SMT patch reflow soldering device

Abstract

The utility model relates to SMT patch welding technical field, concretely is a kind of SMT patch reflow soldering device, including shell assembly, the top side of shell assembly is provided with air suction pump, improved reflow soldering device, by the cooperation of air suction pump, refrigeration box main body and air suction cover, make SMT patch reflow soldering device during use, realize the heat air generated in the inside of reflow soldering box main body and carry out quick refrigeration, the air after refrigeration is retransported to reflow soldering box main body by air pump, SMT patch after welding is cooled in time, avoid the case that SMT patch temperature is too high and causes scalding to staff hand, to make the health of staff be guaranteed, utilize the cooperation of purification box, filter screen and lacquer pump, make SMT patch reflow soldering device during use, realize the harmful gas filtration treatment in the heat air generated in the inside of reflow soldering box main body, to make the air that exhausts satisfy environmental protection emission requirement.

Description

Technical Field

[0001] This utility model relates to the field of SMT surface mount technology, specifically to an SMT surface mount reflow soldering device. Background Technology

[0002] SMT (Surface Mount Technology) is an abbreviation for a series of processes performed on a PCB (Printed Circuit Board). PCB stands for Printed Circuit Board, and SMT is Surface Mount Technology, the most popular technology and process in the electronics assembly industry. The SMT production process includes three steps: solder paste printing, placement, and reflow soldering. Therefore, to form a complete SMT production line, it is necessary to include equipment that performs the above processes: a printer, a placement machine, and a reflow oven. Reflow soldering equipment is highly efficient, multifunctional, and intelligent, with short setup time and high production efficiency, and is therefore widely used.

[0003] An existing patent (publication number: CN213694346U) discloses an SMT dual-surface hybrid reflow soldering device for mobile phones, including a nitrogen cylinder and a nitrogen cylinder valve. The nitrogen cylinder is equipped with a nitrogen valve at the bottom, and the nitrogen valve is connected to a nitrogen heating chamber through a nitrogen pipe. A soldering chamber is installed at the bottom of the nitrogen heating chamber, and a nitrogen heating resistance wire is installed inside the nitrogen heating chamber. The nitrogen heating resistance wire heats the nitrogen into a high-temperature gas. Solder paste is pre-applied to both sides of the SMT dual-surface, and the SMT surface mount is precisely installed on the surface mount slot. The soldering chamber door is opened, and the soldering rack is placed in the soldering chamber through the soldering rack handle. The soldering chamber adopts an insulated structure to prevent burns during operation. The soldering chamber door is closed, and high-temperature nitrogen gas is sprayed onto the SMT surface mount circuit board with the components already mounted. This device adopts a dual nitrogen injection valve design, with nitrogen injection valves installed at both the top and bottom of the SMT surface mount. The circuits at both ends of the SMT surface mount are soldered simultaneously in one soldering operation, eliminating the need for secondary soldering, thus improving soldering efficiency and soldering quality.

[0004] In the process of developing this utility model, the inventors discovered the following problems with the existing technology: 1. Existing SMT reflow soldering equipment lacks a cooling mechanism. The temperature of the SMT components after reflow soldering is too high, which can easily cause burns to the hands of workers when they handle them, thus harming their health; 2. A large amount of hot air is generated during the SMT reflow soldering process. This hot air contains a large amount of harmful gases. Existing SMT reflow soldering equipment directly emits these harmful gases without purifying them, resulting in pollution of the work area and failing to meet environmental emission requirements. Utility Model Content

[0005] The purpose of this invention is to provide an SMT reflow soldering device to solve the problems mentioned in the background art, namely, the lack of a cooling mechanism in existing SMT reflow soldering devices, the excessively high temperature of the SMT components after reflow soldering, which can easily cause burns to the hands of workers and thus harm their health, and the inability of existing SMT reflow soldering devices to purify the harmful gases in the air during this heat, resulting in pollution of the work area and failure to meet environmental emission requirements.

[0006] To achieve the above objectives, this utility model provides the following technical solution: an SMT surface mount reflow soldering device, comprising a housing assembly, an air suction pump disposed on one side of the top of the housing assembly, two positioning seats disposed on the side of the top of the housing assembly away from the air suction pump, a main pipe disposed between the two positioning seats, two branch pipes disposed at the bottom of the main pipe, a diversion pipe disposed at the bottom of the two branch pipes, a plurality of nozzles disposed on one side of each of the two diversion pipes, an air suction hood disposed at the bottom of the interior of the housing assembly, a purification chamber disposed in the middle of the bottom of the housing assembly, filters disposed at both ends of the interior of the purification chamber, a cooling chamber body disposed on one side of the housing assembly, and the cooling chamber body and the purification chamber being connected by a connecting pipe.

