A gluing device for splicing silicon rods

Abstract

The utility model provides a kind of gluing device of spliced silicon rod, comprising: transmission unit, identification unit, gluing unit and control unit;The identification unit is placed in one end of the transmission unit, for identifying the silicon rod to be processed;The gluing unit is placed in one side of the transmission unit, for along the transmission unit movement to carry out gluing to the transmission unit;The control unit is electrically connected with the identification unit and the gluing unit respectively, for after receiving the information of the silicon rod, the gluing unit is controlled to carry out gluing at different speeds.By identification unit obtains silicon rod information, and by control unit according to the information control gluing speed of gluing unit, the intelligent control of gluing process is realized, effectively improves the automation level of gluing operation, reduces the instability brought by manual operation.

Description

Technical Field

[0001] This utility model relates to the photovoltaic field, specifically to a coating device for splicing silicon rods. Background Technology

[0002] Competition in the photovoltaic industry is becoming increasingly fierce, and the level of automation in each manufacturing link is constantly improving to meet the operational needs of enterprises to reduce costs and increase efficiency. Before 2018, in the upstream wafer slicing unit of the photovoltaic industry chain, the silicon rod bonding process mainly adopted a manual mixing and manual application of adhesive. This mode has several problems: on the one hand, due to the high dependence on manual operation, it is necessary to manually weigh and control the weight and ratio of adhesive for each cut, resulting in differences in the amount of adhesive used and the consistency of adhesive mixing between silicon rod cuts; on the other hand, the weight of a single silicon rod is between 60kg and 90kg, and it is difficult for personnel to accurately control the relative position of the silicon rod with the resin board and the crystal drag of the slicing machine, which easily leads to situations such as misaligned silicon rod bonding and empty adhesive, requiring rework.

[0003] To address these issues, specialized equipment manufacturers in the industry launched their first generation of automated adhesive bonding equipment around 2018. After several years of innovation and upgrades, the functions of automated adhesive bonding lines have been continuously enriched, and leading companies now possess the capability for fully automated operation of the adhesive bonding process. Through the rational matching of control units and equipment process parameters, standardized adhesive coating for both plate adhesive and stick adhesive layers has been achieved in core operational steps such as adhesive supply, mixing, and application, significantly reducing the quality differences in silicone rod coating between different cutting passes.

[0004] However, standardized adhesive coating still presents technical challenges in practical applications. When matching single silicon rods, after the rod is placed on the adhesive surface and pressure is applied with counterweight, the adhesive can overflow normally around the adhesive surface of the single rod, with no voids in the adhesive layer, and the shape meets the process requirements. However, in splicing rod applications, because the adhesive at the splicing seam is squeezed into the middle of the two silicon rods, the effective amount of adhesive near the end faces of the two silicon rods at the splicing seam is insufficient. After pressure is applied with counterweight, some adhesive on both sides cannot overflow normally during the cut. Specifically, voids appear with a length of 0mm-50mm and a depth of 0mm-10mm, with a void rate in the range of 1%-5%. This void can cause the diamond wire saw to break when cutting to the adhesive layer or get stuck when raising the rod to the adhesive layer after cutting, which not only affects the efficiency of the slicing machine but also leads to the loss of silicon wafers and diamond wires. Utility Model Content

[0005] The purpose of this invention is to solve the problem of empty glue at the splicing seam of splicing rods in the prior art.

[0006] This utility model provides a coating device for splicing silicon rods, including: a transmission unit, an identification unit, a coating unit, and a control unit;

[0007] The identification unit is located at one end of the transmission unit and is used to identify the silicon rod to be processed;

[0008] The adhesive application unit is positioned on one side of the transmission unit and is used to move along the transmission unit to apply adhesive to the transmission unit.

[0009] The control unit is electrically connected to the identification unit and the coating unit respectively, and is used to control the coating unit to apply adhesive at different speeds after receiving the information from the silicon rod.

