A new earphone shell structure for controlling sound pressure of a moving iron loudspeaker

Abstract

A novel headphone shell structure for controlling the sound pressure of a balanced armature speaker is disclosed, relating to the technical field of balanced armature headphone devices. The headphone shell has a recessed pressure relief hole on the side away from the mounting base. A mounting groove is formed on the side of the headphone shell connected to the mounting base. A speaker unit mounting groove is connected to the rear end of the pressure relief hole. A conductive groove is positioned vertically above the pressure relief hole, separating the speaker unit mounting groove from the pressure relief hole. A metal conductive element is placed within the conductive groove. The middle of the mounting groove is hollow and extends towards the front end to form a front cavity, which is connected to the conductive groove. By placing a pressure relief hole at the transition point between the headphone shell's sound cavity and the front cavity, a traditional damper is replaced. A conductive element is placed at this pressure relief hole to control the sound pressure variation. This not only allows for a more natural sound transition but also optimizes the headphone's structural components, reducing production costs and assembly difficulty.

Description

Technical Field

[0001] This utility model relates to a novel headphone shell structure for controlling the sound pressure of a moving iron speaker, and relates to the technical field of moving iron headphone equipment. Background Technology

[0002] Headphones are classified into dynamic and balanced armature headphones based on their operating principle. Balanced armature headphones are more popular because they are more adaptable to different headphone housings.

[0003] Existing balanced armature earphones mainly consist of an earphone shell, a balanced armature speaker unit, a sound tube (including a damper and a filter), a crossover, ear tips, and an interface. Among these, the sound tube is the core component for sound tuning. The damper selectively absorbs or attenuates specific frequency energy in the sound signal. Due to the limited space inside the earphone shell, the assembly of each component is difficult, resulting in a high defect rate during production and assembly. In particular, if the damper is not properly fixed, unnatural sound transitions can easily occur. Therefore, a novel earphone shell structure for controlling the sound pressure of the balanced armature speaker is proposed to solve the problems existing in the current technology. Utility Model Content

[0004] The purpose of this invention is to address the defects or deficiencies in the existing technology by providing a novel headphone shell structure for controlling the sound pressure of a moving iron speaker. By setting a pressure relief hole at the transition position between the sound-emitting cavity and the front cavity of the headphone shell to replace the traditional damper, and by setting a conductive element at the pressure relief hole to control the variable of sound pressure, not only can the sound be connected more naturally, but the structural components of the headphone are also optimized, and the production cost and assembly difficulty are reduced.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: It includes an earphone shell 1 and a fixing base 2. The fixing base 2 is detachably disposed on the rear side of the earphone shell 1. A recessed pressure relief hole 13 is provided on the side of the earphone shell 1 away from the fixing base 2. The side of the earphone shell 1 connected to the fixing base 2 is recessed to form a mounting groove 101. A speaker unit mounting groove 14 is provided at the rear end of the pressure relief hole 13 and is connected to the mounting groove 101. A conduction groove 11 is provided at the vertical position of the pressure relief hole 13. The conduction groove 11 separates the speaker unit mounting groove 14 from the pressure relief hole 13. A metal conductor 4 is provided in the conduction groove. The middle part of the mounting groove 101 is a hollow structure and extends to the front end to form a front cavity 15. The front cavity 15 is connected to the conduction groove 11.

[0006] Furthermore, a filter groove 12 is provided at the front end of the pressure relief hole 13, and the diameter of the pressure relief hole 13 is 0.5 to 1.0 mm.

[0007] Furthermore, the metal conductive element 4 includes a fixed cover 41 and a conductive rod 42 disposed at its bottom. The conductive rod 42 has a forked structure, forming a U-shaped structure, and the conductive rod 42 extends to the transition edge between the front cavity 15 and the conductive groove 11.

[0008] Furthermore, the front cavity 15 is a Z-shaped conductive cavity structure, and the inner diameter of the front end is smaller than the inner diameter of the rear end.

