Vehicle body domain control compatible load box
By designing a small load cell with an all-metal structure and integrated analog modules, the problems of large size and complex testing of traditional load cells are solved. This achieves EMI shielding, improved EMC efficiency, and compatibility with multiple projects, while reducing costs and redundancy.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- WENZHOU CHANGJIANG AUTOMOBILE ELECTRONICS SYST
- Filing Date
- 2025-06-09
- Publication Date
- 2026-06-16
AI Technical Summary
In multi-functional integrated domain controller projects, traditional load cell designs result in a surge in the number of pins, leading to bulky load cells, poor mobility, high testing complexity, and significant challenges in EMC and DV testing.
Design a vehicle-mounted domain control compatible load box with an all-metal enclosure. It integrates multiple IDL, IDH, HSD, LSD, IAN, and OHB analog modules, which are connected via adapter cables and a panel. It shields against EMI interference and achieves miniaturization and multi-project compatibility.
It effectively shields EMI interference, improves EMC testing efficiency, reduces load redundancy, enhances versatility and utilization, simplifies design, and reduces costs.
Smart Images
Figure CN224366122U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of testing equipment technology, and more specifically, to a vehicle body domain control compatible load cell. Background Technology
[0002] Currently, the design of load boards for automotive switches typically involves configuring analog resistors on the load board and connecting these resistors to the device under test (DUT) via wiring harnesses. However, in today's multi-functional integrated domain controller projects, the pin count requirements for connectors have surged, often reaching hundreds, and these pins need to support multiple CAN communication channels, LIN communication channels, and automotive Ethernet functionality. This high-density pin configuration and diverse communication requirements pose significant challenges to traditional load box designs.
[0003] Traditional load cell designs require an exceptionally large load board to accommodate so many pins and communication functions. This significantly reduces load cell mobility and creates numerous inconveniences during hardware and software debugging, EMC (electromagnetic compatibility) testing, and DV (design verification) testing. Particularly in signal monitoring, the bulky load cell design significantly increases the complexity and difficulty of testing.
[0004] In view of this, we have designed a new type of load cell to solve the problems existing in the prior art, and it is particularly suitable for software and hardware debugging, as well as EMC and DV testing needs during the R&D phase. Utility Model Content
[0005] This invention overcomes the shortcomings of the prior art, can greatly reduce complex EMI interference, greatly reduce the redundancy of the load, and can be compatible with different projects, thus improving the versatility of the load box.
[0006] To achieve the above objectives, the present invention provides the following technical solution:
[0007] A vehicle-mounted domain control compatible load cell includes a housing. The top surface of the housing has a top cover panel, the bottom surface has a grounding panel, and the sides of the housing have a connector panel, a load indicator panel, a communication interface panel, and a shielding panel. The connector panel and the load indicator panel are connected via adapter cables. The connector panel has an IDH high-level analog input module, an IDL low-level analog input module, a sensor analog module, a LIN bus communication analog module, and a CAN bus communication analog module. The LIN bus communication analog module and the CAN bus communication analog module are both connected to the communication interface panel via adapter cables. The load indicator panel has an HSD high-side drive analog module, an LSD low-side drive analog module, and an H-bridge drive analog module.
[0008] Preferably, the IDH high-level analog input module includes a switch SW1, one end of which is electrically connected to the connector, the other end of which is connected in series with VCC, and a capacitor C1 is connected in parallel with the switch SW1.
[0009] Preferably, the IDL low-level analog input module includes a switch SW2, one end of which is electrically connected to the connector, the other end of which is grounded, and a capacitor C4 is connected in parallel with the switch SW2.
[0010] Preferably, the sensor simulation module includes a resistor R10, one end of which is electrically connected to the connector, the other end of which is grounded, and a capacitor C7 is connected in parallel with the resistor R10.
[0011] Preferably, the LIN bus communication simulation module includes a TVS2 diode, which is electrically connected to the LIN1 interface. The TVS2 diode is connected in parallel with a C12 capacitor, which is connected in parallel with a R11 resistor, and the R11 resistor is connected in series with a D1 diode.
[0012] Preferably, the LIN bus communication simulation module also includes a TVS4 diode, which is electrically connected to the LIN2 interface. The TVS4 diode is connected in parallel with a C16 capacitor, which is connected in parallel with a R20 resistor, and the R20 resistor is connected in series with a D4 diode.
