Diode modular package device with integrated temperature sensor

Abstract

The utility model discloses diode modularization packaging device of integrated temperature sensor, including TO base and the mounting seat of fixed in the middle part of base, the one side of mounting seat has the first integrated chip with laser diode of cementing, the one side of mounting seat is provided with the heat conduction structure that can facilitate temperature sensor welding outside connection cooling equipment to reduce the pin temperature, the utility model discloses the pin of temperature sensor is prolonged and guided to the heat conduction block of mounting seat back, can utilize external refrigeration equipment directly to heat conduction block cooling in the key welding procedure. Through heat path optimization can reduce the risk of temperature sensor damage caused by welding high temperature transmission to temperature sensor body. Through the contact area of heat conduction fin increase with external refrigeration equipment, improve the cooling speed to pin, and the pin positioning structure is formed by the cooperation of wire inlet hole and wire outlet hole with limiting slot, avoid temperature sensor because of pin sway influence welding.

Description

Technical Field

[0001] This utility model relates to the field of diode manufacturing technology, specifically to a modular packaging device for diodes with integrated temperature sensors. Background Technology

[0002] Temperature has a significant impact on the performance of optoelectronic devices such as laser diodes and photodiodes. For example, the output power and wavelength of a laser diode within a TO-CAN package change with temperature. Installing a temperature sensor allows for real-time monitoring of the internal temperature. Subsequent temperature compensation circuitry or control systems can then adjust the device's operating status, thereby ensuring the stability and reliability of its performance.

[0003] When integrated into a package, the distance between the temperature sensor and the diode's hot spot is small. It's crucial to ensure that the temperature difference between the sensor and the diode is within ±3℃ to avoid invalid data. Because the temperature sensor is close to the diode, it becomes more sensitive to temperature changes during diode soldering, making it more susceptible to damage. Utility Model Content

[0004] The purpose of this invention is to provide a modular packaging device for an integrated temperature sensor. By inserting the extended pins of the temperature sensor into the mounting base and setting a heat-conducting block on the back of the mounting base that is in direct contact with the pins, the heat-conducting block is cooled by an external cooling device during the soldering process, which slows down the transfer of heat to the temperature sensor during soldering. This replaces the method of directly soldering the temperature sensor near the diode and reduces the risk of damage to the sensitive components inside the temperature sensor.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a modular packaging device for a diode with an integrated temperature sensor, comprising a TO base and a mounting base fixed in the middle of the base. A first integrated chip with a laser diode is bonded to one side of the mounting base, and a second integrated chip with a photodiode is bonded to the top of the TO base. A temperature sensor is disposed between the laser diode and the photodiode. The pins of the temperature sensor are extended and pass through the mounting base. A heat-conducting structure is provided on one side of the mounting base to facilitate the connection of an external cooling device to reduce the pin temperature during the soldering of the temperature sensor.

[0006] Preferably, the heat-conducting structure includes a heat-conducting block fixed to one side of the mounting base. Two sets of heat-conducting blocks are provided. A limiting groove is formed on one side of the heat-conducting block. The two extended pins of the temperature sensor are respectively wound in the two sets of limiting grooves. The heat-conducting block is located on the side of the mounting base away from the photodiode.

[0007] Preferably, the heat-conducting structure further includes heat-conducting fins, which are welded to both sides of the two sets of heat-conducting blocks.

[0008] Preferably, a pin header is soldered to one side of the first integrated chip, and a female socket for inserting the pin header is soldered to the upper surface of the second integrated chip. The first integrated chip is electrically connected to the second integrated chip through the pin header.

[0009] Preferably, both the mounting base and one side of the first integrated chip have inlet holes and outlet holes for the pins of the temperature sensor to pass through. After the pins of the temperature sensor are inserted into the inlet holes, the outer wall of the sensor is pressed against the limiting groove and inserted into the first integrated chip through the outlet holes. The tail ends of the pins of the temperature sensor are soldered to the first integrated chip.

[0010] Preferably, the diode modular package of the integrated temperature sensor further includes a lead wire electrically connected to the second integrated chip and a housing packaged outside the mounting base, wherein the top of the lead wire passes through the TO base and is fixedly connected to the TO base.

[0011] Preferably, the housing includes a cover and a light guide sheet glued to the top of the cover. The top of the cover has a groove for placing the light guide sheet, and the bottom of the cover is fixedly connected to the TO base.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] 1. This invention extends the pins of the temperature sensor and guides them to a heat-conducting block on the back of the mounting base, allowing external cooling equipment to directly cool the heat-conducting block during critical welding processes. This optimized thermal path reduces the risk of high welding temperatures being transferred to the temperature sensor body, thus minimizing the risk of sensor damage.

