A miniaturized low-cost piezoelectric ceramic drive controller device

Abstract

The utility model discloses a kind of miniaturization low cost piezoelectric ceramic drive controller device, it is related to drive controller technical field, including piezoelectric ceramic drive control circuit board installed in structural member inside, and the piezoelectric ceramic drive control circuit board is connected with electric connector, piezoelectric ceramic drive control circuit board includes: power module, displacement measurement module, DSP system module and high voltage drive module;Wherein, power module is connected with displacement measurement module, DSP system module and high voltage drive module respectively, displacement measurement module, DSP system module and high voltage drive module are sequentially kept connection.The utility model is connected to piezoelectric scanning platform by drive cable, piezoelectric scanning platform is built-in optical lens, piezoelectric ceramic drive controller carries out XY direction's periodic scanning motion by controlling piezoelectric scanning platform, realizes to subpixel displacement of mirror light photon, so that infrared / visible light super-resolution reconstruction platform realizes super-resolution imaging.

Description

Technical Field

[0001] This utility model relates to the field of drive controller technology, and more specifically, to a miniaturized, low-cost piezoelectric ceramic drive controller device. Background Technology

[0002] The piezoelectric ceramic drive control system is mainly used in infrared / visible light super-resolution reconstruction platforms, which are installed on manned / unmanned aerial vehicle platforms for situational awareness and target search and tracking.

[0003] Infrared / visible light super-resolution reconstruction platforms require sub-pixel-level optical displacement to meet the requirements of super-resolution refinement reconstruction. Existing piezoelectric drive controllers output corresponding control voltages according to the control input signals to drive the piezoelectric ceramics to achieve micron-level displacement. However, they are bulky and do not meet the miniaturization requirements of infrared / visible light super-resolution reconstruction platforms. Furthermore, the output displacement requires continuous input signals for control.

[0004] Furthermore, existing piezoelectric ceramic drive controllers on the market mainly perform proportional amplification functions. To achieve fixed-value scanning, the input signal still needs to be controlled. General-purpose piezoelectric ceramic drive controllers are inherently bulky and expensive, making them unsuitable for space-constrained infrared / visible light super-resolution reconstruction systems.

[0005] No effective solutions have yet been proposed to address the problems in the relevant technologies. Utility Model Content

[0006] In view of the problems in the related technologies, this utility model proposes a miniaturized and low-cost piezoelectric ceramic drive controller device to overcome the above-mentioned technical problems existing in the existing related technologies.

[0007] Therefore, the specific technical solution adopted by this utility model is as follows:

[0008] A miniaturized, low-cost piezoelectric ceramic drive controller device includes a piezoelectric ceramic drive control circuit board installed inside a structural component, and the piezoelectric ceramic drive control circuit board is connected to an electrical connector. The piezoelectric ceramic drive control circuit board includes: a power supply module, a displacement measurement module, a DSP system module, and a high-voltage drive module.

[0009] The power supply module is connected to the displacement measurement module, the DSP system module, and the high-voltage drive module, respectively, and the displacement measurement module, the DSP system module, and the high-voltage drive module are connected sequentially.

[0010] Furthermore, the power module includes: operational amplifier power supply, 12V power supply, chip-level power supply and high-voltage power supply;

[0011] The operational amplifier power supply is used to filter the 28V input voltage and output a positive and negative 15V voltage to the displacement measurement module.

[0012] The 12V power supply is used to convert the 28V input voltage into a 12V intermediate voltage and input it to the chip-level power supply. The chip-level power supply is used to convert the 12V intermediate voltage into 1.2V, 1.8V, 3.3V and 5.4V voltages and input them to the DSP system module and the high-voltage drive module respectively.

[0013] The high-voltage power supply is used to boost the 28V input voltage to 125V and input it to the high-voltage drive module.

[0014] Furthermore, the operational amplifier power supply includes: chip U41, inductor L10, inductor L11, inductor L12, capacitor C226, and capacitor C227;

[0015] One end of inductor L11 is connected to the 28V input voltage. The other end of inductor L11 is connected to one end of capacitor C226 and pin 2 of chip U41. The other end of capacitor C226 is connected to pin 1 of chip U41 and grounded. Pin 6 of chip U41 is connected to one end of inductor L10. The other end of inductor L10 is connected to one end of capacitor C225 and outputs a positive 15V voltage. Pin 7 of chip U41 is connected to the other end of capacitor C225 and one end of capacitor C227 and grounded. Pin 8 of chip U41 is connected to one end of inductor L12. The other end of inductor L12 is connected to the other end of capacitor C227 and outputs a negative 15V signal.

[0016] Furthermore, the 12V power supply includes: chip U39, inductor L9, capacitor C216, capacitor C217, resistor R127, resistor R129, and diode V12.

[0017] One end of inductor L9 is connected to the 28V input voltage. The other end of inductor L9 is connected to one end of capacitor C217 and pins B4, C4, and B3 of chip U39, forming node VCC28_1. The other end of capacitor C217 is grounded. Pin C1 of chip U39 is connected to one end of resistor R127. Pin A3 of chip U39 is connected to one end of capacitor C216. The other end of resistor R127 is connected to the other end of capacitor C216 and pin B2 of chip U39, and is grounded. Pins F1, F2, F3, F4, G1, G2, G3, and G4 of chip U39 are all connected to one end of capacitor C220 and output a 12V intermediate voltage. Pin A2 of chip U39 is connected to one end of resistor R129. The other end of resistor R129 is connected to the other end of capacitor C220 and is grounded.

[0018] Furthermore, the chip-level power supply includes: chip U38, capacitor C318, resistor R126, resistor R128, resistor R130, resistor R131, capacitor C218, capacitor C219, capacitor C221, capacitor C222 and capacitor C224.

[0019] One end of capacitor C218 is connected to the 12V intermediate voltage and pins A4, C3, B4, C5, F4, E5, G4, and E3 of chip U38, respectively. The other end of capacitor C218 is grounded. Pin C1 of chip U38 is connected to one end of resistor R126. The other end of resistor R126 is connected to one end of capacitor C219 and grounded. The other end of capacitor C219 is connected to pins A1 and B1 of chip U38 and outputs 1.8V voltage.

[0020] Pin C7 of chip U38 is connected to one end of resistor R128. The other end of resistor R128 is connected to one end of capacitor C221 and grounded. The other end of capacitor C221 is connected to pins A7 and B7 of chip U38 and outputs a 1.2V voltage.

[0021] Pin E7 of chip U38 is connected to one end of resistor R130. The other end of resistor R130 is connected to one end of capacitor C222 and grounded. The other end of capacitor C222 is connected to pins F7 and G7 of chip U38 and outputs 3.3V voltage.

[0022] The E1 pin of chip U38 is connected to one end of resistor R131. The other end of resistor R131 is connected to one end of capacitor C224 and grounded. The other end of capacitor C224 is connected to pins F1 and G1 of chip U38 and outputs a 5.4V voltage.

[0023] Furthermore, the high-voltage power supply includes: chip U37, capacitors C179, C180, C181, C182, C183, C184, C185, C186, C187, C188, C189, C190, C191, C192, C193, C194, C195, C196, C197, C198, C199, C200, C201, C202, C203, C204, and C20. 5. Capacitors C206, C207, C208, C209, C210, C211, C212, C213, C214, C215; Resistors R111, R112, R113, R114, R115, R116, R117, R118, R119, R120, R121, R122, R123, R124; Inductors L7 and L8; Transistors Q1 and Q2; Diodes D38 and D39.

[0024] One end of capacitor C188 is connected to one end of capacitor C189, one end of capacitor C179, one end of capacitor C180, one end of capacitor C181, one end of resistor R111, one end of inductor L7, pin 20 of chip U37, and the 28V input voltage. The other end of capacitor C188 is connected to the other ends of capacitor C189, capacitor C179, capacitor C180, and capacitor C181 and grounded. The other end of resistor R111 is connected to one end of resistor R112 and pin 6 of chip U37, and the other end of resistor R112 is grounded.

[0025] Pin 4 of chip U37 is connected to one end of resistor R112 and one end of resistor R116 respectively. The other end of resistor R116 is grounded. The other end of resistor R115 is connected to the cathode of diode D38, one end of capacitors C182, C183, C184, C185, C186, C187, C190, C191, C192, one end of resistor R113, and a 48V voltage. The other end of capacitor C182 is connected to and grounded to the other ends of capacitors C183, C184, C185, C186, C187, C190, C191, and C192 respectively.

