USB flash disk box and vehicle

Abstract

The application relates to a U disk box and a vehicle, the U disk box comprising an insulating box body, a circuit board, an electrical interface and a suction unit, the insulating box body having a containing space, the circuit board being located in the containing space, the electrical interface being used for providing an interactive interface of the U disk box and an external device, and the suction unit being used for absorbing electromagnetic waves in a preset frequency band; wherein the circuit board and the electrical interface are electrically connected, and the suction unit is located in the containing space, and the suction unit comprises a multilayer structure. Through the above technical scheme, the multilayer structure suction unit is arranged in the containing space of the insulating box body, electromagnetic waves in a preset frequency band can be absorbed, thus the U disk box can avoid disconnection in the preset frequency band, and the use stability of the U disk box is ensured.

Description

Technical Field

[0001] This application relates to the field of electronic technology, and more particularly to a USB flash drive enclosure and a vehicle. Background Technology

[0002] In related technologies, USB flash drive enclosures often use ordinary plastic shells, and their internal circuit boards and electrical interfaces lack effective electromagnetic protection measures, which can affect the overall stability of the USB flash drive enclosure. Utility Model Content

[0003] This application provides a USB flash drive enclosure that improves the stability of the USB flash drive enclosure and at least partially solves the above-mentioned technical problems.

[0004] To achieve the above objectives, according to a first aspect of this application, a USB flash drive enclosure is provided, comprising:

[0005] An insulated box with storage space;

[0006] The circuit board is located within the accommodating space;

[0007] An electrical interface is provided to enable interaction between the USB flash drive enclosure and external devices; and

[0008] The absorbing unit is used to absorb electromagnetic waves in a preset frequency band.

[0009] The circuit board and the electrical interface are electrically connected, and the wave-absorbing unit is located within the accommodating space. The wave-absorbing unit includes a multi-layer structure.

[0010] Optionally, the circuit board is located on the first inner wall surface of the insulating housing;

[0011] The absorbing unit includes:

[0012] The first absorbing unit is attached to the second inner wall surface of the insulating box;

[0013] The first inner wall surface and the second inner wall surface are arranged opposite to each other.

[0014] Optionally, the electrical interface includes:

[0015] The USB flash drive port is located on the third inner wall surface of the insulating box.

[0016] The absorbing unit includes:

[0017] The second wave-absorbing unit is attached to the third inner wall at a position different from the USB flash drive port.

[0018] Optionally, the electrical interface further includes:

[0019] The connector port is located on the fourth inner wall surface of the insulating housing.

[0020] The wave-absorbing unit also includes:

[0021] The third absorbing unit is attached to the fourth inner wall surface at a position different from the connector port;

[0022] The third inner wall surface is disposed opposite to the fourth inner wall surface.

[0023] Optionally, the multi-layer structure includes:

[0024] A flexible layer and insulating layers located on two opposite sides of the flexible layer; and

[0025] A conductive layer is located on the side of the insulating layer away from the flexible layer;

[0026] The conductive layer away from the inner wall of the insulating box is constructed as a ring structure.

[0027] Optionally, the thickness of the flexible layer is greater than the thickness of at least one of the insulating layer and the conductive layer.

[0028] Optionally, the flexible layer has a relative permittivity of 2.35 and a loss tangent of 0.03.

[0029] and / or

[0030] The relative permittivity of the insulating layer is 3.2, and the loss tangent is 0.003.

[0031] Optionally, the sheet resistance of the conductive layer farther from the inner wall of the insulating box is smaller than that of the conductive layer closer to the inner wall of the insulating box.

[0032] Optionally, the sheet resistance of the conductive layer away from the inner wall of the insulating box is 18 Ω / square, and the sheet resistance of the conductive layer near the inner wall of the insulating box is 26 Ω / square.

[0033] According to a second aspect of this application, a vehicle is provided, including a USB flash drive enclosure as described above.

[0034] The beneficial effect of this application is that it provides a USB flash drive enclosure that can improve the stability of use.

