Water-cooling heat dissipation structure of laser

Abstract

This utility model relates to the field of laser heat dissipation technology, and discloses a water-cooled heat dissipation structure for a laser, including a cover plate, a distribution plate, an interface plate, and heat pipes. The cover plate is in contact with the laser chip. The interface plate has spaced-apart inlet and outlet water channels and multiple receiving slots. One end of the distribution plate is welded to the cover plate, and the other end is welded to the interface plate. The distribution plate has a flow area, one end of which is connected to the inlet water channel. The heat pipes are disposed within the receiving slots to conduct heat generated by the laser chip to various locations on the interface plate. By using heat pipes to rapidly diffuse heat from the laser chip to various locations on the interface plate, heat exchange is completed through sufficient contact between the distribution plate and the interface plate and the cooling water, and the heat is carried away by the cooling water, improving the overall heat exchange efficiency.

Description

Technical Field

[0001] This utility model relates to the field of laser heat dissipation technology, and in particular to a water-cooled heat dissipation structure for lasers. Background Technology

[0002] Lasers are essential core components in industries such as fiber optic communication and data transmission. The "heart" of a laser is the laser chip, which generates a significant amount of heat during operation, in addition to converting electrical energy into light energy. If this heat cannot be dissipated quickly, it can cause a series of problems, such as redshift of the lasing wavelength, reduced efficiency, decreased power, and increased threshold current. Therefore, heat dissipation structures are needed to cool the laser and ensure its lifespan and reliability.

[0003] Chinese utility model patent with publication number CN219329470U discloses a water-cooled heat dissipation structure for a fiber laser.

[0004] In the above technical solutions, heat dissipation is achieved through fan cooling and water cooling. The fan can only remove part of the heat from the surface of the laser. Although the S-shaped water cooling pipe and baffle of the water cooling component increase the contact area, the area far from the heat source has difficulty contacting enough heat due to the slow heat transfer. As a result, most of the heat exchange area is not fully utilized, and the overall heat dissipation efficiency is limited. Utility Model Content

[0005] To overcome at least one of the defects described in the prior art, this utility model provides a water-cooled heat dissipation structure for a laser. By setting heat pipes, the heat from the laser chip is rapidly diffused to various locations on the interface board. The heat is exchanged through full contact between the heat exchanger and the cooling water via the heat exchanger and the interface board, and is carried away by the cooling water, thereby improving the overall heat exchange efficiency.

[0006] The technical solution of this utility model is implemented as follows:

[0007] A water-cooled heat dissipation structure for a laser includes a cover plate, a distribution plate, an interface plate, and heat pipes, wherein...

[0008] The cover plate contacts the laser chip; the interface board has spaced-apart inlet and outlet water channels and multiple receiving slots; one end of the flow divider plate is welded to the cover plate, and the other end is welded to the interface board; the flow divider plate has a flow area, one end of which is connected to the inlet water channel, and the other end of which is connected to the outlet water channel; the heat pipe is disposed in the receiving slot to conduct the heat generated by the laser chip to various locations on the interface board.

[0009] Based on the above technical solutions, preferably, both the receiving tank and the heat pipe are elongated, and the heat pipe is fitted to the inner surface of the receiving tank.

[0010] Based on the above technical solutions, preferably, the heat pipe is welded and fixed to the receiving tank.

[0011] Based on the above technical solutions, preferably, the plurality of receiving slots are arranged at circumferential intervals along the interface plate.

[0012] Based on the above technical solutions, preferably, the water inlet channel has a first water inlet and a first water outlet, wherein the first water inlet is located on one side wall of the interface plate; and the first water outlet is located on the top wall of the interface plate.

[0013] Based on the above technical solutions, preferably, the water outlet channel has a second inlet and a second outlet, wherein the second outlet is located on the side wall of the interface plate opposite to the first inlet; the second inlet is located on the top wall of the interface plate.

