Wafer receiving worktable

Abstract

The utility model discloses a wafer material receiving workbench. Including material receiving base, material receiving table, jacking mechanism, support pin, material receiving base is provided with jacking mechanism in, material receiving base top is provided with material receiving table, three support pins are liftably arranged in the middle part of material receiving table, and the line between three support pins forms equilateral triangle, and support pin is connected with jacking mechanism, jacking mechanism includes pneumatic cylinder, push rod, connecting piece, elevating gear, and pneumatic cylinder sets up in material receiving base, and pneumatic cylinder output end is connected with push rod, and every support pin is all set up in the top of corresponding elevating gear, and push rod is connected with elevating gear through connecting piece, and the initial position of support pin is lower than the material receiving surface of material receiving table. The utility model discloses through setting liftable support pin, is convenient for material fork feeding, makes wafer and material receiving table complete contact, does not need additional avoiding space, makes wafer support area complete, guarantees the flatness of wafer.

Description

Technical fields:

[0001] This utility model belongs to the field of wafer manufacturing technology, and specifically relates to a wafer receiving workbench. Background technology:

[0002] When transferring bare wafers, without the aid of a film or steel ring, the front side of the wafer, due to its circuitry and other structures, cannot be contacted by the handling fixture during transport. Therefore, the wafer is typically transferred by contacting the back side. After transfer, when placing the wafer on the platform, the transfer fork needs to be removed, necessitating a special receiving table for convenient transfer and receiving. Common receiving table structures include: 1) using edge clamping for wafer transfer, requiring a clearance structure in the table design. This method results in incomplete wafer adhesion, affecting wafer flatness. 2) creating notches in the table to allow clearance from the transfer fork. This method also suffers from uneven wafer adhesion in the clearance area. Therefore, designing a receiving table that does not interfere with the normal loading and unloading of the transfer fork while ensuring wafer flatness is a problem that needs to be solved.

[0003] The information disclosed in this background section is intended only to enhance the understanding of the overall background of this utility model and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Utility model content:

[0004] The purpose of this invention is to provide a wafer receiving worktable, thereby overcoming the defects in the prior art.

[0005] To achieve the above objectives, this utility model provides a wafer receiving workbench, including a receiving base, a receiving platform, a lifting mechanism, and support pins. The receiving base contains the lifting mechanism, and the receiving platform is located on top of the receiving base. Three support pins are vertically detachable in the middle of the receiving platform, forming an equilateral triangle. The support pins are connected to the lifting mechanism. The lifting mechanism includes a cylinder, a push rod, a connector, and a lifting component. The cylinder is located inside the receiving base, and its output end is connected to the push rod. Each support pin is located on top of its corresponding lifting component, and the push rod is connected to the lifting component via the connector. The initial position of the support pins is lower than the receiving surface of the receiving platform. The lifting mechanism drives the three support pins to rise and fall synchronously, cooperating with the fork to complete the wafer receiving process.

[0006] Preferably, in the technical solution, the connecting component includes a main connecting rod, a first support rod, and a second support rod. The main connecting rod is connected to the push rod, and the first support rod is symmetrically arranged at both ends of the main connecting rod. The middle part of the main connecting rod is connected to the second support rod. The lifting component where the two support pins of the base of the equilateral triangle are located is connected to the corresponding first support rod, and the lifting component where the support pin of the vertex of the equilateral triangle is located is connected to the second support rod.

[0007] Preferably, in the technical solution, the lifting component includes a wedge block and a guide rod. The wedge block is connected to a corresponding first or second support rod, and the guide rod is set on the wedge surface of the wedge block. A support pin is provided at the top of the guide rod. The wedge block is pushed by a cylinder, which drives the guide rod to move along the wedge surface to adjust the lifting of the support pin.

[0008] Preferably, in the technical solution, a fixed plate is provided inside the receiving base, and a rod sleeve is provided at the corresponding position of the guide rod on the fixed plate. The rod sleeve is fitted onto the guide rod to restrict the radial movement of the guide rod.

[0009] Compared with the prior art, the present invention has the following beneficial effects:

[0010] By setting up a liftable support pin, it rises during wafer loading and unloading to facilitate loading and unloading by the fork. After the receiving platform completes the receiving, the support pin descends, ensuring that the wafer is in full contact with the receiving platform without the need for additional clearance space. This ensures the integrity of the wafer support area and guarantees the flatness of the wafer. Attached image description:

[0011] Figure 1 This is a top view of the wafer receiving workbench of this utility model;

[0012] Figure 2 for Figure 1 Sectional view along axis AA;

[0013] Figure 3 This is a top view of the lifting mechanism of this utility model;

[0014] Figure 4 for Figure 3 BB-direction sectional view. Detailed implementation method:

[0015] The specific embodiments of this utility model are described in detail below, but it should be understood that the protection scope of this utility model is not limited to the specific embodiments.