[0010] Furthermore, the identification unit includes: a bracket; a telescopic mechanism mounted on the bracket; and an identification element disposed on the telescopic mechanism.

[0011] Furthermore, the control unit is also connected to the MES system, and the control unit obtains the information of the silicon rod from the MES system through the LOT number identified by the identification unit.

[0012] Furthermore, the control unit is also used for:

[0013] The location of the silicon rod splice seam is determined based on the silicon rod length information;

[0014] The adhesive application unit is controlled to reduce the adhesive application speed at a preset distance from the splice seam.

[0015] Furthermore, the transmission unit includes a workpiece plate and a resin plate, with the resin plate fixed to the workpiece plate;

[0016] After the adhesive coating unit applies the adhesive, an adhesive layer is formed on the resin board, and the adhesive layer includes a thick adhesive layer.

[0017] Furthermore, the seam is placed on the thick adhesive layer.

[0018] Furthermore, the preset length is 10mm-15mm.

[0019] Furthermore, the glue-applying unit reduces the glue-applying speed and runs for two preset lengths before resuming the original glue-applying speed.

[0020] Furthermore, the glue dispensing rate of the glue-applying unit at the preset length is the same as the glue dispensing rate at other locations.

[0021] Furthermore, it also includes a storage unit that is communicatively connected to the control unit, the storage unit being used to store silicon rod information.

[0022] Compared to existing technologies, this invention offers at least the following advantages: By acquiring silicon rod information through an identification unit and controlling the adhesive application speed of the coating unit based on this information, intelligent control of the coating process is achieved, effectively improving the automation level of the coating operation and reducing the instability caused by manual operation. The identification unit accurately acquires the length information of the silicon rod, providing a data basis for precise adjustment of the subsequent adhesive application speed and helping to improve the accuracy of the coating operation. The design of the coating unit moving along the transmission unit allows it to flexibly adjust the adhesive application speed according to the instructions of the control unit, especially at the splice seam, where deceleration can be achieved to ensure sufficient adhesive application at the splice seam, effectively solving the technical problem of empty adhesive at the splice seam. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0024] Figure 1 This is a structural block diagram of the adhesive application device in one embodiment of the present invention;

[0025] Figure 2 This is a schematic diagram of a silicon rod placed on a coating device in one embodiment of the present invention;

[0026] Figure 3 This is a schematic diagram of the identification unit in one embodiment of the present invention.

[0027] Figure 4 This is a front view of the end face of a silicon rod in one embodiment of the present invention;

[0028] Figure 5 This is a schematic diagram of a transmission unit in one embodiment of the present invention;

[0029] Figure 6 This is a schematic diagram of a silicon rod placed on a transmission unit in one embodiment of the present invention;

[0030] Among them, 1-transmission unit; 11-workpiece plate; 12-resin plate; 13-iron plate adhesive layer; 2-identification unit; 21-support; 22-telescopic structure; 23-identification component; 3-adhesive application unit; 4-silicon rod; 41-information code; 42-joint seam; 5-adhesive layer; 51-thick adhesive layer. Detailed Implementation

[0031] The present invention will now be described in more detail with reference to the accompanying drawings, which illustrate preferred embodiments of the present invention. It should be understood that those skilled in the art can modify the present invention described herein while still achieving its advantageous effects. Therefore, the following description should be understood as being broadly known to those skilled in the art and is not intended to limit the present invention.

[0032] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0033] The present invention will be described in more detail below by way of example with reference to the accompanying drawings. The advantages and features of the present invention will become clearer from the following description. It should be noted that the drawings are in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of the present invention.

[0034] This embodiment provides a coating device for splicing silicon rods. Please refer to [reference needed]. Figures 1-6 It includes: a transmission unit 1, an identification unit 2, an adhesive application unit 3, and a control unit.

[0035] The identification unit 2 is placed at one end of the transmission unit 1 and is used to identify the silicon rod 4 to be processed.

