Atomizing mechanism for hair dryer and hair dryer

Abstract

The application discloses an atomizing mechanism for a blowing device and the blowing device, and relates to the technical field of household appliances. The atomizing mechanism comprises an atomizing container and an atomizing sheet. The atomizing container has a containing cavity for containing atomizing liquid and an atomizing opening communicating with the containing cavity. The atomizing sheet is arranged in the atomizing opening. The surface of the atomizing sheet, which is away from the containing cavity, is provided with a liquid-repellent film layer. The application can improve the hydrophobic and oleophobic properties, reduce the adhesion of the atomizing liquid, avoid the atomizing liquid from condensing on the surface of the atomizing sheet and causing the atomizing sheet to be blocked, improve the atomizing effect and service life of the atomizing sheet, and prolong the service life of a single atomizing sheet from about 50 days in the traditional technology to not less than 200 days.

Description

Technical Field

[0001] This application relates to the field of household appliance technology, and in particular to an atomizing mechanism for a blower and a blower device. Background Technology

[0002] An essential oil hair dryer is a product that combines the aroma diffusion function of essential oils with the design of a traditional hair dryer. By diffusing essential oils, it allows users to enjoy the fragrance and potential health benefits of essential oils while drying their hair.

[0003] Traditional essential oil hair dryers have a socket at the top of the main body. A fragrance oil container is inserted into this socket, and the essential oil, filled with it, is atomized by an atomizing plate and sprayed out from its front opening via a fragrance control component. With prolonged use, the essential oil condenses on the atomizing plate. This condensation attracts dust, making the hair dryer dirty. Furthermore, the condensation can clog the atomizing plate, reducing its atomization effectiveness. Utility Model Content

[0004] Therefore, it is necessary to provide an atomizing mechanism that can improve the atomization effect and service life of the atomizing plate.

[0005] One embodiment of this application provides an atomizing mechanism for a blower.

[0006] An atomizing mechanism includes an atomizing container and an atomizing plate. The atomizing container has a receiving chamber for containing an atomizing liquid and an atomizing opening communicating with the receiving chamber. The atomizing plate is disposed in the atomizing opening, and a hydrophobic film layer is provided on the surface of the atomizing plate facing away from the receiving chamber.

[0007] In some embodiments, the surface of the hydrophobic film layer away from the atomizing sheet has a micron- and / or nano-scale rough structure.

[0008] In some embodiments, the atomizing sheet includes a silicon substrate, and the hydrophobic film layer is deposited on the surface of the silicon substrate.

[0009] In some embodiments, the thickness of the silicon substrate is 10 μm to 300 μm.

[0010] In some embodiments, the hydrophobic film layer includes one or both of a hydrophobic film layer and an oleophobic film layer.

[0011] In some embodiments, the liquid-repellent film layer is a hydrophobic film layer, and the water contact angle of the hydrophobic film layer is greater than 110°.

[0012] In some embodiments, the thickness of the hydrophobic film is 30 nm to 50 nm.

[0013] In some embodiments, the hydrophobic film layer is a silicon carbide nanocomposite coating.

[0014] In some embodiments, the atomizing container further includes an atomizing channel, one end of which is connected to the atomizing opening and the other end of which is connected to the receiving chamber, and the atomizing plate is disposed within the atomizing channel and has a gap with the inner wall of the atomizing channel.

[0015] In some embodiments, the atomizing mechanism further includes an adsorption component, one end of which extends to abut against the atomizing sheet and the other end extends into the receiving chamber.

[0016] In some embodiments, the atomizing container is provided with a detachable cover, the cover having the atomizing opening; and / or, the atomizing container is further provided with a liquid inlet communicating with the accommodating chamber and capable of being opened or closed.

[0017] One embodiment of this application also provides a blower device.

[0018] A blower device includes a blower and an atomizing mechanism as described in any of the above embodiments. The blower is provided with a mounting hole, and the atomizing container of the atomizing mechanism is disposed in the mounting hole, with the atomizing opening of the atomizing container facing outward.

[0019] The aforementioned atomizing mechanism forms a hydrophobic film layer by coating the atomizing plate. The hydrophobic film layer can improve the hydrophobic or oleophobic properties, reduce the adhesion of atomizing liquids such as essential oils, and improve the atomization effect and service life of the atomizing plate. This increases the lifespan of a single atomizing plate from about 50 days in traditional technology to no less than 200 days. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings. In the following description, the same reference numerals denote the same parts.

