Display module and electronic device

Abstract

The application relates to the technical field of electronic equipment, and discloses a display module and electronic equipment. The display module comprises a display panel and at least one layer of an under-screen base film stacked along the thickness direction of the display module, and the display panel has a light-emitting surface away from the side of the under-screen base film along the thickness direction; the material of the under-screen base film comprises at least one of carbon fibers, benzene-based benzodioxazole fibers, silicon carbide fibers, boron fibers, aramid fibers, ultra-high molecular weight polyethylene fibers, stainless steel, titanium alloy and ultra-thin glass. In this way, the under-screen base film has good anti-ball ability, and the impact resistance and extrusion resistance of the display module can be improved. The under-screen base film can also improve the indentation problem of the metal layer in the display module, and the strength and yield of the display module can be improved.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and in particular to a display module and an electronic device. Background Technology

[0002] With the continuous development of electronic devices, an under-screen support structure or under-screen buffer structure is usually installed beneath the display panel (such as an organic light-emitting diode (OLED) display panel) in the display module of electronic devices. The under-screen support structure provides support for the display panel. The under-screen buffer structure can effectively absorb and disperse the impact force caused by drops, collisions, etc., to prevent excessive deformation of the display panel when the electronic device is impacted or squeezed, which could lead to display defects.

[0003] However, current under-display support and cushioning structures still offer relatively poor drop and impact protection for the entire device. The impact resistance of under-display materials is typically characterized by resistance to falling ball impact (or falling ball resistance), resistance to pointed head compression, and resistance to pointed head impact. Falling ball resistance refers to the ability of the under-display support or cushioning structure to withstand damage from a ball falling freely from a certain height. Pointed head compression resistance refers to the ability of the under-display support or cushioning structure to withstand damage from compression by a pointed structure. Pointed head impact resistance refers to the ability of the under-display support or cushioning structure to withstand impact from a pointed structure falling freely from a certain height. Therefore, improving the impact and compression resistance of the under-display support or cushioning structure in the display module is a pressing issue that needs to be addressed. Utility Model Content

[0004] This application provides a display module and an electronic device to improve the display module's resistance to falling balls, impact resistance, and compression resistance.

[0005] In a first aspect, this application provides a display module, including a display panel and at least one under-screen base film stacked along the thickness direction of the display module, wherein the display panel has a light-emitting surface on the side away from the under-screen base film along the thickness direction; the material of the under-screen base film includes at least one of carbon fiber, phenylene benzodioxazole fiber, silicon carbide fiber, boron fiber, aramid fiber, ultra-high molecular weight polyethylene fiber, stainless steel, titanium alloy and ultra-thin glass (UTG).

[0006] According to the above embodiments, the under-display base film material has good elastic modulus and rigidity, which improves its resistance to falling balls. Using the under-display base film in the under-display support structure or under-display buffer structure can improve the support performance of the under-display support structure and the impact and compression resistance of the under-display buffer structure, thereby improving the overall strength of the display module. Furthermore, in the under-display buffer structure, the self-adhesion of the under-display base film allows for direct bonding to the copper layer, which can improve the indentation problem of the copper layer when the silicone gel is bonded to the copper layer, and overcome the problems of slow deformation recovery speed and weak recovery force of the silicone gel when bonded to the copper layer. This improves the yield of the display module and reduces the rejection rate of electronic devices.

[0007] In some embodiments of the first aspect above, the molecular weight of the ultra-high molecular weight polyethylene fiber can be in the range of 1 million to 5 million, and the thickness of the ultra-thin glass can be in the range of 25 to 100 μm.

[0008] In some embodiments of the first aspect described above, the under-display base film may further comprise other materials with high elastic modulus. For example, the under-display base film may also comprise materials with an elastic modulus higher than 4.5 gigapascals (GPa). This improves the impact and compression resistance of the under-display base film.

[0009] In some embodiments of the first aspect described above, the display module can serve as the screen of a candybar phone or as the outer screen of a foldable phone. Correspondingly, the display module may include an under-display buffer structure, an under-display support structure, and a display panel, which are sequentially stacked along the thickness direction. At least one of the under-display buffer structure and the under-display support structure includes the aforementioned under-display base film. The specific structures of the under-display buffer structure and the under-display support structure will be described in detail in the following embodiments.

[0010] In some embodiments of the first aspect described above, the display module can be a foldable display module, for example, it can serve as the inner screen of a folding machine. Correspondingly, the display module may include an under-screen support structure and a display panel stacked sequentially along the thickness direction. The under-screen support structure includes the aforementioned under-screen base film. The specific structure of the under-screen support structure will be described in detail in the following embodiments.

[0011] In some embodiments of the first aspect described above, the under-display base film includes a first material layer, a second material layer, and a third material layer stacked sequentially along the thickness direction, with the third material layer located between the second material layer and the display panel; the material of at least one of the first, second, and third material layers includes at least one of carbon fiber, phenylenebenzodioxazole fiber, silicon carbide fiber, boron fiber, aramid fiber, ultra-high molecular weight polyethylene fiber, stainless steel, titanium alloy, and ultra-thin glass.

[0012] In other embodiments of the first aspect described above, at least one of the first, second, and third material layers may further comprise at least one of aramid film, polyimide (PI) film, polyethylene naphthalate film, and polyester (polyethylene terephthalate (PET)) film. The aramid film, PI film, polyethylene naphthalate film, and polyester film can all be high-modulus materials. High-modulus materials refer to materials with a high elastic modulus (or tensile modulus) (e.g., higher than 4.5 GPa).

[0013] In some embodiments of the first aspect described above, at least one of the first, second, and third material layers may also comprise other materials with higher elastic modulus. For example, the first, second, and third material layers may also comprise materials with an elastic modulus higher than 4.5 gigapascals (GPa).

[0014] In some embodiments of the first aspect described above, the first material layer and the third material layer are made of the same material. Furthermore, the first material layer and the second material layer may be made of the same material or different materials.

[0015] This avoids the stress caused by the curing and shrinkage of the resin during the production process of the under-screen base film, thereby preventing warping or deformation of the under-screen base film due to asymmetrical stress on the upper and lower layers, thus improving the flatness and stability of the under-screen base film.

[0016] In some embodiments of the first aspect described above, at least one of the first material layer, the second material layer, and the third material layer (also referred to as the prepreg layer) includes an adhesive layer, a fiber layer, and an adhesive layer that are sequentially stacked and cross-linked along the thickness direction. That is, at least one of the first material layer, the second material layer, and the third material layer can be a composite material layer including a fiber layer.

[0017] In this context, the prepreg layer refers to a composite material layer in which two adhesive layers (usually thermosetting resins) are pre-impregnated onto a substrate (i.e., the fiber layer). In the prepreg layer, the fiber layer serves as the main material.

[0018] In some embodiments of the first aspect described above, the adhesive layer is made of epoxy resin, and the fiber layer is made of one or more of carbon fiber, poly-p-phenylene benzobisoxazole (PBO) fiber, silicon carbide fiber, boron fiber, aramid fiber, and ultra-high molecular weight polyethylene fiber.

[0019] Thus, since the elastic modulus of carbon fiber, PBO fiber, silicon carbide fiber, boron fiber, aramid fiber, and ultra-high molecular weight polyethylene fiber are all greater than that of polyester (PET) film, the under-screen base film has higher resistance to falling balls, resulting in higher impact and compression resistance, thereby improving the performance of the display module.

[0020] In some embodiments of the first aspect described above, the epoxy resin can have a high conductivity and dielectric constant (Dk), for example, Dk>6, thereby improving the copper rod effect of the display module.

[0021] In some embodiments of the first aspect described above, the material of the adhesive layer may also include other resin-based materials or adhesive materials.

[0022] In some embodiments of the first aspect described above, the first material layer, the second material layer, and the third material layer each include an adhesive layer, a fiber layer, and an adhesive layer that are sequentially stacked and cross-linked along the thickness direction.

[0023] In some embodiments of the first aspect described above, the fiber layers in the first, second, and third material layers can all include carbon fiber. In this case, the first, second, and third material layers can all be referred to as carbon fiber sheets (or carbon fiber prepreg layers). Specifically, carbon fiber has the highest elastic modulus (i.e., tensile modulus) when parallel to the fiber orientation, exceeding 80 GPa, and the lowest elastic modulus, approximately 45 GPa, when perpendicular to the fiber orientation (i.e., at a 90° angle). That is, carbon fiber exhibits a high elastic modulus in all directions, significantly greater than the 4.5 GPa elastic modulus of polyester film. This increases the impact and compression resistance of the under-screen base film in different directions, thereby improving the overall strength and rigidity of the display module.

[0024] In some embodiments of the first aspect described above, the fibers (e.g., carbon fibers) in the first material layer and the fibers (e.g., carbon fibers) in the third material layer are oriented parallel to each other, while the fibers (e.g., carbon fibers) in the first material layer and the fibers (e.g., carbon fibers) in the second material layer are oriented perpendicular to each other. Furthermore, the fiber orientations in the first, second, and third material layers are all perpendicular to the thickness direction of the display module.

[0025] Since the main strength of carbon fiber is usually stronger along the fiber orientation, meaning that the strength and stiffness of carbon fiber perpendicular to the fiber orientation are weaker, by setting the under-screen base film as a three-layered material layer and setting the fiber layers in the three material layers to different and symmetrical structures, the impact resistance and compression resistance of the under-screen base film can be increased in different directions, thereby improving the overall strength and rigidity of the display module.

[0026] In some other embodiments, the material of one or more of the fiber layers in the first, second, and third material layers may further include PBO fibers. Alternatively, in still other embodiments, the material of one or more of the fiber layers in the first, second, and third material layers may further include other fibers with a high elastic modulus (e.g., an elastic modulus greater than 4.5 GPa).

