Heat dissipation assembly and electronic device

Abstract

This utility model provides a heat dissipation component and electronic device, relating to the field of artificial intelligence technology, particularly large-scale models and chips. The specific implementation is as follows: The heat dissipation component includes a heat dissipation substrate, a first heat dissipation part, and a second heat dissipation part. The heat dissipation substrate has a first side and a second side, with the second side facing away from the first side. The first side of the heat dissipation substrate is used to contact a heat exchange medium, and the second side faces a circuit substrate. The circuit substrate is provided with a first chip and a second chip. The first heat dissipation part is disposed on the second side of the heat dissipation substrate and is used to dissipate heat from the first chip. The second heat dissipation part is disposed on the second side of the heat dissipation substrate and is used to dissipate heat from the second chip. The thermal conductivity of the first heat dissipation part is greater than that of the second heat dissipation part.

Description

Technical Field

[0001] This utility model relates to the field of artificial intelligence technology, and more particularly to the fields of large models and chips. More specifically, this utility model provides a heat dissipation component and an electronic device. Background Technology

[0002] In the field of artificial intelligence, the demand for computing power is exploding as large-scale models continue to iterate. While the computing power per unit area of ​​a chip increases, the chip's power consumption also increases, leading to a surge in heat from the chip and other components, as well as the entire system. Therefore, heat dissipation is necessary to ensure the chip functions properly. Utility Model Content

[0003] This invention provides a heat dissipation component and an electronic device.

[0004] According to one aspect of the present invention, a heat dissipation component is provided, comprising: a heat dissipation substrate, a first heat dissipation part, and a second heat dissipation part. The heat dissipation substrate has a first side and a second side, the second side of the heat dissipation substrate being opposite to the first side of the heat dissipation substrate. The first side of the heat dissipation substrate is used to contact a heat exchange medium, and the second side of the heat dissipation substrate is used to face a circuit substrate. The circuit substrate is provided with a first chip and a second chip. The first heat dissipation part is disposed on the second side of the heat dissipation substrate and is used to dissipate heat from the first chip. The second heat dissipation part is disposed on the second side of the heat dissipation substrate and is used to dissipate heat from the second chip. The thermal conductivity of the first heat dissipation part is greater than that of the second heat dissipation part.

[0005] According to another aspect of the present invention, an electronic device is provided, comprising: the above-mentioned heat dissipation component and chip component, wherein the chip component includes a circuit board, a first chip and a second chip.

[0006] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this utility model, nor is it intended to limit the scope of this utility model. Other features of this utility model will become readily apparent from the following description. Attached Figure Description

[0007] The accompanying drawings are provided for a better understanding of this solution and do not constitute a limitation on this utility model. Wherein:

[0008] Figure 1 This is an assembly diagram of the heat dissipation component and the chip component according to an embodiment of the present utility model;

[0009] Figure 2 This is a schematic structural diagram of the cover body according to an embodiment of the present utility model;

[0010] Figure 3 This is a schematic structural diagram of the first heat dissipation part according to an embodiment of the present utility model; and

[0011] Figure 4 This is an assembly diagram of the heat dissipation substrate, the first heat dissipation part, and the second heat dissipation part according to an embodiment of the present utility model. Detailed Implementation

[0012] The following description, in conjunction with the accompanying drawings, illustrates exemplary embodiments of the present invention, including various details to aid understanding. These embodiments should be considered merely exemplary. Therefore, those skilled in the art will recognize that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the present invention. Similarly, for clarity and brevity, descriptions of well-known functions and structures are omitted in the following description.

[0013] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention. The terms “comprising,” “including,” etc., as used herein indicate the presence of features, steps, operations, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, or components.

[0014] All terms used herein (including technical and scientific terms) have the meanings commonly understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used herein are to be interpreted in a manner consistent with the context of this specification, and not in an idealized or overly rigid way.

[0015] When using expressions such as "at least one of A, B, and C," the expression should generally be interpreted in accordance with the meaning commonly understood by a person skilled in the art (e.g., "a system having at least one of A, B, and C" should include, but is not limited to, systems having only A, only B, only C, A and B, A and C, B and C, and / or systems having A, B, and C, etc.). Two components / pipelines are connected, either directly or indirectly through other components / pipelines.

[0016] In some technical solutions, air cooling or liquid cooling can be used to dissipate heat from the chip. However, for scenarios requiring high computing power, such as large-scale models, multiple chips such as SoC (System on Chip), HBM (High Bandwidth Memory), and VR (Voltage Regulator) are integrated on the circuit board. These chips differ in parameters such as power consumption, size, and power density, resulting in varying heat generation per unit time and unit area. If the same heatsink or multiple identical heatsinks are used to cool multiple chips simultaneously, the chip with lower power density will operate at its normal operating temperature while the chip with higher power density will overheat. In other words, using the same heatsink or multiple identical heatsinks to cool multiple chips will cause uneven temperatures among the chips, leading to localized hot spots.