[0009] Furthermore, the mounting groove 101 is provided with a communicating sound-permeable groove 16 at the front end of the front cavity 15.

[0010] Furthermore, the fixed base 2 is provided with a connecting pipe 21 that is connected to the sound-permeable groove 16.

[0011] Furthermore, the rear end of the fixed base 2 is provided with a cover 3, and the cover 3 is provided with a sound-permeable hole 31 corresponding to the connecting pipe 21.

[0012] Furthermore, the front end of the earphone shell 1 is provided with an ear cap mounting head 17 that communicates with the front cavity 15.

[0013] Furthermore, a wire terminal mounting part 18 is provided on one side of the earphone housing 1, which is connected to the mounting groove 101.

[0014] After adopting the above technical solution, the beneficial effects of this utility model are as follows: by setting a pressure relief hole at the transition position from the sound cavity to the front cavity of the headphone shell to replace the traditional damper, and by setting a conductive element at the pressure relief hole to control the variable of sound pressure, not only can the sound be connected more naturally, but the structural components of the headphone are also optimized, and the production cost and assembly difficulty are reduced. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the structure of this utility model;

[0017] Figure 2 This is an exploded structural diagram of the present invention;

[0018] Figure 3 This is a schematic diagram of the structure of the earphone shell 1 in this utility model;

[0019] Figure 4This is a schematic diagram of the structure of the metal conductive element 4 in this utility model;

[0020] Figure 5 yes Figure 1 Sectional view along the AA direction;

[0021] Figure 6 yes Figure 2 The second angle view.

[0022] Explanation of reference numerals in the attached drawings: 1. Earphone housing; 2. Mounting base; 3. Face cover; 4. Metal conductive component; 11. Conductive groove; 12. Filter groove; 13. Pressure relief hole; 14. Speaker unit mounting groove; 15. Front cavity; 16. Sound transmission groove; 17. Ear cap mounting head; 18. Wire terminal mounting part; 21. Connecting pipe; 31. Sound transmission hole; 101. Mounting groove. Detailed Implementation

[0023] See Figures 1-6As shown, the technical solution adopted in this specific embodiment is as follows: It includes an earphone shell 1 and a fixing base 2. The fixing base 2 is detachably disposed on the rear side of the earphone shell 1. A recessed pressure relief hole 13 is provided on the side of the earphone shell 1 away from the fixing base 2. The side of the earphone shell 1 connected to the fixing base 2 is recessed to form a mounting groove 101. A speaker unit mounting groove 14 is provided at the rear end of the pressure relief hole 13 and is connected to the mounting groove 101. A conductive groove 11 is provided at a vertical position of the pressure relief hole 13. The conductive groove 11 separates the speaker unit mounting groove 14 from the pressure relief hole 13. A metal conductive component 4 is provided in the conductive groove. The part is a hollow structure that extends to the front end to form a front cavity 15, which is connected to the conduction groove 11. The pressure relief hole 13 has a diameter of 0.5-1.0mm. Traditional balanced armature headphones require the use of a sound tube and a damper to regulate the sound pressure and eliminate specific frequency resonance peaks, mainly the 1.5-3kHz resonance peak. However, the sound tube and damper occupy more than 30% of the headphone cavity space, which is not conducive to the use of a small space. Moreover, it requires high assembly precision. A damper offset of 0.5mm will cause the frequency response curve to drift (±3dB). At the same time, the multi-stage structure is prone to phase loss, making the sound transition less natural and more... The production and assembly of components also led to an increased defect rate. Therefore, in this embodiment, a pressure relief hole is used to replace the sound guide tube and damper. The pressure relief hole is essentially a miniature Helmholtz resonator. In this embodiment, a 0.6mm aperture is used as an example. Sound waves above 1.5kHz are preferentially released through the pressure relief hole due to their shorter wavelength. Sound waves below 1kHz are guided to the front cavity by the U-shaped metal conductor. The entire sound transmission path is: moving iron unit -- transmission groove -- metal conductor -- front cavity / pressure relief hole. When sound is emitted, it is first transmitted to the metal conductor in the transmission groove, and then guided into the front cavity by the metal conductor. When sound passes through the metal conductor, excess sound pressure is discharged through the pressure relief hole, thereby relieving pressure on specific high-frequency sounds. This eliminates resonance peaks in the 1.5-3kHz range, achieving the corresponding tuning effect. This not only reduces the number of drivers in the unit structure but also optimizes the headphone's space utilization, increases the volume of the sound transmission cavity, and obtains better sound quality. It also reduces production costs and the defect rate. The diameter of the pressure relief hole can be specifically set according to the specific tuning requirements of different headphones, allowing for rapid adjustment of the frequency response curve. A smaller hole diameter attenuates higher frequencies. The formula for calculating the hole diameter is as follows:

