Circuit board assembly and electronic device
By arranging connectors and terminals on both sides of the circuit board and using isolation components and groove structures for layered layout, the problem of compact circuit board design is solved, high-density wiring and stable connection are achieved, and the temperature rise of the circuit board is reduced.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- DONGGUAN NVT TECH
- Filing Date
- 2025-07-10
- Publication Date
- 2026-06-12
AI Technical Summary
The pads of existing mobile device battery modules typically use a single-sided surface layout. When there are many wire harness branches, the circuit board needs to be expanded laterally, exceeding the size requirements of compact design.
In the circuit board assembly, the connecting parts and connecting terminals are arranged on both sides of the circuit board. The extension section is divided into two rows by the isolation component. The isolation component and the groove structure are used to improve the connection stability and wiring density. The interference fit and bending design are used to enhance the connection stability and conductivity.
This technology enables increased wiring density, enhanced connection stability and conductivity, reduced temperature rise, and improved production efficiency without increasing circuit board size.
Smart Images
Figure CN224356346U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of energy storage technology, and in particular to a circuit board assembly and electronic device. Background Technology
[0002] The pads of existing mobile device battery modules typically adopt a single-sided surface layout. When there are many wire harness branches, due to the physical limitations of planar arrangement density, the circuit board needs to expand laterally to achieve the pad array layout, resulting in the size exceeding the requirements of compact design. Utility Model Content
[0003] In view of the above, this application provides a circuit board assembly that enables a compact design.
[0004] Embodiments of this application provide a circuit board assembly, which includes a circuit board and a wire harness. The circuit board includes a first surface and a second surface disposed along a first direction. The first surface has a plurality of first connecting portions, and the second surface has a plurality of second connecting portions. The first direction is the thickness direction of the circuit board. The wire harness includes a plurality of first sub-wire harnesses and a plurality of second sub-wire harnesses. The ends of the first sub-wire harnesses are provided with first connecting terminals, which are connected to the first connecting portions. The ends of the second sub-wire harnesses are provided with second connecting terminals, which are connected to the second connecting portions.
[0005] In the aforementioned circuit board assembly, the first connecting portion and the second connecting portion are arranged on both sides of the circuit board, and the first connecting terminal and the second connecting terminal are distributed on both sides of the circuit board, so as to increase the wiring density without increasing the size of the circuit board, which is conducive to the compact design of the circuit board assembly.
[0006] In some embodiments of this application, a first sub-wire harness includes a first extension segment connected to a first connection terminal. A second sub-wire harness includes a second extension segment connected to a second connection terminal. The circuit board assembly includes a first isolator, at least a portion of which is located between a plurality of first extension segments and a plurality of second extension segments. The first isolator is configured to separate the plurality of first extension segments and the plurality of second extension segments along a first direction, such that the plurality of first extension segments and the plurality of second extension segments are layered into upper and lower rows, thereby facilitating the distribution of the first connection terminal and the second connection terminal on both sides of the circuit board, which is beneficial to improving the stability of the connection between the first connection terminal and the first connection portion, as well as improving the stability of the connection between the second connection terminal and the second connection portion.
[0007] In some embodiments of this application, the first isolation member includes a first isolation portion and a second isolation portion. The first isolation portion encloses a plurality of first extension segments, and the second isolation portion encloses a plurality of second extension segments, thereby improving the stability of the separation between the plurality of first extension segments and the plurality of second extension segments. Furthermore, the enclosing effect of the first isolation portion and the second isolation portion can save the wire handling process during connection, thus improving production efficiency.
[0008] In some embodiments of this application, a first isolator is disposed on one side of a circuit board along a second direction, which is perpendicular to the first direction. The first isolator includes a first surface and a second surface arranged along the first direction, a plurality of first extension segments are disposed on the first surface, and a plurality of second extension segments are disposed on the second surface, so as to improve the stability of the separation between the plurality of first extension segments and the plurality of second extension segments.
[0009] In some embodiments of this application, the first isolation member includes a third surface and a fourth surface disposed opposite to each other along a second direction, with the third surface closer to the circuit board than the fourth surface along the second direction. The first surface has a plurality of first grooves, each first groove having a first opening facing the first surface, a second opening facing the third surface, and a third opening facing the fourth surface. Each first groove accommodates at least one first extension segment. The first grooves are used to engage the first extension segments to reduce the risk of disordered arrangement of the first extension segments, thereby facilitating improved stability of the connection between the first connecting terminal and the first connecting portion.
[0010] In some embodiments of this application, the second surface is provided with a plurality of second grooves, the second grooves having a fourth opening facing the second surface, a fifth opening facing the third surface, and a sixth opening facing the fourth surface, and the second grooves accommodating at least one second extension segment. The second grooves are used to engage the second extension segments to reduce the risk of disordered arrangement of the second extension segments, thereby facilitating the improvement of the stability of the connection between the second connecting terminal and the second connecting portion.
[0011] In some embodiments of this application, a connection hole is provided on the third side. The circuit board includes a first end face facing the third side, and the first end face is provided with a first extension that extends into the connection hole to improve the stability of the connection between the first isolator and the circuit board.
[0012] In some embodiments of this application, the first extension has a first protrusion on at least one surface in the first direction. The first extension is interference-fitted with the connection hole through the first protrusion to reduce the risk of the first isolator detaching from the circuit board and further improve the stability of the connection between the first isolator and the circuit board.
[0013] In some embodiments of this application, the material of the first protrusion includes solder paste.
