An inertial device assembly structure

Abstract

This application discloses an inertial device assembly structure in the field of sensor technology, including a mounting frame. The mounting frame includes an inertial device mounting plate and at least one PCB mounting plate, with the PCB mounting plate assembled onto the inertial device mounting plate. The PCB mounting plate has a pre-reserved adhesive application area and a positioning area. The adhesive application area is used to apply adhesive to achieve bonding and fixation between the PCB layout and the PCB mounting plate. The positioning area is used to install a temporary positioning mechanism, which maintains the relative position of the PCB layout and the PCB mounting plate during adhesive curing and is removed from the positioning area after adhesive curing. This application can avoid stress concentration problems and ensure installation accuracy, significantly improving the stability and reliability of the inertial device assembly structure.

Description

Technical Field

[0001] This application relates to the field of sensor technology, and in particular to an inertial device assembly structure. Background Technology

[0002] The mounting method of inertial devices plays a decisive role in the output accuracy, stability, and adaptability to harsh environments of the inertial system. Since MEMS inertial devices typically require electrical connections and physical support via PCBs, their mounting effectiveness largely depends on the PCB fixing method.

[0003] While traditional integrated injection molding packaging technology effectively protects electronic components from external environmental influences (such as waterproofing, dustproofing, and moisture protection) and improves impact and vibration resistance, its irreversibility cannot meet the needs of subsequent maintenance and component replacement. Furthermore, the thermal stress during the injection molding process can easily cause PCB deformation, reducing the installation accuracy of inertial devices. As for screw fixing, although it can provide a stable mechanical connection, screw installation can lead to stress concentration, especially under vibration or impact environments, where screws may loosen or fall out.

[0004] Therefore, in complex and ever-changing application scenarios, existing installation technologies are unable to simultaneously ensure installation stability, anti-interference, and maintainability, and there is an urgent need for an inertial device assembly structure that can effectively solve the above problems.

[0005] The information disclosed in this background section is intended only to enhance the understanding of the overall background of this application and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Utility Model Content

[0006] The purpose of this application is to provide an inertial device assembly structure that can avoid stress concentration problems, ensure installation accuracy, and significantly improve the stability and reliability of the inertial device assembly structure.

[0007] To achieve the above objectives, this application employs the following technical solution:

[0008] An inertial device assembly structure includes a mounting frame, the mounting frame including an inertial device mounting plate and at least one PCB mounting plate, the PCB mounting plate being assembled onto the inertial device mounting plate;

[0009] The PCB mounting board has a pre-reserved adhesive application area and a positioning area;

[0010] The dispensing area is used to apply adhesive to achieve the bonding and fixation of the PCB layout to the PCB mounting board;

[0011] The positioning area is used to install a temporary positioning mechanism, which is used to maintain the relative position of the PCB layout and the PCB mounting board during the colloid curing process, and is removed from the positioning area after the colloid has cured.

[0012] Multiple PCB mounting boards are provided, and the multiple PCB mounting boards and the inertial device mounting board form a polyhedral structure.

[0013] The positioning area is configured as a boss structure protruding from the PCB mounting plate. When the PCB layout is fixed to the boss structure by the temporary positioning mechanism, a gap space for accommodating the adhesive is formed between the PCB layout and the PCB mounting plate.

[0014] The boss structure is provided with screw holes, and the temporary positioning mechanism is a screw that is adapted to the screw holes.

[0015] The inertial device mounting plate is equipped with positioning pins for mounting and positioning the inertial device.

[0016] The PCB layout is a composite board formed by connecting multiple PCB boards, with flexible connections between adjacent PCB boards.

