A semiconductor device compression test apparatus

Abstract

The utility model provides a kind of semiconductor device crimping test device, including base and be set on the linear drive part of base, heat dissipation positioning part, crimping conductive part, heat dissipation positioning part and crimping conductive part alternatively slidably set on base and are driven to slide by linear drive part, heat dissipation positioning part includes radiator and at least one positioning slot for test piece to place on radiator, crimping conductive part includes insulating plate and the elastic crimping structure of being set on the same side of insulating plate, test conductive structure, test conductive structure is set corresponding positioning slot.The utility model's semiconductor device crimping test device, using module integration design, realize crimping type contact conduction and heat dissipation, replacement device operation is simple, just one takes one and places, can be quickly completed device replacement, crimping conduction and heat dissipation mode avoid screwing screw and coating silicon grease to be tested product appearance scratch and dirty, can be well guaranteed factory IGBT appearance requirement, applicable to factory IGBT batch testing.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor device production and testing technology, and specifically relates to a semiconductor device crimping test device. Background Technology

[0002] IGBTs are now widely used in new energy power generation, locomotives, high-voltage power transmission, and electric vehicles. With the large-scale application of IGBTs, their reliability has become increasingly prominent, especially in high-reliability converter applications such as locomotive traction and electric vehicles. IGBTs are the core component of traction converters, and their operating environment is quite complex. High-speed driving, frequent starts and stops, and high temperatures severely threaten the reliability and lifespan of power devices. Extensive converter failure data shows that IGBTs have become a key component affecting converter reliability. Therefore, improving IGBT reliability is of great significance for reducing converter failures and improving vehicle operational stability. To ensure high IGBT reliability, pre-shipment testing is necessary. However, traditional IGBT testing involves assembling the devices into components for testing. This process requires screws to secure the conductive main and auxiliary terminals, as well as the substrate. This involves numerous and cumbersome installation steps, resulting in low efficiency for device replacement and making it unsuitable for device-level testing. Furthermore, the screwing and silicone grease application during IGBT installation can cause mechanical damage to the main terminals and substrate, such as scratches, abrasions, and indentations. Applying silicone grease also contaminates the substrate and is difficult to clean. All of these factors contribute to failing to meet the appearance requirements for factory-shipped IGBTs, making it unsuitable for batch testing. Therefore, it is necessary to design a testing device suitable for batch testing of factory-shipped IGBTs to address these issues. Utility Model Content

[0003] The purpose of this invention is to overcome the shortcomings of the existing technology and provide a semiconductor device crimping test device that has high testing efficiency and does not damage the appearance of the device.

[0004] To achieve the above objectives, the technical solution of this utility model is implemented as follows:

[0005] This utility model provides a semiconductor device crimping test device, including a base and a linear driving part, a heat dissipation positioning part, and a crimping conductive part disposed on the base. The heat dissipation positioning part and the crimping conductive part are slidably disposed on the base and are driven by the linear driving part to slide. The heat dissipation positioning part includes a heat sink and at least one positioning groove disposed on the heat sink for placing the test piece. The crimping conductive part includes an insulating plate and an elastic crimping structure and a test conductive structure disposed on the same side of the insulating plate. The test conductive structure is disposed corresponding to the positioning groove.

[0006] In one embodiment, the test conductive structure includes at least one conductive spring copper pillar and at least one auxiliary end conductive probe.

[0007] In one embodiment, the elastic pressing structure includes a plurality of hydraulic springs.

[0008] In one embodiment, the heat dissipation positioning part is slidably disposed between the linear driving part and the press-fit conductive part.

[0009] In one embodiment, a guide post is provided on the base extending along the driving direction of the linear drive unit, and a through hole is provided on the heat dissipation positioning unit relative to the guide post. The heat dissipation positioning unit is slidably connected to the guide post through the through hole, and a limiting part is provided on the guide post corresponding to the through hole to restrict downward movement.

[0010] In one embodiment, the radiator is provided with an internal cooling water channel and a water inlet connector and a water outlet connector respectively connected to the internal cooling water channel.

[0011] In one embodiment, the elastic pressing structure includes a plurality of hydraulic springs arranged in a matrix.

[0012] In one embodiment, the heat dissipation positioning part further includes a heat dissipation base plate, and the heat sink is detachably connected to the heat dissipation base plate.