[0035] More specifically, some embodiments of this application may produce the following specific beneficial effects:

[0036] In this embodiment of the USB flash drive enclosure, the enclosure includes an insulating housing, a circuit board, an electrical interface, and a wave-absorbing unit. The insulating housing has a receiving space, the circuit board is located within the receiving space, the electrical interface provides an interface for interaction between the USB flash drive enclosure and external devices, and the wave-absorbing unit absorbs electromagnetic waves in a preset frequency band. The circuit board and the electrical interface are electrically connected, and the wave-absorbing unit is located within the receiving space. The wave-absorbing unit includes a multi-layer structure. Through this technical solution, by setting a multi-layered wave-absorbing unit within the receiving space, electromagnetic waves in a preset frequency band can be absorbed. This avoids connection problems in the USB flash drive enclosure within the preset frequency band, ensuring the stability of the USB flash drive enclosure's use.

[0037] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0038] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0039] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0040] Figure 1 This is a schematic diagram of the overall structure of the USB flash drive enclosure provided in an exemplary embodiment of this application;

[0041] Figure 2 This is a schematic diagram of the overall structure of the absorbing unit provided in an exemplary embodiment of this application;

[0042] Figure 3 This is a top view of the absorbing unit provided in an exemplary embodiment of this application;

[0043] Figure 4 This is a side view of the absorbing unit provided in an exemplary embodiment of this application;

[0044] Figure 5 This is the absorption rate curve of the absorbing unit provided in the exemplary embodiment of this application.

[0045] Explanation of reference numerals in the attached figures:

[0046] 100. USB flash drive enclosure;

[0047] 110. Insulating box; 111. First inner wall surface; 112. Second inner wall surface; 113. Third inner wall surface; 114. Fourth inner wall surface;

[0048] 120. Circuit board;

[0049] 130. Electrical interface; 131. USB flash drive port; 132. Connector port;

[0050] 140. Absorbing unit;

[0051] 141. Flexible layer; 142. Insulating layer;

[0052] 143. Conductive layer; 1431. First conductive layer; 1432. Second conductive layer. Detailed Implementation

[0053] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0054] According to the first aspect of this application, reference to Figure 1 and Figure 2 This application provides a USB flash drive enclosure 100. The USB flash drive enclosure 100 in this embodiment includes an insulating housing 110, a circuit board 120, an electrical interface 130, and a wave-absorbing unit 140. The insulating housing 110 has a receiving space, the circuit board 120 is located in the receiving space, the electrical interface 130 is used to provide an interface for interaction between the USB flash drive enclosure 100 and external devices, and the wave-absorbing unit 140 is used to absorb electromagnetic waves of a preset frequency band. The circuit board 120 and the electrical interface 130 are electrically connected, and the wave-absorbing unit 140 is located in the receiving space. The wave-absorbing unit 140 includes a multi-layer structure.

[0055] By using the above technical solution, and by setting up a multi-layered wave-absorbing unit 140 in the containment space, electromagnetic waves of a preset frequency band can be absorbed. This can avoid the USB flash drive enclosure 100 from disconnecting in the preset frequency band and ensure the stability of the USB flash drive enclosure 100.

[0056] For example, the preset band may include electromagnetic waves in the 380MHz to 420MHz frequency band. The electromagnetic waves in this frequency band are directionally absorbed by the absorbing unit 140 to block the interference coupling path, improve the anti-interference performance of the USB system, avoid disconnection problems caused by signal crosstalk, and improve the stability of data transmission.

[0057] The insulating box 110 in this embodiment can be made of plastic material, so that the USB flash drive box 100 in this embodiment has a plastic shell, and the circuit board 120 and the wave absorbing unit 140 are both arranged in the accommodating space of the plastic shell.

[0058] It should be noted that the absorbing unit 140 in the embodiments of this application includes a multi-layer structure, which means that the absorbing unit 140 can be a multi-layer structure.

[0059] In some embodiments, the circuit board 120 is located on the first inner wall surface 111 of the insulating housing 110; the absorbing unit 140 includes: a first absorbing unit (not shown in the figure).