[0014] In some embodiments of this application, the connecting hole has a second protrusion on at least one surface in the first direction, and the first extension is interference-fitted with the connecting hole through the second protrusion to reduce the risk of the first isolator detaching from the circuit board and further improve the stability of the connection between the first isolator and the circuit board.
[0015] In some embodiments of this application, the first groove includes a first sub-groove and a second sub-groove, which are located at both ends of a first surface along a third direction. The first and second sub-grooves each accommodate two first extension segments, and the first, second, and third directions are perpendicular to each other. The second groove includes a third sub-groove and a fourth sub-groove, which are located at both ends of a second surface along a third direction. Along the first direction, the projections of the first and third sub-grooves overlap, as do the projections of the second and fourth sub-grooves. The third and fourth sub-grooves each accommodate two second extension segments. The polarity of the second extension segment located in the third sub-groove is the same as the polarity of the first extension segment located in the first sub-groove. Corresponding first and second connecting portions overlap along the first direction and have the same polarity, thereby improving the current-carrying capacity of the circuit board and facilitating the reduction of the circuit board's temperature rise. The polarity of the second extension segment located in the fourth sub-groove is the same as the polarity of the first extension segment located in the second sub-groove. Corresponding first and second connecting portions overlap along the first direction and have the same polarity, thereby improving the current-carrying capacity of the circuit board and facilitating the reduction of the circuit board's temperature rise.
[0016] In some embodiments of this application, along a third direction, the length of the first opening of the first groove is less than the sum of the diameters of the first extension segments disposed in the first groove, so as to facilitate snap-fit.
[0017] In some embodiments of this application, along a third direction, the length of the fourth opening of the second groove is less than the sum of the diameters of the second extension segments disposed in the second groove, so as to facilitate snap-fit.
[0018] In some embodiments of this application, the first sub-wire harness includes a third extension segment connected to the first extension segment, the third extension segment being bent relative to the first extension segment. The second sub-wire harness includes a fourth extension segment connected to the second extension segment, the fourth extension segment being bent relative to the second extension segment. The circuit board assembly includes a second isolator, the second isolator including a third isolator portion and a fourth isolator portion. The third isolator portion encloses a plurality of third extension segments, and the fourth isolator portion encloses a plurality of fourth extension segments, so that the plurality of third extension segments and the plurality of fourth extension segments drive the plurality of first extension segments and the plurality of second extension segments to be layered into upper and lower rows, thereby facilitating the distribution of the first connecting terminal and the second connecting terminal on both sides of the circuit board, which is beneficial to improving the stability of the connection between the first connecting terminal and the first connecting portion, as well as improving the stability of the connection between the second connecting terminal and the second connecting portion.
[0019] In some embodiments of this application, the first connecting portion and the second connecting portion overlapping along the first direction have the same polarity, so that the wiring layers on both sides of the circuit board can simultaneously construct copper foil layers of the same polarity. In the first aspect, by multiplying the equivalent conductive cross-sectional area through parallel paths, the current carrying capacity of the circuit board can be improved. In the second aspect, by increasing the heat dissipation area on both sides, the temperature rise of the circuit board can be reduced.
[0020] Embodiments of this application also provide an electronic device, which includes a battery cell and a motherboard. The electronic device includes any of the circuit board assemblies described in the above embodiments. The circuit board is electrically connected to the battery cell, and one end of the wiring harness away from the circuit board is electrically connected to the motherboard.
[0021] In the aforementioned circuit board assembly and electronic device, the first connecting portion and the second connecting portion are arranged on both sides of the circuit board, and the first connecting terminal and the second connecting terminal are distributed on both sides of the circuit board, so as to increase the wiring density without increasing the size of the circuit board, which is conducive to the compact design of the circuit board assembly. Attached Figure Description
[0022] Figure 1 This is a front view of a circuit board assembly in one embodiment of this application.
[0023] Figure 2 This is a schematic diagram of the back structure of a circuit board assembly in one embodiment of this application.
[0024] Figure 3 This is a schematic diagram of the structure of the second isolator of the circuit board assembly in one embodiment of this application.
[0025] Figure 4 This is a front view of a circuit board assembly in one embodiment of this application.
[0026] Figure 5 This is a schematic diagram of the back structure of a circuit board assembly in one embodiment of this application.
[0027] Figure 6 yes Figure 5 A magnified view of a portion at point A.
[0028] Figure 7 This is a front view of a circuit board assembly in one embodiment of this application.
[0029] Figure 8 This is a schematic diagram of the back structure of a circuit board assembly in one embodiment of this application.
[0030] Figure 9 This is a schematic diagram of the disassembled structure of a circuit board assembly in one embodiment of this application.
[0031] Figure 10 This is a schematic diagram of the structure of the first protrusion of a circuit board assembly in one embodiment of this application.
[0032] Figure 11 This is a schematic diagram of the structure of the second protrusion of a circuit board assembly in one embodiment of this application.
[0033] Figure 12This is a schematic diagram of the structure of the first isolator of a circuit board assembly in one embodiment of this application.
[0034] Figure 13 This is a schematic diagram of the structure of the first isolator of the circuit board assembly in another embodiment of this application.
[0035] Figure 14 This is a schematic diagram of the structure of the first isolator of the circuit board assembly in another embodiment of this application.
[0036] Figure 15 This is a schematic diagram of the structure of the first isolator of the circuit board assembly in another embodiment of this application.
[0037] Figure 16 This is a schematic diagram of the structure of the first isolator of the circuit board assembly in another embodiment of this application.
[0038] Figure 17 This is a schematic diagram of the circuit board assembly in one embodiment of this application.
