Heat dissipating device, laser device and portable skin care device

Abstract

The application discloses a heat dissipation device, a laser device and a portable skin care device. The heat dissipation device comprises a liquid cooling box, the liquid cooling box is provided with a liquid cooling cavity for containing cooling liquid, and the liquid cooling cavity is communicated with an inlet hole and an outlet hole. The liquid cooling box has a light source setting surface for heat conduction connection with a laser module. The technical scheme improves the heat dissipation effect of the laser module, reduces the temperature of the laser module during operation, prolongs the service life of the laser module, and prolongs the service life of the laser hair removal instrument.

Description

Technical Field

[0001] This application relates to the field of laser beauty equipment technology, and in particular to a heat dissipation device, a laser device, and a portable skin care device. Background Technology

[0002] Traditionally, hair removal devices were large-scale equipment used in hospitals and beauty salons. However, with advancements in home-use technology, portable hair removal devices have emerged, which are small, lightweight, and convenient for users to carry and use anytime. Currently, there are two main types of portable hair removal devices: one uses intense pulsed light (IPL) as the light source, and the other uses lasers.

[0003] To achieve optimal treatment results, laser hair removal devices require very high energy density, meaning the laser module needs high power. However, the photoelectric conversion efficiency of the laser module is relatively low (typically below 50%). Therefore, during operation, up to 50% of the laser module's power is converted into waste heat, resulting in significant heat generation. Existing portable laser hair removal devices use air-cooling systems to dissipate heat from the laser module, which is inefficient and ineffective. This makes it difficult to lower the laser module's temperature, causing it to operate at consistently high temperatures. This significantly reduces the laser module's lifespan, leading to a shorter overall lifespan for the portable laser hair removal device. Utility Model Content

[0004] This application provides a heat dissipation device, which aims to improve the heat dissipation effect of the laser module, reduce the temperature of the laser module during operation, and improve the service life of the laser module, so as to extend the life of the portable laser hair removal device.

[0005] To achieve the above objectives, the present application proposes a heat dissipation device for heat dissipation of a laser module in a portable skin care device. The heat dissipation device includes a liquid cooling box, which has a liquid cooling cavity for containing coolant, and an inlet and an outlet communicating with the liquid cooling cavity. The liquid cooling box has a light source mounting surface for thermally conductive connection with the laser module.

[0006] In some embodiments, a heat dissipation component is provided in the liquid-cooled cavity, and the heat dissipation component is thermally connected to the side of the liquid-cooled cavity near the light source mounting surface, so as to transfer the heat of the light source mounting surface to the coolant in the liquid-cooled cavity.

[0007] In some embodiments, the heat dissipation assembly includes a heat spreader plate, which is thermally connected, welded, or bonded to the side of the liquid-cooled cavity near the light source mounting surface.

[0008] And / or,

[0009] The heat dissipation component includes a heat pipe, the evaporation section of which is thermally connected to the side of the liquid-cooled inner cavity near the light source mounting surface, and the condensation section of which is spaced apart from the side of the liquid-cooled inner cavity near the light source mounting surface.

[0010] And / or, the heat dissipation assembly includes a finned heat sink, which is thermally connected to the side of the liquid-cooled cavity near the light source mounting surface.

[0011] In some embodiments, the heat dissipation assembly includes a vapor chamber and a finned heat sink. One side of the vapor chamber is thermally connected, welded, or bonded to the side of the liquid-cooled cavity near the light source mounting surface, and the other side of the vapor chamber is thermally connected to the finned heat sink.

[0012] In some embodiments, the heat dissipation assembly includes a finned heat sink that divides the liquid-cooled cavity into meandering flow channels, one end of which communicates with the liquid inlet and the other end of which communicates with the liquid outlet.

[0013] In some embodiments, the liquid cooling box includes a first inner sidewall and a second inner sidewall opposite to each other, the finned heat sink is located between the first inner sidewall and the second inner sidewall, the finned heat sink forms a liquid collection area between the first inner sidewall and the second inner sidewall respectively, the liquid collection area is provided with at least one partition, the partition divides the liquid collection area into multiple sub-areas, all sub-areas include a liquid inlet area, a liquid outlet area and at least one transfer area, the liquid inlet hole communicates with the liquid inlet area, the liquid outlet hole communicates with the liquid outlet area, the coolant in the liquid inlet area flows through the fin gaps of the finned heat sink sequentially through each transfer area to reach the liquid outlet area.