[0027] During the production of the under-display support structure and / or under-display buffer structure, the carbon fiber prepreg layer becomes adhesive at temperatures above a certain level (e.g., 50°C). Therefore, the under-display base film can also act as an adhesive, bonding with adjacent structural layers to form a more stable under-display support structure and / or under-display buffer structure, further enhancing the strength of the display module. In current display modules, the under-display buffer structure uses silicone gel to connect with the copper layer. Silicone gel is prone to deformation and has a low recovery rate when subjected to external impact, and because the copper layer is very thin, it is also prone to deformation. Consequently, the copper layer connected to the silicone gel is prone to indentation, resulting in visible indentations on the display module; this can be termed a molding problem. This application utilizes the adhesive properties of the under-display base film at temperatures above 50°C to directly bond the under-display base film and copper layer during the production of the under-display support structure and / or under-display buffer structure (e.g., by hot rolling), eliminating the need for an additional adhesive layer (e.g., silicone gel layer) to bond with the copper layer. This improves the problem of indentations on the copper layer, thereby enhancing the overall strength of the display module. Furthermore, eliminating the need for an additional adhesive layer reduces the thickness of the under-display buffer structure, contributing to the thinner and lighter design of electronic devices.

[0028] In some embodiments of the first aspect described above, the first material layer includes a first adhesive layer, a first fiber layer, and a second adhesive layer; the material of the second material layer includes stainless steel; and the third material layer includes a third adhesive layer, a second fiber layer, and a fourth adhesive layer. In other embodiments, the material of the second material layer may also include titanium alloy or ultra-thin glass, etc.

[0029] For example, the first and third material layers can be carbon fiber prepreg layers, and the second material layer can be a stainless steel layer. Since stainless steel has strong supporting capacity and fatigue resistance, the under-display base film can further enhance the supporting capacity and impact / extrusion resistance of the under-display support structure or under-display buffer structure.

[0030] In some embodiments of the first aspect described above, the first material layer is made of stainless steel, the second material layer includes a fifth adhesive layer, a third fiber layer, and a sixth adhesive layer, and the third material layer is made of stainless steel. In other embodiments, the first material layer may also include titanium alloy or ultra-thin glass, and the third material layer may also include titanium alloy or ultra-thin glass.

[0031] For example, the first and third material layers can be stainless steel layers, and the second material layer can be a carbon fiber prepreg layer.

[0032] In some embodiments of the first aspect described above, the under-screen base film further includes N fourth material layers, where N is an integer greater than or equal to 1; the first material layer, the N fourth material layers, the second material layer, and the third material layer are stacked sequentially along the thickness direction.

[0033] In some embodiments of the first aspect described above, the thickness of the under-screen base film ranges from 10 to 200 μm.

[0034] For example, the thickness of the under-display substrate film can be 10μm, 40μm, 50μm, 100μm, 150μm, or 200μm, etc. The thicknesses of the first, second, and third material layers can be the same or different.

[0035] In some embodiments of the first aspect described above, the display module further includes a first adhesive layer, an under-screen base film, the first adhesive layer, and a display panel that are sequentially stacked and connected along the thickness direction; wherein the first adhesive layer and the under-screen base film are used together to form an under-screen support structure (also known as an under-screen back film or under-screen support back film).

[0036] In some embodiments of the first aspect described above, the material of the first adhesive layer includes one or more of acrylic acid, silicone, epoxy resin, and polyurethane.

[0037] In some embodiments of the first aspect described above, the recovery rate and adhesion of the first adhesive layer can be high. For example, the recovery rate of the first adhesive layer is >95%, and the adhesion between the first adhesive layer and the under-screen base film is >5 N / cm. Thus, the first adhesive layer can quickly recover its original shape after being subjected to pressure without significant deformation, thereby giving the display module stronger durability and stability.

[0038] In addition, the conductivity and dielectric constant (Dk) of the first adhesive layer can be relatively high, for example, Dk>6, which can improve the copper rod effect of the display module.

[0039] In some embodiments, the first adhesive layer may be a pressure-sensitive adhesive layer, an optical adhesive layer, or other adhesive layers.

[0040] In some embodiments of the first aspect described above, the number of under-screen base films is two, and the under-screen support structure and the under-screen buffer structure (also referred to as the under-screen buffer film) in the display module may each include one under-screen base film. Specifically, the display module further includes a first metal layer and a second adhesive layer, wherein the first metal layer, one of the under-screen base films, and the second adhesive layer are sequentially stacked along the thickness direction and together form the under-screen buffer structure. The under-screen buffer structure, the under-screen support structure, and the display panel are sequentially stacked along the thickness direction, and the second adhesive layer is connected to the under-screen base film in the under-screen support structure.

[0041] Thus, the display module of the candybar phone includes an under-screen support structure and an under-screen buffer structure. Both the under-screen support structure and the under-screen buffer structure use an under-screen base film, which can further improve the under-screen support capability and the impact and extrusion resistance, thereby improving the overall strength of the display module.

[0042] In some embodiments of the first aspect described above, the material of the first metal layer includes copper, and the material of the second adhesive layer includes silicone gel. In other embodiments, the material of the first metal layer may also include one or more of stainless steel, aluminum, or titanium. The second adhesive layer may also include an optical adhesive layer or other adhesive layers.

[0043] Thus, this layer structure possesses excellent thermal conductivity, thereby improving the heat dissipation capacity of the display module. Furthermore, the copper material can be directly bonded to the under-display base film, thereby enhancing the extrusion resistance of the first metal layer and mitigating film printing issues.

[0044] In the under-display buffer structure, when subjected to localized external impact, the second adhesive layer absorbs the impact energy, while the under-display base film transforms the localized impact or compressive force into a uniform in-plane force, allowing the second adhesive layer to recover quickly. The combination of the second adhesive layer and the under-display base film forms a dual-armor protection system within the under-display buffer structure, effectively protecting the display module.

[0045] In some embodiments of the first aspect described above, the under-screen buffer structure further includes a third adhesive layer and a substrate layer, wherein the first metal layer, the under-screen base film, the third adhesive layer, the substrate layer, and the second adhesive layer are stacked sequentially along the thickness direction.

[0046] In some embodiments of the first aspect described above, the material of the third adhesive layer includes silicone gel, and the material of the base layer includes polyethylene terephthalate (PET) or polyimide (PI). In other embodiments, the third adhesive layer may also include an optical adhesive layer or other adhesive layers.

[0047] In some embodiments of the first aspect described above, the display module further includes an optical structure located on the side of the display panel away from the under-screen substrate along the thickness direction.

[0048] In some embodiments of the first aspect described above, the optical structure may include a polarizer and a pressure-sensitive adhesive layer, an optical adhesive layer and a cover glass, which are stacked sequentially along the thickness direction.

[0049] Secondly, this application provides an electronic device, including a housing and a display module as described in the first aspect, wherein the display module is located on the housing.

[0050] The beneficial effects of the second aspect described above can be referred to the relevant descriptions in the various embodiments of the first aspect described above, and will not be repeated here. Attached Figure Description

[0051] To more clearly illustrate the technical solution of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below.

[0052] Figure 1 According to some embodiments of this application, a three-dimensional structural schematic diagram of a mobile phone 1a is shown;

[0053] Figure 2 According to some embodiments of this application, a schematic cross-sectional structure diagram of a display module 10a is shown;

[0054] Figure 3A According to some embodiments of this application, a three-dimensional structural schematic diagram of a mobile phone 1b is shown;

[0055] Figure 3B According to some embodiments of this application, a three-dimensional structural schematic diagram of another mobile phone 1b is shown;

[0056] Figure 4 According to some embodiments of this application, a schematic cross-sectional structure diagram of a display module 10b is shown;

[0057] Figure 5 According to some embodiments of this application, a schematic cross-sectional structure diagram of a display module 10c is shown;

[0058] Figure 6 According to some embodiments of this application, a cross-sectional structural schematic diagram of another display module 10c is shown;

[0059] Figure 7A According to some embodiments of this application, a schematic cross-sectional structure diagram of an under-screen base film 123 / 115 is shown;

[0060] Figure 7B According to some embodiments of this application, a schematic cross-sectional structure diagram of another under-screen base film 123 / 115 is shown;

[0061] Figure 7CAccording to some embodiments of this application, a non-isothermal differential scanning calorimetry (DSC) curve of a prepreg layer is shown;

[0062] Figure 7D According to some embodiments of this application, a graph of the energy storage modulus of a prepreg layer is shown;

[0063] Figure 8 According to some embodiments of this application, a schematic cross-sectional structure diagram of another under-screen base film 123 / 115 is shown;

[0064] Figure 9 According to some embodiments of this application, a cross-sectional structural schematic diagram of an under-screen base film 115 and a copper layer 111 is shown;

[0065] Figure 10 According to some embodiments of this application, a schematic cross-sectional structure diagram of a display module 10d is shown;

[0066] Figure 11A According to some embodiments of this application, a schematic cross-sectional structure diagram of a display module 10e is shown;

[0067] Figure 11B According to some embodiments of this application, a schematic cross-sectional structure diagram of another display module 10e is shown;

[0068] Figure 11C According to some embodiments of this application, a schematic cross-sectional structure diagram of a display module 10f is shown;

[0069] Figure 11D According to some embodiments of this application, a schematic cross-sectional structure diagram of another display module 10f is shown;

[0070] Figure 12A (a), (b), and (c) in this application illustrate cross-sectional structural diagrams of different steps in a method for preparing an under-screen base film, according to some embodiments of this application.

[0071] Figure 12B (a), (b), and (c) in this application show cross-sectional structural schematic diagrams of different steps in another method for preparing an under-screen base film, according to some embodiments of this application.

[0072] Figure 13 (a), (b), (c) and (d) in this application show cross-sectional structural schematic diagrams of different steps in a method for preparing an under-screen base film and a copper layer, according to some embodiments of this application;

[0073] Figure 14(a), (b), and (c) in this application show cross-sectional structural schematic diagrams of different steps in another method for preparing an under-screen base film, according to some embodiments of this application. Detailed Implementation

[0074] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments.

[0075] The illustrative embodiments of this application include, but are not limited to, display modules and electronic devices.

[0076] Figure 1 This application illustrates an exemplary application scenario of this invention, specifically a mobile phone. However, the mobile phone can also be any other electronic device including a display module (i.e., a screen). The electronic device can be a mobile phone, smart TV, wearable device, tablet computer, desktop computer, laptop computer, virtual reality (VR) device, augmented reality (AR) device, electronic device in industrial control, electronic device in self-driving, electronic device in remote medical surgery, electronic device in smart grid, electronic device in transportation safety, electronic device in smart city, electronic device in smart home, etc. This application does not limit the specific form of the electronic device.