[0022] Figure 1 This is a schematic diagram of an atomizing mechanism according to an embodiment of this application;

[0023] Figure 2 This is a schematic diagram of the atomizing mechanism described in one embodiment of this application from another angle;

[0024] Figure 3 This is a schematic diagram of the atomizing plate structure of the atomizing mechanism described in one embodiment of this application;

[0025] Figure 4 This is a schematic diagram of a blower device according to an embodiment of this application;

[0026] Figure 5 This is a flowchart illustrating the preparation of a hydrophobic film layer according to an embodiment of this application;

[0027] Figure 6 This is a flowchart illustrating the preparation of a rough structure according to an embodiment of this application.

[0028] Explanation of reference numerals in the attached figures

[0029] 10. Atomizing mechanism; 100. Atomizing container; 101. Containing chamber; 102. Atomizing opening; 103. Cover; 200. Atomizing plate; 300. Adsorption assembly; 301. Adsorption component; 302. Mounting bracket; 20. Blower; 21. Mounting socket. Detailed Implementation

[0030] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0031] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0032] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0033] In the description of this application, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0035] In this application, when numerical intervals (i.e., numerical ranges) are mentioned, unless otherwise specified, the distribution of selectable numerical values ​​within the numerical interval is considered continuous, and includes the two endpoints of the numerical interval (i.e., the minimum and maximum values), as well as every numerical value between these two endpoints. Unless otherwise specified, when a numerical interval refers only to integers within that numerical interval, it includes the two endpoint integers of the numerical range, as well as every integer between the two endpoints, which is equivalent to directly listing every integer. When multiple numerical ranges are provided to describe features or characteristics, these numerical ranges can be merged. In other words, unless otherwise specified, the numerical ranges disclosed in this application should be understood to include any and all subranges included therein. The "numerical value" in the numerical interval can be any quantitative value, such as a number, percentage, ratio, etc. The term "numerical interval" can be broadly included to include percentage intervals, ratio intervals, proportion intervals, etc.

[0036] One embodiment of this application provides an atomizing mechanism 10 to solve at least one of the following technical problems in conventional essential oil hair dryers 20 after prolonged use: (1) fragrance essential oils condense on the atomizing plate 200, and the fragrance essential oils also attract dust, causing the essential oil hair dryer 20 to become dirty; (2) the condensation of fragrance essential oils can also cause the atomizing plate 200 to become clogged, reducing the atomization effect and also reducing the service life of the atomizing plate 200. The atomizing mechanism 10 will be described below with reference to the accompanying drawings.

[0037] The atomizing mechanism 10 provided in one embodiment of this application is exemplary; please refer to [link to relevant documentation]. Figure 1 As shown, Figure 1 This is a schematic diagram of the atomizing mechanism 10 provided in one embodiment of this application. The atomizing mechanism 10 of this application can be used to atomize liquids such as fragrance essential oils, thereby enhancing the aroma diffusion function of the hair dryer 20.

[0038] To more clearly illustrate the structure of the atomizing mechanism 10, the following description of the atomizing mechanism 10 will be provided in conjunction with the accompanying drawings.

[0039] For example, please refer to Figure 1 As shown, an atomizing mechanism 10 includes an atomizing container 100 and an atomizing plate 200. The atomizing container 100 has a receiving chamber 101 for containing an atomizing liquid and an atomizing opening 102 communicating with the receiving chamber 101. Please refer to... Figure 2 As shown, Figure 2 This is another schematic diagram of the atomizing mechanism 10 provided in one embodiment of this application. The atomizing plate 200 is disposed within the atomizing opening 102, and a hydrophobic film layer 400 is disposed on the surface of the atomizing plate 200 facing away from the receiving chamber 101. See also... Figure 3 As shown, Figure 3 This is a schematic diagram of the atomizing plate structure of the atomizing mechanism described in one embodiment of this application.

[0040] The atomization principle of the atomizing mechanism 10 of this application is as follows: After the atomizing plate 200 is energized, the atomizing plate 200 generates high-frequency oscillation, which can break up the liquid water molecule structure adsorbed by the adsorption component 300 at the atomizing plate 200 to generate naturally drifting water mist.

[0041] Optionally, two surfaces of the atomizing plate 200 are provided with a hydrophobic film layer, that is, the surface near the receiving chamber 101 is also provided with a hydrophobic film layer.

[0042] In some embodiments, the atomizing mechanism 10 of this application further includes an adsorption component 300. One end of the adsorption component 300 extends to abut against the atomizing plate 200, and the other end extends into the receiving chamber 101.

[0043] In some embodiments, the lyophobic film layer 400 includes one or both of a hydrophobic film layer and an oleophobic film layer.