[0014] In some embodiments, the liquid cooling box includes a heat-conducting plate and a box body with an open end. The heat-conducting plate seals and covers the open end of the box body to form the liquid cooling cavity with the box body. The side of the heat-conducting plate facing away from the box body is the light source mounting surface.

[0015] In some embodiments, a sealing fit structure is provided between the heat-conducting plate and the open end of the box body. The sealing fit structure includes an annular groove, an annular boss and a sealing ring. One of the annular groove and the annular boss is provided on the heat-conducting plate and the other is provided on the open end of the box body. The sealing ring is provided in the annular groove and the annular boss is engaged in the annular groove and abuts against the sealing ring.

[0016] Alternatively, the heat-conducting plate is provided with an annular groove, and a sealing ring is provided in the annular groove. The open end of the box body is inserted into the annular groove and abuts against the sealing ring.

[0017] And / or,

[0018] The heat-conducting plate is fixed to the box body by screws, or the heat-conducting plate is fixed to the box body by adhesive bonding;

[0019] And / or,

[0020] The heat-conducting plate is a copper plate or a heat spreader.

[0021] This application also proposes a laser device for use in a portable skin care device, including a laser module and the aforementioned heat dissipation device; the laser module is mounted on the light source setting surface, or the laser module includes a thermally conductive ceramic substrate and at least one laser chip disposed on one side of the ceramic substrate, with the side of the ceramic substrate facing away from the laser chip attached to the light source setting surface.

[0022] This application also proposes a portable skin care device, including a housing with a light-emitting window, and the aforementioned laser device, which is disposed inside the housing and is used to emit laser light from the light-emitting window for skin care.

[0023] The technical solution of the heat dissipation device in this application, when used for heat dissipation of a laser module, involves installing the laser module on the light source mounting surface of the liquid cooling box, making the light source mounting surface thermally connected to the laser module. The liquid inlet and outlet of the box are respectively connected to the coolant supply device, allowing coolant to be injected into the liquid cooling cavity. The heat generated by the laser module during operation is quickly transferred to the inner wall of the liquid cooling cavity through the light source mounting surface. Then, the inner wall of the liquid cooling cavity exchanges heat with the contacting coolant to quickly transfer the heat into the coolant. The high-temperature coolant after heat exchange flows out from the outlet, while low-temperature coolant is continuously replenished into the liquid cooling cavity from the inlet. This cycle continuously and quickly removes the heat generated by the laser module, preventing excessive heat accumulation on the laser module, effectively reducing the operating temperature of the laser module, improving its service life, and thus extending the lifespan of portable laser hair removal devices or other portable skin care devices that utilize laser modules. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the structure of an embodiment of the heat dissipation device of this application;

[0025] Figure 2 This is a schematic diagram of the structure of the heat dissipation device and the laser module during assembly in this application;

[0026] Figure 3 for Figure 1 A cross-sectional view of the heat dissipation device shown in the embodiment;

[0027] Figure 3a This is a schematic diagram showing the connection between the heat dissipation device, the coolant supply device, and the circulating power device of this application;

[0028] Figure 4 This is an exploded view of an embodiment of the heat dissipation device of this application;

[0029] Figure 5 This is a schematic diagram of the structure of one embodiment of the heat dissipation device housing of this application;

[0030] Figure 6 for Figure 1 Another cross-sectional view of the heat dissipation device shown in the embodiment;

[0031] Figure 7 This is a schematic diagram of the structure of a heat-conducting plate according to an embodiment of the heat dissipation device of this application;

[0032] Figure 8 for Figure 3 An enlarged view of position A in the middle;

[0033] Figure 9 This is a partial structural schematic diagram of an embodiment of the portable skin care device of this application. Detailed Implementation

[0034] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0035] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0036] It should also be noted that when a component is described as "fixed to" or "set on" another component, it can be directly on the other component or there may be an intervening component present. When a component is described as "connected to" another component, it can be directly connected to the other component or there may be an intervening component present.

[0037] Furthermore, the use of terms such as "first" and "second" in this application is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed in this application.