[0013] Preferably, the CAN bus communication simulation module includes two bus capacitors connected in series, one of which is connected to the CANL interface and the other is connected to the CANH interface. It also includes two TVS diodes connected in series, with the first and second pins of the two TVS diodes connected in parallel to the two bus capacitors. The two TVS diodes have a third pin between them, which is connected to the two bus capacitors and is grounded.
[0014] Preferably, the HSD high-side drive analog module includes an R35 resistor, an LED1 indicator light with one end connected to the R35 resistor and the other end grounded, a C27 capacitor connected in parallel with the LED1 indicator light, a D5 diode connected in parallel with the LED1 indicator light, and an R38 resistor connected in parallel with the D5 diode.
[0015] Preferably, the LSD low-side drive analog module includes a KL30 power supply, an R45 resistor connected in series with the KL30 power supply, a D6 diode connected in series with the R45 resistor, an R43 resistor connected in parallel with the D6 diode, an LED2 indicator light connected in parallel with the D6 diode, and a C34 capacitor connected in parallel with the LED2 indicator light.
[0016] Preferably, the H-bridge drive analog module includes an M high-power analog resistor and an L2 inductor connected in series with the M high-power analog resistor; an LED4 indicator, a D8 diode, a C37 capacitor, and an R50 resistor connected in parallel with the M high-power analog resistor and the L2 inductor; an R49 resistor, a C38 capacitor, a D7 diode, and an LED3 indicator connected in parallel with the M high-power analog resistor and the L2 inductor; an R48 resistor connected in series with the LED4 indicator, the D8 diode, the C37 capacitor, and the R50 resistor; and an R51 resistor connected in series with the R49 resistor, the C38 capacitor, the D7 diode, and the LED3 indicator.
[0017] The beneficial effects of this utility model are:
[0018] 1. The enclosure adopts an all-metal design, which can effectively shield the EMI interference generated when the load is working, avoid affecting other equipment, greatly improve the efficiency of EMC testing, and has good practicality and economy. Moreover, when conducting EMC testing, the shielding panel can be oriented towards the receiving antenna. The panel is seamless, which greatly reduces the load EMI interference factors and has a great improvement effect on EMC testing.
[0019] 2. By integrating multiple IDL (low-level input), IDH (high-level input), HSD (high-side drive), LSD (low-side drive), IAN (analog signal input), OHB (bridge drive) and other inputs into a small load cell through control indication and communication monitoring, the redundancy of the load is greatly reduced.
[0020] 3. By adopting an adapter solution for the load indicator panel, it can be used in multiple projects, greatly improving the utilization rate and versatility of the load box;
[0021] 4. The load cell of this utility model is simpler in design, has a shorter manufacturing cycle, and lower cost than traditional projects. Attached Figure Description
[0022] Figure 1 This is a schematic diagram illustrating the structure of the box in a specific embodiment of the present invention. Figure 1 ;
[0023] Figure 2 This is a schematic diagram illustrating the structure of the box in a specific embodiment of the present invention. Figure 2 ;
[0024] Figure 3 This is a schematic diagram illustrating the internal structure of the box in a specific embodiment of this utility model. Figure 1 ;
[0025] Figure 4 This is a schematic diagram illustrating the internal structure of the box in a specific embodiment of this utility model. Figure 2 ;
[0026] Figure 5 This is a circuit system block diagram of a specific embodiment of the present utility model;
[0027] Figure 6 The circuit structure diagram of the IDH high-level analog input module is shown in a specific embodiment of this utility model.
[0028] Figure 7 The circuit structure diagram of the IDL low-level analog input module is shown in a specific embodiment of this utility model.
[0029] Figure 8 The circuit diagram shown here illustrates the sensor simulation module in a specific embodiment of this utility model.
[0030] Figure 9 The circuit structure diagram of the LIN bus communication simulation module is shown in the specific embodiment of this utility model.
[0031] Figure 10 The circuit structure diagram of the CAN bus communication simulation module is shown in a specific embodiment of this utility model.
[0032] Figure 11 The circuit structure diagram of the HSD high-side drive simulation module is shown in a specific embodiment of this utility model.
[0033] Figure 12 The circuit structure diagram of the HSD high-side drive simulation module is shown in a specific embodiment of this utility model.
[0034] Figure 13 The circuit structure diagram of the H-bridge drive simulation module is shown in a specific embodiment of this utility model.
