A plastic sealing device for diode production

Abstract

This utility model discloses a molding compound for diode production, relating to the field of electronic manufacturing technology. It includes a cutting device mounted on the main body of a packaging machine, comprising a lifting plate mounted on the cutting device. The bottom of the lifting plate is provided with an elastic reset member, and multiple limiting blocks are installed at the bottom of the elastic reset member. A cutting blade is also fixedly mounted at the bottom of the lifting plate. The bottom of the limiting blocks extends downwards and crosses the parallel line at the bottom of the cutting blade. In this utility model, when the lifting plate moves downwards, it drives the cutting blade closer to the packaging film on the conveyor belt. The bottom of the limiting blocks is lower than the bottom of the cutting blade. When the lifting plate moves downwards, the limiting blocks first contact and press against the packaging film. Subsequently, the elastic reset member retracts, and the limiting blocks continue to press against the packaging film until the cutting blade cuts the packaging film. The limiting blocks press down on the packaging film first, preventing the packaging film from lifting during cutting and reducing irregular areas after cutting.

Description

Technical Field

[0001] This utility model relates to the field of electronic manufacturing technology, specifically to a plastic encapsulation device for diode production. Background Technology

[0002] A diode encapsulation device is a specialized piece of equipment used to encapsulate and protect diodes. It uses a mechanically automated structure to fill the outer periphery of the diode chip and lead frame, and completes thermoforming or injection molding under set temperature, pressure and other process conditions.

[0003] Typically, diodes are placed on a conveyor belt, which then transports them to the encapsulation area. After the packaging is applied, a cutting blade cuts the packaging to create individual packages. Because diodes are tall and the packaging film is very light, some areas of the packaging will curl up after the packaging is applied. Therefore, uneven cutting often occurs after the cutting blade falls. In subsequent encapsulation, due to the uneven cutting, a lot of crooked packaging film is often cut off and discarded, resulting in waste.

[0004] To address these issues, we designed a molding compound for diode manufacturing. Utility Model Content

[0005] The purpose of this invention is to provide a molding compound for diode manufacturing, in order to solve the problems mentioned in the background art.

[0006] To solve the above-mentioned technical problems, this utility model provides a plastic encapsulation device for diode production, including a cutting device installed on the main body of a packaging machine, comprising,

[0007] A lifting plate is installed on the cutting equipment. The bottom end of the lifting plate is provided with an elastic reset member. Multiple limit blocks are installed at the bottom of the elastic reset member. A cutting blade is also fixedly installed at the bottom of the lifting plate. The bottom of the limit blocks extends downward and crosses the parallel line at the bottom end of the cutting blade.

[0008] Furthermore, the elastic reset component includes a telescopic rod, which includes an insert rod and a sleeve. The bottom end of the sleeve is connected to a limiting block, the top end of the insert rod is fixedly connected to the inner top wall of the lifting plate, the bottom end of the insert rod extends into the sleeve and is slidably connected to the sleeve, and a spring is sleeved around the telescopic rod. The top end of the spring is fixedly connected to the inner top wall of the lifting plate, and the bottom end is connected to the limiting block.

[0009] Furthermore, the elastic reset component also includes a fixing plate, which is located between the limiting block and the lifting plate. The bottom ends of the sleeve and the spring are fixedly connected to the top of the fixing plate, and the top of the limiting block is fixedly connected to the bottom of the fixing plate.

[0010] Furthermore, multiple telescopic rods and springs are provided, and the telescopic rods and springs are arranged at equal intervals along the fixed plate.

[0011] Furthermore, the side of the limiting block facing away from the cutting blade has an arc surface and an inclined slope. The arc surface is close to the top of the limiting block, and the inclined slope is close to the bottom of the limiting block. The end of the inclined slope near the bottom of the limiting block gradually deviates towards the cutting blade.

[0012] Furthermore, a rubber pad is fixedly installed on the outer wall of the inclined slope. The rubber pad is elastic, and the bottom end of the rubber pad is also provided with a thickened end.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] 1. When the lifting plate moves down, it drives the cutting blade to approach the packaging film on the conveyor belt. The bottom of the limiting block is lower than the bottom of the cutting blade. When the lifting plate moves down, the limiting block first contacts and presses down on the packaging film. Then the elastic reset part retracts, and the limiting block continues to press against the packaging film until the cutting blade cuts the packaging film. The limiting block presses down on the packaging film first to prevent the packaging film from lifting up during cutting and to reduce irregular areas after cutting.

[0015] 2. The curvature and slope of the inclined slope and arc surface can first contact the supported packaging film, then press the packaging film first, and then gradually press the packaging film onto the conveyor belt as the limit block moves down, so as to avoid the packaging film from wrinkling, shifting or breaking due to sudden force. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the appearance of the present utility model;

[0017] Figure 2 This is a schematic diagram of the connection structure between the cutting device and the lifting plate in this utility model;

[0018] Figure 3 This is a schematic diagram of the connection structure between the lifting plate and the limiting block in this utility model;

[0019] Figure 4 This is a schematic diagram of the connection structure between the telescopic rod and the spring in this utility model;

[0020] Figure 5 This is a schematic diagram of the connection structure between the limiting block and the rubber pad in this utility model.