[0036] The glue-applying unit 3 is placed on one side of the transmission unit 1 and is used to move along the transmission unit 1 to apply glue to the transmission unit 1.

[0037] The control unit is electrically connected to the identification unit 2 and the coating unit 3 respectively; it is used to control the coating unit 3 to switch different coating speeds after receiving information from the silicon rod 4.

[0038] The adhesive coating device for splicing silicon rods in this embodiment mainly consists of four parts: a transmission unit 1, an identification unit 2, an adhesive coating unit 3, and a control unit. After obtaining information about the silicon rod 4, the adhesive coating unit 3 can switch between different coating speeds according to a preset correspondence. For example, at the splicing seam 42, the adhesive coating speed can be reduced to ensure sufficient adhesive at the splicing seam 42, effectively solving the technical problem of empty adhesive at the splicing seam.

[0039] Furthermore, the transmission unit 1 includes a workpiece plate 11 and a resin plate 12, with the resin plate 12 fixed on the workpiece plate 11.

[0040] The transmission unit 1 is used to transport the silicone rod 4 to be coated with adhesive. In this embodiment, the transmission unit 1 is disposed on a transmission line and moves along the transmission line. The transmission unit 1 includes a workpiece plate 11 disposed on the transmission line, and a resin plate 12 is disposed on the workpiece plate 11. The workpiece plate 11 and the resin plate 12 are fixed together by an iron plate adhesive layer 13. The adhesive coating unit 3 moves along the transmission unit 1 to apply adhesive to the resin plate 12.

[0041] The identification unit 2 is provided at one end of the transmission unit 1. The identification unit 2 can obtain relevant information about the silicon rod 4, especially the length information of the silicon rod 4.

[0042] The glue application unit 3 is installed on one side of the transmission line and can move along the transmission direction of the transmission line to perform glue application on the resin board 12.

[0043] The control unit stores the matching relationship between silicon rod information and coating speed. Specifically, the control unit stores information such as the type, batch information, length information, and moving speed of the coating unit 3 for the silicon rod 4. The moving speed is set according to the specific type, length information, and / or batch information of the silicon rod 4. The type and / or length information of the silicon rod 4 stored in the control unit includes the position information of the splice seam 42. Generally, silicon rods of the same type and / or the same length have the same position of the splice seam 42. In addition, the control unit also stores the relationship between the moving speed and the splice seam 42. For example, when the distance from the splice seam 42 is greater than a preset length, the first moving speed is maintained; when the distance from the splice seam 42 is less than or equal to the preset length, the second moving speed is maintained, and the second moving speed is less than the first moving speed. It should be noted that the preset length from the splice seam 42 includes the distance when close to the splice seam 42 and the distance when far from the splice seam 42. Furthermore, the control unit also stores the relationship between the moving speed and the splice seam 42 under different batch information.

[0044] The control unit is responsible for receiving the information collected by the identification unit 2 and automatically adjusting the running speed of the glue application unit 3 according to the pre-set matching relationship.

[0045] Furthermore, the matching relationship may also include the corresponding coating pressure and flow rate based on the material characteristics, surface condition and coating requirements of the silicon rod 4, so as to meet the coating uniformity while adapting to different process requirements, and ultimately achieve precise coating control for silicon rods 4 of different specifications, thereby improving the coating quality stability and production efficiency, while reducing manual intervention and material waste.

[0046] Furthermore, the control unit may have a built-in storage unit or may be communicatively connected to an external storage unit, which may be an independent database or server. The storage unit is used to store the matching relationship between silicon rod information and coating speed.

[0047] The storage unit can be a standalone database or server.

[0048] The storage unit can store historical data on adhesive application speed. Furthermore, the storage unit can also have data backup and recovery functions to prevent data loss.

[0049] By introducing a storage unit, the management and storage of silicon rod information can be effectively solved. Silicon rod information can be systematically stored and managed, ensuring data accuracy and traceability. Specifically, the storage unit can record and update silicon rod information in real time, enabling the control unit to make accurate decisions based on the latest data, thereby improving the precision and efficiency of the coating process. Furthermore, the introduction of the storage unit also allows silicon rod information to be shared between different devices, further enhancing the collaborative efficiency of the entire production line.