[0014] 2. The heat-conducting block of this utility model is in direct contact with the pin. The heat-conducting fins increase the contact area with the external cooling equipment, thereby improving the cooling speed of the pin. At the same time, the inlet and outlet holes cooperate with the limiting groove to form a pin positioning structure, which avoids the temperature sensor from being affected by pin shaking, thus preventing unstable electrical connection. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the internal structure of the casing of this utility model;

[0016] Figure 2 This is an isometric drawing of this utility model;

[0017] Figure 3 This is a schematic diagram showing the location of the heat-conducting structure of this utility model;

[0018] Figure 4 This is a schematic diagram of the heat-conducting structure of this utility model;

[0019] Figure 5This is a schematic diagram of the structure of the temperature sensor of this utility model;

[0020] Figure 6 This is a schematic diagram showing the location of the inlet hole of this utility model.

[0021] In the diagram: 1. TO base; 2. Mounting base; 3. Laser diode; 4. First integrated chip; 5. Second integrated chip; 6. Temperature sensor; 8. Thermal conductive structure; 801. Thermal block; 802. Limiting groove; 803. Thermal fin; 9. Pin header; 10. Female connector; 11. Inlet hole; 12. Outlet hole; 13. Pin; 14. Lead wire; 15. Housing; 1501. Cover; 1502. Light guide plate. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figure 1-6 This utility model provides a technical solution: a modular packaging device for diodes with integrated temperature sensors, including a TO base 1 and a mounting base 2 fixed in the middle of the base. A first integrated chip 4 with a laser diode 3 is glued to one side of the mounting base 2. A second integrated chip 5 with a photodiode is glued to the top of the TO base 1. A temperature sensor 6 is disposed between the laser diode 3 and the photodiode. The temperature sensor 6 is located between the laser diode 3 and the photodiode and directly monitors the hot spot temperature of the chip. The pin 13 of the temperature sensor 6 is extended and passes through the mounting base 2. The pin 13 of the temperature sensor 6 passes through the inlet hole 11 and the outlet hole 12 of the mounting base 2 and extends to the back of the mounting base 2. A heat-conducting structure 8 is provided on one side of the mounting base 2 to facilitate the connection of external cooling equipment to reduce the temperature of the pin 13 during the soldering of the temperature sensor 6.

[0024] The heat-conducting structure 8 includes a heat-conducting block 801 fixed to one side of the mounting base 2. Two sets of heat-conducting blocks 801 are provided. A limiting groove 802 is formed on one side of each heat-conducting block 801. The heat-conducting block 801 and the pin 13 are in direct contact within the limiting groove 802, forming a heat conduction path. Figure 3 and Figure 4As shown, the two extended pins 13 of the temperature sensor 6 are respectively wound within two sets of limiting grooves 802, and the heat-conducting block 801 is located on the side of the mounting base 2 away from the photodiode. The heat-conducting block 801 and the heat-conducting fins 803 can be made of nickel-plated oxygen-free copper, and the heat-conducting fins 803 are welded using SnAgCu lead-free solder.

[0025] The heat-conducting structure 8 also includes heat-conducting fins 803, which are welded to both sides of the two sets of heat-conducting blocks 801. During welding, an external cooling device, such as a semiconductor cooling chip, clamps the two sets of cooling chips against the outer wall of the heat-conducting fins 803, forcibly cooling them and absorbing the welding heat transferred through the pins 13. The heat is trapped by the heat-conducting blocks 801, preventing high temperature from entering the temperature sensor 6 along the pins 13 and preventing thermal damage to the sensitive element. Under normal operation, the heat-conducting blocks 801 do not affect the real-time monitoring of the diode temperature by the temperature sensor 6.

[0026] A header pin 9 is soldered to one side of the first integrated chip 4, and a female connector 10 for inserting the header pin 9 is soldered to the upper surface of the second integrated chip 5. The first integrated chip 4 is electrically connected to the second integrated chip 5 through the header pins. The header pin 9 of the first integrated chip 4 is inserted into the female connector 10 of the second integrated chip 5 to realize the circuit interconnection between the laser diode 3 and the photodiode.

[0027] The mounting base 2 and the first integrated chip 4 are both provided with an inlet hole 11 and an outlet hole 12 for the pins 13 of the temperature sensor 6 to pass through. After the pins 13 of the temperature sensor 6 are inserted into the inlet hole 11, the outer wall is close to the limiting groove 802 and is inserted into the first integrated chip 4 through the outlet hole 12. The tail end of the pins 13 of the temperature sensor 6 is soldered to the first integrated chip 4.

