Anti-tin-bleeding pin-preparation tin tool

Abstract

The utility model provides a kind of anti-slip tin's PIN needle prefabricated tin tool, including upper plate and lower plate;Silicone rubber gasket is arranged between the upper plate and the lower plate, and the through-hole corresponding with PIN needle position is opened on the silicone rubber gasket;Lock screw is used to compress and fix the upper plate, the lower plate and the silicone rubber gasket;Wherein, the silicone rubber gasket is clamped by elastic deformation PIN needle, to fix PIN needle and close the gap between needle body and needle holder.The utility model effectively closes the gap between needle body and needle holder by the close wrapping of elastic material, solves the needle body pollution and tin ball forming problem caused by the flow of molten solder along the gap, significantly improves the process yield of prefabricated tin ball and product reliability.

Description

Technical Field

[0001] This utility model relates to a PIN pin pre-formed solder tooling for preventing solder from dripping. Background Technology

[0002] In the power module packaging process, separate PIN pins need to be soldered to the substrate to achieve electrical signal transmission. Before soldering, solder balls need to be pre-formed at the bottom of the PIN pin holder. Traditional processes use vacuum adsorption to fix the PIN pins, but there are the following drawbacks: 1) PIN pins are stuck and carried away by the soldering head: The viscosity of molten solder easily causes the PIN pins to stick when the soldering head is lifted, resulting in soldering head displacement or PIN pin bending and scrapping; 2) Excessive solder flow: There is a gap between the PIN body and the holder of the separate PIN pin. The vacuum adsorption force will cause molten solder to be drawn along the gap to the surface of the PIN body, resulting in PIN body contamination and insufficient solder in the holder; 3) Low yield: The above problems reduce the yield of the pre-formed solder ball process by about 50%. To solve the above problems, this utility model provides a separate tooling. Utility Model Content

[0003] This invention provides a pre-soldering fixture for preventing solder dripping in PIN pins, which can effectively solve the above-mentioned problems.

[0004] This utility model is implemented as follows:

[0005] A PIN pin pre-formed solder tooling for preventing solder dripping, including

[0006] upper and lower plates;

[0007] PIN needle body, and PIN needle holder disposed at one end of the PIN needle body;

[0008] A silicone rubber gasket is disposed between the upper plate and the lower plate, and the silicone rubber gasket has through holes corresponding to the positions of the PIN pins.

[0009] The fastening screw is used to press and fix the upper plate, the lower plate and the silicone rubber gasket; wherein, the silicone rubber gasket clamps the PIN needle body by elastic deformation to seal the gap between the PIN needle body and the PIN needle seat.

[0010] The beneficial effects of this utility model are:

[0011] (1) This utility model sets a silicone rubber gasket with through holes between the upper plate and the lower plate, and uses locking screws to press and fix the three-layer structure, so that the silicone rubber gasket can generate elastic deformation to clamp the PIN pin. This not only achieves reliable fixation without vacuum adsorption and prevents the PIN pin from sticking and flowing away when the solder head is lifted, but also effectively seals the gap between the pin body and the pin seat through the tight wrapping of elastic material. This solves the problems of pin body contamination and poor solder ball formation caused by molten solder flowing along the gap, and significantly improves the process yield and product reliability of pre-made solder balls. Attached Figure Description

[0012] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0013] Figure 1 This is the front view of this utility model.

[0014] Figure 2 This is an exploded view of the present invention.

[0015] Figure 3 This is a cross-sectional view of the present invention.

[0016] Explanation of icon numbers:

[0017] 10. Upper plate; 20. Lower plate; 30. Silicone rubber gasket; 300. Through hole; 40. First hole; 50. Locking screw; 60. Positioning pin; 70. Second hole; 80. PIN pin body; 800. PIN pin holder. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model. Therefore, the following detailed description of the embodiments of this utility model provided in the accompanying drawings is not intended to limit the scope of the claimed utility model, but merely to represent selected embodiments of this utility model.

[0019] In the description of this utility model, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0020] Reference Figure 1-2 As shown, a PIN pin pre-formed solder tooling for preventing solder dripping includes...