[0077] In the following text, a mobile phone will be used as an example of an electronic device to illustrate the technical solution of this application.

[0078] First, combined Figure 1 This describes a specific structure of a mobile phone.

[0079] Figure 1 A three-dimensional structural diagram of a mobile phone 1a is shown. Specifically, the mobile phone 1a can be a candybar phone (or candybar phone).

[0080] refer to Figure 1 The mobile phone 1a includes a display module 10 and a housing 20. The display module 10 and the housing 20 can together form an accommodating space, in which various functional components of the mobile phone 1a can be installed. For ease of description, the functional components of the mobile phone 1a will not be described in detail here.

[0081] For ease of subsequent description, let's first combine... Figure 1Define the X-axis, Y-axis, and Z-axis directions corresponding to mobile phone 1a. For example... Figure 1 As shown, the X-axis direction is the width direction of the phone 1a. For example, in the user's default usage orientation, the direction from the left edge to the right edge of the phone 1a is the positive X-axis direction. The Y-axis direction is the length direction of the phone 1a. For example, in the user's default usage orientation, the direction from the bottom edge to the top edge of the phone 1a is the positive Y-axis direction. The Z-axis direction is the thickness direction of the phone 1a. For example, in the user's default usage orientation, the direction from the back edge to the front edge is the positive Z-axis direction. In some embodiments of this application, the X-axis, Y-axis, and Z-axis directions intersect each other. In some implementations, the X-axis, Y-axis, and Z-axis directions can be perpendicular to each other.

[0082] It should be noted that the directional terms such as "upper," "lower," "left," "right," "top," "bottom," and "above" used in this document refer to exemplary orientations shown in the accompanying drawings corresponding to the embodiments, and do not indicate or imply that the components referred to must have a specific orientation. These terms can vary accordingly based on actual use and should not be construed as limiting this application. Furthermore, it is understood that when the viewing angle of the accompanying drawings changes (e.g., the drawings are rotated at any angle for reference), the directional terms also change accordingly.

[0083] It is understood that the perpendicularity in this application is not absolute perpendicularity. Approximate perpendicularity due to processing and assembly errors (e.g., an angle of 89° between two structural features) is also within the scope of mutual perpendicularity in this application. Similarly, the parallelism in this application is not absolute parallelism. Approximate parallelism due to processing and assembly errors (e.g., an angle of 1° between two structural features) is also within the scope of mutual parallelism in this application. The limitations of mutual parallelism and mutual perpendicularity will not be repeated below.

[0084] Figure 2 A schematic cross-sectional view of a display module 10a in a mobile phone 1a (candybar phone) is shown. Specifically, the cross-section can be parallel to the XZ plane. It can be understood that the display module 10a is... Figure 1 The image shows an exemplary structure of module 10.

[0085] refer to Figure 2The display module 10a includes an under-screen cushion structure 11, an under-screen support structure 12, a display panel 13, and an optical structure 14, stacked sequentially along the positive Z-axis. The under-screen cushion structure 11, also known as an under-screen cushion film (SCF), includes a copper (Cu) layer 111, a silicone gel layer 112, a polyester (polyethylene terephthalate, PET) film 113, and a silicone gel layer 114, stacked sequentially along the positive Z-axis. The under-screen support structure 12 includes a polyester film 121 and a pressure-sensitive adhesive (PSA) layer 122, stacked sequentially along the positive Z-axis. The optical structure 14 includes a polarizer (POL) layer, a PSA layer 141, an optically clear adhesive (OCA) layer 142, and a cover glass (CG) 143, stacked sequentially along the positive Z-axis.

[0086] Among them, the under-screen buffer structure 11 is used to absorb and disperse the force caused to the display panel 13 by impacts such as drops and collisions, the under-screen support structure 12 is used to provide support for the display panel 13, the display panel 13 is used to display images, and the optical structure 14 is used to prevent ambient light reflection and protect the display panel 13, etc.

[0087] It can be seen that both the under-screen buffer structure 11 and the under-screen support structure 12 currently use polyester film. Polyester film is a type of plastic film with good mechanical strength, transparency, heat resistance, and chemical resistance. However, the tensile modulus (or elastic modulus) of polyester film is approximately 2-4.5 gigapascals (GPa), which makes its impact resistance relatively poor. Elastic modulus is a physical property of a material used to describe the stiffness of a material under stress within its elastic deformation range; in other words, elastic modulus measures a material's ability to resist deformation under stress. The higher the elastic modulus of a material, the stronger its resistance to falling balls.

[0088] In some other embodiments, the polyester film in the under-screen buffer structure 11 and the under-screen support structure 12 can be replaced with yellow polyimide (YPI). Yellow polyimide has an elastic modulus of approximately 2-8 gigapascals (GPa) and poor resistance to falling balls. During the production of mobile phone 1a, due to the poor impact and compression resistance of the under-screen buffer structure 11 and the under-screen support structure 12, the number of defective products of mobile phone 1a is relatively large. Defective products refer to products with defects such as black spots, cracks, or bright spots on the screen, that is, the light-emitting surface of the display module. Therefore, the yield of mobile phone 1a is low.

[0089] Figure 3A and Figure 3B Another structure of the mobile phone in an embodiment of this application is shown.

[0090] Figure 3A and Figure 3B The diagram shows two three-dimensional structural illustrations of mobile phone 1b. Specifically, mobile phone 1b can be a foldable phone. Figure 3A This is a schematic diagram of mobile phone 1b in its flattened state. Figure 3B This is a schematic diagram of the phone 1b in its folded state.

[0091] It should be noted that the X-axis, Y-axis, and Z-axis directions of mobile phone 1b are the same as those of mobile phone 1a mentioned above. That is, as... Figure 3A As shown, the X-axis, Y-axis, and Z-axis directions represent the width, length, and thickness of the phone 1b in its flattened state, respectively. Please refer to the above for details. Figure 1 The description in the text will not be repeated here.

[0092] refer to Figure 3A and Figure 3B The mobile phone 1b includes a first housing 30a, a second housing 30b, a display module 10, a display module 10', and a rotating shaft 40. The rotating shaft 40 extends along the Y-axis direction. The first housing 30a and the second housing 30b are respectively disposed on both sides of the rotating shaft 40 and are respectively connected to the rotating shaft 40 to realize the rotational connection between the first housing 30a and the second housing 30b.

[0093] Display module 10 is disposed on the first housing 30a, and display module 10' is disposed on the first housing 30a and the second housing 30b. Display module 10 is the outer screen of mobile phone 1b, and display module 10' is the inner screen of mobile phone 1b. The first housing 30a and the second housing 30b can rotate relative to each other via a pivot 40, and can cause display module 10' to flatten or bend, allowing mobile phone 1b to... Figure 3A The flattened state shown and Figure 3B Switch between the shown folded states.

[0094] When the mobile phone 1b is in a flattened state, the included angle between the first housing 30a and the second housing 30b can be, for example, in the range of 178°-182°. For example, this included angle can be 180°, that is, the flattened angle of the mobile phone 1b is 180°. The first housing 30a and the second housing 30b are arranged side by side along the X-axis, and the display module 10' is flattened in a similar "I" shape, enabling full-screen display, thereby giving the mobile phone 1b a large display area for easy viewing by the user.

[0095] When the phone 1b is in a folded state, the angle between the first housing 30a and the second housing 30b can be in the range of 0°-2°, for example, the angle can be 0°. The first housing 30a and the second housing 30b are stacked, and the display module 10' is similarly bent in a "U" shape, thereby making the size of the phone 1b smaller so that it is easier for the user to carry.

[0096] The following describes the specific structure of display module 10 and display module 10' in mobile phone 1b.

[0097] First, it should be noted that the specific structure of the display module 10 in mobile phone 1b is the same as that in mobile phone 1a, therefore Figure 2 The display module 10a in the mobile phone 1b can also be an exemplary structure of the display module 10 in the mobile phone 1b. Therefore, the outer screen of the mobile phone 1b also has the problem of poor impact and compression resistance.

[0098] The following is combined with Figure 4 This describes a specific structure of the display module 10' in mobile phone 1b.

[0099] Figure 4 A schematic cross-sectional view of a display module 10b in a mobile phone 1b is shown. Specifically, the cross-section can be parallel to the XZ plane. It can be understood that the display module 10b is... Figure 3A An exemplary structure of the display module 10' is shown below. The display module 10b is a foldable display module, that is, the display module 10b is a foldable structure.

[0100] refer to Figure 4 The display module 10b includes an under-display protective structure 21, an under-display support structure 22, a display panel 23, and an optical structure 24, which are stacked sequentially along the positive Z-axis. The under-display protective structure 21 includes a copper (Cu) layer 211, a carbon plate 212, and a pressure-sensitive adhesive (PSA) layer 213, all stacked sequentially along the positive Z-axis. The under-display support structure 22 includes a polyester (PET) film 221 and a pressure-sensitive adhesive (PSA) layer 222, all stacked sequentially along the positive Z-axis. The optical structure 24 includes a polarizer (POL), a pressure-sensitive adhesive (PSA) layer 241, an optically conductive adhesive (OCA) layer 242, and a cover plate 243, all stacked sequentially along the positive Z-axis.

[0101] Among them, the under-screen protection structure 21 and the under-screen support structure 22 are used to provide support and protection for the display panel 23, the display panel 23 is used to display images, and the optical structure 24 is used to prevent ambient light reflection and protect the display panel 23, etc.

[0102] It should be noted that, Figure 4 The under-screen support structure 22 and Figure 2The under-screen support structure 12 is structurally identical. Therefore, as mentioned earlier, the under-screen support structure 22, like the under-screen support structure 12, also suffers from poor impact and compression resistance.

[0103] In summary, both display module 10a (i.e., display module 10 in mobile phone 1a and mobile phone 1b) and display module 10b (i.e., display module 10' in mobile phone 1b) have poor impact and compression resistance.