[0021] In the diagram: 1. Packaging machine body; 2. Cutting equipment; 3. Lifting plate; 4. Limiting block; 5. Cutting blade; 6. Telescopic rod; 7. Spring; 8. Curved surface; 9. Inclined slope; 10. Rubber pad; 11. Thickened end; 12. Fixing plate. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figure 1-5 This utility model provides a technical solution: a plastic encapsulation device for diode production, including a cutting device 2 installed on the main body 1 of a packaging machine, comprising,

[0024] A lifting plate 3 is installed on the cutting equipment 2. The bottom of the lifting plate 3 is provided with an elastic reset component. Multiple limit blocks 4 are installed at the bottom of the elastic reset component. A cutting blade 5 is also fixedly installed at the bottom of the lifting plate 3. The bottom of the limit block 4 extends downward and crosses the parallel line at the bottom of the cutting blade 5.

[0025] In practice, the lifting plate 3 can slide up and down along the cutting device 2. When the lifting plate 3 moves down, it can drive the cutting blade 5 to approach the packaging film on the conveyor belt of the main body 1 of the packaging machine, and then cut the packaging through the cutting blade 5. The bottom of the limiting block 4 is lower than the bottom of the cutting blade 5. Therefore, when the lifting plate 3 moves down, the bottom of the limiting block 4 will first contact the packaging film and then press the packaging film down. Subsequently, as the lifting plate 3 continues to move down, the elastic reset member opens and contracts, and the limiting block 4 presses tightly against the packaging film until the cutting blade 5 contacts the packaging film and cuts it.

[0026] Instead of allowing the cutting blade 5 to directly contact the packaging film, it is first pressed down by the limiting block 4. This prevents a large area of ​​the packaging film from lifting up, which would result in too many irregular areas after the cutting blade 5 cuts the packaging film.

[0027] See Figure 1-5 The elastic reset component includes a telescopic rod 6, which includes an insert rod and a sleeve. The bottom end of the sleeve is connected to the limiting block 4, and the top end of the insert rod is fixedly connected to the inner top wall of the lifting plate 3. The bottom end of the insert rod extends into the sleeve and is slidably connected to the sleeve. A spring 7 is sleeved around the telescopic rod 6. The top end of the spring 7 is fixedly connected to the inner top wall of the lifting plate 3, and the bottom end is connected to the limiting block 4.

[0028] After the limiting block 4 presses against the packaging film, as the lifting plate 3 continues to move down, the spring 7 contracts, and the insert rod slides down along the inner wall of the sleeve. After the cutting is completed, the lifting plate 3 is lifted, and the spring 7 rebounds, making the bottom of the limiting block 4 lower than the bottom of the cutting blade 5 again.

[0029] See Figure 1-5The elastic reset component also includes a fixing plate 12, which is located between the limiting block 4 and the lifting plate 3. The bottom ends of the sleeve and the spring 7 are fixedly connected to the top of the fixing plate 12, and the top of the limiting block 4 is fixedly connected to the bottom of the fixing plate 12.

[0030] Based on the above implementation, the fixing plate 12 is used to fix multiple limiting blocks 4. After the limiting blocks 4 contact the packaging film, the lifting plate 3 continues to press down, and the limiting blocks 4 will contact the spring 7 and the sleeve through the fixing plate 12, so that multiple limiting blocks 4 can be subjected to force together.

[0031] See Figure 1-5 Multiple telescopic rods 6 and springs 7 are provided, and the telescopic rods 6 and springs 7 are arranged at equal intervals along the fixed plate 12.

[0032] Multiple sets of elastic reset components connect the fixing plate 12 and the limiting block 4 below the lifting plate 3. When the limiting block 4 abuts against the packaging film and the lifting plate 3 moves down, multiple springs 7 are compressed together. Then, when the lifting plate 3 is lifted, multiple springs 7 reset together, providing more stable support and reset capability.

[0033] See Figure 1-5 The side of the limiting block 4 facing away from the cutting blade 5 has an arc surface 8 and an inclined slope 9. The arc surface 8 is close to the top of the limiting block 4, and the inclined slope 9 is close to the bottom of the limiting block 4. The end of the inclined slope 9 close to the bottom of the limiting block 4 gradually deviates towards the cutting blade 5.

[0034] In practice, the packaging film and the packaged diode are aligned in the direction of the arc surface 8. Therefore, the packaging film has a height. The curvature and slope of the inclined slope 9 and the arc surface 8 allow the packaging film to first contact the supported packaging film. Then, the packaging film is pressed first. After that, as the limiting block 4 moves down, the packaging film is gradually pressed onto the conveyor belt. This gradual pressing flattens the packaging film onto the conveyor belt, which can prevent the packaging film from wrinkling, shifting or breaking due to sudden force. It ensures that the packaging film and the diode are flat and adhered to each other. At the same time, it reduces stress concentration during the pressing process, prevents the diode from being damaged by squeezing, and allows the packaging film to remain stable before cutting, improving the subsequent cutting accuracy and packaging quality.