[0026] The anode of diode D38 is connected to the other end of inductor L7 and the emitter of transistor Q1. The collector of transistor Q1 is connected to pin 18 of chip U37, one end of resistor R114 and one end of resistor R117. The other end of resistor R117 is grounded. The other end of resistor R114 is connected to pin 25 of chip U37 and one end of capacitor C193. The other end of capacitor C193 is connected to pin 24 of chip U37 and grounded.

[0027] Pin 22 of chip U37 is connected to one end of capacitor C195, the other end of capacitor C195 is connected to pin 32 of chip U37, pin 19 of chip U37 is connected to one end of capacitor C197, and the other end of capacitor C197 is connected to pin 17 of chip U37.

[0028] The other end of resistor R113 is connected to one end of resistor R194 and one end of inductor L8. The other end of resistor R194 is grounded. The other end of inductor L8 is connected to the emitter of transistor Q2 and the anode of diode D39. The cathode of diode D39 is connected to one end of capacitors C198, C199, C200, C201, C204, C202, C203, C205, C212, C211, C210, C209, and resistor R1. One end of resistor R124 is connected and outputs 125V voltage. The other end of resistor R124 is connected to one end of resistor R123 and pin 9 of chip U37. The other end of resistor R123 is grounded. The other end of capacitor C198 is connected to the other ends of capacitors C199, C200, C201, C204, C202, C203, and C205 and grounded. The other end of capacitor C212 is connected to the other ends of capacitors C211, C210, and C209 and grounded.

[0029] The collector of transistor Q2 is connected to one end of resistor R122 and one end of resistor R120 respectively. The other end of resistor R122 is grounded. The other end of resistor R120 is connected to one end of capacitor C213 and pin 11 of chip U37 respectively. The other end of capacitor C213 is connected to pin 12 of chip U37 and grounded.

[0030] Pin 2 of chip U37 is connected to one end of resistor R118, pin 3 of chip U37 is connected to one end of capacitor C196, and the other end of resistor R118 is connected to the other end of capacitor C196 and grounded.

[0031] Pin 5 of chip U37 is connected to one end of resistor R119 and one end of capacitor C206 respectively. The other end of resistor R119 is connected to one end of capacitor C207, and the other end of capacitor C206 is connected to the other end of capacitor C207 and grounded.

[0032] Pin 10 of chip U37 is connected to one end of resistor R121 and capacitor C214 respectively. The other end of resistor R121 is connected to one end of capacitor C215, and the other end of capacitor C215 is connected to the other end of capacitor C214 and grounded.

[0033] Furthermore, the displacement measurement module includes: chip U4, amplifier U5, amplifier U6, amplifier U9, amplifier U10, resistors R17, R18, R19, R20, R21, R22, R23, R27, R25, R28, R30, capacitors C13, C14, C15, C16, C17, C18, C19, C24, C25, C26, C27, C28, C31, C34, C35, C36, C38, and C39;

[0034] Among them, one end of resistor R21 is connected to the SG_A signal, and the other end of resistor R21 is connected to one end of capacitor C26 and the non-inverting input terminal of amplifier U5. The other end of capacitor C26 is grounded. The inverting input terminal of amplifier U5 is connected to one end of resistor R17. The other end of resistor R17 is connected to the output terminal of amplifier U5 and one end of resistor R19. The inverting output terminal of amplifier U5 is connected to one end of capacitor C24. The other end of capacitor C24 is grounded. The non-inverting output terminal of amplifier U5 is connected to one end of capacitor C28. The other end of capacitor C28 is grounded.

[0035] The other end of resistor R19 is connected to one end of resistor R18 and the inverting input of amplifier U6. The non-inverting input of amplifier U6 is connected to one end of resistor R22 and one end of resistor R20. The other end of resistor R22 is connected to one end of capacitor C27 and grounded. The other end of capacitor C27 is connected to the other end of resistor R20. The inverting output of amplifier U6 is connected to one end of capacitor C25 and the other end of capacitor C25 is grounded. The non-inverting output of amplifier U6 is connected to one end of capacitor C31 and the other end of capacitor C31 is grounded. The output of amplifier U6 is connected to the other end of resistor R18 and one end of resistor R27.

[0036] The other end of resistor R27 is connected to one end of resistor R25 and the inverting input of amplifier U10. The non-inverting input of amplifier U10 is connected to one end of resistor R30. The other end of resistor R30 is grounded. The inverting output of amplifier U10 is connected to one end of capacitor C35. The other end of capacitor C35 is grounded. The non-inverting output of amplifier U10 is connected to one end of capacitor C39. The other end of capacitor C39 is grounded. The output of amplifier U10 is connected to the other end of resistor R25 and one end of resistor R28.

[0037] The other end of resistor R28 is connected to one end of capacitor C36 and the non-inverting input of amplifier U9, and the other end of capacitor C36 is grounded. The inverting input of amplifier U9 is connected to one end of resistor R23, and the other end of resistor R23 is connected to the output of amplifier U9 and the ACH_AD signal, respectively. The inverting output of amplifier U9 is connected to one end of capacitor C34, and the other end of capacitor C34 is grounded. The non-inverting output of amplifier U9 is connected to one end of capacitor C38, and the other end of capacitor C38 is grounded.

[0038] Pin 49 of chip U4 is connected to the ACH_AD signal. Pin 45 of chip U4 is connected to one end of capacitor C13. The other end of capacitor C13 is connected to pins 46 and 47 of chip U4 and grounded. Pin 42 of chip U4 is connected to one end of capacitor C15. Pin 44 of chip U4 is connected to one end of capacitor C14. The other end of capacitor C14 is connected to the other end of capacitor C15 and pin 43 of chip U4. Pin 39 of chip U4 is connected to one end of capacitor C16. The other end of capacitor C16 is grounded. Pin 36 of chip U4 is connected to one end of capacitor C17. The other end of capacitor C17 is grounded. Pin 23 of chip U4 is connected to one end of capacitor C18 and one end of capacitor C19. The other end of capacitor C18 is connected to the other end of capacitor C196 and grounded.

[0039] Furthermore, the DSP system module includes: chip U26B, chip U29, chip U30, chip U31, chip U32, chip U42, resistors R97, R98, R99, R100, R101, R102, R103, R104, R105, R106, R107, R108, R110, R133, R134, R135, capacitors C102, C103, C106, C114, C228, diodes D33, D34, D35, D36, D37, varistors RV1, RV2, RV3, and RV4;

[0040] Specifically, one end of resistor R97 is connected to the SCITXDA signal, and the other end of resistor R97 is connected to one end of capacitor C103 and pin 3 of chip U29. The other end of capacitor C103 is grounded. Pin 2 of chip U29 is connected to one end of resistor R99, and the other end of resistor R99 is connected to one end of capacitor C102 and the SCITXDA signal. The other end of capacitor C102 is grounded. Pin 5 of chip U29 is connected to one end of diode D33, one end of varistor RV1, and pin 2 of diode D36. Pin 8 of chip U29 is connected to one end of diode D35 and varistor RV1. One end of RV4 is connected to pin 1 of diode D37. Pin 6 of chip U29 is connected to the other end of diode D33, pin 1 of diode D36, and one end of varistor RV2. Pin 7 of chip U29 is connected to the other end of diode D35, pin 2 of diode D37, and one end of varistor RV3. The other end of varistor RV1 is connected to one end of resistor R106. The other end of resistor R106 is connected to the other end of varistor RV2. The other end of varistor RV3 is connected to one end of resistor R107. The other end of resistor R107 is connected to the other end of varistor RV4.