[0038] Laser hair removal equipment used in hospitals, beauty salons, and other professional settings is typically large-scale, consisting of a bulky main unit and a handpiece connected to it. The main unit contains a large water tank for circulating and cooling the laser module, thus eliminating heat dissipation issues. Portable laser hair removal devices, on the other hand, integrate all components into a small, portable casing, allowing for easy carrying and handheld use. Due to their small size, achieving efficient heat dissipation is a crucial challenge for portable laser hair removal devices.

[0039] To achieve good treatment results, portable laser hair removal devices require very high energy density, meaning the laser module needs high power. However, the photoelectric conversion efficiency of the laser module is relatively low (usually below 50%). Therefore, during operation, up to 50% of the laser module's power is converted into waste heat, resulting in significant heat generation. Existing portable laser hair removal devices use air-cooling devices (cooling fans and bladed heat sinks) to dissipate heat from the laser module. For example, the home-use large-window laser hair removal device disclosed in CN214180573U fixes the laser module to a metal heat sink with thermally conductive silicone grease, and a cooling fan is installed on one side of the metal heat sink to dissipate heat from the laser module. This air-cooling method has very low heat dissipation efficiency and poor effect, making it difficult to lower the temperature of the laser module. This results in the laser module operating at a consistently high temperature, significantly reducing its lifespan and consequently leading to a shorter lifespan for the portable laser hair removal device.

[0040] In response to the aforementioned problems with laser hair removal devices, the applicant of this application proposes a heat dissipation device solution for the laser module, which can effectively improve the heat dissipation effect of the laser module, reduce the temperature of the laser module during operation, and thus improve the service life of the laser module, thereby extending the life of the laser hair removal device.

[0041] The heat dissipation device proposed in this application is mainly used for heat dissipation of the laser module in a portable skin care device. The portable skin care device can be a laser hair removal device, a laser skin rejuvenation device, or other beauty equipment or instruments that use a laser module.

[0042] Reference Figures 1 to 3 In this embodiment, the heat dissipation device 100 includes a liquid cooling box 10, which has a liquid cooling inner cavity 103 for containing coolant, and an inlet hole 101 and an outlet hole 102 communicating with the liquid cooling inner cavity 103. The liquid cooling box 10 has a light source setting surface 104 for thermally conductive connection with the laser module 200.

[0043] The inlet hole 101 is used to allow low-temperature coolant to enter the liquid-cooled inner cavity 103, and the outlet hole 102 is used to discharge the high-temperature coolant from the liquid-cooled inner cavity 103.

[0044] Combined with reference Figure 3a When the heat dissipation device 100 is assembled into the portable skin care device, the liquid inlet 101 of the heat dissipation device 100 is connected to the liquid outlet 501 of the coolant supply device 500 through a liquid pipe 34, and the liquid outlet 102 of the heat dissipation device 100 is connected to the liquid return port 502 of the coolant supply device 500 through another liquid pipe 34. The circulation power device 35 (e.g., a liquid pump) is installed on a liquid pipe 34, and the coolant is driven to flow and circulate between the heat dissipation device 100 and the coolant supply device 500 through the circulation power device 35. When the portable laser hair removal device is running, the circulating power unit 35 is activated to drive the flow of coolant in the liquid pipe 34. This causes the coolant supply device 500 to discharge low-temperature coolant through the drain hole 501 and deliver it to the inlet hole 101 of the heat dissipation device 100. The coolant then enters the heat dissipation device 100 to exchange heat with the laser module 200, absorbing the heat generated by the laser module 200. Next, the high-temperature coolant, having absorbed heat, flows out from the outlet hole 102 and is transported back to the coolant supply device 500 through the return hole 502 via the liquid pipe 34. The coolant supply device 500 cools the returned high-temperature coolant, resulting in low-temperature coolant that is then discharged from the drain hole 501 and delivered to the inlet hole 101 of the heat dissipation device 100. This cycle continues to cool the laser module 200. The coolant supply device 500 can be a heat exchanger, a refrigeration device, or something similar.