[0013] In one embodiment, the linear drive unit includes three cylinders.

[0014] In one embodiment, the test conductive structure corresponds one-to-one with the positioning groove, and one of the test conductive structures includes six conductive spring copper pillars and three auxiliary end conductive probes.

[0015] Compared with existing technologies, the semiconductor device crimping test device of this utility model solves the problem that traditional testing methods cannot be used for batch testing of IGBT devices. It adopts a modular integrated design to achieve crimping contact conductivity and heat dissipation, eliminating the screw-tightening and silicone grease application steps in the IGBT device installation process. The device replacement operation is simple, requiring only one pick-up and one drop, which can quickly complete the device replacement. The crimping conductivity and heat dissipation method avoids the scratching and dirt on the appearance of the device under test caused by screw-tightening and silicone grease application, which can well ensure the appearance requirements of the IGBT devices leaving the factory. It is suitable for batch testing of IGBT devices leaving the factory. Attached Figure Description

[0016] Figure 1 This is an exploded view of the structure of a high-power IGBT crimping test device according to an embodiment of the present invention;

[0017] Figure 2 for Figure 1A schematic diagram of the crimped conductive part in the high-power IGBT crimping test device, viewed from below.

[0018] Figure 3 for Figure 1 A schematic diagram of the side view of the crimped conductive part in the high-power IGBT crimping test device shown;

[0019] Figure 4 for Figure 1 The diagram shows a top view of the heat dissipation positioning part in the high-power IGBT crimping test device.

[0020] Explanation of reference numerals in the attached drawings: 1 base, 11 guide post, 2 linear drive unit, 3 heat dissipation positioning unit, 31 radiator, 313 water inlet connector, 315 water outlet connector, 33 positioning groove, 35 through hole, 37 heat dissipation base plate, 4 press-fit conductive part, 41 insulating plate, 43 elastic press-fit structure, 45 test conductive structure, 431 hydraulic spring, 451 conductive spring copper column, 453 auxiliary end conductive probe, 455 detection board support frame, 47 mounting hole. Detailed Implementation

[0021] See also Figure 1-4 This embodiment provides a high-power IGBT (Insulated Gate Bipolar Transistor) crimping test device, including a base 1 and a linear drive unit 2, a heat dissipation positioning unit 3, and a crimping conductive unit 4 disposed on the base 1. The heat dissipation positioning unit 3 is slidably disposed between the linear drive unit 2 and the crimping conductive unit 4, and slides under the drive of the linear drive unit 2. A guide post 11 extending along the driving direction of the linear drive unit 2 and serving as a vertical guide is provided on the base 1. The heat dissipation positioning unit 3 has a through hole 35 relative to the guide post 11, and the heat dissipation positioning unit 3 is slidably connected to the guide post 11 through the through hole 35. A limiting part is provided on the guide post 11 corresponding to the through hole 35 to limit the downward movement. The linear drive unit 2 includes three cylinders, and the base 1 supports and fixes the three cylinders to ensure that the cylinders are raised. The three cylinders are used to provide sufficient pressure so that the main terminals and auxiliary terminals of the IGBT device are connected to the conductive structure of the crimping conductive unit 4 by crimping. The three cylinders of the linear drive unit are evenly distributed. The cylinder action sequence is to raise the middle cylinder first and then the two side cylinders to avoid the water-cooled radiator base support plate getting stuck due to asynchronous lifting of the three cylinders.

[0022] In this embodiment, the heat dissipation positioning part 3 includes a heat dissipation base plate 37, a heat sink 31, and at least one positioning groove 33 on the heat sink 31 for placing the test specimen. The positioning groove 33 is the IGBT mounting area of ​​the test specimen. The heat sink 31 is detachably connected to the heat dissipation base plate 37. The heat dissipation base plate 37 supports and fixes the heat sink 31, and moves the heat sink 31 up and down under the action of a cylinder. The heat sink 31 is a water-cooled heat sink, equipped with internal heat dissipation water channels and water inlet connectors 313 and water outlet connectors 315 respectively connected to the internal heat dissipation water channels. The heat sink 31 uses water as a medium to carry away the heat generated during the high-power IGBT test through heat conduction, thus playing a heat dissipation role.