[0104] To address the aforementioned issues, this application provides a display module comprising a display panel and an under-display base film, which replaces at least one of the aforementioned polyester film 121, polyester film 113, or polyester film 221. The material of the under-display base film includes at least one of carbon fiber, phenylene benzodioxazole fiber, silicon carbide fiber, boron fiber, aramid fiber, ultra-high molecular weight polyethylene fiber, stainless steel, titanium alloy, and ultra-thin glass. Because the material of the under-display base film has a good elastic modulus, its resistance to falling balls is improved, thereby enhancing the impact and compression resistance of the display module.

[0105] In addition, continue to refer to Figure 2 In the under-display buffer structure 11 of the display module 10a, the soft material and resilience of the silicone gel layers 112 and 114 are used to buffer impact and compression forces, while the copper layer 111 facilitates heat dissipation for the display panel 13. Furthermore, the silicone gel layer 112 is bonded to the copper layer 111. However, due to the weak recovery force of the silicone gel after deformation, and the thin copper layer itself being prone to deformation, the copper layer 111 bonded to the silicone gel layer 112 is easily compressed and indented after being subjected to impact and compression forces. This leads to a further increase in defective products of the mobile phone 1a. The under-display base film in the display module provided in this application can be directly connected to the copper layer, and because the under-display base film has strong impact and compression resistance, it can improve the indentation problem of the copper layer, thereby further improving the performance of the display module.

[0106] In some embodiments, the molecular weight of the ultra-high molecular weight polyethylene fiber can be in the range of 1 million to 5 million, and the thickness of the ultra-thin glass can be in the range of 25 to 100 μm.

[0107] The following is combined with Figures 5-9 The first exemplary structure of the display module in the embodiments of this application will be described in detail.

[0108] Figure 5 and Figure 6 Two cross-sectional structural diagrams of the display module 10c are shown respectively. Specifically, the cross-section can be parallel to the XZ plane.

[0109] It should be noted that the display module 10c is an exemplary structure of the display module 10 in mobile phone 1a or mobile phone 1b. It should also be noted that this application does not limit the application scenarios of the display module 10c; the display module 10c can also be applied to other types of electronic devices.

[0110] Additionally, it should be noted that in the embodiments of this application, the thickness direction of the display module can be the same as the thickness direction of the aforementioned mobile phones 1a and 1b, that is, it can be the Z-axis direction, which will not be repeated in the following embodiments. Furthermore, the thickness of the structure described in the embodiments of this application can refer to the dimension of the structure along the Z-axis direction, which will not be repeated below.

[0111] refer to Figure 5 The display module 10c may include an under-display buffer structure 11, an under-display support structure 12, a display panel 13, and an optical structure 14, which are sequentially stacked and connected along the positive Z-axis. The under-display buffer structure 11, also known as an under-display buffer film (SCF), includes a copper layer 111, an under-display base film 115, and a silicone gel layer 114, which are sequentially stacked and connected along the positive Z-axis. The under-display support structure 12, also known as an under-display support back film or under-display back film, includes an under-display base film 123 and a pressure-sensitive adhesive (PSA) layer 122, which are sequentially stacked along the positive Z-axis. The display panel 13 has a light-emitting surface on the side away from the under-display base film 115 and the under-display base film 123 along the Z-axis, and the optical structure 14 is located on the light-emitting surface. The optical structure 14 may include a polarizer (POL) and pressure-sensitive adhesive (PSA) layer 141, an optical adhesive (OCA) layer 142, and a cover glass (CG) 143, which are stacked sequentially along the positive Z-axis.

[0112] The following combination Figures 6-7D An exemplary structure of the under-display base film 123 is described.

[0113] In some embodiments, reference Figure 6 , Figure 6 The base film under the middle screen is 123. Figure 5 An exemplary structure of the under-screen base film 123, Figure 6 The rest of the structure and Figure 5 The same. In the under-display support structure 12, the under-display base film 123 may include material layer L1 (as an example of a first material layer), material layer L2 (as an example of a second material layer) and material layer L3 (as an example of a third material layer) stacked and connected sequentially along the positive Z-axis direction, with material layer L3 located between material layer L2 and display panel 13.

[0114] In some embodiments, reference Figure 7A and Figure 7B , Figure 7A and Figure 7B Two cross-sectional structural diagrams of the under-screen base film 123 are shown respectively. Specifically, Figure 7A for Figure 5 and Figure 6 A cross-sectional view of the under-screen base film 123 in the XZ plane. Figure 7B for Figure 7A A further detailed structural diagram of the intermediate structure is shown. In the under-screen base film 123, material layers L1, L2, and L3 can all be composite material layers. Specifically, material layer L1 may include an adhesive layer L11, a fiber layer L12, and an adhesive layer L13 sequentially stacked and cross-linked along the positive Z-axis; material layer L2 may include an adhesive layer L21, a fiber layer L22, and an adhesive layer L23 sequentially stacked and cross-linked along the positive Z-axis; and material layer L3 may include an adhesive layer L31, a fiber layer L32, and an adhesive layer L33 sequentially stacked and cross-linked along the positive Z-axis.

[0115] Among them, material layers L1, L2, and L3 can all be referred to as prepreg layers. A prepreg layer is a composite material layer in which two adhesive layers (usually thermosetting resins) are pre-impregnated onto a substrate (i.e., the fiber layer). In the prepreg layer, the fiber layer can serve as the main material.

[0116] It should be noted that, although in Figure 7B In the diagram, the fiber layer and two adhesive layers within the same material layer represent a clear layered structure. However, because the material layer as a whole is a cross-linked structure, in actual structural cross-sections, the molecular structures of the fiber layer and its adjacent adhesive layer can be cross-linked, meaning they may not necessarily have cross-linking properties. Figure 7B A clear dividing line. For example, in Figure 7B In material layer L1, the adhesive layer L11 and the fiber layer L12 are schematically shown to be clearly separated, as are the fiber layer L12 and the adhesive layer L13. However, in actual structural cross-sections, the adhesive layer L11, fiber layer L12, and adhesive layer L13 can cross-link and fuse with each other, and do not show a clear layered structure. The structures of material layers L2 and L3 are similar.

[0117] In some embodiments, continue to refer to Figure 7A and Figure 7B The material of any one of the adhesive layers L11, L13, L21, L23, L31, and L33 may include epoxy resin. The epoxy resin may have high conductivity and dielectric constant (Dk), for example, Dk > 6, thereby improving the copper rod effect of the display module 10c.

[0118] In some embodiments, the material of any one of the fiber layers L12, L22, and L32 includes one or more of carbon fiber (CF), PBO fiber, silicon carbide fiber, boron fiber, aramid fiber, and ultra-high molecular weight polyethylene fiber. Since the elastic modulus of carbon fiber, PBO fiber, silicon carbide fiber, boron fiber, aramid fiber, and ultra-high molecular weight polyethylene fiber are all greater than that of polyester film, therefore... Figure 7A and Figure 7B The under-screen base film 123 shown has high resistance to falling balls, thus providing high resistance to impact and compression, thereby improving the performance of the display module 10c.

[0119] In some embodiments, the materials of fiber layers L12, L22, and L32 can all include carbon fiber. In this case, material layers L1, L2, and L3 can all be referred to as carbon fiber sheets (or carbon fiber prepreg layers). Carbon fiber has the highest elastic modulus (i.e., tensile modulus) when parallel to the fiber orientation, for example, greater than 80 GPa, and the lowest elastic modulus (i.e., tensile modulus) when perpendicular to the fiber orientation (i.e., at a 90° angle to the fiber orientation), for example, approximately 45 GPa. That is, carbon fiber has a high elastic modulus in all directions, and is much greater than the elastic modulus of polyester (PET) film (4.5 GPa). Therefore, the impact and compression resistance of the display module can be increased in different directions, thereby improving the overall strength and rigidity of the display module.

[0120] In some other embodiments, the material of one or more of fiber layers L12, L22, and L32 may further include PBO fibers. Alternatively, in yet another embodiment, the material of one or more of fiber layers L12, L22, and L32 may further include other fibers with a high elastic modulus (e.g., an elastic modulus greater than 4.5 GPa).

[0121] In some embodiments, the crosslinking temperature of the adhesive layer and fiber layer in the prepreg layer (material layer L1, material layer L2, or material layer L3) can be approximately 135°C-150°C. (Reference) Figure 7C For example, Figure 7CA non-isothermal DSC curve of a carbon fiber prepreg layer is shown, specifically a curve showing the relationship between heat flow and temperature. In this curve, the peak represents the start of crosslinking between the epoxy resin (i.e., the adhesive layer) and the carbon fiber (i.e., the fiber layer) in the prepreg layer. It can be seen that the reaction temperature corresponding to the peak is approximately 135°C, meaning that the epoxy resin and carbon fiber begin to crosslink at around 135°C. In other embodiments, the reaction temperature can also be between 135°C and 150°C, for example, 150°C. After the epoxy resin and carbon fiber are crosslinked, they are cured to form a cured carbon fiber prepreg layer. In some embodiments, the crosslinking agent for the epoxy resin can be a polyurea system, a dicyandiamide system, etc. For example, the types of crosslinking agents can include polyamines, anhydride types, phenolic types, and polythiol types.

[0122] In some embodiments, during the fabrication of the under-display support structure 12, as the temperature rises, the adhesive layer (e.g., epoxy resin) in the prepreg layer (material layer L1, material layer L2, or material layer L3) gradually changes from a solid state to a non-solid state (i.e., a flowing gel state). For example, the temperature at which the epoxy resin changes from a solid state to a non-solid state can be approximately 50°C. Above 50°C, the under-display base film 123 is in a viscous, flowing gel state. It should be noted that this application does not impose specific limitations on the transition temperature.

[0123] refer to Figure 7D , Figure 7D A storage modulus curve of a carbon fiber prepreg layer is shown, specifically a curve showing the relationship between storage modulus and temperature. Storage modulus reflects the elastic energy stored in a material under stress. A higher storage modulus indicates a more rigid material; a sharp decrease in storage modulus indicates a glass transition; and a stabilization or further decrease in storage modulus indicates a flowing colloidal state. Therefore, during the production of the under-display support structure 12, at temperatures above 50°C, the under-display base film 123 is in a flowing colloidal state. The under-display base film 123 can act as an adhesive to bond with adjacent structural layers, thereby forming a more stable under-display support structure 12 to further enhance the strength of the display module 10c.