[0035] In the diagram: 100, enclosure; 101, top cover panel; 102, grounding panel; 103, connector panel; 104, load indicator panel; 105, communication interface panel; 106, shielding panel; 1. IDH high-level analog input module; 2. IDL low-level analog input module; 3. sensor analog module; 4. LIN bus communication analog module; 5. CAN bus communication analog module; 6. HSD high-side drive analog module; 7. LSD low-side drive analog module; 8. H-bridge drive analog module. Detailed Implementation
[0036] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0037] like Figure 1-13As shown, a vehicle-mounted domain control compatible load cell includes a housing 100. A top cover panel 101 is provided on the top surface of the housing 100, and a grounding panel 102 is provided on the bottom surface. A connector adapter panel 103, a load indicator panel 104, a communication interface panel 105, and a shielding panel 106 are provided on the sides of the housing 100. The connector adapter panel 103 and the load indicator panel 104 are connected via an adapter cable. The connector adapter panel 103 is equipped with an IDH high-level analog input module 1, an IDL low-level analog input module 2, a sensor analog module 3, a LIN bus communication analog module 4, and a CAN bus communication analog module 5. The LIN bus communication analog module... Block 4 and CAN bus communication simulation module 5 are both connected to the communication interface panel 105 via adapter cables. The load indicator panel 104 is equipped with an HSD high-side drive simulation module 6, an LSD low-side drive simulation module 7, and an H-bridge drive simulation module 8. The IDH high-level analog input module 1 includes a SW1 switch, one end of which is electrically connected to the connector, and the other end of which is connected in series with VCC. A capacitor C1 is connected in parallel with the SW1 switch. The IDL low-level analog input module 2 includes a SW2 switch, one end of which is electrically connected to the connector, and the other end of which is grounded. A capacitor C4 is connected in parallel with the SW2 switch. The sensor simulation module 3 includes a resistor R10, R... One end of resistor R10 is electrically connected to the connector, and the other end of resistor R10 is grounded. Resistor R10 is connected in parallel with capacitor C7. The LIN bus communication simulation module 4 includes a TVS2 diode, which is electrically connected to the LIN1 interface. The TVS2 diode is connected in parallel with capacitor C12, and capacitor C12 is connected in parallel with resistor R11. Resistor R11 is connected in series with diode D1. The LIN bus communication simulation module 4 also includes a TVS4 diode, which is electrically connected to the LIN2 interface. The TVS4 diode is connected in parallel with capacitor C16, and capacitor C16 is connected in parallel with resistor R20. Resistor R20 is connected in series with diode D4. The CAN bus communication simulation module 5 includes two series-connected... The system includes bus capacitors, one of which is connected to the CANL interface and the other to the CANH interface. It also includes two TVS diodes connected in series, with the first and second pins of the two TVS diodes connected in parallel to the two series-connected bus capacitors. A third pin is located between the two series-connected TVS diodes and is connected to both bus capacitors. The third pin is grounded. The HSD high-side drive analog module 6 includes a resistor R35, an LED1 indicator light with one end connected to the R35 resistor and the other end grounded, a capacitor C27 connected in parallel with the LED1 indicator light, a diode D5 connected in parallel with the LED1 indicator light, and a resistor R38 connected in parallel with the D5 diode.The LSD low-side drive analog module 7 includes a KL30 power supply, an R45 resistor connected in series with the KL30 power supply, a D6 diode connected in series with the R45 resistor, an R43 resistor connected in parallel with the D6 diode, an LED2 indicator light connected in parallel with the D6 diode, and a C34 capacitor connected in parallel with the LED2 indicator light; the H-bridge drive analog module 8 includes an M high-power analog resistor and an L2 inductor connected in series with the M high-power analog resistor; an LED4 indicator light, a D8 diode, a C37 capacitor, and an R50 resistor connected in parallel with the M high-power analog resistor and the L2 inductor; an R49 resistor, a C38 capacitor, a D7 diode, and an LED3 indicator light connected in parallel with the M high-power analog resistor and the L2 inductor; an R48 resistor connected in series with the LED4 indicator light, the D8 diode, the C37 capacitor, and the R50 resistor; and an R51 resistor connected in series with the R49 resistor, the C38 capacitor, the D7 diode, and the LED3 indicator light.
