An IC carrier plate marking machine feeding mechanism

Abstract

The utility model relates to IC carrier board processing equipment technical field, concretely relates to a kind of feeding mechanism of IC carrier board marking machine, including rack, rack is installed with hopper, hopper includes bottom plate, bottom plate is slidably connected in rack, first baffle and second baffle of fixed mounting are perpendicular on bottom plate, first baffle and second baffle are slidably connected with load plate between, multiple layers of IC plate workpieces can be stacked on load plate, first direction of corresponding IC plate workpiece is installed with the first positioning assembly that penetrates load plate on bottom plate, the second direction of corresponding IC plate workpiece is installed with the second positioning assembly that penetrates load plate on bottom plate, rack is installed with the lifting assembly of transmission connection with load plate. The first positioning assembly and the second positioning assembly of the present application effectively adapt to IC plate workpiece of different sizes, reduce equipment change time, improve assembly line compatibility.

Description

Technical Field

[0001] This utility model relates to the technical field of IC carrier board processing equipment, specifically to a feeding mechanism for an IC carrier board marking machine. Background Technology

[0002] In the IC substrate manufacturing process, laser marking technology, with its advantages of high precision, non-contact, and permanent marking, has become a key means of identifying defective IC substrates. Laser beams can mark text, symbols, and QR codes with micron-level precision, which not only helps in defect traceability but also improves product quality control through anti-counterfeiting marking. The feeding mechanism, as the front-end execution unit of the laser marking equipment, directly determines the conveying efficiency, positioning accuracy, and marking consistency of the IC substrate.

[0003] Currently, the feeding mechanisms of existing IC substrate marking machines generally adopt customized designs, with their mechanical structures and parameters only adaptable to IC substrates of specific sizes and specifications. These feeding mechanisms typically use fixed-size conveyor tracks, positioning fixtures, and gripping components, lacking effective dynamic size adjustment and adaptive mechanisms. In laser processing technology, IC substrates require extremely high positioning accuracy; line width / spacing is often at the micrometer level. Any slight positioning deviation can lead to problems such as laser marking position shifts and character defects. When companies face the need for mixed-line production of multiple models and sizes of IC substrates, existing feeding mechanisms, limited by their structural rigidity and adjustment range, cannot effectively adapt to some new models or non-standard specifications of IC substrates, resulting in equipment malfunctions such as jamming and positioning deviations, and even equipment downtime.

[0004] Therefore, how to design a feeding mechanism that can dynamically adapt to IC substrates of different sizes and meet the high-precision requirements of laser processing has become a problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0005] In order to adapt to IC board workpieces of different sizes and improve feeding accuracy and efficiency, this application provides a feeding mechanism for an IC carrier marking machine.

[0006] The feeding mechanism of the IC carrier marking machine provided in this application adopts the following technical solution:

[0007] A feeding mechanism for an IC substrate marking machine is characterized by: a frame, a hopper mounted on the frame, the hopper including a base plate slidably connected to the frame, a first baffle and a second baffle fixedly mounted on the base plate perpendicular to each other, a carrier plate slidably connected between the first baffle and the second baffle, the carrier plate capable of stacking multiple IC substrates, a first positioning component penetrating the carrier plate and a second positioning component penetrating the carrier plate and corresponding to a second direction of the IC substrates mounted on the base plate, and a lifting component connected to the carrier plate in a transmission manner mounted on the frame.

[0008] Furthermore, the first positioning component includes a mounting bracket, which is fixedly mounted on the base plate. A first motor is fixedly mounted on the base plate, and the first motor is driven by a first rotating rod. A first moving block is threadedly connected to the first rotating rod. A first guide rail is fixedly mounted on the mounting bracket, and a first moving slider is fixedly mounted on the first moving block. The first moving slider is slidably connected to the first guide rail. A plurality of first limiting rods are fixedly mounted on the first moving block corresponding to the first baffle. A first limiting groove is formed on the material carrier plate corresponding to the first limiting rod, and the first limiting rod passes through the first limiting groove.

[0009] Furthermore, a first pulley is fixedly connected to the first motor, and a second pulley is fixedly connected to the first rotating rod. A synchronous toothed belt is sleeved on the outside of the first pulley and the second pulley, and the synchronous toothed belt meshes with both the first pulley and the second pulley simultaneously.