[0017] Compared with the prior art, the beneficial effects achieved by this application are as follows:

[0018] The mounting frame includes an inertial device mounting plate and a PCB mounting plate. The PCB mounting plate is divided into a dispensing area and a positioning area. The dispensing area is used to fix the PCB layout by applying adhesive, while the positioning area is used to install a temporary positioning mechanism to maintain the relative fixation of the PCB layout and the PCB mounting plate during the adhesive curing process. The inertial device assembly structure provided in this application adopts a combination of adhesive bonding and temporary positioning mechanism fixation. After the adhesive in the dispensing area cures, it forms a high-strength adhesive layer, providing a long-term stable connection. The temporary positioning mechanism in the positioning area restricts the displacement of the PCB layout during the adhesive curing process, avoiding installation deviations caused by adhesive shrinkage during curing, ensuring installation accuracy, and significantly improving the installation stability of the inertial device in complex environments such as vibration and impact. The temporary positioning mechanism is removed after the adhesive cures, which can avoid stress concentration problems. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1This is a schematic diagram of an inertial device assembly structure that removes the temporary positioning mechanism, as provided in this application.

[0021] Figure 2 This application provides Figure 1 A schematic diagram of a structure for installing a frame in a central part;

[0022] Figure 3 This application provides Figure 1 A schematic diagram of a PCB layout in its unfolded state;

[0023] Explanation of reference numerals in the attached figures:

[0024] 100 - Mounting frame; 110 - Inertial device mounting plate; 120 - PCB mounting plate; 200 - Boss structure; 300 - PCB layout; 500 - Locating pin; 600 - Screw hole. Detailed Implementation

[0025] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit this application or its application or use.

[0026] like Figure 1 , Figure 2 As shown, the inertial device assembly structure provided in this application includes a mounting frame 100, which includes an inertial device mounting plate 110 and at least one PCB mounting plate 120. In practical applications, the PCB mounting plate 120 can be securely assembled onto the inertial device mounting plate 110 by means of welding, bolting, or other methods.

[0027] The surface of the PCB mounting board 120 is divided into a dispensing area and a positioning area. The dispensing area is used to apply the adhesive, which can be a material with good bonding properties, such as epoxy resin or silicone rubber. Taking epoxy resin as an example, it has good fluidity at room temperature, making it easy to apply to the dispensing area. After heating and curing, it forms a high-strength adhesive layer, achieving reliable bonding and fixation between the PCB layout 300 and the PCB mounting board 120.

[0028] The positioning area is used to install a temporary positioning mechanism, which maintains the relative position of the PCB layout 300 and the PCB mounting plate 120 during the colloid curing process. This ensures installation accuracy and significantly improves the installation stability of inertial devices under complex environments such as vibration and impact. It should be noted that the temporary positioning mechanism should be removed after the colloid has cured to effectively avoid stress concentration issues.

[0029] See Figure 2 In one embodiment, the positioning area can be designed as a boss structure 200 protruding from the PCB mounting plate 120. When the PCB layout 300 is fixed to the boss structure 200 by a temporary positioning mechanism, a gap space is formed between the PCB layout 300 and the PCB mounting plate 120. The height of this gap space can be set according to actual needs to accommodate the adhesive, ensuring that the adhesive can be evenly distributed and fully exert its bonding effect.

[0030] Optionally, a temporary positioning mechanism can be a screw, with screw holes 600 on the boss structure 200 to accommodate the screws. During assembly, the PCB layout 300 is placed on the boss structure 200, aligning the screw holes on the PCB layout 300 with the screw holes 600 on the boss structure 200. Then, the screws are screwed in, and the tightening force of the screws securely fixes the PCB layout 300 to the PCB mounting plate 120. The screw specifications can be selected according to actual conditions, such as M2 or M3. The tightening torque is controlled within the range that the PCB layout 300 can withstand to ensure a secure fixation and avoid damage to the PCB layout 300. To prevent deformation due to uneven stress on the PCB layout 300, the boss structure 200 should be distributed as evenly as possible along the edge of the PCB mounting plate 120. (See [reference]). Figure 2 If the PCB mounting board 120 is set as a square, the boss structure 200 can be set at the four corners of the square.