[0060] In this embodiment, the first absorbing unit is attached to the second inner wall surface 112 of the insulating box 110. The first inner wall surface 111 and the second inner wall surface 112 are arranged opposite to each other. In this way, the first absorbing unit and the circuit board 120 can be arranged opposite to each other. When the circuit board 120 and the first absorbing unit are arranged opposite to each other, a symmetrical electromagnetic field absorption structure is formed. The electromagnetic waves radiated by the circuit board 120 are absorbed by the first absorbing unit when they propagate to the second inner wall surface 112, instead of being reflected back to the circuit board 120. This avoids the influence of electromagnetic waves on the circuit board 120 and improves the stability of the circuit board 120 in use.

[0061] For example, when the first absorbing unit is attached to the second inner wall surface 112, the first absorbing unit completely covers the second inner wall surface 112. By adopting such a solution, the area for absorbing electromagnetic waves can be increased.

[0062] In some embodiments, reference Figure 1 The electrical interface 130 includes: a USB flash drive port 131 and a connector port 132.

[0063] The USB flash drive port 131 is located on the third inner wall surface 113 of the insulating box 110, and the connector port 132 is located on the fourth inner wall surface 114. The third inner wall surface 113 and the fourth inner wall surface 114 are arranged opposite to each other.

[0064] The absorbing unit 140 in this embodiment includes a second absorbing unit (not shown in the figure) and a third absorbing unit (not shown in the figure). The second absorbing unit is attached to the third inner wall surface 113 at a position different from the USB flash drive port 131, and the third absorbing unit is attached to the fourth inner wall surface 114 at a position different from the connector port 132; wherein the third inner wall surface 113 and the fourth inner wall surface 114 are arranged opposite to each other.

[0065] By attaching the second absorbing unit to the third inner wall surface 113 at a position different from the USB flash drive port 131 and attaching the third absorbing unit at a position different from the connector port 132, the electromagnetic interference of electromagnetic waves to the USB flash drive port 131 and the connector port 132 can be further avoided. In other words, the second and third absorbing units can absorb electromagnetic waves at the USB flash drive port 131 and the connector port 132, thereby improving the stability of the USB flash drive port 131 and the connector port 132 during use.

[0066] For example, when the second absorbing unit is attached to the third inner wall surface 113 and the third absorbing unit is attached to the fourth inner wall surface 114, the two absorbing units 140 completely cover the corresponding inner wall surfaces. By adopting such a scheme, the area for absorbing electromagnetic waves can be increased.

[0067] In this embodiment, the USB flash drive port 131 can be connected to a data storage device, and the connector port 132 can be connected to a data device, enabling data transmission. Both the USB flash drive port 131 and the connector port 132 can have windows opened on the insulating housing 110 to expose the port and connector port 132, ensuring interference-free insertion and removal operations and achieving physical adaptation and functional compatibility.

[0068] In some embodiments, the absorbing unit 140 includes a multilayer structure.

[0069] Among them, reference Figure 2 The multilayer structure includes: a flexible layer 141, an insulating layer 142, and a conductive layer 143.

[0070] In this embodiment, the insulating layer 142 is located on the two sides opposite to the flexible layer 141, and the conductive layer 143 is located on the side of the insulating layer 142 away from the flexible layer 141.

[0071] The conductive layer 143, which is away from the inner wall of the insulating box 110, is constructed as a ring structure.

[0072] For example, the flexible layer 141 includes a first side and a second side, and an insulating layer 142 is provided on both the first side and the second side. A conductive layer 143 is provided on the side of each insulating layer 142 away from the flexible layer 141, that is, there are two conductive layers 143 and two insulating layers 142.

[0073] Of course, the conductive layer 143 and the insulating layer 142 can also be set according to actual needs, and there are no restrictions here.

[0074] The flexible layer 141 in this embodiment can be made of a flexible material, such as polydimethylsiloxane, the insulating layer 142 can be made of an insulating material, such as polyethylene terephthalate, and the conductive layer 143 can be made of a conductive material, such as indium tin oxide.

[0075] In some embodiments, the thickness of the flexible layer 141 is greater than the thickness of at least one of the insulating layer 142 and the conductive layer 143.

[0076] This design allows the absorbing unit 140 to be in a flexible state, making it easy to fit onto the inner wall surface.