[0010] Furthermore, the second positioning component includes a second guide rail, which is fixedly mounted on the base plate. A second motor is fixedly mounted on the base plate corresponding to the second guide rail. The second motor is driven by a second rotating rod. A second slider is threadedly connected to the second rotating rod. The second slider is slidably connected to the second guide rail. A second limiting rod is fixedly connected to the second slider corresponding to the second baffle. A second limiting groove is formed on the material carrier plate corresponding to the second limiting rod, and the second limiting rod passes through the second limiting groove.

[0011] Furthermore, the lifting assembly includes a mounting platform, which is fixedly installed inside the frame. A third guide rail is fixedly connected to the mounting platform, and a third motor is fixedly installed on the mounting platform. The third motor is driven by a third rotating rod, which is rotatably connected to a third slider. The third slider is slidably connected to the third guide rail. A movable plate is fixedly connected to the third slider corresponding to the material carrier plate. A plurality of first support rods are fixedly connected to the movable plate. The first support rods penetrate the frame. A second support rod is fixedly connected to the end of the material carrier plate near the frame corresponding to the first support rod. The second support rod penetrates the hopper.

[0012] Furthermore, a fourth slider is fixedly connected to the material carrier plate, and a fourth guide rail is fixedly installed on the first baffle plate corresponding to the fourth slider, with the fourth slider and the fourth guide rail being slidably connected.

[0013] Furthermore, a first mounting plate is fixedly installed on the base plate corresponding to the frame, and a second mounting plate is fixedly installed on the frame corresponding to the first mounting plate. A ball bearing slide rail is installed between the first mounting plate and the second mounting plate.

[0014] Furthermore, the first baffle and the second baffle are fixedly connected to a position sensor at their top positions, and the position sensor is electrically connected to a controller, which is electrically connected to the third motor.

[0015] Furthermore, a fixing rod is fixedly installed on the first moving block, the fixing rod passes through the first limiting groove, a counting sensor is fixedly installed on the fixing rod, and the counting sensor is electrically connected to a controller.

[0016] Furthermore, both the first and second limiting rods have obliquely oriented air jet holes corresponding to the IC board workpiece, and an air supply device is connected to the outside of the air jet holes.

[0017] Beneficial effects achieved:

[0018] This application utilizes a first positioning component and a second positioning component to drive a first limit rod and a second limit rod to push the IC board workpiece, achieving precise two-dimensional positioning of the IC board workpiece on a horizontal plane. Simultaneously, it presses against the side of the workpiece to prevent vibration displacement. Furthermore, it can adapt to IC board workpieces of different sizes without requiring manual adjustment of the mechanical structure, reducing equipment changeover time and improving production line compatibility. A lifting component enables smooth lifting of the carrier plate, and linkage with a position sensor controls precise feeding, improving feeding accuracy and efficiency. The multi-bin design combined with a ball bearing slide rail for rapid material changing ensures continuous production and significantly increases production capacity. Attached Figure Description

[0019] Figure 1This is a schematic diagram of the overall structure of one embodiment of this application.

[0020] Figure 2 This is an exploded view of the structure of one embodiment of this application.

[0021] Figure 3 This is a structural exploded view of one embodiment of the first positioning component in this application.

[0022] Figure 4 This is a structural exploded view of one embodiment of the second positioning component in this application.

[0023] Figure 5 This is an exploded view of the structure of one embodiment of the lifting component in this application.

[0024] Figure 6 This is a partial internal structure diagram of one embodiment of this application.

[0025] Explanation of reference numerals in the attached drawings: 100, frame; 101, hopper; 1011, base plate; 1012, first baffle; 1013, second baffle; 1014, first mounting plate; 1015, second mounting plate; 102, material carrier plate; 103, ball bearing slide rail; 104, position sensor; 105, air jet; 200, first positioning component; 201, mounting bracket; 202, first motor; 203, first rotating rod; 204, first moving block; 205, first guide rail; 206, first moving slider; 207, first limiting rod; 208, first limiting groove; 209, ... 1. First pulley; 210. Second pulley; 211. Synchronous toothed belt; 212. Fixed rod; 300. Second positioning assembly; 301. Second guide rail; 302. Second motor; 303. Second rotating rod; 304. Second slider; 305. Second limiting rod; 306. Second limiting groove; 400. Lifting assembly; 401. Mounting platform; 402. Third guide rail; 403. Third motor; 404. Third rotating rod; 405. Third slider; 406. Moving plate; 407. First support rod; 408. Second support rod; 409. Fourth slider; 410. Fourth guide rail. Detailed Implementation

[0026] The following is in conjunction with the appendix Figure 1-6 This application will be described in further detail.