[0124] In some embodiments, the carbon fiber may include one or more of T700, T800, and M40. It should be noted that other types of carbon fiber may also be used, and this application does not impose any restrictions on this.

[0125] In some embodiments, the carbon fibers are made of polyacrylonitrile (PAN). Polyacrylonitrile, also known as acrylonitrile filament, is a synthetic polymer with high strength and durability, as well as high resistance to abrasion, chemicals, and heat.

[0126] In some embodiments, continue to refer to Figure 7A and Figure 7B The thickness of the under-display base film 123 ranges from 10 to 200 μm. For example, the thickness of the under-display base film 123 can be 10 μm, 40 μm, 50 μm, 100 μm, 150 μm, or 200 μm. The thicknesses of material layers L1, L2, and L3 can be the same or different. For example, the thicknesses of material layers L1, L2, and L3 can all be the same, or the thicknesses of material layers L1 and L3 can be the same, but different from the thickness of material layer L2.

[0127] In this embodiment, the thickness of the under-screen base film 123 can be 50 μm. Alternatively, the thickness of the under-screen base film 123 can be 45 μm, wherein the thicknesses of material layers L1, L2, and L3 are all 15 μm.

[0128] Thus, in the under-screen base film 123, three material layers (i.e., material layer L1, material layer L2 and material layer L3) are used, and all three material layers are mainly fiber layers. That is, the elastic modulus of all three material layers can be greater than the elastic modulus of polyester film, thereby further improving the impact and compression resistance of the under-screen support structure 12, so as to improve the overall impact resistance of the display module 10c.

[0129] In addition, with Figure 2 Compared to the polyester film 121 shown, the thickness of the under-display base film 123 is similar to that of the polyester film 121. Therefore, this application can still ensure that the thickness of the under-display support structure 12 is small, thereby ensuring the thinness of the display module 10c and thus ensuring the thinness of electronic devices (such as mobile phones).

[0130] It should be noted that the thickness relationship between the layers of each display module in the accompanying drawings is only schematic and does not represent the thickness ratio in the actual structure.

[0131] In other embodiments, the material of any one of the adhesive layers L11, L13, L21, L23, L31, and L33 may also include other resin-based or adhesive materials, and the material of any one of the fiber layers L12, L22, and L32 may also include other fibrous materials. This application does not impose any limitations on these aspects.

[0132] In some embodiments, continue to refer to Figure 7A and Figure 7B In this structure, the fibers (e.g., carbon fibers) in fiber layer L12 and fiber layer L32 are oriented parallel to each other; for example, the fibers in fiber layer L12 and fiber layer L32 are both oriented along the X-axis. Figure 7AIn the diagram, the horizontal lines filling material layers L1 and L3 serve as an orientation diagram. The fibers (e.g., carbon fibers) in fiber layer L12 and fiber layer L22 are oriented perpendicularly; for example, the fibers in fiber layer L22 are all oriented along the Y-axis. Figure 7A In the diagram, the dotted filling of material layer L2 serves as an orientation illustration. Furthermore, the fiber orientations in fiber layers L12, L22, and L32 are all perpendicular to the Z-axis direction.

[0133] Thus, since the main strength of carbon fibers is typically stronger along the fiber orientation, meaning that the strength and stiffness of carbon fibers perpendicular to the fiber orientation are weaker, by setting the under-screen base film 123 as a three-layered material layer and setting the fiber layers in the three material layers to have different and symmetrical orientations, the impact resistance and compression resistance of the under-screen base film 123 can be increased in different directions, thereby improving the overall strength and rigidity of the display module 10c. For example, with... Figure 2 Compared to the display module 10a shown, the display module 10c has an improved ball drop capability of about 50% and an improved sharp-point extrusion impact performance of about 150%.

[0134] In some embodiments, material layers L1 and L3 can be made of the same material, and their thicknesses can also be the same. This avoids stress on the under-screen base film 123 during production due to resin curing shrinkage, thus preventing warping or deformation caused by asymmetrical stress on the upper and lower layers, thereby improving the flatness and stability of the under-screen base film 123.

[0135] The following is combined with Figure 8 Another exemplary structure of the under-display base film 123 is introduced.

[0136] Figure 8 A schematic cross-sectional view of another under-screen base film 123 is shown. (Compared to...) Figure 7A and Figure 7B Compared to the under-screen base film 123 shown, Figure 8 The only difference in the under-screen base film 123 is that material layer L2 is replaced with material layer L2' (as another example of a second material layer), wherein the material of material layer L2' can be stainless steel (SUS). That is, material layer L2' does not include the laminated adhesive layer, fiber layer, and adhesive layer. Thus, due to the superior support and fatigue resistance of stainless steel, Figure 8 The under-screen base film 123 shown can further enhance the support capability of the under-screen support structure 12.

[0137] refer to Figure 8 In some embodiments, material layer L1 (as another example of a first material layer) and material layer L3 (as another example of a third material layer) can be coupled with... Figure 7A and Figure 7B Material layers L1 and L3 have the same structure, meaning that both material layers L1 and L3 can be carbon fiber prepreg layers, and material layer L2' can be a stainless steel layer. For example, material layer L1 may include an adhesive layer L11 (as an example of a first adhesive layer), a fiber layer L12 (as an example of a first fiber layer), and an adhesive layer L13 (as an example of a second adhesive layer) that are sequentially stacked and cross-linked along the positive Z-axis. Material layer L3 may include an adhesive layer L31 (as an example of a third adhesive layer), a fiber layer L32 (as an example of a second fiber layer), and an adhesive layer L33 (as an example of a fourth adhesive layer) that are sequentially stacked and cross-linked along the positive Z-axis.

[0138] Thus, by using a structure combining carbon fiber and stainless steel in the under-display base film 123, it is possible to improve the impact and compression resistance while enhancing the support for the display panel 13.

[0139] The material of the aforementioned material layer L2' is stainless steel, but this application is not limited to this. In some other embodiments, the material of material layer L2' can also be titanium alloy, ultra-thin glass, PET, or yellow PI, that is, material layer L2' can also be titanium alloy, ultra-thin glass, PET layer, or PI layer. Thus, since material layers L1 and L3 can both be carbon fiber prepreg layers, the under-screen base film 123 can still have strong impact and compression resistance. It should be noted that material layer L2' can also be selected from other materials as needed, and this application does not impose any restrictions on the material of material layer L2'.

[0140] Figure 8 Other structures of material layer L1 and material layer L3 are similar to Figure 7A and Figure 7B Material layer L1 and material layer L3 are the same, and can be referred to the above-mentioned related embodiments, which will not be repeated here.

[0141] In some other embodiments of this application, the under-display base film 123 may also have another exemplary structure (not shown): the under-display base film 123 may include a stacked material layer L1' (another example of a first material layer), a material layer L2 (another example of a second material layer), and a material layer L3' (another example of a third material layer). That is, the under-display base film 123 may include a stacked material layer L1' (another example of a first material layer), a material layer L2 (another example of a second material layer), and a material layer L3' (another example of a third material layer). Figure 7A and Figure 7B Material layers L1 and L3 are replaced with material layers L1' and L3' respectively, while material layer L2 and... Figure 7A and Figure 7BThe material layer L2 shown is the same. The materials of material layers L1' and L3' can be one or more of SUS, titanium alloy, ultra-thin glass, PET, and yellow PI. That is, material layers L1 and L3 do not include the laminated adhesive layer, fiber layer, and adhesive layer. For example, material layer L1' can be a stainless steel layer, material layer L3' can be a stainless steel layer, and material layer L2 can be an adhesive layer L21 (as an example of a fifth adhesive layer), a fiber layer L22 (as an example of a third fiber layer), and an adhesive layer L23 (as an example of a sixth adhesive layer) that are sequentially laminated and cross-linked along the positive Z-axis direction.

[0142] In some further embodiments of this application, the under-screen base film may further include N material layers L4 (not shown as an example of a fourth material layer), where N is an integer greater than or equal to 1. The aforementioned material layers L1, L4, L2, and L3 are stacked sequentially along the positive Z-axis. Material layer L4 may be made of the same material as material layers L1, L2, and L3. Alternatively, material layer L4 may be made of the same material as material layer L2, material layer L1 may be made of the same material as material layer L3, while material layer L4 may be made of a different material than material layer L1.

[0143] For example, material layer L1, N-layer material layer L4, material layer L2, and material layer L3 are all carbon fiber prepreg layers. As another example, material layers L1 and L3 are carbon fiber prepreg layers, and N-layer material layer L4 and material layer L2 are stainless steel layers. Yet another example, material layers L1 and L3 are stainless steel layers, and N-layer material layer L4 and material layer L2 are carbon fiber prepreg layers. It should be noted that this application does not impose any restrictions on the specific material of material layer L4, and the materials of N-layer material layer L4 can be the same or different.

[0144] In summary, the under-display support structure 12 employs an under-display base film 123, and at least one layer of the under-display base film 123 is made of at least one of the following materials: carbon fiber, phenylene benzodioxazole fiber, silicon carbide fiber, boron fiber, aramid fiber, ultra-high molecular weight polyethylene fiber, stainless steel, titanium alloy, and ultra-thin glass. That is, the material of the under-display base film 123 includes at least one of the following: carbon fiber, phenylene benzodioxazole fiber, silicon carbide fiber, boron fiber, aramid fiber, ultra-high molecular weight polyethylene fiber, stainless steel, titanium alloy, and ultra-thin glass. Alternatively, it may include other materials with a high elastic modulus (e.g., higher than 4.5 GPa) to improve resistance to falling balls, impact, and compression. For example, with... Figure 2 Compared to the display module 10a shown, the drop ball performance of the display module 10c is improved by about 60%, and the impact resistance of the pointed extrusion is improved by about 170%.