[0016] Unless otherwise expressly stated, throughout the specification and claims, the term "comprising" or its variations such as "including" or "comprises" shall be understood to include the stated elements or components without excluding other elements or other components.

[0017] like Figure 1-4As shown, a wafer receiving workbench includes a receiving base 1, a receiving platform 2, a lifting mechanism 3, and support pins 4. The receiving base 1 houses the lifting mechanism 3 and a fixed plate 5. The receiving platform 2 is located on the top of the receiving base 1. Three support pins 4 are vertically detachable in the middle of the receiving platform 2, forming an equilateral triangle. The support pins 4 are connected to the lifting mechanism 3. The initial position of the support pins 4 is lower than the receiving surface of the receiving platform 2. The lifting mechanism 3 includes a cylinder 30, a push rod 31, a connector, and a lifting component. The cylinder 30 is located inside the receiving base 1, and its output end is connected to the push rod 31. The connector includes a main connecting rod 32, a first support rod 33, and a second support rod 34. The main connecting rod 32 is connected to the push rod 31. The connecting rod 32 is symmetrically provided with first support rods 33 at both ends, and the middle part of the main connecting rod 32 is connected to the second support rod 34; the lifting component where the two support pins 4 at the base of the equilateral triangle are located is connected to the corresponding first support rod 33, and the lifting component where the support pin 4 at the vertex of the equilateral triangle is located is connected to the second support rod 34; the lifting component includes a wedge block 35 and a guide rod 36, the wedge block 35 is connected to the corresponding first support rod 33 or second support rod 34, the guide rod 36 is set on the wedge surface of the wedge block 35, and a support pin 4 is provided at the top of the guide rod 36. The fixed plate 5 is provided with a rod sleeve 50 at the corresponding position of the guide rod 36, and the rod sleeve 50 is fitted on the guide rod 36 to restrict the radial movement of the guide rod 36; the wedge block 35 is pushed by the cylinder 30, which drives the guide rod 36 to move along the wedge surface, thereby adjusting the lifting of the support pin 4.

[0018] During loading, cylinder 30 lifts support pin 4, and the fork places the wafer on support pin 4. Then, the fork is withdrawn, and cylinder 30 lowers support pin 4 back to its original position, allowing the wafer to fall onto receiving platform 2, completing one loading / unloading cycle. During unloading, cylinder 30 lifts support pin 4, and the fork extends into the gap between the wafer and receiving platform 2. Then, cylinder 30 lowers support pin 4 back to its original position, allowing the wafer to fall onto the fork, which then removes it. The lifting mechanism 3 drives the three support pins 4 to rise and fall synchronously, cooperating with the fork to complete the loading and unloading of the wafer. This facilitates loading and unloading of the fork, ensures complete contact between the wafer and receiving platform without requiring additional clearance, maintains a complete wafer support area, and guarantees wafer flatness.

[0019] The foregoing description of specific exemplary embodiments of the present invention is for illustrative and explanatory purposes. These descriptions are not intended to limit the present invention to the precise forms disclosed, and it will be apparent that many changes and variations can be made in accordance with the foregoing teachings. The exemplary embodiments were chosen and described in order to explain the specific principles of the present invention and its practical application, thereby enabling those skilled in the art to implement and utilize various different exemplary embodiments of the present invention, as well as various different choices and variations. The scope of the present invention is intended to be defined by the claims and their equivalents.

Claims

1. A wafer receiving table, characterized by: Including receiving base, receiving table, jacking mechanism, support pin, the receiving base is provided with jacking mechanism in, the receiving base top is provided with receiving table, the receiving table middle part is provided with three support pins liftable, the line between three support pins forms equilateral triangle, the support pin is connected with jacking mechanism, the jacking mechanism includes cylinder, push rod, connecting piece, lifting piece, cylinder is arranged in receiving base, cylinder output end is connected with push rod, each support pin is arranged in the top of corresponding lifting piece, push rod is connected with lifting piece through connecting piece, the initial position of support pin is lower than the receiving surface of receiving table, connecting piece includes main connecting rod, first branch, second branch, main connecting rod is connected with push rod, the both ends of main connecting rod are provided with first branch symmetrically, the middle part of main connecting rod is connected with second branch, the lifting piece of the support pin of equilateral triangle base side is connected with corresponding first branch, the lifting piece of the support pin of equilateral triangle vertex is connected with second branch, lifting piece includes wedge block, guide rod, wedge block is connected with corresponding first branch or second branch, guide rod is arranged on the wedge surface of wedge block, and the top of guide rod is provided with support pin.

2. The wafer handling table of claim 1, wherein: The fixed flat plate is arranged in receiving base, and the rod sleeve is arranged on the guide rod in the corresponding position of the fixed flat plate.

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