
[0005] Another objective of this invention is to improve the moisturizing effect.
[0006] A further objective of this invention is to further expand the applicable scenarios of the variable wafer positioning bracket.
[0007] A second aspect of this invention is to provide a grinding apparatus including the aforementioned variable wafer positioning holder.
[0008] An embodiment of this utility model provides a variable wafer positioning holder for a wafer grinding equipment and includes:
[0009] The positioning substrate includes an annular base plate and a horizontal positioning portion located on the annular base plate. The annular base plate is used to support the bottom surface of the wafer, and the horizontal positioning portion is used to limit the degree of freedom of the wafer in the horizontal direction.
[0010] The lifting assembly includes a support platform and a drive assembly for driving the support platform to lift. The support platform can be configured to form a first state flush with the annular base plate so that the support platform and the annular base plate jointly support a first wafer with a thickness less than a preset value. The support platform can also be configured to form a second state lower than a preset height of the annular base plate so as to make room for the patterned area of the second wafer.
[0011] Optionally, the positioning base further includes a connecting recess, the top of which is connected to the annular base plate, and the connecting recess or the support platform is provided with multiple water spray nozzles.
[0012] Optionally, the lifting assembly is disposed on the top surface of the connecting recess.
[0013] Optionally, the connecting recess is provided with a through-hole that allows the lifting rod of the drive assembly to pass through.
[0014] Optionally, the connecting recess is a frame structure including multiple connecting arms, and the hollow area between the connecting arms serves as the communication port.
[0015] Optionally, the number of lifting components is multiple, so that the multiple support platforms can form a variety of support areas.
[0016] Optionally, the plurality of support platforms include a plurality of radially continuous fan rings or circular rings.
[0017] Optionally, the area of the upper limiting region of the horizontal positioning part is larger than the area of the lower limiting region.
[0018] Optionally, the horizontal positioning part is a thin-walled cylindrical shape or includes at least three vertically extending limiting posts.
[0019] In particular, embodiments of this application also provide a wafer grinding apparatus, including the variable wafer positioning bracket described in any of the above claims.
[0020] According to a first aspect of this utility model, a variable wafer positioning bracket includes a fixed positioning base and a liftable support platform. The horizontal limiting portion of the positioning base can define the position of the wafer, and an annular base plate is used to support the lower edge region of the wafer. When the support platform is raised, it and the annular base plate together form a large support area, which can effectively support thin wafers and prevent them from breaking. When the support platform is lowered, it can make room for the patterned area of ordinary wafers. In other words, the variable wafer positioning bracket of this application can be compatible with two types of wafers, has a wider range of applications, and has a simple structure that is easy to implement.
[0021] Furthermore, by placing the drive component directly above the connection recess, there is no need to consider interference with the connection recess, and the water spray nozzle is located at the support platform, which can reduce the distance between the water spray nozzle and the wafer, resulting in better moisturizing effect.
[0022] Furthermore, the number of support platforms is multiple and can be controlled individually. Therefore, by controlling the number and individual support platforms in the first state, different support areas can be formed, allowing the patterned area of the third wafer to be vacated in a specific position, while effectively supporting the third wafer in other areas. Thus, it can also adapt to the use needs of patterned and thinner third wafers, further expanding the applicable scenarios of the variable wafer positioning bracket. This multi-area adjustable lifting component is highly flexible in use.
[0023] According to a second aspect of this invention, a grinding apparatus including a variable wafer positioning holder is also provided. Since the variable wafer positioning holder is compatible with a wide variety of wafers, it expands the applicability of the grinding apparatus, avoids the need to purchase different grinding apparatuses for different wafers, and helps reduce costs. Attached Figure Description
[0024] Figure 1 This is a schematic diagram of the structure of a wafer scaffold in the prior art;
[0025] Figure 2 This is a top view of a variable wafer positioning bracket according to an embodiment of the present invention;
[0026] Figure 3 for Figure 2 A cross-sectional view of the variable wafer positioning support (carrying a second wafer) in the middle;
[0027] Figure 4 for Figure 2 A cross-sectional view of the variable wafer positioning support (carrying the first wafer) in the middle;
[0028] Figure 5 This is a cross-sectional view of a variable wafer positioning bracket according to another embodiment of the present invention;
[0029] Figure 6 for Figure 5 A top view of the positioning base of the variable wafer positioning bracket;
[0030] Figure 7 This is a top view of a variable wafer positioning bracket according to another embodiment of the present invention;
[0031] Figure 8 for Figure 7 Sectional view at point AA;
[0032] Figure label:
[0033] 100-Variable wafer positioning bracket, 10-Positioning base, 11-Annular base plate, 12-Horizontal positioning part, 20-Lifting assembly, 21-Supporting platform, 22-Drive assembly, 110-First wafer, 120-Second wafer, 201-Patterned area, 130-Third wafer, 13-Connecting recess, 101-Water nozzle, 131-Connecting port, 221-Lifting rod, 132-Connecting arm, 211-Fan ring, 121-Limiting post. Detailed Implementation
[0034] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, it should be noted that, for ease of description, only the parts relevant to this application are shown in the accompanying drawings, not the entire structure. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application.