[0041] Pin K4 of chip U26B is connected to one end of resistor R102; pin K3 of chip U26B is connected to one end of resistor R103; the other end of resistor R102 is connected to the other end of resistor R103; pin K2 of chip U26B is connected to one end of resistor R104; pin K1 of chip U26B is connected to one end of resistor R105; the other end of resistor R104 is connected to the other end of resistor R105; pin U13 of chip U26B is connected to one end of resistor R135 and pin K42 of chip U26B. 1. Pin connections: Pin T13 of chip U26 is connected to one end of resistor R134 and pin 2 of chip U42. Pin U14 of chip U26B is connected to one end of resistor R133 and pin 3 of chip U42. The other ends of resistors R133, R134, and R135 are connected to and grounded. Pin 8 of chip U42 is connected to one end of capacitor C228. The other end of capacitor C228 is connected to pins 5, 6, and 7 of chip U42 and grounded. Pin B16 of chip U26B is connected to one end of resistor R108 and one end of resistor R110, with the other end of resistor R108 and R110 grounded. Pin A11 of chip U26B is connected to one end of resistor R100 and one end of resistor R98, with the other end of resistor R98 connected to 3.3V and the other end of resistor R100 grounded. Pin A2 of chip U26B is connected to the cathode of diode D34, and the anode of diode D34 is connected to one end of resistor R101. The other end of R101 is connected to a 3.3V voltage. Pin J1 of chip U26B is connected to pin 5 of chip U30. Pin 2 of chip U30 is connected to one end of capacitor C106. The other end of capacitor C106 is connected to pin 1 of chip U30 and is connected to a 3.3V voltage. Pin J2 of chip U26B is connected to pin 5 of chip U31. Pin 2 of chip U31 is connected to one end of capacitor C114. The other end of capacitor C114 is connected to pin 1 of chip U31 and is connected to a 3.3V voltage.

[0042] Furthermore, the high-voltage drive module includes: resistors R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, R11, R12, R13, and R14; capacitors C1, C2, C3, C4, C5, C6, C7, C8, C9, C10, C11, and C12; amplifiers U1 and U2; diodes D1, D2, D3, D4, D5, D6, D7, and D8; and chip U3.

[0043] In this configuration, one end of resistor R2 is connected to the VOUTA signal, and the other end of resistor R2 is connected to the non-inverting input of amplifier U1. The non-inverting output of amplifier U1 is connected to one end of capacitor C2, and the other end of capacitor C2 is grounded. The inverting input of amplifier U1 is connected to one end of resistor R1, and the other end of resistor R1 is connected to the output of amplifier U1 and one end of resistor R13. The inverting output of amplifier U1 is connected to one end of capacitor C1, and the other end of capacitor C1 is grounded. The other end of resistor R13 is connected to the anode of diode D4, one end of capacitor C10, the cathode of diode D5, and the non-inverting input of amplifier U2, and the other end of capacitor C10 is grounded. The cathode of diode D4 is connected to the anode of diode D5, one end of resistor R8, the inverting input of amplifier U2, and one end of resistor R3. One end of capacitor C3 is connected, and the other end of resistor R8 is grounded. The non-inverting output of amplifier U2 is connected to one end of capacitor C9 and the anode of diode D7. The other end of capacitor C9 is grounded. The cathode of diode D7 is connected to the output of amplifier U2, the anode of diode D3, and one end of resistor R9. The cathode of diode D3 is connected to one end of capacitor C4 and the inverting output of amplifier U2. The other end of resistor R9 is connected to the anode of diode D1, the cathode of diode D2, and pin 2 of chip U3. Pin 4 of chip U3 is connected to one end of resistor R11. The other end of resistor R11 is connected to one end of capacitor C7. The other end of capacitor C7 is connected to pin 5 of chip U3. Pin 21 of chip U3 is connected to one end of resistor R14. The other end of resistor R14 is grounded.

[0044] The cathode of diode D1 is connected to one end of resistor R5, the anode of diode D2, pin 1 of chip U3, one end of capacitor C5, and one end of resistor R6. The other end of resistor R6 is connected to the other end of capacitor C5, one end of resistor R7, one end of resistor R4, one end of capacitor C3, the anode of diode D6, the cathode of diode D8, one end of resistor R10, and pin 18 of chip U3. The other end of resistor R4 is connected to the other end of resistor R3. The other end of resistor R7 is connected to the HVOUT_A signal. The cathode of diode D6 is connected to one end of capacitor C6 and pin 16 of chip U3. The anode of diode D8 is connected to one end of capacitor C11 and pin 20 of chip U3. The other end of capacitor C11 is connected to one end of capacitor C8 and pin 19 of chip U3. The other end of capacitor C8 is connected to one end of resistor R12. The other end of resistor R12 is connected to pin 3 of chip U3.

[0045] The beneficial effects of this utility model are as follows:

[0046] 1. The piezoelectric ceramic actuator designed in this utility model operates at 28V and can achieve high-precision control of 5μm to 12μm. Under high and low temperature conditions (-40℃ to +60℃), the displacement error is less than 5%. It can perform positioning control as well as scanning control. The miniaturized piezoelectric ceramic drive controller can be installed inside the infrared / visible light super-resolution reconstruction platform and connected to the piezoelectric scanning platform through a drive cable. The piezoelectric scanning platform has built-in optical lenses. The piezoelectric ceramic drive controller controls the piezoelectric scanning platform to perform periodic scanning motion in the XY direction to achieve sub-pixel displacement of the incident photons, thereby enabling the infrared / visible light super-resolution reconstruction platform to achieve the function of super-resolution imaging.

[0047] 2. By designing a piezoelectric drive controller that meets the miniaturization and low cost requirements of the infrared / visible light super-resolution reconstruction platform, this device features low cost and miniaturization. It can be placed inside the miniaturized infrared / visible light super-resolution reconstruction platform to achieve open-loop and closed-loop drive control in both X and Y directions. It achieves micron-level control accuracy, a control frequency of 100Hz, high displacement control accuracy, and small creep error of the piezoelectric actuator in high and low temperature environments. It can execute determined displacement values ​​according to the command settings. Attached Figure Description

[0048] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0049] Figure 1 This is a system principle block diagram of the piezoelectric ceramic drive control circuit board in a miniaturized, low-cost piezoelectric ceramic drive controller device according to an embodiment of the present invention;

[0050] Figure 2 This is a schematic diagram of the operational amplifier power supply circuit in the power supply module of a miniaturized, low-cost piezoelectric ceramic drive controller device according to an embodiment of the present invention.

[0051] Figure 3 This is a circuit diagram of the 12V power supply in the power module of a miniaturized, low-cost piezoelectric ceramic drive controller device according to an embodiment of the present invention.

[0052] Figure 4 This is a circuit diagram of the chip-level power supply in the power module of a miniaturized, low-cost piezoelectric ceramic drive controller device according to an embodiment of the present invention.

[0053] Figure 5This is a circuit diagram of the high-voltage power supply in the power module of a miniaturized, low-cost piezoelectric ceramic drive controller device according to an embodiment of the present invention.

[0054] Figure 6 This is one of the circuit schematic diagrams of the displacement monitoring module in a miniaturized, low-cost piezoelectric ceramic drive controller device according to an embodiment of the present invention;

[0055] Figure 7 This is the second circuit schematic diagram of the displacement monitoring module in a miniaturized, low-cost piezoelectric ceramic drive controller device according to an embodiment of the present invention;

[0056] Figure 8 This is one of the circuit schematic diagrams of the DSP system module in a miniaturized, low-cost piezoelectric ceramic drive controller device according to an embodiment of the present invention;

[0057] Figure 9 This is the second circuit schematic diagram of the DSP system module in a miniaturized, low-cost piezoelectric ceramic drive controller device according to an embodiment of the present invention.

[0058] Figure 10 This is the third circuit schematic diagram of the DSP system module in a miniaturized, low-cost piezoelectric ceramic drive controller device according to an embodiment of the present invention;

[0059] Figure 11 This is a circuit diagram of the high-voltage drive module in a miniaturized, low-cost piezoelectric ceramic drive controller device according to an embodiment of the present invention. Detailed Implementation

[0060] To further illustrate the various embodiments, the present invention provides accompanying drawings, which are part of the disclosure of the present invention. These drawings are mainly used to illustrate the embodiments and can be used in conjunction with the relevant descriptions in the specification to explain the operating principles of the embodiments. With reference to these contents, those skilled in the art should be able to understand other possible implementation methods and the advantages of the present invention. The components in the figures are not drawn to scale, and similar component symbols are usually used to represent similar components.

[0061] According to an embodiment of the present invention, a miniaturized, low-cost piezoelectric ceramic drive controller device is provided.

[0062] The present invention will now be further described in conjunction with the accompanying drawings and specific embodiments, such as... Figure 1 As shown, the miniaturized low-cost piezoelectric ceramic drive controller device according to an embodiment of the present utility model includes a piezoelectric ceramic drive control circuit board installed inside a structural component, and the piezoelectric ceramic drive control circuit board is connected to an electrical connector. The piezoelectric ceramic drive control circuit board includes: a power supply module, a displacement measurement module, a DSP system module, and a high-voltage drive module.

[0063] The power supply module is connected to the displacement measurement module, the DSP system module, and the high-voltage drive module, respectively, and the displacement measurement module, the DSP system module, and the high-voltage drive module are connected sequentially.