[0077] For example, the thickness of the flexible layer 141 is greater than the thickness of the insulating layer 142 and the conductive layer 143, and the thickness of the insulating layer 142 on both sides of the flexible layer 141 can be set to be the same. The thickness of the two conductive layers 143 can be determined according to the requirements, and can be the same or different.

[0078] refer to Figure 3 and Figure 4 In this embodiment, the cross-sectional shape of the flexible layer 141 can be square, the width p of the square can be 380mm, the thickness t of the flexible layer 141 can be 96mm, and the thickness d of the insulating layer 142 can be 0.175mm.

[0079] In this embodiment, the conductive layer 143 on the inner wall surface away from the insulating box 110 is constructed as a ring structure, which can enhance the resonance capability of the absorber and thus improve its ability to absorb electromagnetic waves.

[0080] For example, refer to Figure 3 The ring structure can be a nested concentric ring structure, for example, it can include three rings, including a first ring, a second ring, and a third ring. The outer diameter a of the first ring is 40mm, the outer diameter b of the second ring is 92mm, and the outer diameter c of the third ring is 134mm. The width w of each ring is equal and can be 10mm.

[0081] In this embodiment, the center of the annular structure can be the center of the flexible layer 141.

[0082] In some embodiments, the relative permittivity of the flexible layer 141 is 2.35, and the loss tangent is 0.03, while the relative permittivity of the insulating layer 142 is 3.2, and the loss tangent is 0.003. In this embodiment, the relative permittivity of the flexible layer 141 is lower than that of the insulating layer 142. Thus, the lower permittivity reduces the phase delay of the electromagnetic wave in the ring structure, while the higher permittivity of the insulating layer 142 enhances the electric field concentration effect.

[0083] In some embodiments, the sheet resistance of the conductive layer 143 away from the inner wall surface of the insulating box 110 is smaller than that of the conductive layer 143 near the inner wall surface of the insulating box 110. Thus, the conductive layers 143 with different sheet resistances, and the bottom conductive layer 143 (the conductive layer 143 near the inner wall surface of the insulating box 110) has a larger sheet resistance, can enhance the residence time of the electric field in the flexible layer 141; the top conductive layer 143 (the conductive layer 143 away from the inner wall surface of the insulating box 110) has a smaller sheet resistance, which can make the surface current of the conductive layer 143 uniformly distributed.

[0084] For example, the bottom conductive layer 143 (the conductive layer 143 near the inner wall of the insulating box 110) is defined as the first conductive layer 1431, and the top conductive layer 143 (the conductive layer 143 away from the inner wall of the insulating box 110) is defined as the second conductive layer 1432. That is, the sheet resistance of the first conductive layer 1431 is greater than the sheet resistance of the second conductive layer 1432, and the second conductive layer 1432 is constructed as a ring structure.

[0085] In some embodiments, the sheet resistance of the conductive layer 143 away from the inner wall of the insulating box 110 is 18 Ω / square, and the sheet resistance of the conductive layer 143 near the inner wall of the insulating box 110 is 26 Ω / square.

[0086] That is, the sheet resistance of the second conductive layer 1432 is 18Ω / square, and the sheet resistance of the first conductive layer 1431 is 26Ω / square.

[0087] In summary, in this embodiment, a flexible absorbing unit 140 is integrated into the inner wall of the plastic shell to directionally absorb electromagnetic waves in the 380MHz to 420MHz frequency band, blocking interference coupling paths and improving the anti-interference performance of the USB system. This application of the directional electromagnetic absorption of the absorbing unit 140 in the combination of an insulating plastic shell and highly sensitive circuits solves the narrowband interference problem of miniaturized electronic devices. The electromagnetic parameters of the absorbing unit 140 are matched to the 380MHz to 420MHz frequency band, achieving an electromagnetic absorption effect of over 90% in the target frequency band. Furthermore, the flexible layer 141 in the absorbing unit 140 of this embodiment has a relatively large thickness, allowing it to conform to the inner curved surface of the plastic shell and avoiding assembly gaps caused by rigid materials. The area covered by the absorbing unit 140 forms a spatial shield with the electrical interface 130 and the circuit board 120, preferentially attenuating the energy of the interference field in sensitive areas.