[0035] See Figure 1-5 A rubber pad 10 is fixedly installed on the outer wall of the inclined slope 9. The rubber pad 10 is elastic, and the bottom end of the rubber pad 10 is also provided with a thickened end 11.

[0036] The rubber pad 10 acts as a buffer. When the limiting block 4 approaches the packaging film, the thickened end 11 will first come into contact with the packaging film, and then the thickened end 11 will deform, reducing the hard impact of the limiting block 4 squeezing the packaging film, so as to avoid damaging the packaging film.

[0037] Working principle: Before use, the lifting plate 3 can slide up and down along the cutting device 2. When the lifting plate 3 moves down, it can drive the cutting blade 5 to approach the packaging film on the conveyor belt of the main body of the packaging machine 1. Then the packaging is cut by the cutting blade 5. The bottom of the limiting block 4 is lower than the bottom of the cutting blade 5. Therefore, when the lifting plate 3 moves down, the bottom of the limiting block 4 will first contact the packaging film and then press the packaging film down. Then, as the lifting plate 3 continues to move down, the elastic reset member opens and contracts, and the limiting block 4 presses tightly against the packaging film until the cutting blade 5 contacts the packaging film and cuts it.

[0038] Instead of allowing the cutting blade 5 to directly contact the packaging film, it is first pressed down by the limiting block 4. This prevents a large area of ​​the packaging film from lifting up, resulting in too many irregular areas in the packaging film after the cutting blade 5 cuts it.

[0039] The packaging film and the packaged diode are aligned in the direction of the arc surface 8, so the packaging film has a height. The curvature and slope of the inclined slope 9 and the arc surface 8 allow the packaging film to first contact and be supported, and then the packaging film is pressed first. Then, as the limiting block 4 moves down, the packaging film is gradually pressed onto the conveyor belt. This gradual pressing flattens it onto the conveyor belt, which can prevent the packaging film from wrinkling, shifting or breaking due to sudden force, ensuring that the packaging film and the diode are flat and adhered, while reducing stress concentration during the pressing process, preventing the diode from being damaged by squeezing, and also keeping the packaging film stable before cutting, improving the subsequent cutting accuracy and packaging quality.

Claims

1. A plastic packaging device for diode production, comprising a cutting device (2) mounted on a packaging machine body (1), characterized in that, include, A lifting plate (3) is installed on the cutting equipment (2). The bottom end of the lifting plate (3) is provided with an elastic reset member. Multiple limit blocks (4) are installed at the bottom of the elastic reset member. A cutting blade (5) is also fixedly installed at the bottom of the lifting plate (3). The bottom of the limit block (4) extends downward and crosses the parallel line at the bottom end of the cutting blade (5).

2. The encapsulation device for diode manufacturing as described in claim 1, characterized in that: The elastic reset component includes a telescopic rod (6), which includes an insert rod and a sleeve. The bottom end of the sleeve is connected to the limiting block (4), and the top end of the insert rod is fixedly connected to the inner top wall of the lifting plate (3). The bottom end of the insert rod extends into the sleeve and is slidably connected to the sleeve. A spring (7) is sleeved around the telescopic rod (6). The top end of the spring (7) is fixedly connected to the inner top wall of the lifting plate (3), and the bottom end is connected to the limiting block (4).

3. The encapsulation device for diode manufacturing as described in claim 2, characterized in that: The elastic reset component also includes a fixing plate (12), which is located between the limiting block (4) and the lifting plate (3). The bottom ends of the sleeve and the spring (7) are fixedly connected to the top of the fixing plate (12), and the top of the limiting block (4) is fixedly connected to the bottom of the fixing plate (12).

4. The encapsulation apparatus for diode manufacturing as described in claim 3, characterized in that: Multiple telescopic rods (6) and springs (7) are provided, and the telescopic rods (6) and springs (7) are arranged at equal intervals along the fixed plate (12).

5. The encapsulation apparatus for diode manufacturing as described in claim 4, characterized in that: The limiting block (4) has an arc surface (8) and an inclined slope (9) on the side facing away from the cutting blade (5). The arc surface (8) is close to the top of the limiting block (4), and the inclined slope (9) is close to the bottom of the limiting block (4). The end of the inclined slope (9) close to the bottom of the limiting block (4) gradually deviates towards the cutting blade (5).

6. The encapsulation apparatus for diode manufacturing as described in claim 5, characterized in that: A rubber pad (10) is fixedly installed on the outer wall of the inclined slope (9). The rubber pad (10) is elastic, and the bottom end of the rubber pad (10) is also provided with a thickened end (11).

Images