[0027] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0028] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0029] This application discloses a feeding mechanism for an IC substrate marking machine.

[0030] Please refer to Figures 1 to 6 In one embodiment of this application, a feeding mechanism for an IC substrate marking machine includes a frame 100, a hopper 101 mounted on the frame 100, a base plate 1011 slidably connected to the frame 100, a first baffle 1012 and a second baffle 1013 perpendicular to each other fixedly mounted on the base plate 1011, a carrier plate 102 slidably connected between the first baffle 1012 and the second baffle 1013, and multiple IC substrates can be stacked on the carrier plate 102. A first positioning component 200 penetrating the carrier plate 102 is mounted on the base plate 1011 in a first direction corresponding to the IC substrate, and a second positioning component 300 penetrating the carrier plate 102 is mounted on the base plate 1011 in a second direction corresponding to the IC substrate. A lifting component 400 that is drively connected to the carrier plate 102 is mounted on the frame 100.

[0031] During operation, the stacked IC board workpieces are placed on the carrier plate 102. The initial positioning of the IC board workpieces within the hopper 101 is achieved by utilizing the vertical relationship between the first baffle 1012 and the second baffle 1013. The first positioning component 200 and the second positioning component 300 penetrate the carrier plate 102 along the first and second directions of the IC board workpiece, respectively, and abut against the side of the IC board workpiece, ensuring that the IC board workpieces are accurately and stably placed on the carrier plate 102 on the horizontal plane. At the same time, the lifting component 400 is connected to the carrier plate 102 for transmission, which can control the vertical movement of the carrier plate, facilitating the material picking operation of the marking machine.

[0032] Through the cooperation of the first positioning component 200, the second positioning component 300 and the hopper 101, the feeding mechanism can accurately position and fix IC board workpieces of various specifications, and at the same time avoid the position displacement of IC board workpieces during the feeding process, thus improving the adaptability and practicality of the feeding mechanism.

[0033] Please refer to Figures 1 to 6 In one embodiment of this application, the first positioning component 200 includes a mounting frame 201, which is fixedly mounted on a base plate 1011. A first motor 202 is fixedly mounted on the base plate 1011. The first motor 202 is driven by a first rotating rod 203. A first moving block 204 is threadedly driven onto the first rotating rod 203. A first guide rail 205 is fixedly mounted on the mounting frame 201. A first moving slider 206 is fixedly mounted on the first moving block 204. The first moving slider 206 is slidably connected to the first guide rail 205. A plurality of first limiting rods 207 are fixedly mounted on the first moving block 204 corresponding to the first baffle 1012. A first limiting groove 208 is opened on the material plate 102 corresponding to the first limiting rods 207. The first limiting rods 207 pass through the first limiting groove 208.

[0034] During operation, the first motor 202 is started, driving the first rotating rod 203 to start rotating. At the same time, the first moving block 204 moves linearly along the first rotating rod 203 through the thread, driving the first moving slider 206 to move linearly along the first guide rail 205. This causes the first limiting rod 207 to move towards the first baffle 1012 in the first limiting groove 208, thereby accurately positioning and fixing the IC board workpiece on the carrier plate 102 in the first direction. When it is necessary to change the workpiece or adjust the position, the first motor 202 rotates in the opposite direction, and the first moving block 204 drives the first limiting rod 207 to exit the first limiting groove 208, releasing the positioning constraint on the workpiece.

[0035] The first positioning component 200 quickly and accurately controls the position of the first limit rod 207, thereby ensuring that the feeding mechanism can use IC board workpieces of different sizes in the first direction, reducing equipment changeover time, increasing the production capacity of the production line, and also ensuring that the IC board workpieces will not be displaced in the first direction due to vibration during the feeding process.