[0024]

[0025] Where f0 is the frequency response value, r is the radius of the pressure relief hole, V is the front cavity volume, and L is the channel length. For example, Φ0.4mm attenuates 10kHz (f0), with a typical attenuation of -10 to 12dB. Small apertures create acoustic impedance for short-wavelength high-frequency waves. Φ0.8mm attenuates 2kHz (f0), with a typical attenuation of -6 to 8dB. 1.5-3kHz corresponds to a pressure relief hole diameter of 0.5 to 1.0mm. Larger apertures allow some mid-frequency waves to escape, thus enabling specific customization according to specific needs to meet the needs of different users. Moreover, it eliminates the need for the refined tuning design of traditional structures, effectively improving production efficiency.

[0026] The space between the mounting base and the mounting slot is also used for mounting and securing the control board and other components.

[0027] More specifically, the front end of the pressure relief hole 13 is provided with a filter groove 12, which is used to set a dustproof net or a microporous membrane for adjusting the sound transmission rate, so as to obtain a better sound pressure control effect.

[0028] More specifically, the metal conductive component 4 includes a fixed cover 41 and a conductive rod 42 disposed at its bottom. The conductive rod 42 has a forked structure, forming a U-shaped structure, and the conductive rod 42 extends to the transition edge between the front cavity 15 and the conductive groove 11. In this embodiment, the conductive rod of the metal conductive component adopts a forked structure, which facilitates sound transmission and also achieves a pressure relief effect.

[0029] More specifically, the front cavity 15 is a Z-shaped conductive cavity structure, and the inner diameter of the front end is smaller than that of the rear end. In this embodiment, the corners of the inner wall of the front cavity are all rounded to form a Z-shaped sound conductive cavity structure, which can conduct sound over the shortest distance and reduce sound distortion.

[0030] More specifically, the mounting slot 101 is provided with a sound-permeable slot 16 at the front end of the front cavity 15. The fixing seat 2 is provided with a connecting pipe 21 connected to the sound-permeable slot 16. The fixing seat 2 is provided with a face cover 3 at the rear end. The face cover 3 is provided with a sound-permeable hole 31 corresponding to the connecting pipe 21. Since the headphones adopt an in-ear design, further sound pressure control is required during actual use. The sound-permeable slot, connecting pipe, and sound-permeable hole are connected to the front cavity, which can effectively release and control excess sound pressure, reduce discomfort during long-term use, and improve user comfort.

[0031] More specifically, the front end of the earphone shell 1 is provided with an ear cap mounting head 17 that is connected to the front cavity 15. The ear cap mounting head is used to cooperate with the in-ear ear cap for ear cap installation. Its outer wall may adopt a threaded structure or a smooth surface structure, depending on the actual needs.

[0032] More specifically, the earphone housing 1 has a wire terminal mounting part 18 on one side that is connected to the mounting groove 101. The wire terminal mounting part is used to connect and fix the terminal.