[0050] According to the control unit in the above embodiment, the device can automatically select the coating parameters according to the specific situation of the silicon rod 4. In particular, the coating speed can be adjusted according to the distance during the coating process, thereby improving the coating quality.

[0051] For further details, please refer to... Figure 3 In one embodiment, the identification unit 2 includes a bracket 21, a telescopic mechanism 22 mounted on the bracket 21, and an identification element 23 disposed on the telescopic mechanism 22.

[0052] The bracket 21 is used to fix and support the entire identification unit 2, and the telescopic mechanism 22 is used to adjust the height of the identification element 23 to accommodate silicon rods 4 of different sizes. The identification element 23 is used to scan information on the silicon rod 4, such as the length of the silicon rod 4. Specifically, the bracket 21 can be made of metal to ensure its stability and durability. The telescopic mechanism 22 can be electrically or pneumatically operated and precisely adjusted by a control unit. The identification element 23 can use laser scanning or image recognition technology to achieve rapid and accurate identification of the information on the silicon rod 4.

[0053] In a preferred embodiment, the telescopic mechanism 22 can be equipped with a position sensor to provide real-time feedback on the height position of the identification element 23, thereby improving the accuracy of the scanning process. The identification element 23 is, for example, an industrial camera, such as a CCD camera, which can be equipped with autofocus to adapt to silicon rods 4 at different distances. By introducing the telescopic mechanism 22 and the identification element 23, automatic identification of the silicon rod 4 is achieved, solving the problems of low efficiency and poor accuracy in traditional manual operation. Compared with existing technologies, this solution improves the automation and accuracy of silicon rod information identification and reduces the need for manual intervention.

[0054] In addition, in one embodiment, the identification unit 2 includes a sensor, for example, mounted on one side of the transmission line, capable of measuring the length of the silicon rod 4 and transmitting the measurement result to the control unit.

[0055] The length information of silicon rod 4 refers to the specific length data of silicon rod 4 obtained through identification unit 2. This information can be obtained in various ways, such as reading the information code 41 on silicon rod 4 through identification unit 2, or measuring the length of silicon rod 4 through a sensor. Obtaining the length information of silicon rod 4 is the basis for realizing subsequent adhesive coating control.

[0056] As an example, the length information of the silicon rod 4 can be obtained in the following way: the identification unit 2 identifies the information code 41 on the silicon rod 4 (such as...). Figure 4 The control unit scans the silicon rod 4 (as shown) to obtain its identification information. After receiving the information identified by the scan (such as the type of silicon rod), the control unit can obtain the corresponding coating speed from the preset matching relationship.

[0057] As an example, the identification unit 2 scans the information code 41 on the silicon rod 4 to obtain the identification information of the silicon rod 4. The control unit retrieves the corresponding information of the silicon rod 4 from the MES (Manufacturing Execution System) using this identification information, thereby obtaining the corresponding coating speed from a preset matching relationship.

[0058] Specifically, a Manufacturing Execution System (MES) is a software system used to manage and monitor the production process, capable of collecting and analyzing production data in real time. In this application, the MES system is connected to a control unit, and the information of silicon rod 4 is obtained from the MES system through the LOT number (batch number) identified by the identification unit 2. This method enables the control unit to obtain the production batch information of silicon rod 4 in real time, thereby selecting the corresponding coating parameters according to different batch information, improving the accuracy and consistency of the coating process.

[0059] The MES system can communicate with the control unit via a network interface.

[0060] As an example, the identification unit 2 measures the length of the silicon rod 4, and after receiving the measured length information, the control system can obtain the corresponding coating speed from the preset matching relationship.

