Bonding positioning tool for micro-hemispherical resonator gyro

Abstract

The utility model discloses a kind of micro hemispherical resonator gyro bonding positioning tool, the positioning tool top surface is equipped with the first groove being cooperated with the lip edge plane of micro hemispherical resonator, the groove bottom of first groove is equipped with the second groove being cooperated with micro hemispherical electrode, first groove and second groove are coaxially arranged in depth direction, and the positioning tool is enclosed by two half-positioning blocks symmetrically arranged along the radial direction of micro hemispherical resonator.Formed.The utility model is enclosed by two half-positioning blocks to form the positioning tool by design, the first groove of the positioning tool top surface is cooperated with the lip edge plane of micro hemispherical resonator, so that micro hemispherical resonator can be positioned in circumference, the second groove of second groove groove bottom is cooperated with micro hemispherical electrode, so that micro hemispherical electrode can be positioned in circumference, first groove and second groove are coaxially arranged in depth direction, so that the coaxiality after micro hemispherical resonator and micro hemispherical electrode assembly can be guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of inertial navigation fabrication technology, specifically to a bonding and positioning tooling for a micro-hemispherical resonant gyroscope. Background Technology

[0002] The micro-hemispherical resonator gyroscope is a high-precision inertial sensor based on the Coriolis effect. It has the advantages of high precision, long life and high reliability, and is an important direction for the future development of gyroscopes.

[0003] During the assembly of a micro-hemispherical resonator gyroscope, the gap between the lip of the hemispherical resonator and the upper surface of the plate electrode must first be adjusted to a set value. Finally, the lower end of the central column of the micro-hemispherical resonator is fixedly connected to the plate electrode. Its working principle is as follows: the lip of the micro-hemispherical resonator and multiple electrodes on the surface of the plate electrode form a capacitor. By detecting the change in capacitance between these electrodes, the angular rate of the carrier's motion is measured. Therefore, the assembly quality of the micro-hemispherical resonator and the plate electrode plays a decisive role in the overall performance of the micro-hemispherical resonator gyroscope.

[0004] One study employed a sacrificial layer technique to position the gap between the micro-hemispherical resonator and the planar electrode, then bonded them together using a bonding process. Finally, the sacrificial layer was removed through cleaning to form the micro-hemispherical resonator gyroscope assembly, thus ensuring the flatness between the two components. To ensure the coaxiality of the micro-hemispherical resonator and the planar electrode after assembly, suitable positioning fixtures need to be designed to ensure their coaxiality and to prevent radial displacement during the bonding process. Utility Model Content

[0005] To address the problems in the background technology, this utility model proposes a bonding and positioning fixture for a micro-hemispherical resonator gyroscope that can ensure the coaxiality of the micro-hemispherical resonator and the micro-hemispherical electrode after assembly.

[0006] The present invention adopts the following technical solution:

[0007] A bonding and positioning fixture for a micro-hemispherical resonator gyroscope, wherein the top surface of the positioning fixture has a first groove that mates with the lip plane of the micro-hemispherical resonator, and the bottom of the first groove has a second groove that mates with the micro-hemispherical electrode. The first groove and the second groove are coaxially arranged in the depth direction. The positioning fixture is formed by two semi-positioning blocks symmetrically arranged along the radial direction of the micro-hemispherical resonator.

[0008] As a further improvement to the above technical solution:

[0009] A connecting structure is provided between the two semi-positioning blocks to fix them together.

[0010] The connection structure includes fasteners and threaded holes on the opposing walls of the two semi-locating blocks. The threaded holes of the two semi-locating blocks are arranged correspondingly, and the two semi-locating blocks are fixed together by the cooperation of the fasteners and the threaded holes.

[0011] The connection structure is provided in two sets, which are located on both sides of the second groove.

[0012] The bottom surface of the positioning fixture has multiple positioning holes that extend upwards to connect with the second groove. Each positioning hole corresponds to a different through hole on the micro-hemispherical electrode.