[0028] Pin 13 is bent and attached to the limiting groove 802 of the heat-conducting block 801. The inlet hole 11 and outlet hole 12 constrain the passage path of pin 13. The limiting groove 802 provides lateral fixation, forming a three-point positioning to avoid displacement during welding or vibration. The bent pin 13 can release bending stress in the limiting groove 802 to prevent the connection between pin 13 and temperature sensor 6 from being unstable during welding.

[0029] The diode modular package of the integrated temperature sensor also includes a lead 14 electrically connected to the second integrated chip 5 and a housing 15 encapsulated outside the mounting base 2. The top of the lead 14 passes through the TO base 1 and is fixedly connected to the TO base 1.

[0030] The housing 15 includes a cover 1501 and a light guide 1502 glued to the top of the cover 1501. The light guide 1502 ensures the transmission of laser signals and protects the internal optical components. The top of the cover 1501 has a groove for placing the light guide 1502. The bottom of the cover 1501 is fixedly connected to the TO base 1. The lead wire 14 passes through the TO base 1 and is sealed to provide a stable external circuit interface and maintain airtightness.

[0031] In use, an external cooling device, such as a clamp with a semiconductor cooling plate, holds the heat-conducting fin 803. The semiconductor cooling plate is in contact with the heat-conducting fin 803, which cools down the heat-conducting fin 803 and the heat-conducting block 801. This cools down the pin 13 that is in close contact with the inner wall of the limiting groove 802, absorbs the welding heat transferred through the pin 13, and prevents the temperature sensor 6 from being damaged by excessive heat.

[0032] During normal operation, the temperature sensor 6 directly monitors the temperature of the diode hot spot and feeds the data back to the control circuit in the first integrated chip 4. The control circuit adjusts the working state of the device in real time. For example, when the temperature rises, the laser power decreases, and the drive current can be increased by the control circuit, etc., which will not be elaborated further.

[0033] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A diode modular package device integrated with a temperature sensor, characterized by: The device includes a TO base (1) and a mounting base (2) fixed in the middle of the base. A first integrated chip (4) with a laser diode (3) is glued to one side of the mounting base (2). A second integrated chip (5) with a photodiode is glued to the top of the TO base (1). A temperature sensor (6) is disposed between the laser diode (3) and the photodiode. The pin (13) of the temperature sensor (6) is extended and passes through the mounting base (2). A heat-conducting structure (8) is disposed on one side of the mounting base (2) to facilitate the connection of an external cooling device to reduce the temperature of the pin (13) when the temperature sensor (6) is soldered.

2. The integrated temperature sensor diode modular package apparatus of claim 1, wherein: The heat-conducting structure (8) includes a heat-conducting block (801) fixed on one side of the mounting base (2). Two sets of heat-conducting blocks (801) are provided. A limiting groove (802) is opened on one side of the heat-conducting block (801). The two extended pins (13) of the temperature sensor (6) are respectively wound in the two sets of limiting grooves (802). The heat-conducting block (801) is located on the side of the mounting base (2) away from the photodiode.

3. The diode modular packaging device for an integrated temperature sensor according to claim 2, characterized in that: The heat-conducting structure (8) also includes heat-conducting fins (803), which are welded to both sides of the two sets of heat-conducting blocks (801).

4. The diode modular packaging device for an integrated temperature sensor according to claim 3, characterized in that: The first integrated chip (4) has a pin header (9) soldered on one side, and the second integrated chip (5) has a female socket (10) soldered on the upper surface for the pin header (9) to be inserted. The first integrated chip (4) is electrically connected to the second integrated chip (5) through the pin header.

5. The diode modular packaging device for an integrated temperature sensor according to claim 4, characterized in that: The mounting base (2) and the first integrated chip (4) are provided with an inlet hole (11) and an outlet hole (12) for the pins (13) of the temperature sensor (6) to pass through. After the pins (13) of the temperature sensor (6) are inserted into the inlet hole (11), the outer wall is close to the limiting groove (802) and is inserted into the first integrated chip (4) through the outlet hole (12). The tail end of the pins (13) of the temperature sensor (6) is soldered to the first integrated chip (4).

6. The diode modular packaging device for an integrated temperature sensor according to claim 5, characterized in that: The diode modular package of the integrated temperature sensor also includes a lead (14) electrically connected to the second integrated chip (5) and a housing (15) encapsulated outside the mounting base (2), the top of the lead (14) passing through the TO base (1) and fixedly connected to the TO base (1).

7. The diode modular packaging device for an integrated temperature sensor according to claim 6, characterized in that: The housing (15) includes a cover (1501) and a light guide (1502) glued to the top of the cover (1501). The top of the cover (1501) has a groove for placing the light guide (1502), and the bottom of the cover (1501) is fixedly connected to the TO base (1).

Images