[0039] Figure 18 This is a schematic diagram of the structure of an electronic device in one embodiment of this application.
[0040] Explanation of main component symbols
[0041] Circuit board assemblies 100A, 100B, 100C, 100D
[0042] Electronic devices 200
[0043] Circuit Board 10
[0044] Page 11
[0045] First connecting part 111
[0046] Page 2, 12
[0047] Second connecting part 121
[0048] First end face 13
[0049] First extension 131
[0050] First convex portion 1311
[0051] Wire harness 20
[0052] First sub-harness 21
[0053] First connecting terminal 211
[0054] First extension section 212
[0055] Third extension section 213
[0056] Second sub-harness 22
[0057] Second connection terminal 221
[0058] Second extension section 222
[0059] Fourth extension paragraph 223
[0060] Connector 23
[0061] First isolation component 30
[0062] First Isolation Section 31
[0063] Second Isolation Section 32
[0064] Page 1, 30A
[0065] First groove 33
[0066] First opening 331
[0067] Second opening 332
[0068] Third opening 333
[0069] First junction 334
[0070] First sub-groove 33A
[0071] Second sub-groove 33B
[0072] Fifth sub-groove 33C
[0073] Sixth Sub-groove 33D
[0074] Second page 30B
[0075] Second groove 34
[0076] Fourth opening 341
[0077] Fifth opening 342
[0078] Sixth opening 343
[0079] Second junction 344
[0080] Third sub-groove 34A
[0081] Fourth sub-groove 34B
[0082] Seventh Sub-groove 34C
[0083] Eighth sub-groove 34D
[0084] Third side 30C
[0085] Connection hole 30C1
[0086] Second convex portion 30C2
[0087] Fourth side 30D
[0088] Second extension 30D1
[0089] Second isolation component 40
[0090] Third Isolation Section 41
[0091] Fourth Isolation Department 42
[0092] First direction Z
[0093] Second direction X
[0094] Third direction Y
[0095] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation
[0096] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.
[0097] It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or may also have a component that is centrally located. When a component is considered to be "set" on another component, it can be directly set on the other component or may also have a component that is centrally located.
[0098] When a value is considered "equal" to another value, it means that the two values are equal within a set deviation range of 5%. In other words, when at least one of the two values fluctuates within the set deviation range, they are considered to be approximately equal even if their values are not equal.
[0099] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items. The term "overlap" as used herein refers to the overlapping of the projected portions of two components or the coincidence of the projected portions of two components.
[0100] Embodiments of this application provide a circuit board assembly, which includes a circuit board and a wire harness. The circuit board includes a first surface and a second surface disposed along a first direction. The first surface has a plurality of first connecting portions, and the second surface has a plurality of second connecting portions. The first direction is the thickness direction of the circuit board. The wire harness includes a plurality of first sub-wire harnesses and a plurality of second sub-wire harnesses. The ends of the first sub-wire harnesses are provided with first connecting terminals, which are connected to the first connecting portions. The ends of the second sub-wire harnesses are provided with second connecting terminals, which are connected to the second connecting portions.
[0101] In the aforementioned circuit board assembly, the first connecting portion and the second connecting portion are arranged on both sides of the circuit board, and the first connecting terminal and the second connecting terminal are distributed on both sides of the circuit board, so as to increase the wiring density without increasing the size of the circuit board, which is conducive to the compact design of the circuit board assembly.
[0102] The embodiments of this application will be further described below with reference to the accompanying drawings.
[0103] Example 1
[0104] Please refer to the following: Figure 1 and Figure 2 One embodiment of this application provides a circuit board assembly 100A, which includes a circuit board 10 and a wiring harness 20. The circuit board 10 is configured to be electrically connected to a battery cell, and the wiring harness 20 is configured to be electrically connected between the circuit board 10 and an external circuit. The external circuit may be, but is not limited to, the motherboard of an electronic device equipped with the circuit board assembly 100A.
[0105] The circuit board 10 includes a first surface 11 and a second surface 12 disposed along a first direction Z, where Z is the thickness direction of the circuit board 10. The first surface 11 is provided with a plurality of first connecting portions 111, and the second surface 12 is provided with a plurality of second connecting portions 121.
[0106] The wiring harness 20 includes a plurality of first sub-wire harnesses 21 and a plurality of second sub-wire harnesses 22. The first sub-wire harnesses 21 are provided with a first connecting terminal 211 at their ends, and the first connecting terminal 211 is connected to a first connecting part 111. The second sub-wire harnesses 22 are provided with a second connecting terminal 221 at their ends, and the second connecting terminal 221 is connected to a second connecting part 121.
[0107] In the circuit board assembly 100A described above, the first connecting portion 111 and the second connecting portion 121 are arranged on both sides of the circuit board 10, and the first connecting terminal 211 and the second connecting terminal 221 are distributed on both sides of the circuit board 10, so as to increase the wiring density without increasing the size of the circuit board 10, which is beneficial to the compact design of the circuit board assembly 100A.
[0108] In some embodiments, the first connecting portion 111 and the second connecting portion 121 are solder pads, the first connecting terminal 211 is soldered to the first connecting portion 111, and the second connecting terminal 221 is soldered to the second connecting portion 121.
[0109] In some embodiments, the first sub-wire harness 21 includes a first extension 212 connected to the first connection terminal 211. An insulating layer is provided on the outer side of the first extension 212. The second sub-wire harness 22 includes a second extension 222 connected to the second connection terminal 221. An insulating layer is provided on the outer side of the second extension 222.