[0023] In this embodiment, the press-fit conductive part 4 includes an insulating plate 41 and an elastic press-fit structure 43 and a test conductive structure 45 disposed on the same side of the insulating plate 41. The test conductive structure 45 is disposed corresponding to the positioning groove 33. The test conductive structure 45 includes at least one conductive spring copper pillar 451 and at least one auxiliary end conductive probe 453. The insulating plate 41 is an epoxy insulating plate, which serves to fix the conductive spring copper pillar 451 and the hydraulic spring 431 and to provide insulation. The auxiliary end conductive probe 453 is fixed on the insulating plate 41 by a test plate support frame 455. The conductive spring copper pillar 451 is a copper device that can elastically expand and contract and conduct large currents. The elastic press-fit structure 43 includes a plurality of hydraulic springs 431 arranged in a matrix. The hydraulic springs 431 contact the IGBT device substrate by press-fitting, so that the IGBT device substrate and the heat sink 31 are in close contact, replacing the substrate fastening screws to play a fixing role and helping to enhance the heat dissipation effect. The test conductive structure 45 corresponds one-to-one with the positioning groove 33. One test conductive structure 45 includes six conductive spring copper pillars and three auxiliary end conductive probes. The conductive spring copper pillar 451 contacts the main terminal of the IGBT device via a crimping method, providing conductivity and capable of withstanding large current flows. The three cylinders of the linear drive unit 2 provide sufficient pressure to connect the main and auxiliary terminals of the IGBT device to the conductive spring copper pillar 451 and the auxiliary conductive probe 453 via crimping. Simultaneously, the IGBT device substrate presses against the hydraulic spring 431, causing it to retract and thus bringing the IGBT device into close contact with the heat sink 31, significantly increasing heat dissipation.

[0024] In this embodiment, the main structure comprises three parts: a top layer, a middle layer, and a bottom layer. The middle layer mainly includes a heat dissipation base plate 37 and a heat sink 31. The heat sink 31 is used to place the IGBT device test specimen and provides water cooling. The IGBT test specimen is placed in six test specimen areas. The test specimen areas defined by the positioning groove 33 can achieve precise docking with the conductive spring copper pillar 451, auxiliary conductive probe 453, and hydraulic spring 431 at the bottom of the top layer, achieving conductivity and fixation. The upper part of the insulating plate 41 of the top layer is mainly used to connect the low-inductance busbar for electrical connection. The conductive spring copper pillar 451, the test board bracket 455, and the hydraulic spring 431 are fixed to the lower part of the insulating plate 41 of the top layer through fixing mounting holes. The auxiliary conductive probe 453 is fixed to the test board support frame 455. The conductive spring copper pillar, the auxiliary conductive probe, and the hydraulic spring are all designed with elasticity, and their pressure and compression stroke can be adjusted by replacement to meet different pressure and compression stroke requirements. The top layer includes an insulating plate 41 and stacked copper busbars, conductive spring copper pillars, hydraulic springs, a test board support frame, and auxiliary conductive probes disposed on the insulating plate 41. In use, the upper part of the insulating plate 41 is fastened to the electrical connection terminals such as the composite busbar with bolts. The conductive spring copper pillars 451 and auxiliary conductive probes 453 of the lower part are in direct contact with the IGBT device under test, and the hydraulic spring 431 is in direct contact with the substrate of the IGBT device under test. Pressure is applied by the bottom cylinder, causing the heat sink 31 and the IGBT under test in the middle layer to rise until they achieve elastic contact and conductivity with the conductive spring copper pillars 451, auxiliary conductive probes 453, and hydraulic springs 431, and elastic fixation of the device substrate. The pressure and retraction of the conductive spring copper pillars, auxiliary conductive probes, and hydraulic springs are all adjustable, achieving soft contact, which has the advantages of no damage or contamination to the appearance of the IGBT device under test. In other embodiments, the top-level and middle-level structures can be modified according to different application scenarios and connection objects. By changing the size of the components, it can be adapted to various models of IGBT devices. Furthermore, the testing device is applicable to, but not limited to, three-phase bridges, and can also be used for single-phase bridges.