[0007] More preferably, the housing assembly includes a base, with support legs at each of the four corners of the base's bottom end, a reflow soldering box body at the center of the top of the base, and an air pump on one side of the top of the base.

[0008] More preferably, the air pump and the purification box are connected to the main pipe via a connecting pipe.

[0009] More preferably, two positioning rings are respectively provided on the two inner walls of the reflow welding box body, and the inner dimensions of the two positioning rings are consistent with the outer dimensions of the diversion pipe.

[0010] More preferably, the suction hood and suction pump are connected to the main body of the refrigeration box via pipes.

[0011] More preferably, the filter screen is an activated carbon adsorption plate, and the external dimensions of the activated carbon adsorption plate are consistent with the internal dimensions of the purification box.

[0012] More preferably, the branch pipe and the flow branch pipe are symmetrical about the vertical center line of the reflow welding box body.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0014] In this invention, the combination of an air pump, a cooling chamber body, and an air suction hood enables the SMT surface mount reflow soldering device to draw in hot air generated inside the reflow soldering chamber body during use. The cooling chamber body then rapidly cools the drawn-in hot air. The cooled air is then pumped back into the reflow soldering chamber body to cool the soldered SMT surface mounts in a timely manner, preventing burns to workers' hands due to excessively high SMT surface mount temperatures and thus ensuring the health of the workers.

[0015] In this invention, the combination of a purification chamber, a filter screen, and a paint pump enables the SMT reflow soldering device to filter harmful gases in the hot air generated inside the reflow soldering chamber during use. This solves the problem of harmful gases in the hot air polluting the working area, thus ensuring that the exhaust air meets environmental emission requirements. Attached Figure Description

[0016] Figure 1 This is a front view structural diagram of the present invention;

[0017] Figure 2 This is a front view of the internal structure of this utility model;

[0018] Figure 3 This utility model Figure 2 Enlarged structural diagram at point A in the middle;

[0019] Figure 4 This is a side view of the diversion pipe structure of this utility model.

[0020] In the diagram: 1. Outer shell assembly; 101. Base; 102. Support leg; 103. Reflow soldering box body; 104. Air pump; 2. Suction pump; 3. Positioning seat; 4. Main pipe; 5. Branch pipe; 6. Diversion pipe; 7. Nozzle; 8. Suction hood; 9. Purification box; 10. Filter screen; 11. Refrigeration box body; 12. Connecting pipe. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0022] Please see Figures 1 to 4This utility model provides a technical solution: an SMT surface mount reflow soldering device, including a housing assembly 1, an air pump 2 is provided on one side of the top of the housing assembly 1, two positioning seats 3 are provided on the side of the top of the housing assembly 1 away from the air pump 2, a main pipe 4 is provided between the two positioning seats 3, two branch pipes 5 are provided at the bottom of the main pipe 4, a diversion pipe 6 is provided at the bottom of the two branch pipes 5, and a plurality of nozzles 7 are provided on one side of the two diversion pipes 6, an air suction hood 8 is provided at the bottom of the inner part of the housing assembly 1, a purification box 9 is provided in the middle of the bottom of the housing assembly 1, filters 10 are provided at both ends of the inner part of the purification box 9, a cooling box body 11 is provided on one side of the housing assembly 1, and the cooling box body 11 and the purification box 9 are connected by a connecting pipe 12.

[0023] In this embodiment, as Figure 1 As shown, the outer casing assembly 1 includes a base 101, with support legs 102 at each of the four corners of the bottom end of the base 101, a reflow soldering box body 103 at the center of the top end of the base 101, and an air pump 104 on one side of the top end of the base 101.

[0024] In this embodiment, as Figure 1 As shown, the air pump 104 and the purification chamber 9 are connected to the main pipe 4 through a connecting pipe; the purified hot air, with the cooperation of the air pump 104, cools the soldered SMT components in a timely manner, avoiding the situation where the SMT components are too hot and cause burns to the workers' hands, thereby ensuring the health of the workers.

[0025] In this embodiment, as Figure 4 As shown, two positioning rings are respectively provided on the two inner walls of the reflow soldering box body 103. The internal dimensions of the two positioning rings are consistent with the external dimensions of the diversion tube 6; this fixes the position of the diversion tube 6 and prevents the diversion tube 6 from shifting or tilting during use.

[0026] In this embodiment, as Figure 1 As shown, the suction hood 8 and the suction pump 2 are connected to the cooling box body 11 through pipes; this enables the intake of hot air generated inside the reflow welding box body 103, and the cooling box body 11 to quickly cool the intake hot air.