[0045] Specifically, the heat dissipation device 100 dissipates heat from the laser module 200 by placing the laser module 200 on the light source mounting surface 104 of the liquid cooling box 10 for thermally conductive connection. When the laser module 200 is operating, the heat generated by the laser module 200 is rapidly transferred through the light source mounting surface 104 to the side of the liquid cooling cavity 103 closest to the mounting surface (i.e., the inner wall). The heat on the inner wall of the liquid cooling cavity 103 is then rapidly transferred to the coolant through heat exchange with the low-temperature coolant in the liquid cooling cavity 103. The high-temperature coolant after heat exchange is discharged from the liquid outlet 102 of the liquid cooling box 10, while the liquid inlet 101 of the liquid cooling box 10 continuously replenishes the low-temperature coolant into the liquid cooling cavity 103, maintaining a low-temperature coolant level in the liquid cooling cavity 103. This cycle repeats, achieving rapid heat dissipation and cooling of the laser module 200. The laser module 200 can be bonded to the light source setting surface 104 by thermally conductive adhesive, the laser module 200 can be welded to the light source setting surface 104, or the laser module 200 can be directly attached to and in contact with the light source setting surface 104, etc.

[0046] In this embodiment, the heat dissipation device 100, when used for heat dissipation of the laser module 200, mounts the laser module 200 on the light source mounting surface 104 of the liquid cooling box 10, making the light source mounting surface 104 thermally connected to the laser module 200. The liquid inlet 101 and liquid outlet 102 of the box body 12 are respectively connected to the coolant supply device 500, allowing coolant to be injected into the liquid cooling cavity 103. The heat generated by the laser module 200 during operation is quickly transferred to the inner wall of the liquid cooling cavity 103 through the light source mounting surface 104. Then, the inner wall of the liquid cooling cavity 103 contacts the coolant. Liquid heat exchange is used to quickly transfer heat to the coolant. The high-temperature coolant after heat exchange flows out from the outlet 102, while low-temperature coolant is continuously replenished into the liquid-cooled inner cavity 103 from the inlet 101. This cycle continuously and quickly removes the heat generated by the laser module 200, preventing excessive heat buildup on the laser module 200. This effectively reduces the operating temperature of the laser module 200, extends its service life, and consequently prolongs the lifespan of portable laser hair removal devices or other portable skin care devices that utilize the laser module 200.

[0047] Reference Figure 3In some embodiments, a heat dissipation assembly 20 is provided in the liquid-cooled cavity 103. The heat dissipation assembly 20 is thermally connected to the side of the liquid-cooled cavity 103 near the light source mounting surface 104 to transfer the heat from the light source mounting surface 104 to the coolant in the liquid-cooled cavity 103. The heat transferred from the laser module 200 to the light source mounting surface 104 by the heat dissipation assembly 20 is transferred to the heat dissipation assembly 20 more quickly. Then, the heat dissipation assembly 20 comes into contact with the coolant in the liquid-cooled cavity 103 to transfer the heat to the coolant more quickly, thereby increasing the heat exchange rate and the speed of heat transfer. In this way, the heat generated by the laser module 200 is carried away more quickly, further improving the heat dissipation effect of the heat dissipation device 100 on the laser module 200.

[0048] Since the heat generated by the laser module 200 is mainly concentrated at the laser chip 220, the heat received by different locations on the light source mounting surface 104 may be uneven, resulting in a large temperature difference between different locations on the light source mounting surface 104. Specifically, the temperature difference is larger on the side of the liquid-cooled cavity 103 near the light source mounting surface 104, leading to slower heat exchange between the coolant and the side of the liquid-cooled cavity 103 near the light source mounting surface 104. Therefore, the heat dissipation assembly 20 in this embodiment employs a solution including a heat spreader 21, which is thermally connected to the side of the liquid-cooled cavity 103 near the light source mounting surface 104. This thermal connection can be direct contact, welding, bonding, or other methods.

[0049] In this embodiment, the heat dissipation component 20 uses a heat spreader 21 that is thermally connected to the side of the liquid-cooled cavity 103 near the light source setting surface 104. The heat spreader 21 has the function of rapid heat diffusion and heat conduction, which can quickly and evenly diffuse the heat from the side of the liquid-cooled cavity 103 near the light source setting surface 104 to the entire heat spreader 21. Then, the entire surface of the heat spreader in contact with the coolant can quickly exchange heat with the coolant, greatly improving the heat exchange speed. This greatly improves the heat dissipation effect of the heat dissipation device 100 on the laser module 200, resulting in less heat accumulation on the laser module 200, a lower operating temperature for the laser module 200, and a longer service life for the laser module 200.