[0145] It should be noted that, Figure 5 and Figure 6 In the above-mentioned under-screen buffer structure 11, the specific structure of the under-screen base film 115 can be similar to that of the under-screen base film 123 in the under-screen support structure 12. Therefore, the structure of the under-screen base film 115 can be referred to the above. Figures 5-8 The relevant embodiments of the under-screen base film 123 will not be described again below.

[0146] Furthermore, it should be noted that the structures of the under-display base film 115 and the under-display base film 123 can be the same or different. This application does not impose any restrictions on this. For example, the under-display base film 115 and the under-display base film 123 may have the same structure, both consisting of three layers of carbon fiber prepreg. Alternatively, the under-display base film 115 and the under-display base film 123 may have different structures; the under-display base film 123 may consist of three layers of carbon fiber prepreg, while the under-display base film 115 may consist of a carbon fiber prepreg layer, a stainless steel layer, and another carbon fiber prepreg layer stacked along the positive Z-axis.

[0147] The following is combined with Figure 9 Some other properties of the under-screen base film 115 in the under-screen buffer structure 11 are described in detail.

[0148] Figure 9 A schematic diagram of the cross-sectional structure of the under-screen base film 115 and the copper layer 111 is shown, specifically a cross-sectional view of the XZ plane. Figure 9 The specific structure of the under-screen base film 115 can be found in the reference. Figure 7B The structure of the under-screen base film 223 will not be described again here.

[0149] refer to Figure 9 and combined Figure 2 As mentioned earlier, in the display module 10a, the silicone gel layer 112 has a low recovery rate when subjected to external impact, and the copper layer 111 itself is thin and easily deformed. Therefore, the copper layer 111 connected to the silicone gel layer 112 is prone to indentation, resulting in visible indentations on the display module 10a; that is, the display module 10a can be described as having a molding defect. Molding defects typically occur more frequently during the transportation and production of the mobile phone 1a. For example, currently, the proportion of display module damage caused by molding defects in the mobile phone 1a is relatively high, leading to batch defects. Damage to the display module manifests as defects such as black spots, cracks, or bright spots on the display module. (Reference) Figure 9 and combined Figure 7D This application utilizes the adhesive properties of the under-display base film 115 (specifically, the epoxy resin in the under-display base film 115) at temperatures above 50°C to directly press and bond the under-display base film 115 and the copper layer 111 (e.g., by hot rolling), without the need for an additional adhesive layer (e.g., silicone gel layer 112 or PSA) to bond with the copper layer 111. Thus, the connection between the under-display base film 115 and the copper layer 111 ( Figure 9The stability of the under-display base film 115 (located within the dashed box) is relatively strong, and it can provide stronger support for the copper layer 111, thus improving the problem of indentation on the copper layer 111 when the under-display buffer structure 11 is subjected to external impact. This enhances the overall strength of the display module 10c. In addition, the elimination of the need for an additional adhesive layer reduces the thickness of the under-display buffer structure 11, which is beneficial for the thinning and lightening of electronic devices.

[0150] Next, we will continue with... Figure 5 and Figure 6 The remaining structure of the display module 10c will be described in detail below. It should be noted that... Figure 5 and Figure 6 The rest of the structure is the same, therefore, the following will be based on... Figure 5 The structure in the example will be used to illustrate this. Figure 6 The structure can be referred to Figure 5 The relevant embodiments will not be described again below.

[0151] In this embodiment, the thickness of the copper layer 111 (as an example of the first metal layer) in the under-screen buffer structure 11 can be approximately 10 μm. It should be noted that this application does not impose any limitations on the thickness of the copper layer 111, and those skilled in the art can choose an appropriate thickness as needed.

[0152] In this embodiment, the thickness of the under-screen buffer structure 11 can be approximately 160 μm. It should be noted that this application does not impose any limitations on the thickness of the under-screen buffer structure 11; those skilled in the art can choose a suitable thickness as needed.

[0153] In some embodiments, reference Figure 5 The copper (Cu) layer 111 can also be replaced with any of the following: a stainless steel (SUS) layer, an aluminum (Al) layer, or a titanium (Ti) layer (as other examples of the first metal layer). Thus, this layer structure can have excellent thermal conductivity, thereby improving the heat dissipation capability of the display module 10c.

[0154] In some embodiments, the silicone gel layer 114 (as an example of a second adhesive layer) may also be replaced with a low-modulus acrylic adhesive layer, a low-modulus thermoplastic polyurethane elastomer (TPU) layer, or other cushioning material layers, etc.

[0155] In this embodiment, the thickness of the silicone gel layer 114 can be approximately 100 μm. It should be noted that this application does not impose any limitations on the thickness of the silicone gel layer 114; those skilled in the art can choose an appropriate thickness as needed.

[0156] In addition, current display modules often use an aluminum plate placed on the back of the display module (i.e., the surface along the negative Z-axis) to improve its impact and compression resistance. However, this method still provides relatively poor impact and compression resistance. In this embodiment, since the silicone gel layer 114 and the under-screen base film 115 are directly bonded, when the under-screen buffer structure 11 is subjected to localized external impact, the silicone gel layer 114 absorbs the impact energy, and the under-screen base film 115 can change the localized impact or compression force into a uniform in-plane force, allowing the silicone gel layer 114 to recover quickly. The combination of the silicone gel layer 114 and the under-screen base film 115 forms a double-armor protection system in the display module 10c, effectively protecting the display module 10c. For example, when the under-screen base film 115 uses a three-layer carbon fiber prepreg layer, the display module 10c's resistance to falling ball compression (i.e., impact and compression) can be increased several times. For example, the resistance to falling ball compression can be increased by 2 times, 3 times, or 5 times.

[0157] In some other embodiments, the silicone gel layer 114 may also be replaced with an optical adhesive (OCA) layer (as another example of a second adhesive layer) or other adhesive layers.

[0158] In some embodiments, continue to refer to Figure 5 In the under-display support structure 12, the pressure-sensitive adhesive layer 122 (as an example of a first adhesive layer) can have a high recovery rate and adhesion strength. For example, the recovery rate of the pressure-sensitive adhesive layer 122 is >95%, and the adhesion strength between the pressure-sensitive adhesive (PSA) layer 122 and the under-display base film 123 is >5 N / cm. Thus, the pressure-sensitive adhesive layer 122 can quickly recover to its original shape after being subjected to pressure without significant deformation, thereby giving the display module 10c stronger durability and stability.

[0159] In addition, the pressure-sensitive adhesive layer 122 can have a high conductivity and dielectric constant (Dk), for example, Dk>6, which can improve the copper rod effect of the display module 10c.

[0160] In some embodiments, continue to refer to Figure 5 The pressure-sensitive adhesive layer 122 may include one or more of acrylic, silicone, epoxy resin and polyurethane.

[0161] In some other embodiments, the pressure-sensitive adhesive layer 122 may also be replaced with an optical adhesive (OCA) layer (as another example of the first adhesive layer) or other adhesive layers.

[0162] In some embodiments, the thickness of the pressure-sensitive adhesive layer 122 can range from 5 to 50 μm. For example, the thickness of the pressure-sensitive adhesive layer 122 can be 5 μm, 15 μm, 25 μm, 35 μm, or 50 μm, etc. It should be noted that this application does not impose any limitation on the thickness of the pressure-sensitive adhesive layer 122, and those skilled in the art can choose a suitable thickness as needed.

[0163] In this embodiment, the thickness of the under-screen support structure 12 can be approximately 65 μm. It should be noted that this application does not impose any limitations on the thickness of the under-screen support structure 12; those skilled in the art can choose a suitable thickness as needed.

[0164] Continue to refer to Figure 5 The display panel 13 can be an OLED. In other embodiments, the display panel 13 can also be a light-emitting diode (LED) or a liquid crystal display (LCD). It should be noted that this application does not impose any limitations on the type of display panel 13.

[0165] In this embodiment, the thickness of the display panel 13 can be approximately 36 μm. It should be noted that this application does not impose any limitations on the thickness of the silicone gel layer 114; those skilled in the art can choose an appropriate thickness as needed.

[0166] Continue to refer to Figure 5 In this embodiment, in the optical structure 14, the thickness of the polarizer and pressure-sensitive adhesive layer (POL+PSA) 141 can be approximately 103 μm, the thickness of the optical adhesive (OCA) layer 142 can be approximately 100 μm, and the thickness of the cover glass (CG) 143 can be approximately 500 μm. It should be noted that this application does not impose any limitations on the thickness of any structure within the optical structure 14; those skilled in the art can select appropriate thicknesses as needed.

[0167] It should be noted that in the above embodiments, the display module 10c has two under-screen base films, that is, the under-screen support structure 12 includes an under-screen base film 123, and the under-screen buffer structure 11 includes an under-screen base film 115. In some other embodiments, the display module 10c may have only one under-screen base film. For example, the under-screen support structure 12 includes an under-screen base film 123, and the under-screen base film 115 in the under-screen buffer structure 11 can be replaced with a PET layer or a PI layer, etc. As another example, the under-screen buffer structure 11 includes an under-screen base film 115, and the under-screen base film 123 in the under-screen support structure 12 can be replaced with a PET layer or a PI layer, etc.

[0168] In summary, by providing an under-screen base film in the under-screen support structure 12 and / or the under-screen buffer structure 11, the under-screen protection capability of the display module 10c can be improved. Furthermore, by hot-pressing and bonding the copper layer and the under-screen base film together, the deformation (film staining) of the copper layer can be resolved or improved, thereby significantly improving the yield of the display module 10c and reducing the market rejection rate.

[0169] The following is combined with Figure 10 A second exemplary structure of the display module in the embodiments of this application will be described in detail.

[0170] Figure 10 A schematic diagram of the cross-sectional structure of the display module 10d is shown. Specifically, the cross-section can be parallel to the XZ plane.

[0171] It should be noted that the display module 10d is an exemplary structure of the display module 10 in mobile phone 1a or mobile phone 1b. It should also be noted that this application does not limit the application scenarios of the display module 10d; the display module 10d can also be applied to other types of electronic devices.