[0110] The circuit board assembly 100A includes a first isolator 30, at least a portion of which is located between a plurality of first extensions 212 and a plurality of second extensions 222. The first isolator 30 is configured to separate the plurality of first extensions 212 and the plurality of second extensions 222 along a first direction Z, such that the plurality of first extensions 212 and the plurality of second extensions 222 are layered into two rows, thereby facilitating the distribution of first connection terminals 211 and second connection terminals 221 on both sides of the circuit board 10. This improves the stability of the connection between the first connection terminals 211 and the first connection portion 111, as well as the stability of the connection between the second connection terminals 221 and the second connection portion 121.
[0111] Please refer to the following: Figure 1 and Figure 2 In some embodiments, the first isolation member 30 includes a first isolation portion 31 and a second isolation portion 32. The first isolation portion 31 encloses a plurality of first extension segments 212, and the second isolation portion 32 encloses a plurality of second extension segments 222, thereby improving the stability of the separation between the plurality of first extension segments 212 and the plurality of second extension segments 222. Furthermore, the enclosing effect of the first isolation portion 31 and the second isolation portion 32 can save the cable management process during connection, thereby improving production efficiency.
[0112] Optionally, the first isolation part 31 is at least one of acetate cloth, polyester film, and masking tape.
[0113] Optionally, the second isolation section 32 is at least one of acetate cloth, polyester film, and masking tape.
[0114] Please refer to the following: Figure 1 and Figure 2 In some embodiments, the wiring harness 20 includes a connector 23, wherein the end of the first sub-wiring harness 21 away from the first connection terminal 211 and the end of the second sub-wiring harness 22 away from the second connection terminal 221 are respectively connected to the connector 23, and the connector 23 is configured to connect with an external circuit.
[0115] Please see Figure 3In some embodiments, the first sub-wire harness 21 includes a third extension 213 connected to the first extension 212, the third extension 213 being bent relative to the first extension 212 to facilitate the wiring layout of the first sub-wire harness 21. The second sub-wire harness 22 includes a fourth extension 223 connected to the second extension 222, the fourth extension 223 being bent relative to the second extension 222 to facilitate the wiring layout of the second sub-wire harness 22.
[0116] In some embodiments, the circuit board assembly 100A includes a second isolator 40. The second isolator 40 includes a third isolator 41 and a fourth isolator 42. The third isolator 41 encloses a plurality of third extension segments 213, and the fourth isolator 42 encloses a plurality of fourth extension segments 223, so that the plurality of third extension segments 213 and the plurality of fourth extension segments 223 drive the plurality of first extension segments 212 and the plurality of second extension segments 222 to be layered into upper and lower rows, thereby facilitating the distribution of the first connection terminal 211 and the second connection terminal 221 on both sides of the circuit board 10, which is beneficial to improving the stability of the connection between the first connection terminal 211 and the first connection portion 111, as well as improving the stability of the connection between the second connection terminal 221 and the second connection portion 121.
[0117] Optionally, the third isolation section 41 is one of acetate cloth, polyester film, and masking tape.
[0118] Optionally, the fourth isolation section 42 is one of acetate cloth, polyester film, or masking tape.
[0119] In some embodiments, the first connecting portion 111 and the second connecting portion 121, which overlap along the first direction Z, have the same polarity, so that the wiring layers on both sides of the circuit board 10 can simultaneously construct copper layers of the same polarity. In the first aspect, by multiplying the equivalent conductive cross-sectional area through parallel paths, the overcurrent capability of the circuit board 10 can be improved. In the second aspect, by increasing the heat dissipation area on both sides, the temperature rise of the circuit board 10 can be reduced.
[0120] Example 2
[0121] Please refer to the following: Figure 4 and Figure 5 An embodiment of this application also provides a circuit board assembly 100B, which differs from the circuit board assembly 100A in that the structure of the first spacer 30 is different.
[0122] The first isolator 30 is disposed on one side of the circuit board 10 along the second direction X, which is perpendicular to the first direction Z. The first isolator 30 includes a first surface 30A and a second surface 30B arranged along the first direction Z. A plurality of first extension segments 212 are disposed on the first surface 30A, and a plurality of second extension segments 222 are disposed on the second surface 30B to improve the stability of the separation between the plurality of first extension segments 212 and the plurality of second extension segments 222.
[0123] Optionally, the first isolation element 30 is one of foam, silicone pad, or plastic block.
[0124] Please see Figure 6 In some embodiments, along the second direction X, the distance between the first surface 30A and the second surface 30B corresponding to the end of the first isolator 30 away from the circuit board 10 is D1, and the distance between the first surface 30A and the second surface 30B corresponding to the end of the first isolator 30 close to the circuit board 10 is D2, where D1≤D2, so that the distance between the plurality of first extensions 212 and the plurality of second extensions 222 is adapted to the thickness of the circuit board 10, and the risk of stress concentration in the first extensions 212 and the second extensions 222 is reduced.
[0125] In some embodiments, when the thickness of the circuit board 10 is 1.2mm, 0mm≤D1≤1.2mm, 1.2mm≤D2≤1.3mm, so that the spacing between the plurality of first extension segments 212 and the plurality of second extension segments 222 is adapted to the thickness of the circuit board 10, and the risk of stress concentration in the first extension segments 212 and the second extension segments 222 is reduced.
[0126] Optionally, D1 can be any value within the range of 0mm, 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm, 1.1mm, 1.2mm, and any other value within the range of 0mm≤D1≤1.2mm.
[0127] Optionally, D2 can be any value within the range of 1.2mm, 1.25mm, 1.3mm, and 1.2mm≤D2≤1.3mm.