[0050] In some embodiments, the heat dissipation assembly 20 may include a heat pipe, wherein the evaporation section of the heat pipe is thermally connected to the side of the liquid-cooled cavity 103 near the light source mounting surface 104; the condensation section of the heat pipe is spaced apart from the side of the liquid-cooled cavity 103 near the light source mounting surface 104 to contact the coolant in the liquid-cooled cavity 103. The evaporation section of the heat pipe may be thermally connected to the side of the liquid-cooled cavity 103 near the light source mounting surface 104 by welding or bonding, or the evaporation section of the heat pipe may be embedded within the side of the liquid-cooled cavity 103 near the light source mounting surface 104.

[0051] In this embodiment, the heat dissipation component 20 uses a heat pipe. The evaporation section of the heat pipe is thermally connected to the side of the liquid-cooled cavity 103 near the light source setting surface 104, so as to quickly transfer the heat transferred from the light source setting surface 104 to the condensation section of the heat pipe. Then, through the contact between the condensation section and the coolant, heat exchange is carried out quickly. In this way, the heat exchange speed is increased, so that the heat generated by the laser module 200 is carried away more quickly, and the heat dissipation effect of the heat dissipation device 100 on the laser module 200 is improved.

[0052] In some embodiments, the heat dissipation assembly 20 includes a finned heat sink 22, which is thermally connected to the side of the liquid-cooled cavity 103 near the light source mounting surface 104. Since the area of ​​the side of the liquid-cooled cavity 103 near the light source mounting surface 104 is small, that is, the area in contact with the coolant for heat exchange is small, the potential for increasing the heat exchange rate is limited. In this embodiment, a finned heat sink 22 is installed in the liquid-cooled cavity 103. The finned heat sink 22 is thermally connected to the side of the liquid-cooled cavity 103 near the light source mounting surface 104, which diffuses the heat from the side of the liquid-cooled cavity 103 near the light source mounting surface 104 to each fin of the finned heat sink 22. Through the contact heat exchange between each fin of the finned heat sink 22 and the coolant in the liquid-cooled cavity 103, the heat exchange area is greatly increased, thereby greatly increasing the heat exchange speed. The heat dissipation effect of the heat dissipation device 100 on the laser module 200 is greatly improved, less heat is accumulated on the laser module 200, the temperature of the laser module 200 is lower when it is working, and the service life of the laser module 200 is longer.

[0053] Reference Figure 3 and Figure 4 In some embodiments, the heat dissipation assembly 20 includes a heat spreader 21 and a finned heat sink 22. One side of the heat spreader 21 is thermally connected, welded, or bonded to the side of the liquid-cooled cavity 103 near the light source mounting surface 104, and the other side of the heat spreader 21 is thermally connected to the finned heat sink 22. In this embodiment, the heat dissipation assembly 20 adopts a heat spreader 21 combined with the finned heat sink 22. First, the heat from the side of the liquid-cooled cavity 103 near the light source mounting surface 104 is quickly and evenly diffused to the other side of the heat spreader 21 through the heat spreader 21. Then, the heat is quickly transferred and diffused to each fin of the finned heat sink 22 from the other side of the heat spreader 21. Finally, the fins of the finned heat sink 22 come into contact with the coolant in the liquid-cooled cavity 103 for heat exchange. This embodiment combines the advantages of rapid heat diffusion of the heat spreader 21 and the increased heat dissipation area of ​​the finned heat sink 22, enabling the heat dissipation device 100 to complete the heat transfer between the laser module 200 and the coolant more quickly, greatly improving the heat dissipation efficiency of the heat dissipation device 100, significantly improving the heat dissipation effect of the laser module 200, allowing the laser module 200 to reach a lower operating temperature and a longer service life.

[0054] Of course, in some other embodiments, the heat dissipation component 20 may also include a heat spreader 21 and a heat pipe; or, the heat dissipation component 20 may include a heat pipe and a finned heat sink 22; or, the heat dissipation component 20 may include a heat spreader 21, a heat pipe and a finned heat sink 22.