[0044] In some embodiments, the connection between the hydrophobic film layer and the atomizing sheet 200 is achieved using a vacuum deposition process. For example, the vacuum deposition process includes Kaufman ion bombardment and electron gun physical deposition.

[0045] In some embodiments, the preparation of the hydrophobic film layer specifically includes the following steps, such as... Figure 5 As shown:

[0046] (1) Silicon substrate preparation

[0047] Cleaning: First, the silicon substrate of the atomizing sheet is cleaned to remove contaminants, dust particles, or natural oxide layers, ensuring that the surface of the silicon substrate is clean. The thickness of the silicon substrate is 10μm~300μm.

[0048] Drying: Use nitrogen purging or other appropriate drying methods to completely dry the silicon substrate.

[0049] (2) Kaufman ion bombardment treatment

[0050] Vacuum environment: The cleaned silicon substrate is placed in a vacuum chamber and evacuated to a high vacuum state, typically 10. -4 Pa~10 -6 Pa.

[0051] Ion source startup: Turn on the Kaufman ion source, select an appropriate gas (such as argon), and adjust the ion energy and dose.

[0052] Surface modification: By controlling the energy, angle and bombardment time of the ion beam, the microstructure of the silicon substrate surface can be adjusted, thereby increasing the surface roughness of the silicon substrate and improving the adhesion between the subsequent deposited layer and the silicon substrate.

[0053] (3) Electron gun physical deposition

[0054] Material selection (taking hydrophobic membrane as an example): Select appropriate materials (such as metals, polymers, composite materials, etc.) as targets according to the properties of the hydrophobic membrane to be prepared. For example, targets include hexamethyldisiloxane (HMDSO).

[0055] Evaporation deposition: The target material is heated by an electron gun until it evaporates, so that the target material is deposited on the surface of a silicon substrate that has been bombarded by ions in the form of atoms or molecules.

[0056] Film thickness control: The thickness of the formed hydrophobic film is precisely controlled by adjusting the deposition time and rate to ensure that it has good hydrophobic properties. The thickness of the hydrophobic film is generally 30nm~50nm.

[0057] Coating: The process of coating a silicon substrate with a hydrophobic film onto the surface of the atomizing sheet.

[0058] (4) Post-processing

[0059] Annealing: Sometimes, in order to further improve the quality of the hydrophobic film, the deposited sample may be heat-treated (annealed) to promote the optimization of the hydrophobic internal structure and better bonding with the silicon substrate.

[0060] (5) Testing and characterization

[0061] The performance of the prepared hydrophobic film was tested using equipment such as a contact angle meter. The performance of the hydrophobic film includes indicators such as water contact angle and uniformity.

[0062] In some embodiments, the water contact angle of the hydrophobic film layer is controlled to be greater than 110°. For example, the water contact angle of the hydrophobic film layer is controlled to be around 130° in this application.

[0063] In some embodiments, a surface treatment step is performed on the surface of the atomizing sheet 200 before preparing the hydrophobic film layer on the atomizing sheet 200.

[0064] In some embodiments, the surface treatment of the atomizing sheet 200 includes a plasma treatment process. In the plasma treatment process, O2 or Ar plasma is used, the plasma generator power is 50W~100W, and the treatment time is 1min~5min. Surface treatment of the atomizing sheet 200 can improve the surface activity of the atomizing sheet 200 and ensure the adhesion between the silicon substrate and the atomizing sheet.

[0065] In some embodiments, the mechanism of oxygen plasma treatment is as follows: oxygen plasma treatment mainly reacts with the silicon substrate surface by generating highly reactive oxygen atoms, oxygen molecular ions, and other oxygen groups. This treatment method can effectively remove organic contaminants and form a thin oxide layer on the silicon substrate surface. Oxygen plasma treatment is used to remove organic residues on the silicon substrate surface. It also improves the hydrophilicity of the silicon substrate surface by introducing hydroxyl (-OH) groups, making it more suitable for subsequent coating processes. Furthermore, it improves the adhesion between the silicon substrate and other materials (such as metals, polymers, etc.), which is beneficial for the manufacture of multilayer structures.

[0066] Argon plasma treatment is primarily a physical sputtering process that uses high-energy argon ions to bombard the surface of a silicon substrate, thereby physically removing surface contaminants. Argon is an inert gas and will not chemically react with the silicon substrate surface. Argon plasma treatment is suitable for removing inorganic contaminants from silicon substrate surfaces, such as dust particles and metallic impurities. Although argon plasma itself does not directly change the surface chemical properties, it can activate the silicon substrate surface through physical sputtering, preparing it for subsequent coating processes.