[0128] Optionally, the first surface 30A is an inclined surface or a curved surface.
[0129] Optionally, the second surface 30B is a sloped surface or a curved surface.
[0130] In some embodiments, the first surface 30A is provided with an adhesive layer for connecting the first extension segment 212, so as to reduce the risk of disordered arrangement of the first extension segment 212, thereby facilitating the improvement of the stability of the connection between the first connecting terminal 211 and the first connecting portion 111.
[0131] In some embodiments, the second surface 30B is provided with an adhesive layer for connecting the second extension 222, so as to reduce the risk of disordered arrangement of the second extension 222, thereby facilitating the improvement of the stability of the connection between the second connecting terminal 221 and the second connecting portion 121.
[0132] Apart from the differences mentioned above, the parameters of circuit board assembly 100B and circuit board assembly 100A are roughly the same, and can be found in the description of circuit board assembly 100A above.
[0133] Example 3
[0134] Please refer to the following: Figure 7 and Figure 8 An embodiment of this application also provides a circuit board assembly 100C, which differs from circuit board assembly 100A in that the structure of the first isolation member 30 is different.
[0135] A first isolator 30 is disposed on one side of the circuit board 10 along a second direction X, which is perpendicular to the first direction Z. The first isolator 30 includes a first surface 30A and a second surface 30B arranged along the first direction Z, a plurality of first extension segments 212 disposed on the first surface 30A, and a plurality of second extension segments 222 disposed on the second surface 30B. The first surface 30A and the second surface 30B are parallel along the first direction Z.
[0136] The first isolation member 30 includes a third surface 30C and a fourth surface 30D disposed opposite to each other along the second direction X. Along the second direction X, the third surface 30C is closer to the circuit board 10 than the fourth surface 30D.
[0137] Please see Figure 9 The first surface 30A is provided with a plurality of first grooves 33. The first grooves 33 have a first opening 331 facing the first surface 30A, a second opening 332 facing the third surface 30C, and a third opening 333 facing the fourth surface 30D. The first grooves 33 accommodate at least one first extension segment 212. The first grooves 33 are used to engage the first extension segment 212 to reduce the risk of disordered arrangement of the first extension segments 212, thereby facilitating the improvement of the stability of the connection between the first connecting terminal 211 and the first connecting portion 111.
[0138] The second surface 30B is provided with a plurality of second grooves 34. Each second groove 34 has a fourth opening 341 facing the second surface 30B, a fifth opening 342 facing the third surface 30C, and a sixth opening 343 facing the fourth surface 30D. Each second groove 34 accommodates at least one second extension segment 222. The second grooves 34 are used to engage the second extension segments 222 to reduce the risk of disordered arrangement of the second extension segments 222, thereby facilitating improved stability of the connection between the second connecting terminal 221 and the second connecting portion 121.
[0139] Optionally, the first isolation element 30 is one of a wire buckle, a wire divider, or a wire clamp.
[0140] Please see Figure 9In some embodiments, the third surface 30C is provided with a connection hole 30C1. The circuit board 10 includes a first end face 13 facing the third surface 30C, and the first end face 13 is provided with a first extension 131, which extends into the connection hole 30C1 to improve the stability of the connection between the first isolator 30 and the circuit board 10.
[0141] Optionally, the connecting hole 30C1 is a blind hole or a through hole that penetrates the first isolation member 30 along the second direction X.
[0142] Please see Figure 10 In some embodiments, the first extension 131 is provided with a first protrusion 1311. Along a direction perpendicular to the second direction X, the first extension 131 is press-fitted with the connection hole 30C1 through the first protrusion 1311 to reduce the risk of the first isolation member 30 detaching from the circuit board 10 and further improve the stability of the connection between the first isolation member 30 and the circuit board 10.
[0143] In some embodiments, the first extension 131 has a first protrusion 1311 on at least one surface in the first direction Z, and the first extension 131 is press-fitted with the connecting hole 30C1 through the first protrusion 1311.
[0144] Optionally, the material of the first protrusion 1311 includes tin, and the first protrusion 1311 is formed by curing with solder paste, so as to control the size of the first protrusion 1311 during the preparation process, and the solder paste is not easily worn, which enables multiple insertion and removal of the first extension 131 and the connecting hole 30C1.
[0145] It is understood that in some embodiments, the first extension 131 has a first protrusion 1311 on at least one surface in the third direction Y, and the first extension 131 is interference-fitted with the connecting hole 30C1 through the first protrusion 1311.
[0146] Please see Figure 11 In some embodiments, the hole surface of the connecting hole 30C1 is provided with a second protrusion 30C2. Along the direction perpendicular to the second direction X, the first extension 131 is interference-fitted with the connecting hole 30C1 through the second protrusion 30C2 to reduce the risk of the first isolation member 30 detaching from the circuit board 10 and further improve the stability of the connection between the first isolation member 30 and the circuit board 10.
[0147] In some embodiments, the connecting hole 30C1 has a second protrusion 30C2 on at least one surface in the first direction Z, and the first extension 131 is interference-fitted with the connecting hole 30C1 through the second protrusion 30C2.
[0148] It is understood that in some embodiments, the connecting hole 30C1 has a second protrusion 30C2 on at least one surface in the third direction Y, and the first extension 131 is interference-fitted with the connecting hole 30C1 through the second protrusion 30C2.