[0064] In one embodiment, such as Figures 2-5 As shown, the power module includes: operational amplifier power supply, 12V power supply, chip-level power supply and high-voltage power supply;

[0065] The operational amplifier power supply is used to filter the 28V input voltage and output a positive and negative 15V voltage to the displacement measurement module.

[0066] The 12V power supply is used to convert the 28V input voltage into a 12V intermediate voltage and input it to the chip-level power supply. The chip-level power supply is used to convert the 12V intermediate voltage into 1.2V, 1.8V, 3.3V and 5.4V voltages and input them to the DSP system module and the high-voltage drive module respectively.

[0067] The high-voltage power supply is used to boost the 28V input voltage to 125V and input it to the high-voltage drive module.

[0068] In one embodiment, such as Figure 2 As shown, the operational amplifier power supply includes: chip U41, inductor L10, inductor L11, inductor L12, capacitor C226, and capacitor C227.

[0069] One end of inductor L11 is connected to the 28V input voltage. The other end of inductor L11 is connected to one end of capacitor C226 and pin 2 of chip U41. The other end of capacitor C226 is connected to pin 1 of chip U41 and grounded. Pin 6 of chip U41 is connected to one end of inductor L10. The other end of inductor L10 is connected to one end of capacitor C225 and outputs a positive 15V voltage. Pin 7 of chip U41 is connected to the other end of capacitor C225 and one end of capacitor C227 and grounded. Pin 8 of chip U41 is connected to one end of inductor L12. The other end of inductor L12 is connected to the other end of capacitor C227 and outputs a negative 15V signal.

[0070] In one embodiment, such as Figure 3 As shown, the 12V power supply includes: chip U39, inductor L9, capacitor C216, capacitor C217, resistor R127, resistor R129, and diode V12.

[0071] One end of inductor L9 is connected to the 28V input voltage. The other end of inductor L9 is connected to one end of capacitor C217 and pins B4, C4, and B3 of chip U39, forming node VCC28_1. The other end of capacitor C217 is grounded. Pin C1 of chip U39 is connected to one end of resistor R127. Pin A3 of chip U39 is connected to one end of capacitor C216. The other end of resistor R127 is connected to the other end of capacitor C216 and pin B2 of chip U39, and is grounded. Pins F1, F2, F3, F4, G1, G2, G3, and G4 of chip U39 are all connected to one end of capacitor C220 and output a 12V intermediate voltage. Pin A2 of chip U39 is connected to one end of resistor R129. The other end of resistor R129 is connected to the other end of capacitor C220 and is grounded.

[0072] In one embodiment, such as Figure 4 As shown, the chip-level power supply includes: chip U38, capacitor C318, resistor R126, resistor R128, resistor R130, resistor R131, capacitor C218, capacitor C219, capacitor C221, capacitor C222 and capacitor C224.

[0073] One end of capacitor C218 is connected to the 12V intermediate voltage and pins A4, C3, B4, C5, F4, E5, G4, and E3 of chip U38, respectively. The other end of capacitor C218 is grounded. Pin C1 of chip U38 is connected to one end of resistor R126. The other end of resistor R126 is connected to one end of capacitor C219 and grounded. The other end of capacitor C219 is connected to pins A1 and B1 of chip U38 and outputs 1.8V voltage.

[0074] Pin C7 of chip U38 is connected to one end of resistor R128. The other end of resistor R128 is connected to one end of capacitor C221 and grounded. The other end of capacitor C221 is connected to pins A7 and B7 of chip U38 and outputs a 1.2V voltage.

[0075] Pin E7 of chip U38 is connected to one end of resistor R130. The other end of resistor R130 is connected to one end of capacitor C222 and grounded. The other end of capacitor C222 is connected to pins F7 and G7 of chip U38 and outputs 3.3V voltage.

[0076] The E1 pin of chip U38 is connected to one end of resistor R131. The other end of resistor R131 is connected to one end of capacitor C224 and grounded. The other end of capacitor C224 is connected to pins F1 and G1 of chip U38 and outputs a 5.4V voltage.

[0077] In one embodiment, such as Figure 5As shown, the high-voltage power supply includes: chip U37, capacitors C179, C180, C181, C182, C183, C184, C185, C186, C187, C188, C189, C190, C191, C192, C193, C194, C195, C196, C197, C198, C199, C200, C201, C202, C203, C204, and C205. Capacitors C206, C207, C208, C209, C210, C211, C212, C213, C214, and C215; Resistors R111, R112, R113, R114, R115, R116, R117, R118, R119, R120, R121, R122, R123, and R124; Inductors L7 and L8; Transistors Q1 and Q2; Diodes D38 and D39.

[0078] One end of capacitor C188 is connected to one end of capacitor C189, one end of capacitor C179, one end of capacitor C180, one end of capacitor C181, one end of resistor R111, one end of inductor L7, pin 20 of chip U37, and the 28V input voltage. The other end of capacitor C188 is connected to the other ends of capacitor C189, capacitor C179, capacitor C180, and capacitor C181 and grounded. The other end of resistor R111 is connected to one end of resistor R112 and pin 6 of chip U37, and the other end of resistor R112 is grounded.

[0079] Pin 4 of chip U37 is connected to one end of resistor R112 and one end of resistor R116 respectively. The other end of resistor R116 is grounded. The other end of resistor R115 is connected to the cathode of diode D38, one end of capacitors C182, C183, C184, C185, C186, C187, C190, C191, C192, one end of resistor R113, and a 48V voltage. The other end of capacitor C182 is connected to and grounded to the other ends of capacitors C183, C184, C185, C186, C187, C190, C191, and C192 respectively.

[0080] The anode of diode D38 is connected to the other end of inductor L7 and the emitter of transistor Q1. The collector of transistor Q1 is connected to pin 18 of chip U37, one end of resistor R114 and one end of resistor R117. The other end of resistor R117 is grounded. The other end of resistor R114 is connected to pin 25 of chip U37 and one end of capacitor C193. The other end of capacitor C193 is connected to pin 24 of chip U37 and grounded.

[0081] Pin 22 of chip U37 is connected to one end of capacitor C195, the other end of capacitor C195 is connected to pin 32 of chip U37, pin 19 of chip U37 is connected to one end of capacitor C197, and the other end of capacitor C197 is connected to pin 17 of chip U37.

[0082] The other end of resistor R113 is connected to one end of resistor R194 and one end of inductor L8. The other end of resistor R194 is grounded. The other end of inductor L8 is connected to the emitter of transistor Q2 and the anode of diode D39. The cathode of diode D39 is connected to one end of capacitors C198, C199, C200, C201, C204, C202, C203, C205, C212, C211, C210, C209, and resistor R1. One end of resistor R124 is connected and outputs 125V voltage. The other end of resistor R124 is connected to one end of resistor R123 and pin 9 of chip U37. The other end of resistor R123 is grounded. The other end of capacitor C198 is connected to the other ends of capacitors C199, C200, C201, C204, C202, C203, and C205 and grounded. The other end of capacitor C212 is connected to the other ends of capacitors C211, C210, and C209 and grounded.

[0083] The collector of transistor Q2 is connected to one end of resistor R122 and one end of resistor R120 respectively. The other end of resistor R122 is grounded. The other end of resistor R120 is connected to one end of capacitor C213 and pin 11 of chip U37 respectively. The other end of capacitor C213 is connected to pin 12 of chip U37 and grounded.

[0084] Pin 2 of chip U37 is connected to one end of resistor R118, pin 3 of chip U37 is connected to one end of capacitor C196, and the other end of resistor R118 is connected to the other end of capacitor C196 and grounded.

[0085] Pin 5 of chip U37 is connected to one end of resistor R119 and one end of capacitor C206 respectively. The other end of resistor R119 is connected to one end of capacitor C207, and the other end of capacitor C206 is connected to the other end of capacitor C207 and grounded.

[0086] Pin 10 of chip U37 is connected to one end of resistor R121 and capacitor C214 respectively. The other end of resistor R121 is connected to one end of capacitor C215, and the other end of capacitor C215 is connected to the other end of capacitor C214 and grounded.