[0061] By acquiring the length information of the silicon rod 4, precise data support can be provided for subsequent adhesive application control. Specifically, since the information of the silicon rod stored in the control unit includes the position information of the splice seam 42, when the type or length information of the silicon rod 4 is obtained, the position of the splice seam 42 is also determined simultaneously, thereby controlling the adhesive application speed and amount at the positions before and after the splice seam 42 by the adhesive application unit 3. This technical solution solves the problem of insufficient adhesive at the splice seam 42 in the prior art, avoids the occurrence of empty adhesive, and improves the uniformity and consistency of adhesive application. Compared with the prior art, this application achieves precise control of the adhesive application process by introducing information recognition of the silicon rod 4, significantly improving the adhesive application quality.

[0062] Furthermore, the control unit controls the glue application unit 3 to reduce the glue application speed at a preset distance from the splice seam 42.

[0063] In this embodiment, the control unit can obtain information about the silicon rod 4 in the manner described above, and then determine the position of the splice seam 42. The speed control of the glue application unit 3 can be achieved by a servo motor or a stepper motor, improving the accuracy of glue application speed adjustment at positions before and after the splice seam 42. In addition, the amount of glue applied can be increased by adjusting the glue dispensing amount or glue application pressure of the glue application head, so that the amount of glue at the splice seam 42 is sufficient.

[0064] Specifically, the preset length can be adjusted according to the length of the silicon rod 4 and the position of the splice seam 42 to improve the uniformity and consistency of the adhesive coating. For example, the preset length can be set between 10mm and 20mm, such as 12mm, 15mm, 18mm, etc., and the specific value can be adjusted according to actual production needs.

[0065] As an example, a deceleration zone (the distance of deceleration) can be preset in the control unit. This zone starts 15mm before the splice seam 42 and ends 15mm after the splice seam 42, meaning the length of the entire deceleration zone is equal to two preset lengths, or 30mm. The splice seam 42 is located in the middle of the deceleration zone. When the glue application unit 3 enters this zone, it will automatically reduce the glue application speed.

[0066] Furthermore, the glue application unit 3 reduces the glue application speed and runs for two preset lengths before resuming the original glue application speed.

[0067] In one implementation, the adhesive application unit 3 applies adhesive at a constant speed of 25% of the maximum speed before the deceleration zone, applies adhesive at a constant speed of 10% of the maximum speed within the deceleration zone, and continues to apply adhesive at a constant speed of 25% of the maximum speed after the deceleration zone.

[0068] Furthermore, the amount of adhesive applied by the adhesive application unit 3 at the positions before and after the splice seam 42 is greater than the amount of adhesive applied at other positions.

[0069] Specifically, reducing the operating speed of the adhesive application unit 3 at positions before and after the splice seam 42 increases the amount of adhesive applied. This can also be achieved by adjusting the adhesive application speed or pressure of the adhesive application unit 3. For example, the adhesive application unit 3 can increase the adhesive application time at the splice seam 42, or increase the adhesive application pressure to ensure that more adhesive is applied to the splice seam 42. As a preferred embodiment, the adhesive application unit 3 can be equipped with additional adhesive application nozzles at the splice seam 42 to increase the amount of adhesive applied.

[0070] After the glue coating unit 3 applies the glue, an adhesive layer 5 is formed on the resin board 12, and the adhesive layer 5 includes a thick adhesive layer 51.

[0071] Please refer to Figure 5 After the adhesive is applied, an adhesive layer 5 is formed on the resin board 12. The adhesive layer 5 includes a thick adhesive layer 51, which corresponds to the joint 42 of the silicon rod 4. After the adhesive application is complete, please refer to... Figure 6 Place the silicon rod 4 on the adhesive layer 5. In order to make the splice seam 42 fall into the area of ​​the thick adhesive layer 51, one end of the workpiece plate 11 can be selected as the standard end. The silicon rod 4 is placed aligned with the standard end so that the splice seam 42 covers the thick adhesive layer 51.