[0038] By adopting the above technical solution, in this utility model, the housing 100 adopts an all-metal design, which can effectively shield the EMI interference generated when the load is working, avoid affecting other equipment, greatly improve the EMC test efficiency, and has good practicality and economy. Moreover, when conducting EMC tests, the shielding panel 106 can be oriented towards the receiving antenna. The panel is seamless, which greatly reduces the load EMI interference factors and has a great improvement effect on EMC testing.
[0039] Furthermore, multiple IDL (low-level input), IDH (high-level input), HSD (high-side drive), LSD (low-side drive), IAN (analog signal input), OHB (bridge drive) and other inputs can be integrated into a small load cell through control indicators and communication monitoring, which greatly reduces the redundancy of the load.
[0040] Furthermore, by using a conversion scheme through the load indicator panel 104, it can achieve multi-project compatibility and greatly improve the utilization rate and versatility of the load box;
[0041] The load cell of this invention is simpler in design, has a shorter manufacturing cycle, and lower cost compared to traditional load cell projects.
[0042] In the circuit system block diagram, the DUT test piece is connected to the connector panel 103 via a wiring harness. The connector panel 103 is equipped with multiple adapters, which are connected to the load indicator panel 104 via adapter cables. The LIN bus communication simulation module 4 and CAN bus communication simulation module 5 of the connector panel 103 are both connected to the communication interface panel 105 via adapter cables. The communication interface panel 105 can be connected to the host computer PC via a communication cable.
[0043] Specifically, in Figures 6-13In the diagram, each module circuit shows the complete circuit board after the load bank and the test piece are connected. The part framed in the diagram is the corresponding load bank module circuit, while the rest is the circuit of the test piece.
[0044] In the IDH high-level analog input module 1, the load box is equipped with a C1 filter capacitor. The IDH signal is pulled up to VCC by the SW1 switch and input to the DUT. After being divided by resistors R1 and R3 and filtered by C2 and C3, it is transmitted to the product MCU (simulating the high-level input of the actual vehicle).
[0045] In IDL low-level analog input module 2, the load bank can pull down the DUT port level through SW2 switch, and the MCU can collect the port voltage change to determine whether there is an IDL signal input (simulating the low-level input of the actual vehicle).
[0046] In sensor simulation module 3, the load box simulates a sensor through R10, divides the voltage at the DUT test piece, and reads the voltage division value at the port through the MCU to determine the actual status of the external sensor (such as a temperature sensor).
[0047] In LIN bus communication simulation module 4, the load bank is configured with a LIN communication circuit, TVS diode, port bus capacitor, and pull-up power supply. The host computer can communicate with the DUT's MCU through the load bank's LIN interface (simulating real vehicle LIN bus communication).
[0048] In the CAN bus communication simulation module 5, the load box is equipped with a CAN communication bus, TVS diodes, and bus capacitors. The host computer can communicate with the DUT's MCU through the CANH / CANL interface of the load box (simulating real vehicle CAN bus communication).
[0049] In the HSD high-side drive simulation module 6, the load box is equipped with components such as R38 (simulating a high-power load), LED1 (working indicator), D5 (LED lamp direction voltage protection device), and C27 (filter capacitor). The DUT outputs a high level to the load box through the HSD (BTS7008 intelligent high-side tube) to simulate the operation of the working parts of the real vehicle (such as heating wire, high and low beam lights, etc.).
[0050] In the LSD low-side drive simulation module 7, the load box is equipped with components such as R43 (simulating a high-power load), LED2 (operation indicator), D6 (LED negative voltage protection device), and C34 (filter capacitor). The DUT outputs a low level to the load box through the LSD (NSE11409 low-side transistor) to simulate the operation of actual vehicle components (such as relays). At the same time, through the Q1 transistor, the MCU on the DUT can determine the operating status of the external load.
[0051] In the H-bridge drive simulation module 8, the load box is equipped with components such as R48 / R51 (current limiting resistors), LED3 / LED4 (operation indicator lights), D7 / D8 (LED negative voltage protection devices), C37 / C38 (filter capacitors), R49 / R50 (LED shunt resistors), M (high-power analog resistor), and L2 inductor. Connecting the load to the H-bridge circuit on the DUT simulates the operation of a real vehicle motor (LED4 lights up during forward rotation, and LED3 (red light) lights up during reverse rotation).
[0052] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.