[0055] In some embodiments, the heat dissipation assembly 20 includes a finned heat sink 22, which divides the liquid-cooled cavity 103 into a tortuous flow channel. One end of the flow channel communicates with the inlet 101, and the other end communicates with the outlet 102. Thus, the low-temperature coolant flowing in from the inlet 101 passes through this tortuous flow channel, exchanges heat with the finned heat sink 22, and then flows out from the outlet 102. By forming a tortuous flow channel, the path of the low-temperature coolant entering from the inlet 101 within the liquid-cooled cavity 103 is lengthened, allowing for more thorough heat exchange with the finned heat sink 22. This prevents the low-temperature coolant flowing in from the inlet 101 from flowing out from the outlet 102 without sufficient heat exchange or absorbing only a small amount of heat, ensuring full utilization of the low-temperature coolant. In this embodiment, the finned heat sink 22 can be directly thermally connected to the side of the liquid-cooled cavity 103 near the light source setting surface 104, or thermally connected to the heat spreader 21 and / or heat pipes located on the side of the liquid-cooled cavity 103 near the light source setting surface 104.

[0056] Among them, the meandering flow channel can be an S-shaped, arc-shaped, ring-shaped, spiral-shaped, or other similar flow channel.

[0057] Reference Figure 5 and Figure 6 In some embodiments, the liquid cooling box 10 includes opposing first inner sidewalls 105 and second inner sidewalls 106. A finned heat sink 22 is located between the first inner sidewall 105 and the second inner sidewall 106. A liquid collection area V is formed between the finned heat sink 22 and the first inner sidewall 105 and the second inner sidewall 106, respectively. At least one partition 107 is provided within the liquid collection area V, dividing it into multiple sub-areas. Each sub-area includes an inlet area V1, an outlet area V2, and at least one transfer area V3. An inlet hole 101 communicates with the inlet area V1, and an outlet hole 102 communicates with the outlet area V2. (Reference) Figure 2 As indicated by the middle arrow, during use, the coolant flowing into the heat dissipation device 100 through the inlet hole 101 first reaches the inlet zone V1. The coolant in the inlet zone V1 then flows through the fin gaps 221 of the finned radiator 22, sequentially through each transfer zone V3, and finally reaches the outlet zone V2. The coolant in the outlet zone V2 flows out through the outlet hole 102. That is, the inlet zone V1, the outlet zone V2, and each transfer zone V3, together with the fin gaps 221 of the finned radiator 22, form a meandering flow channel in the liquid cooling cavity 103.

[0058] In this embodiment, by setting a baffle 107 in the liquid-cooled inner cavity 103, the baffle 107 and the fins of the finned heat sink 22 divide the liquid-cooled inner cavity 103 into a tortuous flow channel, so that the low-temperature coolant flowing in from the liquid inlet hole 101 flows through the gaps 221 between the fins of the finned heat sink 22 and exchanges heat with the finned heat sink 22, effectively improving the heat exchange efficiency between the finned heat sink 22 and the coolant.

[0059] Reference Figures 1 to 3 In some embodiments, the liquid-cooled box 10 includes a heat-conducting plate 11 and a box body 12 with one end open. The heat-conducting plate 11 seals the opening of the box body 12 to form a liquid-cooled inner cavity 103. The side of the heat-conducting plate 11 facing away from the box body 12 is the light source mounting surface 104. The liquid-cooled box 10 is constructed by splicing the heat-conducting plate 11 and the box body 12 with one end open, which facilitates the installation of the heat dissipation component 20 in the liquid-cooled inner cavity 103 and the cleaning of the inside of the box body 12. The side of the liquid-cooled box 10 where the laser module 200 is mounted uses the heat-conducting plate 11 to ensure rapid heat transfer.

[0060] In some embodiments, the heat-conducting plate 11 may be made of copper to ensure excellent thermal conductivity. Of course, the heat-conducting plate 11 may also be made of aluminum or other materials with good thermal conductivity.