[0013] The top surface of the positioning fixture is provided with a chamfered part that connects to the wall of the first slot to prevent the micro-hemispherical resonator from being damaged by bumping into the opening of the first slot when it is placed or moved out of the first slot.

[0014] Compared with the prior art, the advantages of this utility model are:

[0015] This utility model designs a positioning fixture formed by two semi-positioning blocks. The first groove on the top surface of the positioning fixture mates with the lip plane of the micro-hemispherical resonator, thereby enabling circumferential positioning of the micro-hemispherical resonator. The second groove on the bottom of the second groove mates with the micro-hemispherical electrode, thereby enabling circumferential positioning of the micro-hemispherical electrode. The first and second grooves are coaxially arranged in the depth direction, thereby ensuring the coaxiality of the micro-hemispherical resonator and the micro-hemispherical electrode after assembly. Attached Figure Description

[0016] To facilitate understanding of this invention, it will be described in more detail with reference to the specific embodiments shown in the accompanying drawings. These drawings depict only typical embodiments of this invention and should not be considered as limiting the scope of protection of this invention.

[0017] Figure 1 This is a three-dimensional structural diagram of the semi-positioning block according to an embodiment of the present invention.

[0018] Figure 2 This is a three-dimensional structural diagram of the bonding positioning tooling according to an embodiment of the present utility model.

[0019] Figure 3 A three-dimensional structural diagram of the micro-hemispherical electrode positioned in the bonding positioning fixture.

[0020] Figure 4 A schematic diagram of the three-dimensional structure of the micro-hemispherical resonator and electrodes positioned in the bonding positioning fixture.

[0021] Figure 5 This is a schematic cross-sectional view of the micro-hemispherical resonator and electrodes positioned in a bonding positioning fixture.

[0022] Figure label:

[0023] 100-Micro hemispherical electrode, 200-Micro hemispherical resonator, 201-Center rod, 202-Lip edge, 300-Fastener, 400-Positioning fixture, 401-First groove, 402-Second groove, 403-Semi-positioning block, 404-Positioning hole, 406-Threaded hole, 500-Bonding ring. Detailed Implementation

[0024] The embodiments of the present invention are described below with reference to the accompanying drawings, so that those skilled in the art can better understand and implement the present invention. However, the listed embodiments are not intended to limit the present invention. In the absence of conflict, the following embodiments and the technical features in the embodiments can be combined with each other, wherein the same components are indicated by the same reference numerals.

[0025] like Figure 1 and Figure 2 As shown, the micro-hemispherical resonator gyroscope bonding positioning fixture of this embodiment has a first groove 401 on the top surface that mates with the plane of the lip 202 of the micro-hemispherical resonator 200, and a second groove 402 at the bottom of the first groove 401 that mates with the micro-hemispherical electrode 100. The first groove 401 and the second groove 402 are arranged coaxially in the depth direction. The positioning fixture 400 is formed by two semi-positioning blocks 403 arranged symmetrically in the radial direction of the micro-hemispherical resonator.

[0026] In this embodiment, a connecting structure for fixing the two semi-positioning blocks 403 is provided between them.

[0027] In this embodiment, the connection structure includes a fastener 300 and threaded holes 406 formed on the opposing wall surfaces of the two semi-positioning blocks 403. The threaded holes 406 of the two semi-positioning blocks 403 are arranged correspondingly, and the two semi-positioning blocks 403 are fixedly connected by the fastener 300 and the threaded holes 406.

[0028] In this embodiment, there are two sets of connecting structures, which are respectively located on both sides of the second groove 402.

[0029] In this embodiment, the bottom surface of the positioning fixture is provided with a plurality of positioning holes 404, which extend upward to communicate with the second groove 402. The plurality of positioning holes 404 correspond one-to-one with the plurality of through holes on the micro hemispherical electrode 100.

[0030] In this embodiment, the top surface of the positioning fixture 400 is provided with a chamfered portion 405 that is connected to the wall of the first groove 401, so as to prevent the micro-hemispherical resonator from being damaged by hitting the groove opening when it is placed or moved out of the first groove 401.