[0033] The working principle of this utility model is as follows: When the headphones are installed, the moving iron speaker unit is installed in the speaker unit mounting slot 14, and the sound conduction direction is at the front conduction slot 11. It is sealed and fixed with glue. The metal conductor 4 is inserted into the conduction slot 11 and sealed and fixed with glue. At this time, the plane of the conduction rod 42 corresponds to the moving iron speaker unit. During the use of the headphones, the sound is conducted to the conduction rod 42, and then enters the front cavity 15 on the side through the conduction slot 11, and then exits from the front end of the front cavity 15. When the sound is conducted to the metal conductor 4, some specific frequency sounds are released from the pressure relief hole 13, which can eliminate the resonance peak in 1.5-3kHz, making the sound frequency response more natural and distortion-free. Since it is an in-ear headphone, the excess air pressure can be discharged in the opposite direction through the sound transmission slot 16 along the connecting tube 21 from the sound transmission hole 31, improving the comfort during use. Since the damper and sound tube structure are no longer used, the internal space utilization of the headphones is optimized, which can effectively increase the acoustic cavity and thus obtain a better listening experience.

[0034] The above description is only used to illustrate the technical solution of this utility model and is not intended to limit it. Any other modifications or equivalent substitutions made by those skilled in the art to the technical solution of this utility model, as long as they do not depart from the spirit and scope of the technical solution of this utility model, should be covered within the scope of the claims of this utility model.

Claims

1. A novel headphone housing structure for controlling the sound pressure of a moving iron horn, comprising a headphone housing (1) and a fixing base (2), wherein the fixing base (2) is detachably disposed on the rear side of the headphone housing (1), characterized in that: The earphone housing (1) has a recessed pressure relief hole (13) on the side away from the fixed base (2). The side of the earphone housing (1) connected to the fixed base (2) is recessed to form a mounting groove (101). The rear end of the pressure relief hole (13) is connected to a speaker unit mounting groove (14) which is connected to the mounting groove (101). A conduction groove (11) is provided vertically on the pressure relief hole (13). The conduction groove (11) separates the speaker unit mounting groove (14) from the pressure relief hole (13). A metal conductor (4) is provided in the conduction groove. The middle part of the mounting groove (101) is a hollow structure and extends to the front end to form a front cavity (15). The front cavity (15) is connected to the conduction groove (11).

2. The novel headphone shell structure for controlling the sound pressure of a moving iron horn according to claim 1, characterized in that: The pressure relief hole (13) is provided with a filter screen groove (12) at the front end, and the diameter of the pressure relief hole (13) is 0.5 to 1.0 mm.

3. The novel headphone shell structure for controlling the sound pressure of a moving iron horn according to claim 1, characterized in that: The metal conductive element (4) includes a fixed cover (41) and a conductive rod (42) provided at its bottom. The conductive rod (42) has a forked structure, forming a U-shaped structure, and the conductive rod (42) extends to the transition edge between the front cavity (15) and the conductive groove (11).

4. The novel headphone shell structure for controlling the sound pressure of a moving iron horn according to claim 1, characterized in that: The front cavity (15) is a Z-shaped conductive cavity structure, and the inner diameter of the front end is smaller than the inner diameter of the rear end.

5. A novel headphone shell structure for controlling the sound pressure of a moving iron horn according to claim 1, characterized in that: The mounting groove (101) is provided with a sound-transmitting groove (16) at the front end of the front cavity (15).

6. A novel headphone shell structure for controlling the sound pressure of a moving iron horn according to claim 1, characterized in that: The fixed base (2) is provided with a connecting pipe (21) that is connected to the sound-transmitting groove (16).

7. A novel headphone shell structure for controlling the sound pressure of a moving iron horn according to claim 1, characterized in that: The fixed base (2) is provided with a cover (3) at its rear end. The cover (3) is provided with a sound-permeable hole (31) corresponding to the connecting pipe (21).

8. A novel headphone shell structure for controlling the sound pressure of a moving iron horn according to claim 1, characterized in that: The earphone shell (1) has an ear cap mounting head (17) at the front end that is connected to the front cavity (15).

9. A novel headphone shell structure for controlling the sound pressure of a moving iron horn according to claim 1, characterized in that: The earphone housing (1) has a wire terminal mounting part (18) on one side that is connected to the mounting groove (101).

Images