[0036] Please refer to Figures 1 to 6 In one embodiment of this application, a first pulley 209 is fixedly connected to a first motor 202, and a second pulley 210 is fixedly connected to a first rotating rod 203. A synchronous toothed belt 211 is sleeved on the outside of the first pulley 209 and the second pulley 210, and the synchronous toothed belt 211 meshes with the first pulley 209 and the second pulley 210 at the same time.

[0037] During operation, the first motor 202 is started to make the first pulley 209 rotate synchronously, thereby transmitting power to the second pulley 210 through the meshing synchronous toothed belt 211, which drives the first rotating rod 203 to rotate synchronously, thereby realizing the positioning of the first limit rod 207 on the IC board workpiece.

[0038] The synchronous toothed belt 211 avoids positioning deviations caused by slippage, and at the same time, its oil-free characteristics prevent the risk of oil contamination of the IC board workpieces inside the feeding mechanism.

[0039] Please refer to Figures 1 to 6 In one embodiment of this application, the second positioning component 300 includes a second guide rail 301, which is fixedly mounted on a base plate 1011. A second motor 302 is fixedly mounted on the base plate 1011 corresponding to the second guide rail 301. The second motor 302 is drivenly connected to a second rotating rod 303. A second slider 304 is threadedly connected to the second rotating rod 303. The second slider 304 is slidably connected to the second guide rail 301. A second limiting rod 305 is fixedly connected to the second slider 304 corresponding to a second baffle 1013. A second limiting groove 306 is opened on the material plate 102 corresponding to the second limiting rod 305, and the second limiting rod 305 passes through the second limiting groove 306.

[0040] During operation, the second motor 302 drives the second rotating rod 303 to rotate, thereby driving the second slider 304 to slide on the second guide rail 301. The second limiting rod 305, along with the second slider 304, pushes the IC board workpiece towards the second baffle 1013, achieving precise positioning of the IC board workpiece in the second direction. When it is necessary to replace the IC board workpiece with another specification or to release the positioning, the second motor 302 can be reversed to achieve the positioning constraint.

[0041] The second positioning component 300 automatically drives the second limit rod 305 to accurately position the IC board workpiece in the second direction, and enables the feeding mechanism to adapt to the positioning requirements of IC board workpieces of different sizes in the second direction, while also ensuring that the IC board workpiece will not be displaced due to vibration in the second direction.

[0042] Please refer to Figures 1 to 6In one embodiment of this application, the lifting assembly 400 includes a mounting platform 401, which is fixedly installed inside the frame 100. A third guide rail 402 is fixedly connected to the mounting platform 401. A third motor 403 is fixedly installed on the mounting platform 401. The third motor 403 is driven by a third rotating rod 404. The third rotating rod 404 is rotatably connected to a third slider 405. The third slider 405 is slidably connected to the third guide rail 402. A movable plate 406 is fixedly connected to the third slider 405 corresponding to the material carrier plate 102. A plurality of first support rods 407 are fixedly connected to the movable plate 406. The first support rods 407 penetrate the frame 100. A second support rod 408 is fixedly connected to the end of the material carrier plate 102 near the frame 100 corresponding to the first support rod 407. The second support rod 408 penetrates the hopper 101.

[0043] During operation, the third motor 403 is started to drive the third rotating rod 404 to rotate synchronously, and at the same time, the third slider 405 is driven to move linearly along the third guide rail 402. At this time, the third slider 405 drives the first support rod 407 to move linearly through the moving plate 406, thereby pushing the second support rod 408 and the material plate 102 to move linearly, thus realizing the smooth lifting and lowering of the IC board workpiece in the vertical direction.

[0044] The cooperation of multiple first support rods 407 and second support rods 408 provides support for the material carrier plate 102, ensuring that the stacked IC board workpieces are lifted layer by layer to the material picking position during the operation of the marking machine, reducing the processing time between processes, realizing uninterrupted processing, and improving the working efficiency of the marking machine.

[0045] Please refer to Figures 1 to 6 In one embodiment of this application, a fourth slider 409 is fixedly connected to the material carrier plate 102, and a fourth guide rail 410 is fixedly installed on the first baffle 1012 corresponding to the fourth slider 409. The fourth slider 409 and the fourth guide rail 410 are slidably connected.