[0014] Based on the above technical solutions, preferably, a first overflow groove is provided on the top wall of the interface plate corresponding to the position of the first water outlet, and a second overflow groove is provided on the top wall of the interface plate corresponding to the position of the second water inlet, with the first overflow groove and the second overflow groove being spaced apart.

[0015] Based on the above technical solutions, preferably, the length of the first overflow trough is longer than the length of the first inlet, and the length of the second overflow trough is longer than the length of the second inlet.

[0016] Based on the above technical solutions, preferably, the flow area includes a first groove, a second groove, and a third groove. The first groove and the second groove are both formed by recessing inward from the bottom wall of the flow divider plate, and the first groove and the second groove are spaced apart. The third groove is formed by recessing inward from the top wall of the flow divider plate. The first groove includes a first drainage channel and a first guide hole distributed in sequence, and the first drainage channel is correspondingly arranged with the first overflow channel. The second groove includes a second drainage channel and a second guide hole distributed in sequence, and the second drainage channel is correspondingly arranged with the second overflow channel. The third groove includes a guide channel, one end of which is connected to the first guide hole, and the other end of which is connected to the second guide hole.

[0017] Based on the above technical solutions, preferably, the interface board is provided with mounting holes for easy installation of lasers.

[0018] In summary, the water-cooled heat dissipation structure for lasers provided by this utility model has the following advantages over the prior art:

[0019] (1) By setting up heat pipes, the heat generated by the laser chip can be quickly transferred from the cover plate through the splitter plate to various parts of the interface plate by utilizing its thermal conductivity, which is much higher than that of metal materials, thereby improving the heat transfer speed.

[0020] (2) Heat pipes can quickly disperse concentrated heat to various positions of the interface plate, so that the cooling medium in the inlet channel, flow area and outlet channel can fully contact each other, so that the heat exchange area of ​​the flow divider and interface plate can be fully utilized, and the overall heat exchange efficiency can be improved.

[0021] (3) The cover plate and the flow divider plate, and the flow divider plate and the interface plate are fixed by welding, which reduces the contact thermal resistance, makes the heat transfer path smoother, and further improves the overall performance and heat dissipation effect of the heat dissipation structure. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a three-dimensional structural diagram of an embodiment of the present utility model;

[0024] Figure 2 This is a cross-sectional structural diagram of an embodiment of the present utility model;

[0025] Figure 3 This is an exploded view of an embodiment of the present utility model;

[0026] Figure 4 This is a bottom view of the splitter plate according to an embodiment of the present utility model;

[0027] Figure 5 This is a top view of the splitter plate according to an embodiment of the present utility model;

[0028] Figure 6 This is a three-dimensional structural diagram of the diverter plate according to an embodiment of the present utility model;

[0029] Figure 7 This is a top view of the interface board according to an embodiment of the present utility model;

[0030] The meanings of the reference numerals in the attached drawings are as follows: 1. Cover plate; 2. Diverter plate; 21. Flow area; 211. First groove; 2111. First drainage groove; 2112. First guide hole; 212. Second groove; 2121. Second drainage groove; 2122. Second guide hole; 213. Third groove; 2131. Guide groove; 3. Interface plate; 31. Water inlet channel; 311. First water inlet; 312. First water outlet; 32. Water outlet channel; 321. Second water inlet; 322. Second water outlet; 33. Receiving tank; 34. First overflow groove; 35. Second overflow groove; 36. Mounting hole; 4. Heat pipe; 5. First partition plate; 6. Second partition plate; 7. Third partition plate; 8. Fourth partition plate. Detailed Implementation

[0031] The technical solutions of this utility model will be clearly and completely described below with reference to the embodiments of this utility model. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this utility model.

[0032] See Figures 1-7 This utility model discloses a water-cooled heat dissipation structure for a laser, including a cover plate 1, a flow divider plate 2, an interface plate 3, and a heat pipe 4.