[0149] Please refer to the following: Figure 7 and Figure 8 In some embodiments, the first groove 33 includes a first sub-groove 33A and a second sub-groove 33B, which are located at both ends of the first surface 30A along a third direction Y. The first sub-groove 33A and the second sub-groove 33B respectively accommodate at least two first extension segments 212. The first direction Z, the second direction X, and the third direction Y are perpendicular to each other.
[0150] The second groove 34 includes a third sub-groove 34A and a fourth sub-groove 34B, which are located at both ends of the second surface 30B along the third direction Y. Along the first direction Z, the projections of the first sub-groove 33A and the third sub-groove 34A overlap, and the projections of the second sub-groove 33B and the fourth sub-groove 34B overlap. The third sub-groove 34A and the fourth sub-groove 34B each accommodate at least two second extension segments 222.
[0151] The polarity of the second extension 222 located in the third sub-groove 34A is the same as that of the first extension 212 located in the first sub-groove 33A. The polarity of the corresponding first connection terminal 211 is the same as that of the second connection terminal 221. The corresponding first connection portion 111 and second connection portion 121 overlap along the first direction Z and have the same polarity. This allows the wiring layers on both sides of the circuit board 10 to simultaneously construct copper layers of the same polarity. On the one hand, by multiplying the equivalent conductive cross-sectional area through parallel paths, the current carrying capacity of the circuit board 10 can be improved. On the other hand, by increasing the heat dissipation area on both sides, the temperature rise of the circuit board 10 can be reduced.
[0152] The polarity of the second extension 222 located in the fourth sub-groove 34B is the same as that of the first extension 212 located in the second sub-groove 33B. The polarity of the corresponding first connection terminal 211 is the same as that of the second connection terminal 221. The corresponding first connection portion 111 and second connection portion 121 overlap along the first direction Z and have the same polarity. This allows the wiring layers on both sides of the circuit board 10 to simultaneously construct copper layers of the same polarity. On the one hand, by multiplying the equivalent conductive cross-sectional area through parallel paths, the current carrying capacity of the circuit board 10 can be improved. On the other hand, by increasing the heat dissipation area on both sides, the temperature rise of the circuit board 10 can be reduced.
[0153] In some embodiments, the first sub-groove 33A and the second sub-groove 33B respectively accommodate two first extension segments 212, and the third sub-groove 34A and the fourth sub-groove 34B respectively accommodate two second extension segments 222. The parallel design of the two first extension segments 212 and the parallel design of the two second extension segments 222 helps to reduce errors, reduce the difficulty of wire clamping, and facilitates control during hot pressing welding.
[0154] Please see Figure 12 In some embodiments, along the third direction Y, the length of the first opening 331 of the first groove 33 is less than the sum of the diameters of the first extension 212 disposed in the first groove 33, so as to facilitate snap-fit.
[0155] In some embodiments, along the third direction Y, the length of the fourth opening 341 of the second groove 34 is less than the sum of the diameters of the second extension 222 disposed in the second groove 34, so as to facilitate snap-fit.
[0156] Please see Figure 13 In some embodiments, the first junction 334 between the first groove 33 and the first surface 30A is provided with a rounded corner to reduce the risk of damage to the first extension 212 during the snap-fit process.
[0157] In some embodiments, the second junction 344 between the second groove 34 and the second surface 30B is provided with a rounded corner to reduce the risk of damage to the second extension 222 during the snap-fit process.
[0158] Please see Figure 11 In some embodiments, in a first groove 33 that accommodates at least two first extension segments 212, the first groove 33 has a first bottom surface 335 perpendicular to the first direction Z, and the first bottom surface 345 carries the first extension segment 212 to reduce the risk of the first extension segment 212 being interfered with by the bottom protrusion structure of the first groove 33 during the snap-fit process.
[0159] In some embodiments, in a second groove 34 that accommodates at least two second extension segments 222, the second groove 34 has a second bottom surface 345 perpendicular to the first direction Z, the second bottom surface 345 bearing the second extension segments 222, so as to reduce the risk of the second extension segments 222 being interfered with by the bottom protrusion structure of the second groove 34 during the snap-fit process.
[0160] Please see Figure 14In some embodiments, the plurality of first sub-wire harnesses 21 include a first power line and a first signal line, wherein the wire diameter of the first power line is larger than that of the first signal line. The first groove 33 includes a fifth sub-groove 33C and a sixth sub-groove 33D, which are arranged along a third direction Y. The fifth sub-groove 33C accommodates a first extension segment 212 with a larger wire diameter, and the sixth sub-groove 33D accommodates a first extension segment 212 with a smaller wire diameter. The size of the first connecting portion 111 corresponding to the fifth sub-groove 33C is larger than the size of the first connecting portion 111 corresponding to the sixth sub-groove 33D.
[0161] Multiple second sub-wire harnesses 22 include second power lines and second signal lines, with the second power lines having a larger diameter than the second signal lines. The second recess 34 includes a seventh sub-recess 34C and an eighth sub-recess 34D, arranged along a third direction Y. The seventh sub-recess 34C accommodates a second extension segment 222 with a larger diameter, and the eighth sub-recess 34D accommodates a second extension segment 222 with a smaller diameter. The size of the second connecting portion 121 corresponding to the seventh sub-recess 34C is larger than the size of the second connecting portion 121 corresponding to the eighth sub-recess 34D.
[0162] In some embodiments, along the first direction Z, the projections of the fifth sub-groove 33C and the seventh sub-groove 34C overlap, and the projections of the sixth sub-groove 33D and the eighth sub-groove 34D overlap, so that the dimensions of the first connecting portion 111 and the second connecting portion 121 distributed on both sides of the circuit board 10 are consistent, which is beneficial to the uniform stress on the first connecting terminal 211 and the second connecting terminal 221 during the hot-press welding process.