[0021] Upper plate 10 and lower plate 20; upper plate 10 and lower plate 20 are made of metal and are used to provide rigid support; upper plate 10 and lower plate 20 are provided with positioning pins 60 for aligning with the through holes 300 on the silicone rubber gasket 30; upper plate 10 and lower plate 20 are provided with first holes 40 for positioning and locking screws 50.

[0022] PIN needle body 80, and PIN needle holder 800 disposed at one end of the PIN needle body 80.

[0023] The lower plate 20 has vacuum adsorption holes on its side for connection with a vacuum device (not shown in the diagram).

[0024] A silicone rubber gasket 30 is disposed between the upper plate 10 and the lower plate 20. The silicone rubber gasket 30 has through holes corresponding to the positions of the PIN needle body 80. The silicone rubber gasket 30 also has several second holes 70 corresponding to the locking screws 50.

[0025] The through hole 300 is conical, and the diameter of the conical through hole 300 is smaller than the diameter of the PIN needle seat 800, so as to form a radial compression on the PIN needle body 80.

[0026] Specifically, refer to Figure 3As shown, the thickness of the silicone rubber gasket 30 is approximately 2mm. When the locking screw 50 is tightened, the silicone rubber gasket 30 is compressed as a whole. The axial deformation Δh is usually controlled within the material's elastic limit. Generally, silicone rubber allows a compression rate of 15%-30%. Therefore, if a 20% compression rate is taken, the axial deformation of the 2mm thick silicone rubber gasket 30 is approximately 0.4mm, which is the middle value of 0.3-0.5mm, conforming to the elastic deformation range and avoiding permanent deformation or failure. Furthermore, when the upper plate 10 and the lower plate 20 are locked by the locking screw 50... When pressed down, the conical through hole 300 will deform due to compression, forming a complete sealed contact surface with the outer surface of the PIN needle seat 800. In one embodiment, if the silicone rubber gasket 30 is too thin (<1.5mm), it may result in insufficient elastic deformation space, unstable clamping force, and risk of direct contact between the metal plate and the metal plate, thus losing its buffering effect. If the silicone rubber gasket 30 is too thick (>3mm), it will cause the clamping force of the locking screw 50 to decrease, the hole wall of the conical through hole to deform insufficiently, and the clamping force to decrease.

[0027] Furthermore, the conical through-hole 300, after compression, will generate an inclination angle of 20° < θ < 28°. Preferably, the inclination angle of the conical through-hole 300 is approximately 25°, which allows the silicone rubber gasket 30 to undergo radial deformation under pressure, filling and sealing the gap between the PIN needle seat 800 and the PIN needle body 80. In one embodiment, if the inclination angle of the through-hole 300 is less than 20°, the contact area between the conical hole wall and the PIN needle body 80 will be too concentrated at the orifice, while the bottom of the PIN needle seat 800 will not have sufficient contact, forming a weak sealing area; if the inclination angle of the through-hole 300 is greater than 28°, the contact between the silicone rubber and the PIN needle will become a line contact rather than a surface contact, failing to seal the needle seat gap, and the hole wall of the conical through-hole 300 will be prone to tearing after long-term use, especially at high temperatures.

[0028] The locking screw 50 is used to press and fix the upper plate 10, the lower plate 20 and the silicone rubber gasket 30; wherein, the silicone rubber gasket 30 clamps the PIN needle body 80 through elastic deformation to seal the gap between the silicone rubber gasket 30, the PIN needle body 80 and the PIN needle seat 800.

[0029] There are 4-8 50-type fastening screws, evenly distributed on the tooling.

[0030] Specifically, the method for clamping and fixing the precast solder balls in this case is as follows:

[0031] Step 1: Place the silicone rubber gasket 30 with the tapered through hole and the second hole on the lower plate 20. Use the positioning pin 60 to ensure that the through holes of the upper plate 10, the silicone rubber gasket 30 and the lower plate 20 are precisely aligned. Use the locking screw 50 to pass through the first hole 40 and the second hole 70 to evenly lock the upper plate 10 and the lower plate 20, so that the silicone rubber gasket 30 is deformed by pressure.