[0061] In some embodiments, the heat-conducting plate 11 can also be directly the first vapor chamber plate. In this way, the laser module 200 is directly thermally connected to the first vapor chamber plate. Through the rapid heat diffusion and conduction characteristics of the first vapor chamber plate, the heat generated by the laser module 200 can be transferred more quickly and evenly diffused to the side of the heat-conducting plate 11 facing the liquid-cooled inner cavity 103, significantly improving the heat transfer efficiency of the heat-conducting plate 11. Furthermore, by directly using the first vapor chamber plate as the heat-conducting plate 11, the liquid-cooled inner cavity 103 does not need to contain a vapor chamber plate 21 (i.e., the heat dissipation assembly 20 no longer needs to include a vapor chamber plate 21), further simplifying the structure of the heat dissipation device 100 and reducing cost and weight.

[0062] Combined with reference Figures 1 to 3 ,as well as Figure 7 and Figure 8In some embodiments, a sealing fit structure is provided between the heat-conducting plate 11 and the open end 121 of the box body 12 to ensure the sealing effect of the heat-conducting plate 11 on the open end 121 of the box body 12. The sealing fit structure may include an annular groove 31 and a sealing ring 32. The annular groove 31 is provided on the heat-conducting plate 11, and the sealing ring 32 is provided in the annular groove 31. The open end 121 of the box body 12 is directly inserted into the annular groove 31 and abuts against the sealing ring 32 to achieve a seal between the heat-conducting plate 11 and the open end 121 of the box body 12. Through the insertion fit between the open end 121 of the box body 12 and the annular groove 31, the box body 12 and the heat-conducting plate 11 can be quickly positioned and installed, and the sealing performance between the heat-conducting plate 11 and the open end 121 of the box body 12 is ensured by the abutment of the sealing ring 32 against the open end 121 and the annular groove 31.

[0063] In some embodiments, the sealing structure may further include an annular groove 31, an annular boss, and a sealing ring 32. One of the annular groove 31 and the annular boss is located on the heat-conducting plate 11, and the other is located on the open end 121 of the housing 12. The sealing ring 32 is located in the annular groove 31, and the annular boss is engaged in the annular groove 31 and abuts against the sealing ring 32. The engagement between the annular groove 31 and the annular boss allows for quick positioning and installation of the housing 12 and the heat-conducting plate 11. The abutment between the sealing ring 32 and the annular boss and the annular groove 31 ensures a tight seal between the heat-conducting plate 11 and the open end 121 of the housing 12.

[0064] The heat-conducting plate 11 and the housing 12 can be fixed together by screws. Alternatively, the heat-conducting plate 11 and the housing 12 can be fixed together by adhesive. Of course, in other embodiments, the heat-conducting plate 11 and the housing 12 can also be fixed together by other methods.

[0065] It should be noted that, provided there are no contradictions or conflicts, any two or more embodiments of the heat dissipation device 100 described above can be freely combined to form new embodiments.

[0066] like Figure 8 As shown, this application also proposes a laser device for use in a portable skin care device, including a laser module 200 and a heat dissipation device 100. The laser module 200 is mounted on the light source setting surface 104. The specific structure of the heat dissipation device 100 is as described in the above embodiments. Since this laser device adopts all the technical solutions of all the embodiments of the heat dissipation device 100 described above, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0067] In some embodiments, the laser module 200 includes a thermally conductive ceramic substrate 210 and at least one laser chip 220 disposed on one side of the ceramic substrate 210, with the side of the ceramic substrate 210 facing away from the laser chip 220 attached to the light source mounting surface 104. The ceramic substrate 210 may be made of aluminum nitride.

[0068] Reference Figure 9 This application also proposes a portable skin care device, including a laser device 400 and a housing 300 with a light emission window 310. The laser device 400 is disposed inside the housing 300 and is used to emit laser light from the light emission window 310 for skin care. The specific structure of this laser device is the same as described in the above embodiments. Since this portable skin care device adopts all the technical solutions of all the above embodiments of the laser device, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0069] The portable skin care device can be a laser hair removal device, a laser skin rejuvenation device, etc. This portable skin care device is used to apply treatment to the skin. When in use, the end with the light-emitting window 310 is placed against the skin, and the laser device 400 outputs a laser spot from the light-emitting window 310 onto the skin to perform skin care (such as hair removal, skin rejuvenation, etc.).

[0070] The above description is only a part or preferred embodiment of this application. Neither the text nor the drawings should limit the scope of protection of this application. All equivalent structural transformations made using the content of this application's specification and drawings under the overall concept of this application, or direct / indirect applications in other related technical fields, are included within the scope of protection of this application.