[0163] Please see Figure 15 In some embodiments, along the first direction Z, the projections of the fifth sub-groove 33C and the seventh sub-groove 34C do not overlap, and the projections of the sixth sub-groove 33D and the eighth sub-groove 34D do not overlap, so that the wiring layers on both sides of the circuit board 10 can simultaneously construct copper layers of the same polarity. On the one hand, by multiplying the equivalent conductive cross-sectional area through parallel paths, the overcurrent capability of the circuit board 10 can be improved. On the other hand, by increasing the double-sided heat dissipation area, the temperature rise of the circuit board 10 can be reduced.
[0164] Please see Figure 16In some embodiments, multiple first sub-wiring bundles 21 include first signal lines and second signal lines, and multiple second sub-wiring bundles 22 include first power lines and second power lines, with the polarities of the first power lines and second power lines being opposite. A portion of the first recess 33 accommodates the first extension segment 212 of the first signal line, and the remaining portion of the first recess 33 accommodates the first extension segment 212 of the second signal line. There are two second recesses 34 arranged along a third direction Y, with one second recess 34 accommodating the second extension segment 222 of the first power line and the other second recess 34 accommodating the second extension segment 222 of the second power line. This allows the wiring layers on both sides of the circuit board 10 to simultaneously construct copper layers of the same polarity. Firstly, by multiplying the equivalent conductive cross-sectional area through parallel paths, the current-carrying capacity of the circuit board 10 can be improved. Secondly, by increasing the double-sided heat dissipation area, the temperature rise of the circuit board 10 can be reduced.
[0165] It is understood that in some embodiments, the plurality of first sub-wire harnesses 21 include a first power line and a second power line, and the plurality of second sub-wire harnesses 22 include a first signal line and a second signal line. Correspondingly, a portion of the second grooves 34 accommodates the second extension segment 222 of the first signal line, and the remaining portion of the second grooves 34 accommodates the second extension segment 222 of the second signal line. There are two first grooves 33, arranged along a third direction Y, with one first groove 33 accommodating the first extension segment 212 of the first power line and the other first groove 33 accommodating the first extension segment 212 of the second power line.
[0166] Apart from the differences mentioned above, the parameters of circuit board assembly 100C and circuit board assembly 100A are roughly the same, and can be found in the description of circuit board assembly 100A above.
[0167] Example 4
[0168] Please refer to the following: Figure 17 An embodiment of this application also provides a circuit board assembly 100D, which differs from the circuit board assembly 100C in that the first isolation member 30 and the second isolation member 40 have different structures.
[0169] The first sub-wire harness 21 includes a third extension 213 connected to the first extension 212. The third extension 213 is bent relative to the first extension 212 to facilitate the routing layout of the first sub-wire harness 21. The second sub-wire harness 22 includes a fourth extension 223 connected to the second extension 222. The fourth extension 223 is bent relative to the second extension 222 to facilitate the routing layout of the second sub-wire harness 22. The circuit board assembly 100A includes a second isolator 40. The second isolation member 40 includes a third isolation portion 41 and a fourth isolation portion 42. The third isolation portion 41 encloses a plurality of third extension segments 213, and the fourth isolation portion 42 encloses a plurality of fourth extension segments 223, so that the plurality of third extension segments 213 and the plurality of fourth extension segments 223 drive the plurality of first extension segments 212 and the plurality of second extension segments 222 to be layered into upper and lower rows, thereby facilitating the distribution of the first connecting terminal 211 and the second connecting terminal 221 on both sides of the circuit board 10, which is beneficial to improving the stability of the connection between the first connecting terminal 211 and the first connecting portion 111, as well as improving the stability of the connection between the second connecting terminal 221 and the second connecting portion 121.
[0170] The fourth surface 30D is provided with a second extension 30D1, which is located between the third isolation portion 41 and the fourth isolation portion 42. The second extension 30D1 is configured to divide a plurality of third extension segments 213 and a plurality of fourth extension segments 223 along the first direction Z, which helps to reduce the height difference between the first extension segment 212 and the first groove 33, as well as the height difference between the second extension segment 222 and the second groove 34, thereby improving the assembly accuracy.
[0171] Apart from the differences mentioned above, the parameters of circuit board assembly 100D and circuit board assembly 100C are roughly the same, and can be found in the description of circuit board assembly 100C above.
[0172] Please see Figure 18 An embodiment of this application also provides an electronic device 200. The electronic device 200 includes a battery cell 91, a motherboard 92, and a circuit board assembly (100A, 100B, 100C, 100D) as described in any of the above embodiments. The circuit board 10 is electrically connected to the battery cell 90, and one end of the wiring harness 20 away from the circuit board 10 is electrically connected to the motherboard 92.
[0173] Electronic device 200 may include, but is not limited to, mobile or fixed terminals such as tablet computers (PADs), laptops, personal digital assistants (PDAs), handheld devices with wireless communication capabilities, computing devices, in-vehicle devices, wearable devices, virtual reality (VR) terminal devices, augmented reality (AR) terminal devices, wireless terminals in industrial control, wireless terminals in self-driving, wireless terminals in remote medical care, wireless terminals in smart grids, wireless terminals in transportation safety, wireless terminals in smart cities, and wireless terminals in smart homes.