[0088] refer to Figure 5 ,Depend on Figure 5 It can be seen that the absorption unit 140 in this embodiment has an absorption rate of over 90% in the frequency range of 285MHz to 430MHz, and the electromagnetic absorption frequency band covers 380MHz to 420MHz. It can achieve efficient absorption of electromagnetic waves in the 380MHz to 420MHz frequency band, thereby avoiding the disconnection problem of the USB flash drive box 100 in this frequency band.

[0089] According to a second aspect of this application, a vehicle is provided, including a USB flash drive box 100 as described above.

[0090] The vehicle may be a gasoline-powered vehicle, a plug-in hybrid electric vehicle, or a new energy vehicle, etc., and this application does not make any specific restrictions.

[0091] The vehicle in this embodiment uses the aforementioned USB flash drive box 100, and therefore has all the beneficial effects of the aforementioned USB flash drive box 100, which will not be elaborated here.

[0092] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0093] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0094] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0095] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A USB flash drive enclosure (100), characterized in that, The USB flash drive enclosure (100) includes: An insulating box (110) has a receiving space; A circuit board (120) is located within the accommodating space; An electrical interface (130) is provided for interacting with external devices via the USB flash drive enclosure (100); and The absorbing unit (140) is used to absorb electromagnetic waves in a preset frequency band; The circuit board (120) and the electrical interface (130) are electrically connected, and the wave-absorbing unit (140) is located within the accommodating space. The wave-absorbing unit (140) includes a multi-layer structure.

2. The USB flash drive enclosure (100) according to claim 1, characterized in that, The circuit board (120) is located on the first inner wall surface (111) of the insulating box (110); The absorbing unit (140) includes: The first absorbing unit (140) is attached to the second inner wall surface (112) of the insulating box (110); The first inner wall surface (111) and the second inner wall surface (112) are arranged opposite to each other.

3. The USB flash drive enclosure (100) according to claim 1, characterized in that, The electrical interface (130) includes: The USB flash drive port (131) is located on the third inner wall surface (113) of the insulating box (110); The absorbing unit (140) includes: The second absorbing unit (140) is attached to the third inner wall surface (113) at a position different from the USB flash drive port (131).

4. The USB flash drive enclosure (100) according to claim 3, characterized in that, The electrical interface (130) also includes: A connector port (132) is provided on the fourth inner wall surface (114) of the insulating housing (110); The absorbing unit (140) further includes: The third absorbing unit (140) is attached to the fourth inner wall surface (114) at a position different from the connector port (132); The third inner wall surface (113) is disposed opposite to the fourth inner wall surface (114).

5. The USB flash drive enclosure (100) according to any one of claims 1 to 4, characterized in that, The multi-layer structure includes: The flexible layer (141) and the insulating layers (142) located on the two opposite sides of the flexible layer (141); and A conductive layer (143) is located on the side of the insulating layer (142) away from the flexible layer (141); The conductive layer (143) away from the inner wall of the insulating box (110) is constructed as a ring structure.

6. The USB flash drive enclosure (100) according to claim 5, characterized in that, The thickness of the flexible layer (141) is greater than the thickness of at least one of the insulating layer (142) and the conductive layer (143).

7. The USB flash drive enclosure (100) according to claim 5, characterized in that, The flexible layer (141) has a relative permittivity of 2.35 and a loss tangent of 0.

03. and / or The insulating layer (142) has a relative permittivity of 3.2 and a loss tangent of 0.

003.

8. The USB flash drive enclosure (100) according to claim 5, characterized in that, The sheet resistance of the conductive layer (143) away from the inner wall of the insulating box (110) is smaller than that of the conductive layer (143) near the inner wall of the insulating box (110).

9. The USB flash drive enclosure (100) according to claim 5, characterized in that, The sheet resistance of the conductive layer (143) away from the inner wall of the insulating box (110) is 18Ω / square, and the sheet resistance of the conductive layer (143) close to the inner wall of the insulating box (110) is 26Ω / square.

10. A vehicle, characterized in that, Includes the USB flash drive enclosure (100) as described in any one of claims 1 to 9.

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