[0087] In one embodiment, such as Figures 6-7 As shown, the displacement measurement module includes: chip U4, amplifier U5, amplifier U6, amplifier U9, amplifier U10, resistors R17, R18, R19, R20, R21, R22, R23, R27, R25, R28, R30, capacitors C13, C14, C15, C16, C17, C18, C19, C24, C25, C26, C27, C28, C31, C34, C35, C36, C38, and C39;

[0088] Among them, one end of resistor R21 is connected to the SG_A signal, and the other end of resistor R21 is connected to one end of capacitor C26 and the non-inverting input terminal of amplifier U5. The other end of capacitor C26 is grounded. The inverting input terminal of amplifier U5 is connected to one end of resistor R17. The other end of resistor R17 is connected to the output terminal of amplifier U5 and one end of resistor R19. The inverting output terminal of amplifier U5 is connected to one end of capacitor C24. The other end of capacitor C24 is grounded. The non-inverting output terminal of amplifier U5 is connected to one end of capacitor C28. The other end of capacitor C28 is grounded.

[0089] The other end of resistor R19 is connected to one end of resistor R18 and the inverting input of amplifier U6. The non-inverting input of amplifier U6 is connected to one end of resistor R22 and one end of resistor R20. The other end of resistor R22 is connected to one end of capacitor C27 and grounded. The other end of capacitor C27 is connected to the other end of resistor R20. The inverting output of amplifier U6 is connected to one end of capacitor C25 and the other end of capacitor C25 is grounded. The non-inverting output of amplifier U6 is connected to one end of capacitor C31 and the other end of capacitor C31 is grounded. The output of amplifier U6 is connected to the other end of resistor R18 and one end of resistor R27.

[0090] The other end of resistor R27 is connected to one end of resistor R25 and the inverting input of amplifier U10. The non-inverting input of amplifier U10 is connected to one end of resistor R30. The other end of resistor R30 is grounded. The inverting output of amplifier U10 is connected to one end of capacitor C35. The other end of capacitor C35 is grounded. The non-inverting output of amplifier U10 is connected to one end of capacitor C39. The other end of capacitor C39 is grounded. The output of amplifier U10 is connected to the other end of resistor R25 and one end of resistor R28.

[0091] The other end of resistor R28 is connected to one end of capacitor C36 and the non-inverting input of amplifier U9, and the other end of capacitor C36 is grounded. The inverting input of amplifier U9 is connected to one end of resistor R23, and the other end of resistor R23 is connected to the output of amplifier U9 and the ACH_AD signal, respectively. The inverting output of amplifier U9 is connected to one end of capacitor C34, and the other end of capacitor C34 is grounded. The non-inverting output of amplifier U9 is connected to one end of capacitor C38, and the other end of capacitor C38 is grounded.

[0092] Pin 49 of chip U4 is connected to the ACH_AD signal. Pin 45 of chip U4 is connected to one end of capacitor C13. The other end of capacitor C13 is connected to pins 46 and 47 of chip U4 and grounded. Pin 42 of chip U4 is connected to one end of capacitor C15. Pin 44 of chip U4 is connected to one end of capacitor C14. The other end of capacitor C14 is connected to the other end of capacitor C15 and pin 43 of chip U4. Pin 39 of chip U4 is connected to one end of capacitor C16. The other end of capacitor C16 is grounded. Pin 36 of chip U4 is connected to one end of capacitor C17. The other end of capacitor C17 is grounded. Pin 23 of chip U4 is connected to one end of capacitor C18 and one end of capacitor C19. The other end of capacitor C18 is connected to the other end of capacitor C196 and grounded.

[0093] In one embodiment, such as Figures 8-10 As shown, the DSP system module includes: chip U26B, chip U29, chip U30, chip U31, chip U32, chip U42, resistors R97, R98, R99, R100, R101, R102, R103, R104, R105, R106, R107, R108, R110, R133, R134, R135, capacitors C102, C103, C106, C114, C228, diodes D33, D34, D35, D36, D37, varistors RV1, RV2, RV3, and RV4;

[0094] Specifically, one end of resistor R97 is connected to the SCITXDA signal, and the other end of resistor R97 is connected to one end of capacitor C103 and pin 3 of chip U29. The other end of capacitor C103 is grounded. Pin 2 of chip U29 is connected to one end of resistor R99, and the other end of resistor R99 is connected to one end of capacitor C102 and the SCITXDA signal. The other end of capacitor C102 is grounded. Pin 5 of chip U29 is connected to one end of diode D33, one end of varistor RV1, and pin 2 of diode D36. Pin 8 of chip U29 is connected to one end of diode D35 and varistor RV1. One end of RV4 is connected to pin 1 of diode D37. Pin 6 of chip U29 is connected to the other end of diode D33, pin 1 of diode D36, and one end of varistor RV2. Pin 7 of chip U29 is connected to the other end of diode D35, pin 2 of diode D37, and one end of varistor RV3. The other end of varistor RV1 is connected to one end of resistor R106. The other end of resistor R106 is connected to the other end of varistor RV2. The other end of varistor RV3 is connected to one end of resistor R107. The other end of resistor R107 is connected to the other end of varistor RV4.

[0095] Pin K4 of chip U26B is connected to one end of resistor R102; pin K3 of chip U26B is connected to one end of resistor R103; the other end of resistor R102 is connected to the other end of resistor R103; pin K2 of chip U26B is connected to one end of resistor R104; pin K1 of chip U26B is connected to one end of resistor R105; the other end of resistor R104 is connected to the other end of resistor R105; pin U13 of chip U26B is connected to one end of resistor R135 and pin K42 of chip U26B. 1. Pin connections: Pin T13 of chip U26 is connected to one end of resistor R134 and pin 2 of chip U42. Pin U14 of chip U26B is connected to one end of resistor R133 and pin 3 of chip U42. The other ends of resistors R133, R134, and R135 are connected to and grounded. Pin 8 of chip U42 is connected to one end of capacitor C228. The other end of capacitor C228 is connected to pins 5, 6, and 7 of chip U42 and grounded. Pin B16 of chip U26B is connected to one end of resistor R108 and one end of resistor R110, with the other end of resistor R108 and R110 grounded. Pin A11 of chip U26B is connected to one end of resistor R100 and one end of resistor R98, with the other end of resistor R98 connected to 3.3V and the other end of resistor R100 grounded. Pin A2 of chip U26B is connected to the cathode of diode D34, and the anode of diode D34 is connected to one end of resistor R101. The other end of R101 is connected to a 3.3V voltage. Pin J1 of chip U26B is connected to pin 5 of chip U30. Pin 2 of chip U30 is connected to one end of capacitor C106. The other end of capacitor C106 is connected to pin 1 of chip U30 and is connected to a 3.3V voltage. Pin J2 of chip U26B is connected to pin 5 of chip U31. Pin 2 of chip U31 is connected to one end of capacitor C114. The other end of capacitor C114 is connected to pin 1 of chip U31 and is connected to a 3.3V voltage.

[0096] In one embodiment, such as Figure 11 As shown, the high-voltage drive module includes: resistors R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, R11, R12, R13, and R14; capacitors C1, C2, C3, C4, C5, C6, C7, C8, C9, C10, C11, and C12; amplifiers U1 and U2; diodes D1, D2, D3, D4, D5, D6, D7, and D8; and chip U3.

[0097] In this configuration, one end of resistor R2 is connected to the VOUTA signal, and the other end of resistor R2 is connected to the non-inverting input of amplifier U1. The non-inverting output of amplifier U1 is connected to one end of capacitor C2, and the other end of capacitor C2 is grounded. The inverting input of amplifier U1 is connected to one end of resistor R1, and the other end of resistor R1 is connected to the output of amplifier U1 and one end of resistor R13. The inverting output of amplifier U1 is connected to one end of capacitor C1, and the other end of capacitor C1 is grounded. The other end of resistor R13 is connected to the anode of diode D4, one end of capacitor C10, the cathode of diode D5, and the non-inverting input of amplifier U2, and the other end of capacitor C10 is grounded. The cathode of diode D4 is connected to the anode of diode D5, one end of resistor R8, the inverting input of amplifier U2, and one end of resistor R3. One end of capacitor C3 is connected, and the other end of resistor R8 is grounded. The non-inverting output of amplifier U2 is connected to one end of capacitor C9 and the anode of diode D7. The other end of capacitor C9 is grounded. The cathode of diode D7 is connected to the output of amplifier U2, the anode of diode D3, and one end of resistor R9. The cathode of diode D3 is connected to one end of capacitor C4 and the inverting output of amplifier U2. The other end of resistor R9 is connected to the anode of diode D1, the cathode of diode D2, and pin 2 of chip U3. Pin 4 of chip U3 is connected to one end of resistor R11. The other end of resistor R11 is connected to one end of capacitor C7. The other end of capacitor C7 is connected to pin 5 of chip U3. Pin 21 of chip U3 is connected to one end of resistor R14. The other end of resistor R14 is grounded.