[0067] In some embodiments, the surface of the hydrophobic film layer away from the atomizing plate 200 has a micron- and / or nano-scale rough structure.

[0068] In some embodiments, the rough structure can be prepared by means of photolithography and etching processes, forming a micron- and / or nano-scale rough structure composed of several micron- or nano-grooves on the surface of the hydrophobic film away from the atomizing sheet 200. The rough structure can synergistically enhance the hydrophobicity or oleophobicity of the hydrophobic film.

[0069] In some embodiments, the method for preparing the rough structure specifically includes the following steps, such as... Figure 6 As shown:

[0070] (1) Silicon substrate preparation

[0071] Cleaning: Thoroughly clean the silicon substrate containing the hydrophobic film to remove contaminants from the surface of the hydrophobic film.

[0072] (2) Photoresist coating

[0073] Spin coating: The process of uniformly spin-coating photoresist onto a hydrophobic film layer. Photoresist is a photosensitive polymer material, which can be classified into positive and negative photoresists based on whether it dissolves after exposure.

[0074] Soft baking: The spin-coated silicon substrate and hydrophobic film layer need to undergo a gentle heating process to evaporate the solvent in the photoresist and improve the stability of the photoresist layer.

[0075] (3) Exposure

[0076] Mask alignment: Precisely aligning the designed mask with the target area on the hydrophobic film layer. The mask has a patterned structure.

[0077] Exposure: The photomask is illuminated with ultraviolet light or other light sources, allowing light to pass through the gaps in the mask and reach the photoresist, triggering a photochemical reaction. For positive photoresist, the exposed areas are dissolved by the developer; for negative photoresist, the unexposed areas dissolve. This application allows for the setting of photoresist properties based on a patterned mask.

[0078] (4) Development

[0079] Remove exposed or unexposed areas: Immerse the silicon substrate and hydrophobic film layer in the developer to remove unwanted photoresist areas, leaving the photoresist template with the desired pattern.

[0080] (5) Perimembranes

[0081] Curing photoresist: After development, a hard bake is usually required to further cure the photoresist and enhance its resistance to etching.

[0082] (6) Etching

[0083] Dry etching / wet etching: These methods use physical or chemical means to remove the hydrophobic film layer not protected by the photoresist. Dry etching often employs plasma etching technology, enabling higher resolution and finer structures; wet etching utilizes a chemical solution to react with the hydrophobic film material. The etching depth can be set according to the depth of micrometer or nanometer trenches.

[0084] (7) Remove photoresist

[0085] Stripping: Remove the remaining photoresist from the hydrophobic film layer to complete the fabrication of micron- and / or nano-scale rough structures.

[0086] In some embodiments, the atomizing sheet 200 includes a silicon substrate.

[0087] In some embodiments, the thickness of the silicon substrate is 10 μm to 300 μm. The thickness of the silicon substrate can be any value in between.

[0088] In some embodiments, the thickness of the hydrophobic film layer is 30 nm to 50 nm. The thickness of the hydrophobic film layer includes, but is not limited to, 30 nm, 32 nm, 35 nm, 40 nm, 42 nm, 45 nm, 48 nm, 50 nm, or any range between the foregoing.

[0089] In some embodiments, the hydrophobic film layer is a hydrophobic film layer, which can prevent condensation on the surface of the atomizing plate for some water-based essential oils.

[0090] In some embodiments, the hydrophobic film layer may be a silicon carbide nanocomposite coating with a hardness of 30 GPa to 45 GPa, and the surface may be modified with a long-chain silane (such as OTS).

[0091] In some embodiments, the hydrophobic film layer is an oleophobic film layer, which can prevent condensation on the surface of the atomizing plate for some oily essential oils. The oleophobic film layer can be a perfluoroalkyl acrylate coating with a contact angle (to oil) of 80° to 110°.

[0092] In some embodiments, the hydrophobic film layer comprises a plasma polymer film layer. The material of the plasma polymer film layer includes a hexamethyldisiloxane (HMDSO) plasma polymer, which forms the hydrophobic film layer through a Si-O-Si network.

[0093] In some embodiments, the atomizing container 100 further includes an atomizing channel. One end of the atomizing channel is connected to the atomizing opening 102, and the other end is connected to the receiving chamber 101. The atomizing plate 200 is disposed within the atomizing channel and has a gap with the inner wall of the atomizing channel, so that the atomized mist can be ejected through the gap.

[0094] In some embodiments, one end of the adsorption component 300 extends into the atomizing channel and abuts against the atomizing plate 200.