[0035] The term “exemplary” as used herein means “serving as an example, embodiment, or illustration.” Any embodiment illustrated herein as “exemplary” is not necessarily to be construed as superior to or better than other embodiments.
[0036] Furthermore, to better illustrate the present invention, numerous specific details are set forth in the following detailed embodiments. Those skilled in the art will understand that the present invention can be practiced without certain specific details. In some instances, methods, means, elements, and circuits well known to those skilled in the art have not been described in detail in order to highlight the spirit of this disclosure.
[0037] It should be understood that the term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article indicates that the preceding and following related objects have an "or" relationship.
[0038] In the embodiments of this invention, "multiple" refers to two or more. The descriptions of "first," "second," etc., appearing in the embodiments of this invention are merely illustrative and for distinguishing the objects being described; they do not indicate any order, nor do they imply a specific limitation on the number of entities in the embodiments of this invention, and therefore do not constitute any limitation on the embodiments of this invention.
[0039] Figure 2 This is a top view of a variable wafer positioning bracket 100 according to an embodiment of the present invention. Figure 3 for Figure 2A cross-sectional view of the variable wafer positioning support 100 (carrying the second wafer 120). Figure 4 for Figure 2 A cross-sectional view of the variable wafer positioning holder 100 (carrying a first wafer 110) in the image. The variable wafer positioning holder 100 of this application is used in wafer grinding equipment, such as... Figure 2 As shown, in one embodiment, the variable wafer positioning support 100 includes a positioning base 10 and a lifting assembly 20. The positioning base 10 includes an annular base plate 11 and a horizontal positioning portion 12 located on the annular base plate 11. The annular base plate 11 supports the bottom surface of the wafer, and the horizontal positioning portion 12 limits the wafer's degree of freedom in the horizontal direction. In one embodiment, the horizontal positioning portion 12 can be a thin-walled cylindrical shape, using its inner wall to limit the circumference of the wafer. In another embodiment, the horizontal positioning portion 12 includes at least three vertically extending limiting posts 121. The space enclosed by the multiple limiting posts 121 is used to limit the wafer's degree of freedom in the horizontal direction, i.e., to keep the wafer immobile in any horizontal direction. In this embodiment, the horizontal positioning portion 12 includes three limiting posts 121. The lifting assembly 20 includes a support platform 21 and a driving assembly 22 for driving the support platform 21 to move up and down. The drive assembly 22 includes a lifting rod 221, which is connected to the support platform 21. The drive assembly 22 can be a combination of a cylinder, linear motor, rotary motor, and transmission mechanism, or other commonly used lifting drive sources, and is not limited here. Figure 4 As shown, the support platform 21 can be formed in a first state flush with the annular base plate 11, so that the support platform 21 and the annular base plate 11 jointly support the first wafer 110 with a thickness less than a preset value. Here, the first wafer 110 is a special wafer without a pattern and with a thickness less than a standard wafer. Such wafers have no support in the middle, and are extremely prone to breakage when only the bottom edge contacts the annular base plate 11. Figure 3 As shown, the support platform 21 can also form a second state that is lower than the preset height of the annular base plate 11, so as to make room for the pattern area 201 of the second wafer 120. Here, the second wafer 120 is a wafer of ordinary thickness, which can be supported only by the annular base plate 11.
[0040] This embodiment of the variable wafer positioning bracket 100 includes a fixed positioning base 10 and a liftable support platform 21. The horizontal limiting portion of the positioning base 10 can define the position of the wafer, and an annular base plate 11 is used to support the lower edge region of the wafer. When the support platform 21 is raised, it and the annular base plate 11 together form a large support area, which can effectively support thin wafers and prevent them from breaking. When the support platform 21 is lowered, it can make room for the patterned area 201 of ordinary wafers. In other words, the variable wafer positioning bracket 100 of this application can be compatible with two types of wafers, has a wider range of applications, and has a simple structure that is easy to implement.
[0041] In a further embodiment, the area of the upper limiting region of the horizontal positioning part 12 is larger than the area of the lower limiting region. For example... Figure 3 In the embodiment shown, each positioning post is set in a conical shape with the small end at the top. This arrangement can reduce the initial positional accuracy requirements between the wafer and the horizontal positioning part 12, and also play a certain guiding role, making it easier for the wafer to smoothly enter the horizontal positioning part 12.
[0042] In a further embodiment, the positioning base 10 further includes a connecting recess 13, the top of which is connected to the annular base plate 11. The connecting recess 13 or the support platform 21 is provided with a plurality of water spray nozzles 101, which are used to spray out a moisturizing liquid during grinding. Figure 2 and 3 In the embodiment shown, the lifting component 20 is disposed on the top surface of the connecting recess 13, that is, the driving component 22 and the support platform 21 are both disposed above the connecting recess 13, and a plurality of water nozzles 101 are disposed on the support platform 21.
[0043] In this embodiment, the drive component 22 is directly placed above the connection recess 13, so there is no need to consider interference with the connection recess 13. Furthermore, the water spray nozzle 101 is placed at the support platform 21, which can reduce the distance between the water spray nozzle 101 and the wafer, resulting in better moisturizing effect.