[0174] In the aforementioned circuit board assemblies (100A, 100B, 100C, 100D) and electronic device 200, the first connecting portion 111 and the second connecting portion 121 are arranged on both sides of the circuit board 10, and the first connecting terminal 211 and the second connecting terminal 221 are distributed on both sides of the circuit board 10, so as to increase the wiring density without increasing the size of the circuit board 10, which is conducive to the compact design of the circuit board assemblies (100A, 100B, 100C, 100D).
[0175] In addition, those skilled in the art may make other changes within the spirit of this application. Of course, all such changes made in accordance with the spirit of this application should be included within the scope disclosed in this application.
Claims
1. A circuit board assembly, characterized in that, The circuit board assembly includes: The circuit board includes a first surface and a second surface disposed along a first direction. The first surface is provided with a plurality of first connecting portions, and the second surface is provided with a plurality of second connecting portions. The first direction is the thickness direction of the circuit board. The wire harness includes multiple first sub-wire harnesses and multiple second sub-wire harnesses. The ends of the first sub-wire harnesses are provided with first connecting terminals, which are connected to the first connecting portion. The ends of the second sub-wire harnesses are provided with second connecting terminals, which are connected to the second connecting portion.
2. The circuit board assembly as claimed in claim 1, characterized in that, The first sub-wire harness includes a first extension segment connected to the first connection terminal, and the second sub-wire harness includes a second extension segment connected to the second connection terminal; The circuit board assembly includes a first isolator, at least a portion of which is located between a plurality of first extensions and a plurality of second extensions, the first isolator being configured to separate the plurality of first extensions and the plurality of second extensions along the first direction.
3. The circuit board assembly as described in claim 2, characterized in that, The first isolation member includes a first isolation portion and a second isolation portion, wherein the first isolation portion encloses a plurality of first extension segments, and the second isolation portion encloses a plurality of second extension segments.
4. The circuit board assembly as claimed in claim 2, characterized in that, The first isolation member is disposed on one side of the circuit board along a second direction, the second direction being perpendicular to the first direction. The first isolation member includes a first surface and a second surface arranged along the first direction, a plurality of first extension segments are disposed on the first surface, and a plurality of second extension segments are disposed on the second surface.
5. The circuit board assembly as claimed in claim 4, characterized in that, The first isolation member includes a third surface and a fourth surface disposed opposite to each other along the second direction, wherein the third surface is closer to the circuit board than the fourth surface along the second direction; The first surface is provided with a plurality of first grooves, the first grooves having a first opening facing the first surface, the first grooves having a second opening facing the third surface, the first grooves having a third opening facing the fourth surface, and the first grooves accommodating at least one first extension segment; And / or, The second surface is provided with a plurality of second grooves, the second grooves having a fourth opening facing the second surface, the second grooves having a fifth opening facing the third surface, the second grooves having a sixth opening facing the fourth surface, and the second grooves accommodating at least one second extension segment.
6. The circuit board assembly as claimed in claim 5, characterized in that, The third surface is provided with a connection hole; The circuit board includes a first end face facing the third side, the first end face having a first extension that extends into the connection hole.
7. The circuit board assembly as claimed in claim 6, characterized in that, The first extension has a first protrusion on at least one surface in the first direction, and the first extension is interference-fitted with the connecting hole through the first protrusion.
8. The circuit board assembly as claimed in claim 7, characterized in that, The material of the first protrusion includes solder paste.
9. The circuit board assembly as claimed in claim 6, characterized in that, The connecting hole has a second protrusion on at least one surface in the first direction, and the first extension is interference-fitted with the connecting hole through the second protrusion.
10. The circuit board assembly as claimed in claim 5, characterized in that, The first groove includes a first sub-groove and a second sub-groove. The first sub-groove and the second sub-groove are located at both ends of the first surface along a third direction. The first sub-groove and the second sub-groove respectively accommodate two first extension segments. The first direction, the second direction and the third direction are perpendicular to each other. The second groove includes a third sub-groove and a fourth sub-groove, which are located at both ends of the second surface along the third direction. Along the first direction, the projections of the first sub-groove and the third sub-groove overlap, and the projections of the second sub-groove and the fourth sub-groove overlap. The third sub-groove and the fourth sub-groove each accommodate two second extension segments. The polarity of the second extension segment located in the third sub-groove is the same as the polarity of the first extension segment located in the first sub-groove, and the polarity of the second extension segment located in the fourth sub-groove is the same as the polarity of the first extension segment located in the second sub-groove.
11. The circuit board assembly as claimed in claim 10, characterized in that, Along the third direction, the length of the first opening of the first groove is less than the sum of the diameters of the first extension segments disposed in the first groove; and / or, Along the third direction, the length of the fourth opening of the second groove is less than the sum of the diameters of the second extension segments disposed in the second groove.
12. The circuit board assembly as claimed in claim 2, characterized in that, The first sub-wire harness includes a third extension segment connected to the first extension segment, the third extension segment being bent relative to the first extension segment; the second sub-wire harness includes a fourth extension segment connected to the second extension segment, the fourth extension segment being bent relative to the second extension segment. The circuit board assembly includes a second isolator, which includes a third isolator and a fourth isolator. The third isolator encloses a plurality of the third extension segments, and the fourth isolator encloses a plurality of the fourth extension segments.
13. The circuit board assembly as claimed in claim 2, characterized in that, The first connecting portion and the second connecting portion, which overlap along the first direction, have the same polarity.
14. An electronic device comprising a battery cell and a motherboard, characterized in that, The electronic device includes a circuit board assembly as described in any one of claims 1 to 13, the circuit board being electrically connected to the battery cell, and one end of the wiring harness remote from the circuit board being electrically connected to the motherboard.