[0046] When the lifting assembly 400 drives the carrier plate 102 to move vertically upward and downward, the fourth guide rail 410 provides guidance for the fourth slider 409, ensuring that the carrier plate 102 can only move vertically during the lifting process, limiting the displacement and swaying of the carrier plate 102 in the horizontal direction, and ensuring that the carrier plate 102 can reach the predetermined position smoothly and accurately.

[0047] The cooperation between the fourth slider 409 and the fourth guide rail 410 prevents the IC board workpiece from being misaligned or tipped over due to shaking, ensuring safety and stability during the feeding process, and also avoiding the defect rate of subsequent marking caused by the positional deviation of the IC board workpiece.

[0048] Please refer to Figures 1 to 6In one embodiment of this application, a first mounting plate 1014 is fixedly installed on the base plate 1011 corresponding to the frame 100, and a second mounting plate 1015 is fixedly installed on the frame 100 corresponding to the first mounting plate 1014. A ball bearing slide rail 103 is installed between the first mounting plate 1014 and the second mounting plate 1015.

[0049] During operation, when maintenance or loading of the hopper 101 is required, the bottom plate 1011 is pulled out of the mechanism via the ball bearing slide rail 103, thus facilitating subsequent work by the operator.

[0050] The multiple sets of steel balls in the ball bearing slide rail 103 make the base plate 1011 slide smoothly and effortlessly, easily realizing the extraction and pushing of the hopper 101. At the same time, the ball bearing slide rail 103 also avoids damage and jamming of the slide rail due to insufficient load during the sliding process, improving the versatility of the feeding mechanism.

[0051] It is understandable that the feeding mechanism can be equipped with multiple hoppers 101 and other supporting components. When the IC board workpiece in one hopper 101 is finished, the material can be taken from another hopper 101 immediately. At this time, the empty hopper 101 can be pulled out by the ball bearing slide rail and the IC board workpiece can be filled immediately, thereby realizing the overall operating efficiency of the marking machine.

[0052] Please refer to Figures 1 to 6 In one embodiment of this application, a position sensor 104 is fixedly connected to the top of the first baffle 1012 and the second baffle 1013. The position sensor 104 is electrically connected to a controller, and the controller is electrically connected to the third motor 403.

[0053] During operation, the position of the IC board workpiece on the carrier plate 102 is monitored in real time by the position sensor 104, and the signal is converted into an electrical signal. Then, the position sensor 104 transmits the electrical signal to the controller that is electrically connected to it. After processing and analyzing the signal, the controller sends a command to the third motor 403 according to the preset program.

[0054] When the carrier plate 102 rises and the IC board workpiece reaches the height monitored by the position sensor 104, the controller stops the third motor 403, ensuring the IC board workpiece is precisely positioned at the target location for subsequent material handling. If the IC board workpiece has not reached the height monitored by the position sensor 104, the controller starts the third motor 403, causing the carrier plate 102 to rise until the IC board workpiece reaches the area monitored by the position sensor 104. This control mechanism enables continuous filling of the IC board workpiece.

[0055] Real-time monitoring by position sensor 104 ensures that the IC board workpiece is always positioned in the optimal position, speeds up the feeding process, enables the marking machine to operate continuously and efficiently, and improves overall production efficiency.

[0056] Please refer to Figures 1 to 6 In one embodiment of this application, a fixing rod 212 is fixedly installed on the first moving block 204, the fixing rod 212 passes through the first limiting groove 208, a counting sensor is fixedly installed on the fixing rod 212, and a controller is electrically connected to the external side of the counting sensor.

[0057] During operation, when an IC board workpiece is placed on the carrier plate 102, the edge of the workpiece triggers a counting sensor on the fixing rod 212. Simultaneously, the counting sensor converts the detected signal into an electrical signal and transmits it to the controller. Each time a new IC board workpiece moves upwards, the counting sensor is triggered, and the controller records an increase in the count.

[0058] The counting sensor calculates the number of IC board components in real time, avoiding errors caused by manual counting, ensuring the accuracy of production data, and providing data support for production statistics and quality traceability; the controller judges the feeding status by the change in quantity, which helps to detect abnormalities such as material jams and leaks in a timely manner.