[0025] This embodiment of the high-power IGBT crimping test device uses an elastic crimping method to contact and fix the conductive main terminals, auxiliary terminals, and substrate of the IGBT device, eliminating the screw-tightening step of traditional testing. Simply place the device under test in the test area of ​​the heat sink, greatly simplifying the device replacement process and significantly improving testing efficiency. The conductive spring copper pillars used can achieve high current flow, thus achieving crimped conductivity and avoiding contamination and damage to the test sample caused by screws. This also improves the efficiency of test sample replacement during testing, which is beneficial for the rapid batch testing of high-power IGBTs. The hydraulic spring has the characteristic of constant pressure despite stroke changes. It is ideal for fixing device substrates, ensuring close contact between the substrate and the heat sink for good heat dissipation without altering the substrate's curvature. The main body of the test device features a layered design, completely separating strong and weak currents to avoid electromagnetic interference and the risk of electric shock. Considering the issue of large stray inductance that could cause overshoot voltage and damage to the IGBT device under test, low-inductance composite busbars are used between the device contact point and the capacitor, significantly reducing stray inductance and overshoot voltage, effectively preventing damage to the test sample from surge voltage. Water, electricity, and gas interfaces are pre-installed in visible locations, allowing for quick installation and disassembly. The operation is simple, safe, and efficient.

[0026] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of protection of this application is limited to these examples; within the framework of this application, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of one or more embodiments of this application as described above, which are not provided in detail for the sake of brevity.

[0027] One or more embodiments in this application are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of this application. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of one or more embodiments in this application should be included within the protection scope of this application.

Claims

1. A semiconductor device press-fit testing apparatus, characterized in that, The device includes a base (1) and a linear drive part (2), a heat dissipation positioning part (3), and a press-fit conductive part (4) disposed on the base (1). The heat dissipation positioning part (3) and the press-fit conductive part (4) are slidably disposed on the base (1) and are driven by the linear drive part (2) to slide. The heat dissipation positioning part (3) includes a heat sink (31) and at least one positioning groove (33) disposed on the heat sink (31) for placing the test piece. The press-fit conductive part (4) includes an insulating plate (41) and an elastic pressing structure (43) and a test conductive structure (45) disposed on the same side of the insulating plate (41). The test conductive structure (45) is disposed corresponding to the positioning groove (33).

2. The semiconductor device crimping test apparatus as described in claim 1, characterized in that, The test conductive structure (45) includes at least one conductive spring copper pillar (451) and at least one auxiliary end conductive probe (453).

3. The semiconductor device crimping test apparatus as described in claim 1, characterized in that, The elastic pressing structure (43) includes several hydraulic springs (431).

4. The semiconductor device crimping test apparatus as described in claim 1, characterized in that, The heat dissipation positioning part (3) is slidably disposed between the linear driving part (2) and the press-fit conductive part (4).

5. The semiconductor device press-fit testing apparatus as described in claim 4, characterized in that, A guide post (11) is provided on the base (1) along the driving direction of the linear drive unit (2). A through hole (35) is provided on the heat dissipation positioning unit (3) relative to the guide post (11). The heat dissipation positioning unit (3) is slidably connected to the guide post (11) through the through hole (35). A limiting part is provided on the guide post (11) relative to the through hole (35) to restrict downward movement.

6. The semiconductor device crimping test apparatus according to any one of claims 1-5, characterized in that, The radiator (31) is provided with an internal heat dissipation water channel and a water inlet connector (313) and a water outlet connector (315) respectively connected to the internal heat dissipation water channel.

7. The semiconductor device crimping test apparatus according to any one of claims 1-5, characterized in that, The elastic pressing structure (43) includes a plurality of hydraulic springs (431) arranged in a matrix.

8. The semiconductor device press-fit testing apparatus according to any one of claims 1-5, characterized in that, The heat dissipation positioning part (3) also includes a heat dissipation base plate (37), and the heat sink (31) is detachably connected to the heat dissipation base plate (37).

9. The semiconductor device crimping test apparatus according to any one of claims 1-5, characterized in that, The linear drive unit (2) includes three cylinders.

10. The semiconductor device crimping test apparatus according to any one of claims 1-5, characterized in that, The test conductive structure (45) corresponds one-to-one with the positioning groove (33). Each test conductive structure (45) includes six conductive spring copper pillars and three auxiliary end conductive probes.

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