[0031] As an equivalent replacement for screws, the temporary positioning mechanism can also be a snap-fit ​​mechanism. Specifically, a snap hook can be set on the boss structure 200, and a snap groove can be opened on the edge of the PCB layout 300. During assembly, the snap hook and the snap groove are engaged by pressing to ensure that the PCB layout 300 does not shift during the curing process of the colloid.

[0032] The inertial device mounting plate 110 is provided with a positioning pin 500, which is used to achieve the mounting and positioning of the inertial device. The positioning pin 500 and the positioning hole on the inertial device can be interference-fitted to precisely define the mounting position of the inertial device, ensure its mounting accuracy, and thus ensure the measurement accuracy of the inertial system.

[0033] In another embodiment, multiple PCB mounting plates 120 are provided, and the multiple PCB mounting plates 120 and the inertial device mounting plate 110 form a polyhedral structure. For example... Figure 2 As shown, when there are five PCB mounting plates 120, they can be combined with the inertial device mounting plate 110 to form a cubic structure. Adjacent PCB mounting plates 120 are fixed together by welding or snap-fit ​​connection to enhance the stability of the overall structure.

[0034] At this time, the PCB layout 300 can be a combination board of multiple PCB boards connected together. The adjacent PCB boards are connected flexibly, so that each PCB board can be bent and installed on different PCB mounting boards 120. While ensuring electrical connection, it can adapt to the shape changes of the polyhedral structure and avoid damage to the PCB layout 300 due to structural deformation.

[0035] In the actual assembly of the inertial device assembly structure of this application, firstly, adhesive is applied to the dispensing area of ​​the PCB mounting plate 120, and then the PCB layout 300 is fixed in the positioning area by a temporary positioning mechanism to ensure the uniformity of the gap space; next, the inertial device is installed on the inertial device mounting plate 110 by positioning pins 500; finally, the overflowing adhesive is removed, and the adhesive is cured under appropriate temperature and time conditions. After the adhesive is completely cured, the temporary positioning mechanism is removed to complete the entire assembly process.

[0036] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only used to explain the relative positional relationship and movement between components in a specific orientation. If the specific orientation changes, the directional indication will also change accordingly. These terms are used only for the convenience of describing this application and for simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0037] Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0038] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0039] The above description is only a preferred embodiment of this application. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of this application, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. An inertial device assembly structure, characterized in that, The system includes a mounting frame, which comprises an inertial device mounting plate and at least one PCB mounting plate, wherein the PCB mounting plate is assembled onto the inertial device mounting plate. The PCB mounting board has a pre-reserved adhesive application area and a positioning area; The dispensing area is used to apply adhesive to achieve the bonding and fixation of the PCB layout to the PCB mounting board; The positioning area is used to install a temporary positioning mechanism, which is used to maintain the relative position of the PCB layout and the PCB mounting board during the colloid curing process, and is removed from the positioning area after the colloid has cured.

2. The inertial device assembly structure according to claim 1, characterized in that, Multiple PCB mounting boards are provided, and the multiple PCB mounting boards and the inertial device mounting board form a polyhedral structure.

3. The inertial device assembly structure according to claim 1, characterized in that, The positioning area is configured as a boss structure protruding from the PCB mounting plate. When the PCB layout is fixed to the boss structure by the temporary positioning mechanism, a gap space for accommodating the adhesive is formed between the PCB layout and the PCB mounting plate.

4. The inertial device assembly structure according to claim 3, characterized in that, The boss structure is provided with screw holes, and the temporary positioning mechanism is a screw that is adapted to the screw holes.

5. The inertial device assembly structure according to claim 1, characterized in that, The inertial device mounting plate is equipped with positioning pins for mounting and positioning the inertial device.

6. The inertial device assembly structure according to claim 2, characterized in that, The PCB layout is a composite board formed by connecting multiple PCB boards, with flexible connections between adjacent PCB boards.

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