[0098] The cathode of diode D1 is connected to one end of resistor R5, the anode of diode D2, pin 1 of chip U3, one end of capacitor C5, and one end of resistor R6. The other end of resistor R6 is connected to the other end of capacitor C5, one end of resistor R7, one end of resistor R4, one end of capacitor C3, the anode of diode D6, the cathode of diode D8, one end of resistor R10, and pin 18 of chip U3. The other end of resistor R4 is connected to the other end of resistor R3. The other end of resistor R7 is connected to the HVOUT_A signal. The cathode of diode D6 is connected to one end of capacitor C6 and pin 16 of chip U3. The anode of diode D8 is connected to one end of capacitor C11 and pin 20 of chip U3. The other end of capacitor C11 is connected to one end of capacitor C8 and pin 19 of chip U3. The other end of capacitor C8 is connected to one end of resistor R12. The other end of resistor R12 is connected to pin 3 of chip U3.

[0099] To facilitate understanding of the above-mentioned technical solutions of this utility model, the working principle or operation method of this utility model in actual process will be described in detail below.

[0100] In practical applications, the hardware of this invention consists of structural components, electrical connectors, and a piezoelectric ceramic drive control circuit board. The piezoelectric ceramic drive control circuit board is installed inside the structural components, and four mounting holes on the outside allow the piezoelectric ceramic drive controller to be fixed to an infrared / visible light super-resolution platform. The electrical connectors provide power supply, communication, and synchronization signal transmission. The piezoelectric ceramic drive control circuit board consists of four sub-modules: a DSP system module, a power supply module, a displacement measurement module, and a high-voltage drive module. These four modules are placed on the same circuit board, as shown in the schematic diagram below. Figure 1 As shown.

[0101] The power module is responsible for stepping down or boosting the input +28V to a suitable voltage to power various modules; the 28V input voltage passes through device U41 for power filtering, outputting ±15V voltage to power the high-precision operational amplifier, such as... Figure 2 As shown.

[0102] The U39 device converts 28V to a 12V intermediate voltage, and the U38 device further converts the 12V voltage to 1.2V, 1.8V, 3.3V, and 5.4V to power the DSP chip, level conversion chip, 422 driver chip, and high-precision operational amplifier. The U39 design is as follows: Figure 3 As shown, the U38 design is as follows Figure 4 As shown.

[0103] The U37 device provides a high-voltage drive voltage for the operational amplifier by boosting the 28V to 125V. Its structure and operating principle are as follows: Figure 5 As shown.

[0104] The displacement sensor converts the displacement of the piezoelectric ceramic into a voltage input to the displacement measurement module. The displacement measurement module filters the input signal using multiple high-precision operational amplifiers (U5, U6, U9, U10), amplifies it by 100 times, and then inputs it to the AD sampling chip U4. The module is used to measure the displacement along both the X and Y axes. Figure 6-7 As shown.

[0105] The DSP system module uses a TMS320F28377D as the DSP controller (device U26), responsible for receiving external synchronization signals, RS422 communication, reading, analyzing, and calculating displacement measurement signals, and outputting digital control quantities based on the synchronization signals and control mode. Device U26 transmits and receives RS422 communication data through device U29, selecting the motion mode and motion stroke according to the communication protocol. The digital sampled values ​​from the AD chip U4 are read via GPIO, converted, and calculated to obtain the displacement in the X and Y directions. Based on the motion mode, motion stroke, and displacement feedback, the digital control quantity is calculated and output to the DA chip U32. Device U32 converts the digital quantity to an analog quantity and outputs it to the high-voltage drive module.

[0106] The high-voltage drive module outputs the control voltage to the piezoelectric ceramic actuator after proportionally amplifying the analog control signal from the DSP system module to 125V. The core component of the high-voltage module is U3, which requires four control signals, thus necessitating four identical high-voltage drive operational amplifiers. The analog control signal is first isolated and filtered by high-precision operational amplifiers U1 and U2 before entering U4. The schematic diagram is as follows. Figure 11 As shown.

[0107] This invention communicates with external devices via an electrical connector. The circuit board is installed in a trapezoidal metal structure. The assembly method can be changed so that the piezoelectric ceramic drive control circuit can be directly fixed on the infrared / visible light super-resolution reconstruction platform, and the rectangular metal structure can be removed. Only the normal connection of the input and output cables on the circuit board needs to be ensured.

[0108] In summary, with the help of the above-mentioned technical solution of this utility model, the piezoelectric ceramic driver designed by this utility model can operate at 28V and achieve high-precision control of 5μm to 12μm. Under high and low temperature conditions (-40℃ to +60℃), the control displacement error is less than 5%. It can perform positioning control as well as scanning control. The miniaturized piezoelectric ceramic drive controller can be installed inside the infrared / visible light super-resolution reconstruction platform and connected to the piezoelectric scanning platform through a drive cable. The piezoelectric scanning platform has built-in optical lenses. The piezoelectric ceramic drive controller controls the piezoelectric scanning platform to perform periodic scanning motion in the XY direction to achieve sub-pixel displacement of the incident photons, thereby enabling the infrared / visible light super-resolution reconstruction platform to achieve the function of super-resolution imaging. By designing a piezoelectric drive controller that meets the miniaturization and low-cost requirements of infrared / visible light super-resolution reconstruction platforms, this device features low cost and miniaturization. It can be placed inside the miniaturized infrared / visible light super-resolution reconstruction platform to achieve open-loop and closed-loop drive control in both X and Y directions. It achieves micron-level control accuracy, a control frequency of 100Hz, high displacement control accuracy, and small creep error of the piezoelectric actuator in high and low temperature environments. It can execute determined displacement values ​​according to the command settings.

[0109] In this utility model, unless otherwise explicitly specified and limited, the terms "installation", "setting", "connection", "fixing", "screw connection", etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components or the interaction between two components. Unless otherwise explicitly limited, those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0110] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A miniaturized, low-cost piezoelectric ceramic drive controller device, comprising a piezoelectric ceramic drive control circuit board mounted inside a structural component, wherein the piezoelectric ceramic drive control circuit board is connected to an electrical connector, characterized in that, The piezoelectric ceramic drive control circuit board includes: a power supply module, a displacement measurement module, a DSP system module, and a high-voltage drive module; The power supply module is connected to the displacement measurement module, the DSP system module, and the high-voltage drive module, respectively, and the displacement measurement module, the DSP system module, and the high-voltage drive module are connected sequentially.

2. The miniaturized, low-cost piezoelectric ceramic drive controller device according to claim 1, characterized in that, The power module includes: operational amplifier power supply, 12V power supply, chip-level power supply and high-voltage power supply; The operational amplifier power supply is used to filter the 28V input voltage and output a positive and negative 15V voltage to the displacement measurement module. The 12V power supply is used to convert the 28V input voltage into a 12V intermediate voltage and input it to the chip-level power supply. The chip-level power supply is used to convert the 12V intermediate voltage into 1.2V, 1.8V, 3.3V and 5.4V voltages and input them to the DSP system module and the high-voltage drive module, respectively. The high-voltage power supply is used to boost the 28V input voltage to 125V and input it to the high-voltage drive module.

3. The miniaturized, low-cost piezoelectric ceramic drive controller device according to claim 2, characterized in that, The operational amplifier power supply includes: chip U41, inductor L10, inductor L11, inductor L12, capacitor C226, and capacitor C227; In this configuration, one end of inductor L11 is connected to a 28V input voltage, and the other end of inductor L11 is connected to one end of capacitor C226 and pin 2 of chip U41. The other end of capacitor C226 is connected to pin 1 of chip U41 and grounded. Pin 6 of chip U41 is connected to one end of inductor L10, and the other end of inductor L10 is connected to one end of capacitor C225 and outputs a positive 15V voltage. Pin 7 of chip U41 is connected to the other end of capacitor C225 and one end of capacitor C227 and grounded. Pin 8 of chip U41 is connected to one end of inductor L12, and the other end of inductor L12 is connected to the other end of capacitor C227 and outputs a negative 15V signal.