[0031] The process of bonding a micro-hemispherical resonant gyroscope using the assistance of this invention is as follows:

[0032] 1) Insert the micro-hemispherical electrode 100 with the sacrificial layer facing upwards into the second groove 402 of one of the semi-positioning blocks 403 in parallel. Then, enclose the two semi-positioning blocks 403 to form a positioning fixture 400, and fix it with fasteners, such as... Figure 3 As shown;

[0033] 2) After the micro-hemispherical electrode 100 is assembled and positioned, a bonding ring 500 is placed on the high-voltage film layer 1 in the central region of its surface. The central post 201 of the micro-hemispherical resonator 200 is then fitted into the bonding ring 500. At this point, the micro-hemispherical resonator 200 is positioned within the first groove 401, thus completing the limiting assembly. Figure 4 and Figure 5 As shown;

[0034] 3) Place the positioning fixture for assembling the micro-hemispherical resonator and micro-hemispherical electrode into a vacuum furnace and heat it to 350°C at a rate of 5°C / min and hold it for 3 hours to perform bonding and curing, and then cool it down with the furnace.

[0035] 4) Disassemble the positioning fixture, remove the hemispherical gyroscope assembly or directly clean the positioning fixture and the hemispherical gyroscope assembly to remove the sacrificial layer. The internal cleaning fluid after the bonding and cleaning of the micro-hemispherical resonator 200 and the micro-hemispherical electrode 100 is discharged through the array-type through holes or the array-type through holes + positioning holes to ensure the relative cleanliness of the hemispherical gyroscope core.

[0036] The embodiments described above are merely preferred embodiments of this utility model. The terms "in one embodiment," "in another embodiment," "in yet another embodiment," or "in still another embodiment" used in this specification all refer to one or more of the same or different embodiments according to this disclosure. Ordinary variations and substitutions made by those skilled in the art within the scope of this utility model's technical solution should be included within the protection scope of this utility model.

Claims

1. A bonding and positioning fixture for a micro-hemispherical resonant gyroscope, characterized in that, The top surface of the positioning fixture (400) is provided with a first groove (401) that mates with the plane of the lip (202) of the micro-hemispherical resonator (200). The bottom of the first groove (401) is provided with a second groove (402) that mates with the micro-hemispherical electrode (100). The first groove (401) and the second groove (402) are arranged coaxially in the depth direction. The positioning fixture (400) is formed by two semi-positioning blocks (403) arranged symmetrically in the radial direction of the micro-hemispherical resonator.

2. The bonding and positioning fixture for a micro-hemispherical resonant gyroscope according to claim 1, characterized in that, A connecting structure is provided between the two semi-positioning blocks (403) for fixing them together.

3. The bonding and positioning fixture for a micro-hemispherical resonant gyroscope according to claim 2, characterized in that, The connection structure includes a fastener (300) and threaded holes (406) opened on the opposite walls of the two semi-locating blocks (403). The threaded holes (406) of the two semi-locating blocks (403) are arranged correspondingly, and the two semi-locating blocks (403) are fixedly connected by the fastener (300) and the threaded holes (406).

4. The bonding and positioning fixture for a micro-hemispherical resonant gyroscope according to claim 2, characterized in that, The connection structure is provided in two sets, which are located on both sides of the second groove (402).

5. The micro-hemispherical resonant gyroscope bonding and positioning fixture according to any one of claims 1-4, characterized in that, The bottom surface of the positioning fixture has multiple positioning holes (404), which extend upward to communicate with the second groove (402). The multiple positioning holes (404) correspond one-to-one with the multiple through holes on the micro hemispherical electrode (100).

6. The bonding and positioning fixture for a micro-hemispherical resonant gyroscope according to claim 5, characterized in that, The top surface of the positioning fixture (400) is provided with a chamfered part (405) that is connected to the wall of the first groove (401).

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