[0172] Figure 10 Display module 10d and Figure 5 The only difference between display module 10c and display module 10d is that the under-screen buffer structure 11 in display module 10d has an additional layer of silicone gel 117 (as an example of a third adhesive layer) and a layer of polyester film 116 (as an example of a base layer). This further enhances the strength of the under-screen buffer structure 11.

[0173] Specifically, refer to Figure 10 The under-screen buffer structure 11 in the display module 10d includes a copper layer 111, an under-screen base film 115, a silicone gel layer 114, a polyester film 116, and a silicone gel layer 117, which are sequentially stacked along the positive Z-axis. Furthermore, the silicone gel layer 117 is connected to the under-screen base film 123 in the under-screen support structure 12.

[0174] In some embodiments, the polyester film 116 may be replaced by a stainless steel layer or a PI layer, and the silicone gel layer 117 may be replaced by an OCA layer or other adhesive layers.

[0175] It should be noted that the other structures of the display module 10d are similar to... Figure 5 The structure of display module 10c is the same. Therefore, the other structures of display module 10d can be referred to the above. Figures 5-9 The structure of the display module 10c described in the relevant embodiments will not be repeated here.

[0176] The following is combined with Figure 11A and Figure 11B A third exemplary structure of the display module in the embodiments of this application will be described in detail.

[0177] Figure 11A and Figure 11B Two cross-sectional structural diagrams of the display module 10e are shown respectively. Specifically, the cross-section can be parallel to the XZ plane.

[0178] It should be noted that the display module 10e is an exemplary structure of the display module 10' in the mobile phone 1b, and the display module 10e can be a foldable display module. It should also be noted that this application does not limit the application scenarios of the display module 10e; the display module 10e can also be applied to other types of electronic devices.

[0179] Figure 11A and Figure 11B Display module 10e and Figure 5 The difference between display module 10c and display module 10e is that display module 10e does not have an under-screen buffer structure 11.

[0180] refer to Figure 11A and Figure 11B The display module 10e includes an under-display protective structure 21, an under-display support structure 22, a display panel 23, and an optical structure 24, which are sequentially stacked and connected along the positive Z-axis. The under-display protective structure 21 includes a copper layer 211, a carbon fiber plate 212, and a pressure-sensitive adhesive (PSA) layer 213, all sequentially connected along the positive Z-axis. The under-display support structure 22 includes an under-display base film 223 and a pressure-sensitive adhesive layer 222, all sequentially connected along the positive Z-axis. The optical structure 24 includes a polarizer, a pressure-sensitive adhesive layer 241, an optical adhesive layer 242, and a cover plate 243, all sequentially connected along the positive Z-axis.

[0181] It should be noted that, Figure 11A and Figure 11B The structure of the middle screen under support structure 22 and Figures 5-9 The under-screen support structure 12 shown is the same, that is, Figure 11A The structure of the under-screen base film 223 can be related to Figure 5 The structure of the under-screen base film 123 is the same. Figure 11A The pressure-sensitive adhesive layer 222 can be with Figure 5 The structure of the pressure-sensitive adhesive layer 122 is the same. Therefore, the under-screen support structure 22 can be referred to... Figures 5-9 The relevant embodiments of the under-screen support structure 12 will not be described in detail here.

[0182] Thus, it can be understood that the under-screen base film 223 in the display module 10e also possesses strong impact and compression resistance. Furthermore, carbon fiber has the highest elastic modulus (i.e., tensile modulus) when parallel to the fiber orientation (e.g., greater than 80 GPa) and the lowest elastic modulus (i.e., tensile modulus) when perpendicular to the fiber orientation (i.e., at a 90° angle), e.g., approximately 45 GPa. In other words, the elastic modulus of carbon fiber in all directions is significantly greater than the elastic modulus of polyester film (4.5 GPa). Therefore, by setting the under-screen base film 123 as a three-layered material with different fiber orientations, the impact and compression resistance of the under-screen base film 123 can be increased in different directions, thereby improving the overall strength and rigidity of the display module 10c.

[0183] In some embodiments, continue to refer to Figure 11B and combined Figure 3B Material layer L1 may include an adhesive layer L11, a fiber layer L12, and an adhesive layer L13 stacked sequentially along the positive Z-axis. Material layer L3 may include an adhesive layer L31, a fiber layer L32, and an adhesive layer L33 stacked sequentially along the positive Z-axis. The orientation of the fibers in fiber layer L12 and fiber layer L32 may be parallel to the extension direction of the pivot axis in the foldable electronic device. For example, when display module 10e serves as display module 10' of mobile phone 1b, the orientation of the fibers in fiber layer L12 and fiber layer L32 may be parallel to the extension direction of the pivot axis 40, i.e., parallel to the Y-axis direction. This further improves the bending performance of display module 10e.

[0184] In some embodiments, continue to refer to Figure 11A and Figure 11B The cover 243 may include a polyester film, a polyethylene naphthalate (PEN) layer, or a colorless polyimide (CPI) layer, etc.

[0185] In some embodiments, continue to refer to Figure 11A and Figure 11B The carbon plate 212 may also have at least one through hole extending through the carbon plate 212 along the Z-axis direction. Figure 11A and Figure 11B In the middle, the multiple thick vertical lines in carbon plate 212 are a schematic diagram of multiple through holes.

[0186] Continue to refer to Figure 11B In this embodiment, the thickness of the pressure-sensitive adhesive (PSA) layer 213 can range from 15 to 50 μm. It should be noted that this application does not impose any limitations on the thickness of the pressure-sensitive adhesive (PSA) layer 213, and those skilled in the art can choose a suitable thickness as needed.

[0187] Continue to refer to Figure 11B In this embodiment, the thickness of the carbon plate 212 can be approximately 150 μm, the total thickness of the polarizer and pressure-sensitive adhesive layer 241 can be approximately 57 μm, the thickness of the optical adhesive layer 242 can be approximately 50 μm, and the thickness of the cover plate 243 can be approximately 25-50 μm. It should be noted that this application does not impose any limitations on the thickness of any structure in the display module 10e; those skilled in the art can select appropriate thicknesses as needed.

[0188] The following is combined with Figure 11C and Figure 11D The fourth exemplary structure of the display module in the embodiments of this application will be described in detail.

[0189] Figure 11C and Figure 11D Two cross-sectional structural diagrams of the display module 10f are shown respectively. Specifically, the cross-section can be parallel to the XZ plane.

[0190] It should be noted that the display module 10f is an exemplary structure of the display module 10' in the mobile phone 1b, and the display module 10f can be a foldable display module. It should also be noted that this application does not limit the application scenarios of the display module 10f; the display module 10f can also be applied to other types of electronic devices.

[0191] Figure 11C and Figure 11D Display module 10f and Figure 11A and Figure 11B The difference between the display module 10e and the previous one is that: Figure 11A and Figure 11B The polarizer and pressure-sensitive adhesive layer (POL+PSA) 241 in the image are replaced with a composite stack of optical adhesive (OCA) layer 244 and ultra-thin glass (UTG) 245 stacked along the positive Z-axis.

[0192] In some embodiments, continue to refer to Figure 11C and Figure 11D The optical structure 24 in the display module 10f may include an optical adhesive (OCA) layer 244, a UTG 245, an optical adhesive (OCA) layer 242, and a cover plate 243 connected sequentially along the positive Z-axis.

[0193] In some embodiments, continue to refer to Figure 11C and Figure 11DThe thickness of the optical adhesive (OCA) layer 244 can be 15-50 μm, the thickness of the UTG 245 can be 30-50 μm, the thickness of the optical adhesive (OCA) layer 242 can be 15-50 μm, and the thickness of the cover plate 243 can be 25-50 μm. It should be noted that this application does not impose any limitations on the thickness of the optical adhesive (OCA) layer 244, UTG 245, optical adhesive (OCA) layer 242, and cover plate 243; those skilled in the art can choose appropriate thicknesses as needed.

[0194] In some embodiments, continue to refer to Figure 11D The under-display base film 223 may include material layers L1, L2, and L3 stacked along the Z-axis. In other embodiments, the under-display base film 223 may also include other numbers of material layers, such as one material layer, two material layers, four material layers, or more material layers.

[0195] It should be noted that, Figure 11C and Figure 11D Other structures and specific materials in it are respectively related to Figure 11A and Figure 11B Similar, therefore, Figure 11C and Figure 11D Other content can be found in the above text. Figure 11A and Figure 11B The relevant embodiments are not described in detail here.

[0196] In some embodiments, this application also provides an electronic device, which includes a housing and a display module as described in any of the foregoing embodiments, the display module being located on the housing. The relevant details of the electronic device can be found in the descriptions in the foregoing embodiments, and will not be repeated here.

[0197] The following is combined with Figures 12A-14 Different manufacturing methods of the display module in the embodiments of this application will be described respectively.

[0198] First, combined Figure 12A right Figure 7A A detailed description is provided of one method for preparing the under-screen base film shown.

[0199] Figure 12A (a), (b), and (c) in the figure show cross-sectional structural diagrams of different steps in a method for preparing a substrate film under a screen.

[0200] refer to Figure 12A (a), (b) and (c), Figure 7A One method for preparing the under-screen base film shown is as follows:

[0201] S1: Place material layer L1 on the surface of glass G1.

[0202] S2: Place material layer L2 on the surface of material layer L1.

[0203] S3: Place material layer L3 on the surface of material layer L2.

[0204] S4: Perform encapsulation, baking and cooling, and then material layers L1, L2 and L3 form the under-screen base film (not shown).

[0205] Next, combined Figure 12B right Figure 12A The specific details of the preparation method will be further introduced.

[0206] Figure 12B (a), (b), and (c) in the figure show cross-sectional structural diagrams of different steps in another method for preparing the under-screen base film.

[0207] refer to Figure 12B In (a), (b), and (c) above, in S1, placing the material layer L1 on the surface of the glass G1 may include:

[0208] S11: Apply material layer L1 to the surface of glass G1, seal it with breathable cloth 51 and plastic bag 52, and then place it in a high temperature and high pressure furnace for curing.

[0209] In S2 above, placing material layer L2 on the surface of material layer L1 may include:

[0210] S21: First remove the breathable cloth 51 and the plastic bag 52, then attach the material layer L2 to the surface of the material layer L1. The orientation of the carbon fibers in the fiber layer of the material layer L2 is perpendicular to the orientation of the carbon fibers in the fiber layer of the material layer L1.