4. The miniaturized, low-cost piezoelectric ceramic drive controller device according to claim 2, characterized in that, The 12V power supply includes: chip U39, inductor L9, capacitor C216, capacitor C217, resistor R127, resistor R129, and diode V12; In this configuration, one end of inductor L9 is connected to a 28V input voltage. The other end of inductor L9 is connected to one end of capacitor C217 and pins B4, C4, and B3 of chip U39, forming node VCC28_1. The other end of capacitor C217 is grounded. Pin C1 of chip U39 is connected to one end of resistor R127. Pin A3 of chip U39 is connected to one end of capacitor C216. The other end of resistor R127 is connected to the other end of capacitor C216 and pin B2 of chip U39, and is grounded. Pins F1, F2, F3, F4, G1, G2, G3, and G4 of chip U39 are all connected to one end of capacitor C220 and output a 12V intermediate voltage. Pin A2 of chip U39 is connected to one end of resistor R129. The other end of resistor R129 is connected to the other end of capacitor C220 and is grounded.

5. The miniaturized, low-cost piezoelectric ceramic drive controller device according to claim 2, characterized in that, The chip-level power supply includes: chip U38, capacitor C318, resistor R126, resistor R128, resistor R130, resistor R131, capacitor C218, capacitor C219, capacitor C221, capacitor C222 and capacitor C224. Specifically, one end of capacitor C218 is connected to the 12V intermediate voltage and pins A4, C3, B4, C5, F4, E5, G4, and E3 of chip U38, and the other end of capacitor C218 is grounded. Pin C1 of chip U38 is connected to one end of resistor R126, and the other end of resistor R126 is connected to one end of capacitor C219 and grounded. The other end of capacitor C219 is connected to pins A1 and B1 of chip U38 and outputs a 1.8V voltage. The C7 pin of the chip U38 is connected to one end of the resistor R128, the other end of the resistor R128 is connected to one end of the capacitor C221 and grounded, and the other end of the capacitor C221 is connected to the A7 and B7 pins of the chip U38 respectively and outputs a 1.2V voltage. The E7 pin of the chip U38 is connected to one end of the resistor R130, the other end of the resistor R130 is connected to one end of the capacitor C222 and grounded, and the other end of the capacitor C222 is connected to the F7 and G7 pins of the chip U38 respectively and outputs a 3.3V voltage. The E1 pin of the chip U38 is connected to one end of the resistor R131, the other end of the resistor R131 is connected to one end of the capacitor C224 and grounded, and the other end of the capacitor C224 is connected to the F1 and G1 pins of the chip U38 respectively and outputs a 5.4V voltage.

6. The miniaturized, low-cost piezoelectric ceramic drive controller device according to claim 2, characterized in that, The high-voltage power supply includes: chip U37, capacitors C179, C180, C181, C182, C183, C184, C185, C186, C187, C188, C189, C190, C191, C192, C193, C194, C195, C196, C197, C198, C199, C200, C201, C202, C203, C204, and C205. Capacitors C206, C207, C208, C209, C210, C211, C212, C213, C214, and C215; Resistors R111, R112, R113, R114, R115, R116, R117, R118, R119, R120, R121, R122, R123, and R124; Inductors L7 and L8; Transistors Q1 and Q2; Diodes D38 and D39. Specifically, one end of capacitor C188 is connected to one end of capacitor C189, one end of capacitor C179, one end of capacitor C180, one end of capacitor C181, one end of resistor R111, one end of inductor L7, pin 20 of chip U37, and the 28V input voltage. The other end of capacitor C188 is connected to the other ends of capacitors C189, C179, C180, and C181 and grounded. The other end of resistor R111 is connected to one end of resistor R112 and pin 6 of chip U37, and the other end of resistor R112 is grounded. Pin 4 of chip U37 is connected to one end of resistor R112 and one end of resistor R116, respectively. The other end of resistor R116 is grounded. The other end of resistor R115 is connected to the cathode of diode D38, one end of capacitor C182, one end of capacitor C183, one end of capacitor C184, one end of capacitor C185, one end of capacitor C186, one end of capacitor C187, one end of capacitor C190, one end of capacitor C191, one end of capacitor C192, one end of resistor R113, and a 48V voltage. The other end of capacitor C182 is connected to and grounded to the other ends of capacitors C183, C184, C185, C186, C187, C190, C191, and C192, respectively. The anode of diode D38 is connected to the other end of inductor L7 and the emitter of transistor Q1. The collector of transistor Q1 is connected to pin 18 of chip U37, one end of resistor R114 and one end of resistor R117. The other end of resistor R117 is grounded. The other end of resistor R114 is connected to pin 25 of chip U37 and one end of capacitor C193. The other end of capacitor C193 is connected to pin 24 of chip U37 and grounded. Pin 22 of chip U37 is connected to one end of capacitor C195, the other end of capacitor C195 is connected to pin 32 of chip U37, pin 19 of chip U37 is connected to one end of capacitor C197, and the other end of capacitor C197 is connected to pin 17 of chip U37. The other end of resistor R113 is connected to one end of resistor R194 and one end of inductor L8. The other end of resistor R194 is grounded. The other end of inductor L8 is connected to the emitter of transistor Q2 and the anode of diode D39. The cathode of diode D39 is connected to one end of capacitor C198, one end of capacitor C199, one end of capacitor C200, one end of capacitor C201, one end of capacitor C204, one end of capacitor C202, one end of capacitor C203, one end of capacitor C205, one end of capacitor C212, one end of capacitor C211, one end of capacitor C210, and one end of capacitor C209. One end of resistor R124 is connected and outputs a 125V voltage. The other end of resistor R124 is connected to one end of resistor R123 and pin 9 of chip U37. The other end of resistor R123 is grounded. The other end of capacitor C198 is connected to the other ends of capacitors C199, C200, C201, C204, C202, C203, and C205 and grounded. The other end of capacitor C212 is connected to the other ends of capacitors C211, C210, and C209 and grounded. The collector of transistor Q2 is connected to one end of resistor R122 and one end of resistor R120, respectively. The other end of resistor R122 is grounded. The other end of resistor R120 is connected to one end of capacitor C213 and pin 11 of chip U37, respectively. The other end of capacitor C213 is connected to pin 12 of chip U37 and grounded. The second pin of the chip U37 is connected to one end of the resistor R118, the third pin of the chip U37 is connected to one end of the capacitor C196, and the other end of the resistor R118 is connected to the other end of the capacitor C196 and grounded. Pin 5 of chip U37 is connected to one end of resistor R119 and one end of capacitor C206 respectively. The other end of resistor R119 is connected to one end of capacitor C207. The other end of capacitor C206 is connected to the other end of capacitor C207 and grounded. Pin 10 of chip U37 is connected to one end of resistor R121 and capacitor C214 respectively. The other end of resistor R121 is connected to one end of capacitor C215. The other end of capacitor C215 is connected to the other end of capacitor C214 and grounded.