[0033] See Figure 1 As shown, in this embodiment, the cover plate 1 is made of a high thermal conductivity material. The upper surface of the cover plate 1 is in direct contact with the laser chip. When the laser chip is working, heat is conducted downwards along the cover plate 1. The surface of the cover plate 1 is flat and smooth to ensure good adhesion with the laser chip, reduce thermal resistance, and quickly absorb the heat generated by the laser chip, providing a basis for subsequent heat conduction. More specifically, the cover plate 1 is made of oxygen-free copper, which has a thermal conductivity of about 400 W / (m·K), allowing for rapid transfer of heat from the laser chip to the cover plate 1. Furthermore, oxygen-free copper is soft, has good ductility, and is easy to precision machine, meeting the structural precision requirements for laser heat dissipation. In other embodiments, the upper surface of the cover plate 1 can also indirectly transfer heat to the laser chip through an excessive heat sink.

[0034] See Figure 1 and Figure 3As shown, in this embodiment, the interface board 3 is made of oxygen-free copper. The thermal conductivity of oxygen-free copper is about 400W / (m·K), which can quickly transfer heat from the laser chip. Moreover, oxygen-free copper is soft and has good ductility, making it easy to perform precision machining and meeting the structural precision requirements of laser heat dissipation. The interface board 3 is provided with an inlet channel 31 and an outlet channel 32 arranged at intervals. The inlet channel 31 and the outlet channel 32 are separated by a first partition plate 5. Both the inlet and outlet channels are hollow channels to facilitate the flow of cooling water.

[0035] See Figure 2 and Figure 7 As shown, in this embodiment, specifically, the water inlet channel 31 has a first inlet 311 and a first outlet 312. The first inlet 311 and the first outlet 312 are located at both ends of the water inlet channel 31. The first inlet 311 is located on one side wall of the interface plate 3. The first inlet 311 is used to connect the external cooling water supply pipe and the water pump. The first outlet 312 is located on the top wall of the interface plate 3. The top wall of the interface plate 3 is provided with a first overflow groove 34 corresponding to the position of the first outlet 312. Specifically, the first overflow groove 34 is formed by recessing from the top wall of the interface plate 3. Moreover, in this embodiment, the length of the first overflow groove 34 is longer than the length of the first outlet 312. This design facilitates the entry of cooling water from the first outlet 312 into the first overflow groove 34, which facilitates the subsequent introduction of cooling water into the diverter plate 2, increases the contact area between the cooling water and the internal part of the interface plate 3, and improves the heat exchange efficiency.

[0036] See Figure 2 and Figure 7 As shown, in this embodiment, specifically, the water outlet channel 32 has a second inlet 321 and a second outlet 322. The second outlet 322 and the second inlet 321 are located at the two ends of the water outlet channel 32, respectively. The second outlet 322 is located on the side wall of the interface plate 3 opposite to the first inlet 311. The second inlet 321 is located on the top wall of the interface plate 3. A second overflow groove 35 is provided on the top wall of the interface plate 3 corresponding to the position of the second inlet 321. Specifically, the second overflow groove 35 is formed by indentation from the top wall of the interface plate 3. In this embodiment, the length of the second overflow groove 35 is longer than the length of the second inlet 321. This design facilitates the discharge of cooling water from the diversion plate 2 and gathers the cooling water flowing out of the diversion plate 2 into the water outlet channel 32, thereby improving the uniformity of the water flow.

[0037] It should also be noted that the first overflow channel 34 and the second overflow channel 35 are set apart to prevent them from being connected, which would cause cooling water to flow directly from the first outlet 312 to the second inlet 321 and affect the heat exchange efficiency.

[0038] See Figure 1As shown, in some embodiments, the interface board 3 is provided with mounting holes 36 for easy installation of lasers. The mounting holes 36 are provided through the interface board 3. This design allows the interface board 3 to be quickly connected, simplifies the assembly process, and improves installation efficiency.