[0211] In the above S3, placing material layer L3 on the surface of material layer L2 may include:

[0212] S31: Attach material layer L3 to the surface of material layer L2, wherein the orientation of the carbon fibers in the fiber layer of material layer L3 is parallel to the orientation of the carbon fibers in the fiber layer of material layer L1.

[0213] In the above S4, material layers L1, L2, and L3 form an under-screen base film, which may include:

[0214] S41: Place a matte plate 53 on the surface of material layer L3.

[0215] Alternatively, S41 can also place a release film on the surface of material layer L3.

[0216] S42: After sealing with breathable cloth 51 and plastic bag 52, vacuum is applied, and then it is placed in a high temperature and high pressure chamber for baking.

[0217] For example, the baking temperature can be 135℃-150℃, such as 135℃, and the baking time can be 8 hours. It should be noted that this application does not limit the baking temperature and time.

[0218] S43: After cooling to room temperature, remove material layers L1, L2 and L3 to form the under-screen base film.

[0219] For example, material layers L1, L2, and L3 can all be made of T700 carbon fiber prepreg with a weight of 15g, and the weight can be 15g for each. It should be noted that other carbon fiber prepregs can also be used to form the under-screen base film, and this application does not limit this.

[0220] For example, the thickness of material layer L1 can be in the range of 5-50 μm, the thickness of material layer L2 can be in the range of 5-50 μm, and the thickness of material layer L3 can be in the range of 5-50 μm. It should be noted that material layers L1, L2, and L3 can also have other thicknesses, and this application does not limit them.

[0221] It should be noted that the above-described method for preparing the under-screen base film is merely an example and does not constitute a limitation on this application. Those skilled in the art can also choose other preparation methods as needed.

[0222] The following is combined with Figure 13 right Figure 9 A detailed description is provided of a method for preparing the under-screen substrate and copper layer shown.

[0223] Figure 13 (a), (b), (c), and (d) in the figure show cross-sectional structural diagrams of different steps in a method for preparing an under-screen base film and a copper layer.

[0224] refer to Figure 13 (a), (b), (c) and (d) in the text. Figure 9 One method for preparing the structure shown is as follows:

[0225] S1: Place material layer L1 on the surface of glass G1.

[0226] S2: Place material layer L2 on the surface of material layer L1.

[0227] S3: Place material layer L3 on the surface of material layer L2.

[0228] The above S1-S3 and Figure 12A and Figure 12BS1-S3 are the same, you can refer to Figure 12A and Figure 12B Related embodiments.

[0229] S4: Place copper layer 111 on the surface of material layer L3.

[0230] In some embodiments, the copper layer 111 can be directly bonded to the material layer L3 without the need for an additional adhesive layer.

[0231] In some embodiments, the copper layer 111 may be electrolytic copper or rolled copper, etc., and this application does not limit this.

[0232] In some embodiments, the copper layer 111 may also be replaced by a stainless steel layer, an aluminum layer, or a titanium layer, etc.

[0233] S5: Perform encapsulation, baking and cooling. Then, material layers L1, L2 and L3 form an under-screen base film (not shown). The under-screen base film and copper layer 111 are bonded together.

[0234] In some embodiments, material layers L1, L2, and L3 in S5 form an under-screen base film, and the under-screen base film is bonded to the copper layer 111, which may include:

[0235] S51: After sealing material layer L1, material layer L2, material layer L3 and copper layer 111 with breathable cloth and plastic sealing bag, vacuum is applied, and then the material is placed in a high temperature and high pressure oven for baking.

[0236] For example, the baking temperature can be 135℃-150℃, such as 135℃, and the baking time can be 8 hours. It should be noted that this application does not limit the baking temperature and time.

[0237] S52: After cooling to room temperature, remove material layer L1, material layer L2, material layer L3 and copper layer 111 to form a stacked structure of under-screen substrate and copper layer 111.

[0238] In this way, material layers L1, L2, and L3, along with copper layer 111, are first directly pressed together and then baked. During the baking process, the epoxy resin in the material layers softens and becomes a high-viscosity epoxy adhesive, thus forming an adhesive structure between the under-screen base film and copper layer 111. This method saves on additional adhesive layers for bonding copper layer 111, improving the deformation problem of copper layer 111 while also reducing the thickness of the display module structure and lowering costs.

[0239] Next, let's combine... Figure 14 right Figure 8 A detailed description is provided of one method for preparing the under-screen base film shown.

[0240] Figure 14(a), (b), and (c) in the figure show cross-sectional structural diagrams of different steps in another method for preparing a screen-mounted base film.

[0241] refer to Figure 14 (a), (b), and (c) in the text. Figure 8 One method for preparing the under-screen base film shown is as follows:

[0242] S1': Place material layer L1 on the surface of glass G1.

[0243] S2': Place material layer L2' on the surface of material layer L1.

[0244] S3': Place material layer L3 on the surface of material layer L2'.

[0245] In some embodiments, material layers L1 and L3 are made of the same material, but different from the material layer L2'. For example, material layers L1 and L3 can both be carbon fiber prepreg layers, material layer L2' can be a stainless steel layer, and the orientation of the carbon fibers in the fiber layer of material layer L3 is parallel to the orientation of the carbon fibers in the fiber layer of material layer L1. That is, material layers L1, L2', and L3 form a sandwich structure.

[0246] S4': Encapsulation, baking and cooling are performed, and then material layers L1, L2' and L3 form the under-screen base film (not shown).

[0247] The specific embodiments described above illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Although the description of this application is presented in conjunction with some embodiments, this does not mean that the features of this application are limited to this embodiment. On the contrary, the purpose of describing the application in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of this application. This application may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of this application, some specific details have been omitted in the description. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0248] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "set," "install," "connect," and "fit" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0249] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A display module, characterized in that, The display module includes a display panel stacked along its thickness direction and at least one under-screen base film, wherein the display panel has a light-emitting surface on the side away from the under-screen base film along its thickness direction; One of the base films in the at least one under-screen base film is made of a material selected from carbon fiber, benzo[a]benzo[b]dioxazole fiber, silicon carbide fiber, boron fiber, aramid fiber, ultra-high molecular weight polyethylene fiber, stainless steel, titanium alloy and ultra-thin glass.

2. The display module according to claim 1, characterized in that, The under-display base film includes a first material layer, a second material layer, and a third material layer stacked sequentially along the thickness direction, wherein the third material layer is located between the second material layer and the display panel; The material of at least one of the first material layer, the second material layer, and the third material layer includes one of carbon fiber, benzo[a]benzyl dioxazole fiber, silicon carbide fiber, boron fiber, aramid fiber, ultra-high molecular weight polyethylene fiber, stainless steel, titanium alloy, and ultra-thin glass.

3. The display module according to claim 2, characterized in that, The first material layer and the third material layer are made of the same material.

4. The display module according to claim 3, characterized in that, At least one of the first material layer, the second material layer, and the third material layer includes an adhesive layer, a fiber layer, and an adhesive layer that are sequentially stacked and cross-linked along the thickness direction.

5. The display module according to claim 4, characterized in that, The adhesive layer is made of epoxy resin, and the fiber layer is made of one of carbon fiber, poly(p-phenylene benzodioxazole) fiber, silicon carbide fiber, boron fiber, aramid fiber, and ultra-high molecular weight polyethylene fiber.

6. The display module according to claim 5, characterized in that, The first material layer, the second material layer, and the third material layer each include an adhesive layer, a fiber layer, and an adhesive layer that are sequentially stacked and cross-linked along the thickness direction.

7. The display module according to claim 5, characterized in that, The first material layer includes a first adhesive layer, a first fiber layer and a second adhesive layer, the material of the second material layer includes stainless steel, and the third material layer includes a third adhesive layer, a second fiber layer and a fourth adhesive layer.

8. The display module according to claim 5, characterized in that, The first material layer is made of stainless steel, the second material layer includes a fifth adhesive layer, a third fiber layer and a sixth adhesive layer, and the third material layer is made of stainless steel.

9. The display module according to claim 2, characterized in that, The under-screen base film also includes N fourth material layers, where N is an integer greater than or equal to 1; The first material layer, the Nth fourth material layer, the second material layer, and the third material layer are stacked sequentially along the thickness direction.

10. The display module according to claim 2, characterized in that, The thickness of the under-screen base film ranges from 10 to 200 μm.

11. The display module according to any one of claims 1-10, characterized in that, The display module further includes a first adhesive layer, and the under-screen base film, the first adhesive layer and the display panel are sequentially stacked and connected along the thickness direction; The first adhesive layer and the under-screen base film are used together to form the under-screen support structure.

12. The display module according to claim 11, characterized in that, The material of the first adhesive layer includes one of acrylic acid, silicone, epoxy resin and polyurethane.

13. The display module according to claim 11, characterized in that, The number of under-screen base films is two, and the display module also includes a first metal layer and a second adhesive layer. The first metal layer, one of the under-screen base films and the second adhesive layer are stacked sequentially along the thickness direction and are used together to form an under-screen buffer structure. The under-screen buffer structure, the under-screen support structure, and the display panel are stacked sequentially along the thickness direction, and the second adhesive layer is connected to the under-screen base film in the under-screen support structure.

14. The display module according to claim 13, characterized in that, The first metal layer is made of copper, and the second adhesive layer is made of silicone gel.

15. The display module according to claim 13, characterized in that, The under-screen buffer structure further includes a third adhesive layer and a base layer, wherein the first metal layer, the under-screen base film, the third adhesive layer, the base layer and the second adhesive layer are stacked sequentially along the thickness direction.

16. The display module according to claim 15, characterized in that, The material of the third adhesive layer includes silicone gel, and the material of the base layer includes polyethylene terephthalate or polyimide.

17. The display module according to any one of claims 1-10, characterized in that, The display module further includes an optical structure located on the side of the display panel away from the under-screen base film along the thickness direction.

18. An electronic device, characterized in that, It includes a housing and a display module as described in any one of claims 1-17, the display module being located on the housing.

Images