[0059] Please refer to Figures 1 to 6 In one embodiment of this application, the first limiting rod 207 and the second limiting rod 305 are respectively provided with air jet holes 105 at an angle to the corresponding IC board workpiece, and the air jet holes 105 are connected to an air supply device.

[0060] During operation, after the IC board workpiece is placed on the carrier plate 102, the first limiting rod 207 and the second limiting rod 305 move to the positioning position and press against the side of the IC board workpiece under the drive of the first motor 202 and the second motor 302. At this time, the air supply device is activated, supplying compressed gas to the jet nozzle 105 through the pipeline. Since the jet nozzle 105 is opened at an angle, the gas is sprayed directly onto the surface and edges of the IC board workpiece at a certain angle, blowing away the attached dust, debris and other impurities, cleaning the surface of the IC board workpiece.

[0061] By using the impact force of compressed gas, dust, metal shavings and other contaminants on the surface of IC board workpieces are quickly removed, avoiding impurities from affecting the marking quality and preventing problems such as blurry markings and incomplete patterns caused by impurities, thereby improving the product yield. Furthermore, the air jet 105 is integrated into the first limit rod 207 and the second limit rod 305, without taking up additional space, which facilitates the equipment structure layout and upgrades.

[0062] The implementation principle of the feeding mechanism of an IC carrier marking machine according to an embodiment of this application is as follows:

[0063] First, after placing the IC board workpiece on the carrier plate 102, the first motor 202 is started, which drives the first rotating rod 203 to rotate via the synchronous toothed belt 211. Through threaded transmission, the first moving block 204 moves linearly along the first guide rail 205, causing the first limiting rod 207 to press against the side of the IC board workpiece in the first limiting groove 208 of the carrier plate 102, so that the IC board workpiece is tightly attached to one side of the first baffle 1012, achieving fixation and positioning in the first direction. Then, the second motor 302 is started to drive the second rotating rod 303 to rotate. Through threaded transmission, the second slider 304 slides along the second guide rail 301, causing the second limiting rod 305 to push the IC board workpiece towards the second baffle 1013 in the second limiting groove 306 of the carrier plate 102, achieving fixation and positioning in the second direction.

[0064] The loading process then begins. The workpiece height is monitored in real time by a position sensor, triggering the controller to start the third motor 403, which in turn drives the third rotating rod 404 to rotate. This causes the third slider 405 to move linearly along the third guide rail 402. The moving plate 406, the first support rod 407, and the second support rod 408 push the material carrier plate 102 up and down, ensuring that the IC board workpiece is always in the optimal working position and reducing process waiting time. At the same time, the counting sensor on the fixed rod 212 detects the trigger signal at the edge of the workpiece in real time, and the controller counts the number of workpieces in real time to avoid human error and monitor abnormalities such as jamming and leakage.

[0065] After the IC board workpiece in one of the hoppers 101 is processed, the empty hopper 101 is pulled out by the ball bearing slide rail 103 and the workpiece is quickly loaded. At the same time, other hoppers 101 are activated to continue feeding materials, thus realizing uninterrupted operation of the marking machine.

[0066] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. An IC carrier board marking machine's feeding mechanism, characterized in that: The device includes a frame (100), on which a hopper (101) is mounted. The hopper (101) includes a base plate (1011), which is slidably connected to the frame (100). A first baffle (1012) and a second baffle (1013) perpendicular to each other are fixedly mounted on the base plate (1011). A carrier plate (102) is slidably connected between the first baffle (1012) and the second baffle (1013). The material plate (102) can stack multiple IC board workpieces. A first positioning component (200) is installed on the base plate (1011) in a first direction corresponding to the IC board workpiece, penetrating the material plate (102). A second positioning component (300) is installed on the base plate (1011) in a second direction corresponding to the IC board workpiece, penetrating the material plate (102). A lifting component (400) that is drively connected to the material plate (102) is installed on the frame (100).