7. The miniaturized, low-cost piezoelectric ceramic drive controller device according to claim 1, characterized in that, The displacement measurement module includes: chip U4, amplifier U5, amplifier U6, amplifier U9, amplifier U10, resistor R17, resistor R18, resistor R19, resistor R20, resistor R21, resistor R22, resistor R23, resistor R27, resistor R25, resistor R28, resistor R30, capacitor C13, capacitor C14, capacitor C15, capacitor C16, capacitor C17, capacitor C18, capacitor C19, capacitor C24, capacitor C25, capacitor C26, capacitor C27, capacitor C28, capacitor C31, capacitor C34, capacitor C35, capacitor C36, capacitor C38, and capacitor C39; Wherein, one end of resistor R21 is connected to the SG_A signal, the other end of resistor R21 is connected to one section of capacitor C26 and the non-inverting input of amplifier U5, the other end of capacitor C26 is grounded, the inverting input of amplifier U5 is connected to one end of resistor R17, the other end of resistor R17 is connected to the output of amplifier U5 and one end of resistor R19, the inverting output of amplifier U5 is connected to one section of capacitor C24, the other end of capacitor C24 is grounded, the non-inverting output of amplifier U5 is connected to one end of capacitor C28, the other end of capacitor C28 is grounded; The other end of resistor R19 is connected to one end of resistor R18 and the inverting input of amplifier U6. The non-inverting input of amplifier U6 is connected to one end of resistor R22 and one end of resistor R20. The other end of resistor R22 is connected to one end of capacitor C27 and grounded. The other end of capacitor C27 is connected to the other end of resistor R20. The inverting output of amplifier U6 is connected to one end of capacitor C25 and the other end of capacitor C25 is grounded. The non-inverting output of amplifier U6 is connected to one end of capacitor C31 and the other end of capacitor C31 is grounded. The output of amplifier U6 is connected to the other end of resistor R18 and one end of resistor R27. The other end of resistor R27 is connected to one end of resistor R25 and the inverting input of amplifier U10. The non-inverting input of amplifier U10 is connected to one end of resistor R30, and the other end of resistor R30 is grounded. The inverting output of amplifier U10 is connected to one end of capacitor C35, and the other end of capacitor C35 is grounded. The non-inverting output of amplifier U10 is connected to one end of capacitor C39, and the other end of capacitor C39 is grounded. The output of amplifier U10 is connected to the other end of resistor R25 and one end of resistor R28. The other end of resistor R28 is connected to one end of capacitor C36 and the non-inverting input of amplifier U9, respectively. The other end of capacitor C36 is grounded. The inverting input of amplifier U9 is connected to one end of resistor R23. The other end of resistor R23 is connected to the output of amplifier U9 and the ACH_AD signal, respectively. The inverting output of amplifier U9 is connected to one end of capacitor C34, and the other end of capacitor C34 is grounded. The non-inverting output of amplifier U9 is connected to one end of capacitor C38, and the other end of capacitor C38 is grounded. Pin 49 of chip U4 is connected to the ACH_AD signal. Pin 45 of chip U4 is connected to one end of capacitor C13. The other end of capacitor C13 is connected to pins 46 and 47 of chip U4 and grounded. Pin 42 of chip U4 is connected to one end of capacitor C15. Pin 44 of chip U4 is connected to one end of capacitor C14. The other end of capacitor C14 is connected to the other end of capacitor C15 and pin 43 of chip U4. Pin 39 of chip U4 is connected to one end of capacitor C16. The other end of capacitor C16 is grounded. Pin 36 of chip U4 is connected to one end of capacitor C17. The other end of capacitor C17 is grounded. Pin 23 of chip U4 is connected to one end of capacitor C18 and one end of capacitor C19. The other end of capacitor C18 is connected to the other end of capacitor C196 and grounded.

8. The miniaturized, low-cost piezoelectric ceramic drive controller device according to claim 1, characterized in that, The DSP system module includes: chip U26B, chip U29, chip U30, chip U31, chip U32, chip U42, resistors R97, R98, R99, R100, R101, R102, R103, R104, R105, R106, R107, R108, R110, R133, R134, R135, capacitors C102, C103, C106, C114, C228, diodes D33, D34, D35, D36, D37, varistor RV1, RV2, RV3, and RV4; Specifically, one end of resistor R97 is connected to the SCITXDA signal, and the other end of resistor R97 is connected to one end of capacitor C103 and pin 3 of chip U29. The other end of capacitor C103 is grounded. Pin 2 of chip U29 is connected to one end of resistor R99, and the other end of resistor R99 is connected to one end of capacitor C102 and the SCITXDA signal. The other end of capacitor C102 is grounded. Pin 5 of chip U29 is connected to one end of diode D33, one end of varistor RV1, and pin 2 of diode D36. Pin 8 of chip U29 is connected to one end of diode D35 and the varistor... One end of RV4 is connected to pin 1 of diode D37. Pin 6 of chip U29 is connected to the other end of diode D33, pin 1 of diode D36, and one end of varistor RV2. Pin 7 of chip U29 is connected to the other end of diode D35, pin 2 of diode D37, and one end of varistor RV3. The other end of varistor RV1 is connected to one end of resistor R106. The other end of resistor R106 is connected to the other end of varistor RV2. The other end of varistor RV3 is connected to one end of resistor R107. The other end of resistor R107 is connected to the other end of varistor RV4. Pin K4 of chip U26B is connected to one end of resistor R102; pin K3 of chip U26B is connected to one end of resistor R103; the other end of resistor R102 is connected to the other end of resistor R103; pin K2 of chip U26B is connected to one end of resistor R104; pin K1 of chip U26B is connected to one end of resistor R105; the other end of resistor R104 is connected to the other end of resistor R105; pin U13 of chip U26B is connected to one end of resistor R135 and the other end of chip U26B. Pin 1 of chip U22 is connected to the following: pin T13 of chip U26 is connected to one end of resistor R134 and pin 2 of chip U42; pin U14 of chip U26B is connected to one end of resistor R133 and pin 3 of chip U42; the other ends of resistors R133, R134, and R135 are connected to and grounded; pin 8 of chip U42 is connected to one end of capacitor C228; the other end of capacitor C228 is connected to pins 5, 6, and 7 of chip U42 and grounded. Pin B16 of chip U26B is connected to one end of resistor R108 and one end of resistor R110, respectively. The other end of resistor R108 and the other end of resistor R110 are grounded. Pin A11 of chip U26B is connected to one end of resistor R100 and one end of resistor R98, respectively. The other end of resistor R98 is connected to a 3.3V voltage, and the other end of resistor R100 is grounded. Pin A2 of chip U26B is connected to the cathode of diode D34, and the anode of diode D34 is connected to one end of resistor R101. The other end of resistor R101 is connected to a 3.3V voltage. Pin J1 of chip U26B is connected to pin 5 of chip U30. Pin 2 of chip U30 is connected to one end of capacitor C106. The other end of capacitor C106 and pin 1 of chip U30 are connected to a 3.3V voltage. Pin J2 of chip U26B is connected to pin 5 of chip U31. Pin 2 of chip U31 is connected to one end of capacitor C114. The other end of capacitor C114 and pin 1 of chip U31 are connected to a 3.3V voltage.

9. The miniaturized, low-cost piezoelectric ceramic drive controller device according to claim 1, characterized in that, The high-voltage drive module includes: resistors R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, R11, R12, R13, and R14; capacitors C1, C2, C3, C4, C5, C6, C7, C8, C9, C10, C11, and C12; amplifiers U1 and U2; diodes D1, D2, D3, D4, D5, D6, D7, and D8; and chip U3. In this configuration, one end of resistor R2 is connected to the VOUTA signal, and the other end of resistor R2 is connected to the non-inverting input of amplifier U1. The non-inverting output of amplifier U1 is connected to one end of capacitor C2, and the other end of capacitor C2 is grounded. The inverting input of amplifier U1 is connected to one end of resistor R1, and the other end of resistor R1 is connected to the output of amplifier U1 and one end of resistor R13. The inverting output of amplifier U1 is connected to one end of capacitor C1, and the other end of capacitor C1 is grounded. The other end of resistor R13 is connected to the anode of diode D4, one end of capacitor C10, the cathode of diode D5, and the non-inverting input of amplifier U2, and the other end of capacitor C10 is grounded. The cathode of diode D4 is connected to the anode of diode D5, one end of resistor R8, the inverting input of amplifier U2, one end of resistor R3, and the... One end of capacitor C3 is connected, and the other end of resistor R8 is grounded. The non-inverting output of amplifier U2 is connected to one end of capacitor C9 and the anode of diode D7. The other end of capacitor C9 is grounded. The cathode of diode D7 is connected to the output of amplifier U2, the anode of diode D3, and one end of resistor R9. The cathode of diode D3 is connected to one end of capacitor C4 and the inverting output of amplifier U2. The other end of resistor R9 is connected to the anode of diode D1, the cathode of diode D2, and pin 2 of chip U3. Pin 4 of chip U3 is connected to one end of resistor R11. The other end of resistor R11 is connected to one end of capacitor C7. The other end of capacitor C7 is connected to pin 5 of chip U3. Pin 21 of chip U3 is connected to one end of resistor R14. The other end of resistor R14 is grounded. The cathode of diode D1 is connected to one end of resistor R5, the anode of diode D2, pin 1 of chip U3, one end of capacitor C5, and one end of resistor R6. The other end of resistor R6 is connected to the other end of capacitor C5, one end of resistor R7, one end of resistor R4, one end of capacitor C3, the anode of diode D6, the cathode of diode D8, one end of resistor R10, and pin 18 of chip U3. The other end of resistor R4 is connected to the other end of resistor R3. The other end of resistor R7 is connected to the HVOUT_A signal. The cathode of diode D6 is connected to one end of capacitor C6 and pin 16 of chip U3. The anode of diode D8 is connected to one end of capacitor C11 and pin 20 of chip U3. The other end of capacitor C11 is connected to one end of capacitor C8 and pin 19 of chip U3. The other end of capacitor C8 is connected to one end of resistor R12. The other end of resistor R12 is connected to pin 3 of chip U3.

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