[0027] In this embodiment, as Figure 2 As shown, the filter screen 10 is set as an activated carbon adsorption plate, and the external dimensions of the activated carbon adsorption plate are consistent with the internal dimensions of the purification box 9; it achieves the filtration of harmful gases in the hot air generated inside the reflow welding box body 103, solving the problem of harmful gases in the hot air polluting the working area environment, so that the exhaust air meets the environmental protection emission requirements.

[0028] In this embodiment, as Figure 2 As shown, the branch pipe 5 and the branch pipe 6 are symmetrical about the vertical center line of the reflow soldering box body 103 with respect to the nozzle 7; so that the cooled and purified gas can quickly cool the SMT components and avoid the SMT components being too hot and causing burns to the workers' hands.

[0029] The usage and advantages of this utility model: When using this SMT reflow soldering device, the working process is as follows:

[0030] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the base 101 is first placed in the designated position via the support legs 102. Then, the air pump 2 is started by the controller. At this time, the hot air generated during the normal SMT reflow soldering process in the reflow soldering box body 103 is drawn in by the air suction hood 8 under the operation of the air pump 2. The air suction hood 8 transports the hot air to the interior of the cooling box body 11 through the pipe. Then, the cooling box body 11 is started by the controller to quickly cool the hot air inside. After the hot air inside the cooling box body 11 is cooled, the solenoid valve outside the connecting pipe 12 and the air pump 104 are opened by the control. At this time, the air pump 104 transports the gas in the cooling box body 11 to the interior of the purification box 9 through the connecting pipe 12. The cooled air is then filtered by the filter screen 10 of the activated carbon adsorption plate. The filter screen 10 filters out harmful gases in the cooled air, effectively removing harmful gases from the hot air generated inside the reflow soldering box body 103. This solves the problem of harmful gases in the hot air polluting the working area, ensuring that the exhaust air meets environmental emission requirements. Then, the cooled and filtered air is transported to the main pipe 4 through the connecting pipe by the air pump 104, and then to the two branch pipes 6 by the two branch pipes 5. Finally, the cooled and filtered air is sprayed out by the nozzle 7, and the cooled air is then transported back to the reflow soldering box body 103 by the air pump 104. This timely cooling of the soldered SMT components prevents the SMT components from overheating and causing burns to the workers' hands, thus ensuring the health of the workers.

[0031] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. An SMT reflow soldering apparatus, comprising a housing assembly (1), characterized in that: An air pump (2) is provided on one side of the top of the outer shell assembly (1). Two positioning seats (3) are provided on the side of the top of the outer shell assembly (1) away from the air pump (2). A main pipe (4) is provided between the two positioning seats (3). Two branch pipes (5) are provided at the bottom of the main pipe (4). A diversion pipe (6) is provided at the bottom of the two branch pipes (5). Several nozzles (7) are provided on one side of the two diversion pipes (6). An air suction hood (8) is provided at the bottom of the inner part of the outer shell assembly (1). A purification box (9) is provided in the middle of the bottom part of the outer shell assembly (1). Filter screens (10) are provided at both ends of the inner part of the purification box (9). A refrigeration box body (11) is provided on one side of the outer shell assembly (1). The refrigeration box body (11) and the purification box (9) are connected by a connecting pipe (12).

2. The SMT reflow soldering apparatus according to claim 1, characterized in that: The outer casing assembly (1) includes a base (101), with support legs (102) provided at the four corners of the bottom end of the base (101), a reflow soldering box body (103) provided at the center of the top end of the base (101), and an air pump (104) provided on one side of the top end of the base (101).

3. The SMT reflow soldering apparatus according to claim 2, characterized in that: The air pump (104) and the purification box (9) are connected to the main pipe (4) via a connecting pipe.

4. The SMT reflow soldering apparatus according to claim 2, characterized in that: The reflow soldering box body (103) has two positioning rings on its two inner walls, and the internal dimensions of the two positioning rings are consistent with the external dimensions of the diversion pipe (6).

5. The SMT reflow soldering apparatus according to claim 1, characterized in that: The suction hood (8) and suction pump (2) are connected to the main body of the refrigeration box (11) via pipes.

6. The SMT reflow soldering apparatus according to claim 1, characterized in that: The filter screen (10) is set as an activated carbon adsorption plate, and the external dimensions of the activated carbon adsorption plate are consistent with the internal dimensions of the purification box (9).

7. The SMT reflow soldering apparatus according to claim 1, characterized in that: The branch pipe (5) and the branch pipe (6) are symmetrical with respect to the vertical center line of the reflow welding box body (103) and the nozzle (7).

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