[0039] See Figure 3 As shown, in this embodiment, the flow divider 2 is disposed between the cover plate 1 and the interface plate 3. One end of the flow divider 2 is welded and fixed to the cover plate 1, and the other end of the flow divider 2 is welded and fixed to the interface plate 3. Specifically, the welding method between the flow divider 2 and the cover plate 1 and the welding method between the flow divider 2 and the interface plate 3 are brazing. Brazing has high connection strength, which can make the cover plate 1, the flow divider 2 and the interface plate 3 form a whole through brazing. It can ensure that the connection between the components is stable under long-term use and complex working conditions, and will not easily loosen or separate, thus ensuring the integrity and reliability of the heat dissipation structure. Moreover, brazing has good sealing performance, and good sealing can prevent cooling water leakage and ensure the normal operation of the laser.

[0040] Among them, the shunt plate 2 is also made of oxygen-free copper. The thermal conductivity of oxygen-free copper is about 400W / (m·K), which can quickly transfer the heat of the laser chip. Moreover, oxygen-free copper is soft and has good ductility, which makes it easy to carry out precision machining and can meet the structural precision requirements of laser heat dissipation.

[0041] See Figure 4 , Figure 5 and Figure 6As shown, in this embodiment, a flow area 21 is provided on the diversion plate 2. One end of the flow area 21 is connected to the water inlet channel 31, and the other end of the flow area 21 is connected to the water outlet channel 32. Specifically, the flow area 21 includes a first groove 211, a second groove 212, and a third groove 213. The first groove 211 and the second groove 212 are both formed by recessing inward from the bottom wall of the diversion plate 2, and the first groove 211 and the second groove 212 are arranged at intervals. In this embodiment, the first groove 211 and the second groove 212 are separated by a second partition plate 6. The first partition plate 5 and the second partition plate 6 are arranged in contact to prevent cooling water from flowing directly from the first groove 211 into the second groove 212, which would affect the heat exchange efficiency. The third groove 213 is formed by recessing inward from the top wall of the diversion plate 2. The first groove 211 includes a first drainage groove 2111 and a first guide hole 2112 arranged in sequence. Specifically, the first drainage groove 2111 is located on one side of the first groove 211, and the first guide hole 2112 is located on the other side of the first groove 211. The first guide hole 2112 occupies the space of the first groove 211. The second groove 212 includes a second drainage groove 2121 and a second guide hole 2122 arranged sequentially. Specifically, the second drainage groove 2121 is located on one side of the second groove 212, and the second guide hole 2122 is located on the other side of the second groove 212. The second drainage groove 2121 and the second guide hole 2122 occupy the space of the second groove 212. The third groove 213 includes a guide groove 2131. One end of the guide groove 2131 is connected to the first guide hole 2112, and the other end of the guide groove 2131 is connected to the second guide hole 2122.

[0042] With this design, the water pump delivers cooling water from the external water supply pipe through the first inlet 311. The cooling water then passes through the first outlet 312 and sequentially enters the first overflow trough 34, the first drain trough 2111, the first guide hole 2112, and the guide trough 2131. It then passes through the second guide hole 2122, the second drain trough 2121, the second inlet 321, and the second outlet 322 before being discharged. This design involves multiple components and a long flow path for the cooling water, resulting in higher heat exchange efficiency.

[0043] See Figure 4 and Figure 6As shown, in this embodiment, multiple first guide holes 2112 are provided. The first guide holes 2112 are spaced apart along the first groove 211. Multiple parallel third partition plates 7 are provided between adjacent first guide holes 2112. The length of the third partition plate 7 is less than the side length of the first groove 211. The multiple spaced first guide holes 2112 can disperse the water flow and avoid local water flow concentration or excessive flow rate. In conjunction with the third partition plates 7 between adjacent first guide holes 2112, the water flow direction is straightened, so that the water flow enters the subsequent guide groove 2131 more evenly, ensuring that the cooling water and each part of the heat dissipation structure are in full contact.