Claims

1. A heat dissipating device for dissipating heat from a laser module in a portable skin treatment device, characterized in that, The device includes a liquid cooling box, which has a liquid cooling cavity for containing coolant, and an inlet and an outlet communicating with the liquid cooling cavity. The liquid cooling box also has a light source mounting surface for thermally connecting with a laser module. The liquid-cooled cavity is equipped with a heat dissipation component, which is thermally connected to the side of the liquid-cooled cavity near the light source mounting surface to transfer the heat from the light source mounting surface to the coolant in the liquid-cooled cavity.

2. The heat dissipating device according to claim 1, wherein The heat dissipation component includes a heat spreader plate, which is thermally connected, welded, or bonded to the side of the liquid-cooled cavity near the light source mounting surface. And / or, The heat dissipation component includes a heat pipe, the evaporation section of which is thermally connected to the side of the liquid-cooled inner cavity near the light source mounting surface, and the condensation section of which is spaced apart from the side of the liquid-cooled inner cavity near the light source mounting surface. And / or, the heat dissipation assembly includes a finned heat sink, which is thermally connected to the side of the liquid-cooled cavity near the light source mounting surface.

3. The heat dissipating device of claim 1, wherein The heat dissipation assembly includes a vapor chamber and a finned heat sink. One side of the vapor chamber is thermally connected, welded, or bonded to the side of the liquid-cooled cavity near the light source mounting surface, and the other side of the vapor chamber is thermally connected to the finned heat sink.

4. The heat dissipating device according to claim 1 or 2, wherein The heat dissipation assembly includes a finned heat sink, which divides the liquid-cooled cavity into a meandering flow channel. One end of the flow channel is connected to the liquid inlet, and the other end of the flow channel is connected to the liquid outlet.

5. The heat dissipating device of claim 4, wherein The liquid cooling box includes a first inner sidewall and a second inner sidewall opposite to each other. The finned heat sink is located between the first inner sidewall and the second inner sidewall. The finned heat sink forms a liquid collection area between itself and the first inner sidewall and the second inner sidewall respectively. At least one partition is provided in the liquid collection area, and the partition divides the liquid collection area into multiple sub-areas. All sub-areas include a liquid inlet area, a liquid outlet area and at least one transfer area. The liquid inlet hole communicates with the liquid inlet area, and the liquid outlet hole communicates with the liquid outlet area. The coolant in the liquid inlet area flows through the fin gaps of the finned heat sink and sequentially through each transfer area to reach the liquid outlet area.

6. The heat dissipating device according to any one of claims 1 to 3, wherein The liquid-cooled box includes a heat-conducting plate and a box body with an open end. The heat-conducting plate seals and covers the open end of the box body to form the liquid-cooled inner cavity with the box body. The side of the heat-conducting plate facing away from the box body is the surface where the light source is located.

7. The heat dissipating device according to claim 6, wherein A sealing fit structure is provided between the heat-conducting plate and the open end of the box body. The sealing fit structure includes an annular groove, an annular boss and a sealing ring. One of the annular groove and the annular boss is provided on the heat-conducting plate and the other is provided on the open end of the box body. The sealing ring is provided in the annular groove and the annular boss is engaged in the annular groove and abuts against the sealing ring. Alternatively, the heat-conducting plate is provided with an annular groove, and a sealing ring is provided in the annular groove. The open end of the box body is inserted into the annular groove and abuts against the sealing ring. And / or, The heat-conducting plate is fixed to the box body by screws, or the heat-conducting plate is fixed to the box body by adhesive bonding; And / or, The heat-conducting plate is a copper plate or a heat spreader.

8. A laser device for use in a portable skin care device, characterized in that The device includes a laser module and a heat dissipation device as described in any one of claims 1 to 7; the laser module is mounted on the light source mounting surface, or the laser module includes a thermally conductive ceramic substrate and at least one laser chip disposed on one side of the ceramic substrate, and the side of the ceramic substrate facing away from the laser chip is attached to the light source mounting surface.

9. A portable skin treatment device comprising a housing provided with an outcoupling window, characterized in that It also includes the laser device of claim 8, wherein the laser device is disposed within the housing and is used to emit laser light from the light-emitting window for skin care.

Images