[0032] Step 2: Insert the PIN needle body 80 into the tapered through hole of the silicone rubber pad 30. Because the diameter of the through hole 300 is smaller than the diameter of the PIN needle seat 800, the silicone rubber undergoes radial elastic deformation, forming a clamping force. After being compressed, the silicone rubber pad 30 tightly wraps around the PIN needle seat 800, sealing the gap between the PIN needle body 80 and the PIN needle seat 800 to prevent solder from flowing.

[0033] Step 3: Align the soldering machine with the bottom of the PIN pin holder 800 and inject molten solder at 250-280℃. The sealing effect of the silicone rubber gasket 30 prevents the solder from flowing along the gap. After the solder cools, it forms a complete solder ball, without pin contamination or insufficient solder.

[0034] Step 4: Loosen the locking screw 50, the elastic silicone rubber gasket 30 will spring back, making it easy to remove the PIN needle body 80.

[0035] In step two, if vacuum assistance is required, a vacuum device can be connected through the vacuum adsorption hole on the side of the lower plate 20 to enhance the fixing effect (not required).

[0036] Working principle: The upper plate 10 and the lower plate 20 press and fix the middle silicone rubber gasket 30 with locking screws 50, so that the conical through hole of the silicone rubber gasket 30 elastically deforms and radially squeezes the PIN pin, thus firmly fixing the PIN pin without vacuum adsorption; at the same time, the silicone rubber gasket 30 tightly fits the PIN pin, sealing the gap between the pin body and the pin seat, effectively preventing the flow of molten solder, and ensuring that the solder ball is completely formed at the bottom of the pin seat; the positioning pins 60 ensure accurate alignment of the through holes of each layer, while the evenly distributed locking screws 50 provide stable clamping force, and the vacuum adsorption holes on the side of the lower plate 20 can be used as a backup fixing method, ultimately achieving a high-yield pre-made solder ball process.

[0037] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A pre-tinning jig for a pogo pin to prevent tin run-off, characterized in that, include Upper plate (10) and lower plate (20); PIN needle body (80), and PIN needle holder (800) disposed at one end of the PIN needle body (80); A silicone rubber gasket (30) is disposed between the upper plate (10) and the lower plate (20), and the silicone rubber gasket (30) has a through hole (300) corresponding to the position of the PIN needle body (80); The fastening screw (50) is used to press and fix the upper plate (10), the lower plate (20) and the silicone rubber gasket (30); wherein the silicone rubber gasket (30) clamps the PIN needle body (80) by elastic deformation to close the gap between the PIN needle body (80) and the PIN needle seat (800).

2. The PIN pin pre-soldering fixture for preventing solder dripping according to claim 1, characterized in that, The through hole (300) is conical, and the diameter of the conical through hole (300) is smaller than the diameter of the PIN needle seat (800) to form a radial compression on the PIN needle body (80).

3. The PIN pin pre-soldering fixture for preventing solder dripping according to claim 1, characterized in that, The upper plate (10) and the lower plate (20) are made of metal and are used to provide rigid support.

4. The PIN pin pre-soldering fixture for preventing solder dripping according to claim 1, characterized in that, The number of the fastening screws (50) is 4-8, evenly distributed on the tooling.

5. The PIN pin pre-soldering fixture for preventing solder dripping according to claim 1, characterized in that, The upper plate (10) and the lower plate (20) are provided with positioning pins (60) for aligning the position of the through hole (300) on the silicone rubber gasket (30).

6. The PIN pin pre-soldering fixture for preventing solder dripping according to claim 1, characterized in that, The upper plate (10) and the lower plate (20) are provided with first holes (40) for positioning the locking screws (50).

7. The PIN pin pre-soldering fixture for preventing solder dripping according to claim 1, characterized in that, The lower plate (20) has a vacuum adsorption hole on its side for connecting to a vacuum device.

8. The PIN pin pre-soldering fixture for preventing solder dripping according to claim 1, characterized in that, The silicone rubber gasket (30) is also provided with several second holes (70) corresponding to the locking screws (50).

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