[0044] See Figure 4 and Figure 6 As shown, in this embodiment, multiple second guide holes 2122 are provided. The second guide holes 2122 are spaced apart along the second groove 212, and multiple parallel fourth partition plates 8 are provided between adjacent second guide holes 2122. The length of the fourth partition plate 8 is less than the side length of the first groove 211. The multiple spaced second guide holes 2122 can disperse the water flow, avoid local water flow concentration or excessive flow velocity. In conjunction with the fourth partition plates 8 between adjacent second guide holes 2122, the water flow direction is straightened, so that the water flowing in from the guide groove 2131 enters the second guide hole 2122 more evenly, ensuring that the cooling water is in full contact with all parts of the heat dissipation structure.

[0045] See Figure 5 As shown, in this embodiment, multiple guide channels 2131 are provided. The second guide channels 2131 are spaced apart along the third groove 213. The number of second guide channels 2131 is the same as the number of first guide holes 2112 and second guide holes 2122, and they are arranged in a one-to-one correspondence. The multiple guide channels 2131 correspond one-to-one with the first guide holes 2112 and the second guide holes 2122, which can accurately distribute the cooling water flowing in from the first guide hole 2112 to each guide channel 2131, and then discharge it through the corresponding second guide hole 2122. This avoids the problem of concentrated or uneven water flow in the traditional structure and ensures that each area of ​​the diversion plate 2 can be covered by cooling water.

[0046] See Figure 1 and Figure 3As shown, in this embodiment, the interface board 3 is provided with multiple receiving slots 33, and the heat pipe 4 is disposed in the receiving slots 33 to conduct the heat generated by the laser chip to various locations on the interface board 3. The heat pipe 4 has a thermal conductivity far exceeding that of metal, can quickly balance the temperature, and requires no power, relying on its own circulation to work, with no noise and no energy consumption, rapidly conducting the heat from the laser chip. The thermal conductivity of the heat pipe 4 can reach 5000 W / (m·K), which can greatly improve the overall thermal conductivity. Heat can be quickly dispersed to various parts of the interface board 3 through the heat pipe 4, and then carried away by the cooling water. This can accelerate the heat transfer speed in the interface board 3 and the distribution plate 2, solving the problem of insufficient heat exchange due to heat concentration in the middle distribution plate 2 and below the interface board 3.

[0047] In this embodiment, multiple receiving slots 33 are provided, which are spaced apart circumferentially along the interface plate 3. One side of each receiving slot 33 is open to facilitate the placement of heat pipes 4. The number of heat pipes 4 is the same as the number of receiving slots 33. The multiple receiving slots 33 and heat pipes 4 spaced apart circumferentially along the interface plate 3 can quickly conduct the heat generated by the laser chip to various areas of the interface plate 3 through multiple heat pipes 4, avoiding heat accumulation in local areas. Combined with the high thermal conductivity of heat pipes 4 of over 5000 W / (m・K), the heat can be evenly distributed throughout the entire interface plate 3 and then efficiently carried away by cooling water, greatly improving the overall heat dissipation efficiency.

[0048] More specifically, in this embodiment, both the receiving groove 33 and the heat pipe 4 are elongated. The heat pipe 4 is fitted to the inner surface of the receiving groove 33 and is welded to the receiving groove 33. Specifically, the welding method between the heat pipe 4 and the receiving groove 33 is soldering. Soldering can fill any tiny gaps that may exist on the mating surface, forming a continuous heat conduction path. The elongated design makes the contact area between the heat pipe 4 and the receiving groove 33 larger, resulting in higher heat conduction efficiency.

[0049] Specific implementation steps

[0050] The cover plate 1 contacts the laser chip, and the heat from the laser chip is transferred to the cover plate 1, the distribution plate 2, and the interface plate 3. The heat pipe 4 evenly conducts the heat from the laser chip to various parts of the interface plate 3. The water pump sends cooling water from the external water supply pipe into the first inlet 311. The cooling water will pass through the first outlet 312 and enter the first overflow trough 34, the first drainage trough 2111, the first guide hole 2112, and the guide trough 2131 in sequence. Then it will pass through the second guide hole 2122, the second drainage trough 2121, the second inlet 321, and the second outlet 322 in sequence and be discharged. Heat exchange is achieved through the heat pipe 4 and water cooling.