[0044] Figure 5 This is a cross-sectional view of a variable wafer positioning support 100 according to another embodiment of the present invention. Figure 6 for Figure 5 A top view of the positioning base 10 of the variable wafer positioning holder 100. In another embodiment, such as... Figure 5 and 6 As shown, the connecting recess 13 has a through-hole 131 for the lifting rod 221 of the drive assembly 22 to pass through. The connecting recess 13 is a frame structure including multiple connecting arms 132, and the hollow area between the connecting arms 132 serves as the through-hole 131. A water nozzle 101 is provided at the connecting recess 13.
[0045] The lifting component 20 in this embodiment can be adapted to the original frame-type positioning base 10. The original design of setting water spray nozzles 101 on the positioning base 10 is retained. By setting the lifting component 20 to be adapted to the positioning base 10, the modification of the original structure can be reduced and the cost can be saved.
[0046] Figure 7 This is a top view of a variable wafer positioning bracket 100 according to another embodiment of the present invention. Figure 8 for Figure 7 A cross-sectional view at point AA. In one embodiment, the number of lifting components 20 is multiple, so that the multiple support platforms 21 form various support areas. For example... Figure 7 As shown, in one embodiment, the plurality of support platforms 21 include a plurality of radially continuous fan-shaped rings 211. This embodiment includes three support platforms 21, all of which are fan-shaped, and one of the support platforms 21 includes three fan-shaped rings 211 in the radial direction, each driven by a different drive component 22. Of course, in other embodiments not shown, the number and shape of the support platforms 21 can be other, such as circular rings, strips, etc., and are not limited here.
[0047] In this embodiment, the number of support platforms 21 is multiple and can be controlled individually. Therefore, by controlling the number and individual support platforms 21 in the first state, different support areas can be formed, for example... Figure 8 As shown, the patterned area 201 of the third wafer 130 is given up in a specific position, while the third wafer 130 is effectively supported in other areas. Therefore, it can also be adapted to the use needs of the patterned and thinner third wafer 130, further expanding the applicable scenarios of the variable wafer positioning bracket 100. This multi-area adjustable lifting component 20 is highly flexible in use.
[0048] In other embodiments not shown, where the lifting assembly 20 is disposed above the connecting recess 13, the number of lifting assemblies 20 can also be multiple. For example, the support platform 21 can be multiple rings, each of which can lift independently. Adjacent rings can have a certain distance between them or be closely connected. This can also achieve different support areas to meet different wafer support requirements, that is, to provide effective support while giving up the pattern area 201.
[0049] This application also provides a grinding apparatus that includes the variable wafer positioning bracket 100 of any of the above embodiments. Since the variable wafer positioning bracket 100 is compatible with a wide variety of wafers, it expands the applicability of the grinding apparatus, avoids the need to purchase different grinding apparatuses for different wafers, and helps reduce costs.
[0050] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.
Claims
1. A variable wafer positioning bracket, characterized in that, For use in wafer grinding equipment and including: The positioning substrate includes an annular base plate and a horizontal positioning portion located on the annular base plate. The annular base plate is used to support the bottom surface of the wafer, and the horizontal positioning portion is used to limit the degree of freedom of the wafer in the horizontal direction. The lifting assembly includes a support platform and a drive assembly for driving the support platform to lift. The support platform can be configured to form a first state flush with the annular base plate so that the support platform and the annular base plate jointly support a first wafer with a thickness less than a preset value. The support platform can also be configured to form a second state lower than a preset height of the annular base plate so as to make room for the patterned area of the second wafer.
2. The variable wafer positioning bracket according to claim 1, characterized in that, The positioning base also includes a connecting recess, the top of which is connected to the annular base plate, and the connecting recess or the support platform is provided with multiple water spray nozzles.
3. The variable wafer positioning bracket according to claim 2, characterized in that, The lifting assembly is located on the top surface of the connecting recess.
4. The variable wafer positioning bracket according to claim 2, characterized in that, The connecting recess has a through-hole that passes through the upper and lower parts, and the through-hole is used for the lifting rod of the drive assembly to pass through.
5. The variable wafer positioning bracket according to claim 4, characterized in that, The connecting recess is a frame structure comprising multiple connecting arms, and the hollowed-out area between the connecting arms serves as the communication port.
6. The variable wafer positioning bracket according to any one of claims 1-5, characterized in that, The number of lifting components is multiple, so that the multiple support platforms can form a variety of support areas.
7. The variable wafer positioning bracket according to claim 6, characterized in that, The plurality of support platforms comprise a plurality of radially continuous fan rings or circular rings.
8. The variable wafer positioning holder according to any one of claims 1-5, characterized in that, The area of the upper limiting region of the horizontal positioning part is larger than the area of the lower limiting region.
9. The variable wafer positioning bracket according to claim 8, characterized in that, The horizontal positioning part is a thin-walled cylindrical shape or includes at least three vertically extending limiting posts.
10. A wafer grinding apparatus, characterized in that, Includes the variable wafer positioning bracket as described in any one of claims 1-9.