[0072] Therefore, the technical solution of this application effectively solves the problem of insufficient adhesive at the splicing seam 42 in splicing rod application scenarios by increasing the amount of adhesive applied at the splicing seam 42. Specifically, because the adhesive at the splicing seam 42 is squeezed between the two silicon rods 4, the effective amount of adhesive is insufficient, and after the counterweight is applied, the adhesive on both sides of the stick-bonding rod cannot overflow normally during the cutting process. By increasing the amount of adhesive applied at the splicing seam 42, it can be ensured that the adhesive overflows fully at the splicing seam 42, avoiding the phenomenon of empty adhesive, thereby improving the stability and consistency of the adhesive bonding of the silicon rods 4.

[0073] Furthermore, a waiting station is provided on the transmission line, and the identification unit 2 is initially located at the waiting station.

[0074] The waiting station refers to a specific location set on the transmission line for temporarily storing the silicon rod 4 for information identification and processing. The waiting station allows the silicon rod 4 to remain at the designated location during transmission, enabling the identification unit 2 to accurately read the information from the silicon rod 4.

[0075] Specifically, the waiting station can be set up in several ways. For example, the waiting station can be a fixed position on a robotic arm or conveyor belt. The silicon rod 4 stops when it reaches this position, waits for the identification unit 2 to complete reading the information, and then applies adhesive to the workpiece plate 11. After the adhesive application is completed and the silicon rod 4 is transferred to the corresponding workpiece plate 11, the transmission continues. In addition, the waiting station can also be equipped with sensors to detect whether the silicon rod 4 is in place and trigger the operation of the identification unit 2.

[0076] The above-described specific examples are for illustrative purposes only and are not intended to limit the scope of this invention. Those skilled in the art to which this invention pertains can make various simple deductions, modifications, or substitutions based on the concept of this invention.

Claims

1. A device for applying glue to splice silicon rods, characterized by, include: The system includes a transmission unit, an identification unit, an adhesive application unit, and a control unit. The identification unit is located at one end of the transmission unit and is used to identify the silicon rod to be processed; The adhesive application unit is positioned on one side of the transmission unit and is used to move along the transmission unit to apply adhesive to the transmission unit. The control unit is electrically connected to the identification unit and the coating unit respectively, and is used to control the coating unit to apply adhesive at different speeds after receiving the information from the silicon rod.

2. The adhesive applicator as described in claim 1, characterized in that, The identification unit includes: a bracket; a telescopic mechanism mounted on the bracket; and an identification element disposed on the telescopic mechanism.

3. The adhesive applicator as described in claim 2, characterized in that, The control unit is also connected to the MES system, and the control unit obtains the information of the silicon rod from the MES system through the LOT number identified by the identification unit.

4. The adhesive applicator as described in claim 1, characterized in that, The control unit is also used for: The location of the silicon rod splice seam is determined based on the silicon rod length information; The adhesive application unit is controlled to reduce its moving speed at a preset distance from the splice seam.

5. The adhesive applicator as described in claim 4, characterized in that, The transmission unit includes a workpiece plate and a resin plate, with the resin plate fixed to the workpiece plate. After the adhesive coating unit applies the adhesive, an adhesive layer is formed on the resin board, and the adhesive layer includes a thick adhesive layer.

6. The adhesive applicator as described in claim 5, characterized in that, The seam is placed on the thick adhesive layer.

7. The adhesive applicator as described in claim 4, characterized in that, The preset length is 10mm-15mm.

8. The adhesive applicator as described in claim 4, characterized in that, The adhesive application unit reduces its moving speed, travels one preset length to reach the seam, continues to travel one preset length, and then resumes its original moving speed.

9. The adhesive applicator as described in claim 4, characterized in that, The glue dispensing rate of the glue-applying unit at the preset length is the same as the glue dispensing rate at other locations.

10. The adhesive applicator as claimed in claim 1, characterized in that, It also includes a storage unit that is communicatively connected to the control unit, the storage unit being used to store information about the silicon rod.

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