2. The feeding mechanism of the IC carrier plate marking machine according to claim 1, characterized in that: The first positioning component (200) includes a mounting bracket (201), which is fixedly mounted on the base plate (1011). A first motor (202) is fixedly mounted on the base plate (1011). The first motor (202) is drivenly connected to a first rotating rod (203). A first moving block (204) is threadedly connected to the first rotating rod (203). A first guide rail (205) is fixedly mounted on the mounting bracket (201). A first movable slider (206) is fixedly installed on the movable block (204). The first movable slider (206) is slidably connected to the first guide rail (205). A plurality of first limiting rods (207) are fixedly installed on the first movable block (204) corresponding to the first baffle (1012). A first limiting groove (208) is opened on the material plate (102) corresponding to the first limiting rod (207). The first limiting rod (207) passes through the first limiting groove (208).

3. The feeding mechanism of the IC carrier plate marking machine according to claim 2, characterized in that: A first pulley (209) is fixedly connected to the first motor (202), and a second pulley (210) is fixedly connected to the first rotating rod (203). A synchronous toothed belt (211) is sleeved on the outside of the first pulley (209) and the second pulley (210). The synchronous toothed belt (211) meshes with both the first pulley (209) and the second pulley (210).

4. The feeding mechanism of the IC carrier plate marking machine according to claim 2, characterized in that: The second positioning component (300) includes a second guide rail (301), which is fixedly mounted on the base plate (1011). A second motor (302) is fixedly mounted on the base plate (1011) corresponding to the second guide rail (301). The second motor (302) is driven by a second rotating rod (303). A second slider (304) is threadedly connected to the second rotating rod (303). The second slider (304) is slidably connected to the second guide rail (301). A second limiting rod (305) is fixedly connected on the second slider (304) corresponding to the second baffle (1013). A second limiting groove (306) is opened on the material plate (102) corresponding to the second limiting rod (305). The second limiting rod (305) passes through the second limiting groove (306).

5. The feeding mechanism of the IC carrier plate marking machine according to claim 1, wherein: The lifting assembly (400) includes a mounting platform (401), which is fixedly installed inside the frame (100). A third guide rail (402) is fixedly connected to the mounting platform (401). A third motor (403) is fixedly installed on the mounting platform (401). The third motor (403) is driven by a third rotating rod (404). The third rotating rod (404) is rotatably connected to a third slider (405). The third slider (405) is connected to the third guide rail (402). 2) Sliding connection: A movable plate (406) is fixedly connected to the third slider (405) corresponding to the material carrier plate (102). A plurality of first support rods (407) are fixedly connected to the movable plate (406). The first support rods (407) pass through the frame (100). A second support rod (408) is fixedly connected to one end of the material carrier plate (102) near the frame (100) corresponding to the first support rod (407). The second support rod (408) passes through the hopper (101).

6. The feeding mechanism of the IC carrier plate marking machine according to claim 5, characterized in that: A fourth slider (409) is fixedly connected to the material carrier plate (102), and a fourth guide rail (410) is fixedly installed on the first baffle (1012) corresponding to the fourth slider (409). The fourth slider (409) is slidably connected to the fourth guide rail (410).

7. The feeding mechanism of the IC carrier plate marking machine according to claim 1, characterized in that: A first mounting plate (1014) is fixedly installed on the base plate (1011) corresponding to the frame (100), and a second mounting plate (1015) is fixedly installed on the frame (100) corresponding to the first mounting plate (1014). A ball bearing slide rail (103) is installed between the first mounting plate (1014) and the second mounting plate (1015).

8. The feeding mechanism of an IC carrier marking machine according to claim 5, characterized in that: The first baffle (1012) and the second baffle (1013) are fixedly connected to a position sensor (104) at their top positions. The position sensor (104) is electrically connected to a controller, which is electrically connected to the third motor (403).

9. The feeding mechanism of the IC carrier plate marking machine according to claim 2, characterized in that: A fixing rod (212) is fixedly installed on the first moving block (204). The fixing rod (212) passes through the first limiting groove (208). A counting sensor is fixedly installed on the fixing rod (212). The counting sensor is electrically connected to a controller.

10. The feeding mechanism of the IC carrier plate marking machine according to claim 4, characterized in that: Both the first limiting rod (207) and the second limiting rod (305) have obliquely opened air jet holes (105) corresponding to the IC board workpiece, and an air supply device is connected to the outside of the air jet hole (105).

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