[0095] In some embodiments, the atomizing channel is a straight channel, which facilitates the rapid ejection of the atomized airflow.

[0096] In some of these implementations, please refer again. Figure 2 As shown, the adsorption assembly 300 also includes an adsorption element 301 and a mounting bracket 302. The adsorption element 301 is mounted on the inner wall of the accommodating chamber 101 via the mounting bracket 302.

[0097] In some embodiments, the adsorption element 301 includes a sponge.

[0098] In some embodiments, the atomizing container 100 is provided with a detachably connected cover 103. The cover 103 is provided with an atomizing opening 102. The cover 103 can open the receiving chamber 101 of the atomizing container 100 to install or remove the adsorption assembly 300.

[0099] In some embodiments, the atomizing container 100 is also provided with a liquid filling port that communicates with the accommodating chamber 101 and can be opened or closed.

[0100] One embodiment of this application also provides a blower device.

[0101] Please see Figure 4 The diagram shown is a schematic of a hair dryer according to an embodiment of this application. The hair dryer includes a hair dryer 20 and an atomizing mechanism 10 as described in any of the above embodiments. The hair dryer 20 has a mounting hole 21. The atomizing container 100 of the atomizing mechanism 10 is disposed within the mounting hole 21, with the atomizing opening 102 of the atomizing container 100 facing outwards. The atomizing plate 200 of the atomizing mechanism 10 is powered by the power supply of the hair dryer 20. The atomizing plate 200 of the atomizing mechanism 10 is electrically connected to the control mechanism of the hair dryer 20 and can perform atomization under the control of the hair dryer 20.

[0102] In some embodiments, the oscillation frequency of the atomizing plate 200 can be 1.7 MHz or 2.4 MHz.

[0103] In some embodiments, the atomizing mechanism 10 is detachably connected to the blower 20. The atomizing mechanism 10 can be replaced periodically.

[0104] The aforementioned atomizing mechanism 10 forms a hydrophobic film layer by coating the atomizing plate 200. The hydrophobic film layer can improve the hydrophobic performance, reduce the adhesion of the atomizing liquid, and improve the atomization effect and service life of the atomizing plate 200, thereby increasing the lifespan of a single atomizing plate 200 from about 50 days in the traditional technology to no less than 200 days.

[0105] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0106] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0107] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. An atomizing mechanism for a blow dryer, characterized by, The device includes an atomizing container and an atomizing plate. The atomizing container has a receiving chamber for containing atomizing liquid and an atomizing opening communicating with the receiving chamber. The atomizing plate is disposed in the atomizing opening, and a hydrophobic film layer is provided on the surface of the atomizing plate facing away from the receiving chamber.

2. The atomizing mechanism according to claim 1, characterized in that, The surface of the hydrophobic film layer away from the atomizing sheet has a rough structure at the micron and / or nanometer scale.

3. The atomizing mechanism according to claim 2, characterized in that, The atomizing sheet includes a silicon substrate, and the hydrophobic film layer is deposited on the surface of the silicon substrate.

4. The atomizing mechanism according to claim 3, characterized in that, The thickness of the silicon substrate is 10μm to 300μm.

5. The atomizing mechanism according to any one of claims 1 to 4, characterized in that, The liquid-repellent film layer is a hydrophobic film layer, and the water contact angle of the hydrophobic film layer is greater than 110°; The thickness of the hydrophobic film is 30nm~50nm.

6. The atomizing mechanism according to claim 5, characterized in that, The hydrophobic film layer is a silicon carbide nanocomposite coating.

7. The atomizing mechanism according to claim 5, characterized in that, The atomizing container further includes an atomizing channel, one end of which is connected to the atomizing opening and the other end of which is connected to the receiving chamber. The atomizing plate is disposed in the atomizing channel and has a gap with the inner wall of the atomizing channel.

8. The atomizing mechanism according to any one of claims 1-4 and 6-7, characterized in that, The atomizing mechanism also includes an adsorption component, one end of which extends to abut against the atomizing sheet, and the other end extends into the accommodating cavity.

9. The atomizing mechanism according to any one of claims 1-4 and 6-7, characterized in that, The atomizing container is provided with a detachable cover, and the cover is provided with the atomizing opening; And / or, the atomizing container is also provided with a liquid inlet that communicates with the accommodating chamber and can be opened or closed.

10. A blower device, characterized in that, The device includes a hair dryer and an atomizing mechanism as described in any one of claims 1 to 9, wherein the hair dryer is provided with a mounting hole, the atomizing container of the atomizing mechanism is disposed in the mounting hole, and the atomizing opening of the atomizing container faces outward.

Images