[0051] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A water-cooling heat dissipation structure of a laser, characterized by, It includes a cover plate (1), a manifold plate (2), an interface plate (3), and a heat pipe (4), wherein, The cover plate (1) is in contact with the laser chip; The interface plate (3) is provided with an inlet channel (31) and an outlet channel (32) spaced apart, and the interface plate (3) is provided with a plurality of receiving slots (33); One end of the diversion plate (2) is welded and fixed to the cover plate (1), and the other end of the diversion plate (2) is welded and fixed to the interface plate (3). A flow area (21) is provided on the diversion plate (2). One end of the flow area (21) is connected to the water inlet channel (31), and the other end of the flow area (21) is connected to the water outlet channel (32). The heat pipe (4) is disposed in the receiving groove (33) to conduct the heat generated by the laser chip to various locations on the interface board (3).

2. The water-cooling heat dissipation structure of a laser device according to claim 1, wherein Both the receiving groove (33) and the heat pipe (4) are elongated, and the heat pipe (4) is fitted to the inner surface of the receiving groove (33).

3. The water-cooled heat dissipation structure for a laser according to claim 2, characterized in that, The heat pipe (4) is welded and fixed to the receiving tank (33).

4. The water-cooling heat dissipation structure of a laser device according to claim 1 or 2, characterized in that, The plurality of the receiving slots (33) are arranged at circumferential intervals along the interface plate (3).

5. The water-cooling heat dissipation structure of a laser device according to claim 1, wherein The water inlet channel (31) has a first water inlet (311) and a first water outlet (312), wherein, The first water inlet (311) is located on one side wall of the interface plate (3); The first outlet (312) is located on the top wall of the interface plate (3).

6. The water-cooling heat dissipation structure of a laser device according to claim 5, wherein The water outlet channel (32) has a second inlet (321) and a second outlet (322), wherein, The second outlet (322) is located on the side wall of the interface plate (3) opposite to the first inlet (311); The second water inlet (321) is located on the top wall of the interface plate (3).

7. The water-cooling heat dissipation structure of a laser device according to claim 6, wherein The top wall of the interface plate (3) is provided with a first overflow groove (34) corresponding to the position of the first water outlet (312), and the top wall of the interface plate (3) is provided with a second overflow groove (35) corresponding to the position of the second water inlet (321). The first overflow groove (34) and the second overflow groove (35) are provided at intervals.

8. The water-cooling heat dissipation structure of a laser device according to claim 7, wherein The length of the first overflow trough (34) is longer than the length of the first inlet (311), and the length of the second overflow trough (35) is longer than the length of the second inlet (321).

9. The water-cooled heat dissipation structure for a laser according to claim 7, characterized in that, The flow region (21) includes a first groove (211), a second groove (212), and a third groove (213). The first groove (211) and the second groove (212) are both recessed inward from the bottom wall of the flow divider (2), and the first groove (211) and the second groove (212) are spaced apart. The third groove (213) is recessed inward from the top wall of the flow divider (2). The first groove (211) includes a first drainage groove (2111) and a first guide hole (2112) distributed in sequence, and the first drainage groove (2111) is correspondingly provided with the first overflow groove (34); The second groove (212) includes a second drainage groove (2121) and a second guide hole (2122) distributed in sequence, and the second drainage groove (2121) is correspondingly arranged with the second overflow groove (35); The third groove (213) includes a flow guide groove (2131), one end of which is connected to the first flow guide hole (2112), and the other end of which is connected to the second flow guide hole (2122).

10. The water-cooling heat dissipation structure of a laser device according to claim 1, wherein The interface board (3) is provided with mounting holes (36) for easy installation of lasers.

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