Claims
1. A vehicle-mounted domain control compatible load cell, comprising a housing (100), characterized in that, The top surface of the enclosure (100) is provided with a top cover panel (101), the bottom surface of the enclosure (100) is provided with a grounding panel (102), and the sides of the enclosure (100) are provided with a plug-in adapter panel (103), a load indicator panel (104), a communication interface panel (105), and a shielding panel (106). The plug-in adapter panel (103) and the load indicator panel (104) are connected by an adapter cable. The plug-in adapter panel (103) is provided with an IDH high-level analog input module (1), an IDL low-level analog input module (2), a sensor analog module (3), a LIN bus communication analog module (4), and a CAN bus communication analog module (5). The LIN bus communication analog module (4) and the CAN bus communication analog module (5) are both connected to the communication interface panel (105) by an adapter cable. The load indicator panel (104) is provided with an HSD high-side drive analog module (6), an LSD low-side drive analog module (7), and an H-bridge drive analog module (8).
2. The vehicle-mounted domain control compatible load cell according to claim 1, characterized in that, The IDH high-level analog input module (1) includes a SW1 switch. One end of the SW1 switch is electrically connected to the connector, and the other end of the SW1 switch is connected in series with VCC. A capacitor C1 is connected in parallel with the SW1 switch.
3. A vehicle-mounted domain control compatible load cell according to claim 1, characterized in that, The IDL low-level analog input module (2) includes a SW2 switch. One end of the SW2 switch is electrically connected to the connector, and the other end of the SW2 switch is grounded. A C4 capacitor is connected in parallel to the SW2 switch.
4. A vehicle-mounted domain control compatible load cell according to claim 1, characterized in that, The sensor simulation module (3) includes a resistor R10. One end of the resistor R10 is electrically connected to the connector, and the other end of the resistor R10 is grounded. A capacitor C7 is connected in parallel with the resistor R10.
5. A vehicle-mounted domain control compatible load cell according to claim 1, characterized in that, The LIN bus communication simulation module (4) includes a TVS2 diode, which is electrically connected to the LIN1 interface. The TVS2 diode is connected in parallel with a C12 capacitor, which is connected in parallel with an R11 resistor, and the R11 resistor is connected in series with a D1 diode.
6. A vehicle-mounted domain control compatible load cell according to claim 5, characterized in that, The LIN bus communication simulation module (4) also includes a TVS4 diode, which is electrically connected to the LIN2 interface. The TVS4 diode is connected in parallel with a C16 capacitor, the C16 capacitor is connected in parallel with a R20 resistor, and the R20 resistor is connected in series with a D4 diode.
7. A vehicle-mounted domain control compatible load cell according to claim 1, characterized in that, The CAN bus communication simulation module (5) includes two series-connected bus capacitors, one of which is connected to the CANL interface and the other is connected to the CANH interface. It also includes two series-connected TVS diodes, the first and second pins of which are connected in parallel to the two series-connected bus capacitors. The two series-connected TVS diodes have a third pin between them, which is connected to the two bus capacitors and grounded.
8. A vehicle-mounted domain control compatible load cell according to claim 1, characterized in that, The HSD high-side drive analog module (6) includes an R35 resistor, an LED1 indicator light with one end connected to the R35 resistor and the other end grounded, a C27 capacitor connected in parallel with the LED1 indicator light, a D5 diode connected in parallel with the LED1 indicator light, and an R38 resistor connected in parallel with the D5 diode.
9. A vehicle-mounted domain control compatible load cell according to claim 1, characterized in that, The LSD low-side drive analog module (7) includes a KL30 power supply, an R45 resistor connected in series with the KL30 power supply, a D6 diode connected in series with the R45 resistor, an R43 resistor connected in parallel with the D6 diode, an LED2 indicator light connected in parallel with the D6 diode, and a C34 capacitor connected in parallel with the LED2 indicator light.
10. A vehicle-mounted domain control compatible load cell according to claim 1, characterized in that, The H-bridge drive analog module (8) includes an M high-power analog resistor and an L2 inductor connected in series with the M high-power analog resistor, an LED4 indicator light, a D8 diode, a C37 capacitor, and an R50 resistor connected in parallel with the M high-power analog resistor and the L2 inductor, an R49 resistor, a C38 capacitor, a D7 diode, and an LED3 indicator light connected in parallel with the M high-power analog resistor and the L2 inductor, an R48 resistor connected in series with the LED4 indicator light, the D8 diode, the C37 capacitor, and the R50 resistor, and an R51 resistor connected in series with the R49 resistor, the C38 capacitor, the D7 diode, and the LED3 indicator light.