[0017] This utility model aims to provide a heat dissipation component for cooling a first chip and a second chip in a chip assembly. The power density of the first chip is greater than that of the second chip, resulting in the first chip generating more heat per unit time and unit area than the second chip. Since the first chip dissipates heat through a first heat sink and the second chip dissipates heat through a second heat sink, and the thermal conductivity of the first heat sink is greater than that of the second heat sink, the first heat sink can transfer more heat from the first chip, while the second heat sink can transfer less heat from the second chip. This results in a more balanced temperature between the first and second chips after cooling, thus avoiding the problem of localized hot spots.

[0018] Taking a chip substrate integrating three chips—SoC, HBM, and power VR—as an example, in practical applications, the SoC has a higher power density and is usually used as the main chip, while the HBM and power VR have relatively lower power densities. If the same heat dissipation structure is used to dissipate heat from all three chips, the temperatures of the HBM and power VR will be lower than the temperature of the SoC after heat dissipation, making the SoC a local hot spot on the chip substrate. However, when using the heat dissipation component provided in this embodiment to dissipate heat from this chip component, the first heat dissipation part can be attached to the SoC for heat conduction. Because the thermal conductivity of the first heat dissipation part is high, the SoC transfers away more heat through the first heat dissipation part. At the same time, two second heat dissipation parts can be attached to the HBM and power VR respectively for heat conduction. Because the thermal conductivity of the second heat dissipation parts is relatively low, the two chips transfer away relatively less heat through their respective second heat dissipation parts. After heat dissipation, the temperature difference between the SoC, HBM, and power VR is small, and the temperature of the three chips is relatively uniform, thereby eliminating local hot spots on the chip substrate. It should be noted that in other embodiments, if the power density of both SoC and HBM is large, both SoC and HBM can be used as the main chip. In this case, the first chip may include SoC and HBM. SoC and HBM can be arranged in adjacent positions and the same first heat sink can be used to conduct heat to both SoC and HBM at the same time. A second heat sink can be used to conduct heat to the power supply VR.

[0019] The heat dissipation component provided in this embodiment can be applied to the liquid cooling plate of a high-power multi-heat-source GPU (Graphics Processing Unit). Through the differentiated design of different heat dissipation parts, it can meet the heat dissipation needs of multiple chips with different power consumption and size, and avoid local high temperature of the chip.

[0020] The technical solution provided by this utility model will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0021] Figure 1 This is an assembly diagram of the heat dissipation component and the chip component according to an embodiment of the present utility model.

[0022] like Figure 1 As shown, in this embodiment, the heat dissipation component 110 is used to dissipate heat from the chip assembly 120. The chip assembly 120 includes a circuit board 121, a first chip 122, and a second chip 123. Both the first chip 122 and the second chip 123 are disposed on the circuit board 121, for example, on the first side of the circuit board 121. It should be noted that the power density of the first chip 122 is greater than the power density of the second chip 123. For example, the first chip 122 is the main chip, and the second chip 123 is another chip besides the main chip. Without heat dissipation, the temperature of the first chip 122 is higher than the temperature of the second chip 123.

[0023] In this embodiment, the heat dissipation assembly 110 includes a heat dissipation substrate 111, a first heat dissipation part 112, and a second heat dissipation part 113.

[0024] The heat dissipation substrate 111 has a first side and a second side, wherein the first side of the heat dissipation substrate 111 faces away from the second side of the heat dissipation substrate 111, for example, Figure 1 The first side of the heat dissipation substrate 111 can be the upper side, and the second side can be the lower side. The first side of the heat dissipation substrate 111 is used to contact the heat exchange medium, such as contact with coolant or cold air. The second side of the heat dissipation substrate 111 faces the circuit board 121, for example, the lower side of the heat dissipation substrate 111 faces the upper side of the circuit board 121, and the heat dissipation substrate 111 and the circuit board 121 are disposed opposite to each other.

[0025] A first heat dissipation part 112 is disposed on the second side of the heat dissipation substrate 111. The position of the first heat dissipation part 112 corresponds to the position of the first chip 122. The first heat dissipation part 112 dissipates heat from the first chip 122 by directly contacting or indirectly adhering to it. It should be noted that the first chip 122 may include only one chip, or it may include two or more chips disposed adjacently on the heat dissipation substrate 111. This embodiment does not limit the number of chips included in the first chip 122. If the first chip 122 includes multiple chips, the same first heat dissipation part 112 can be used to dissipate heat from all multiple chips.

[0026] The second heat dissipation part 113 is disposed on the second side of the heat dissipation substrate 111. The position of the second heat dissipation part 113 corresponds to the position of the second chip 123. The second heat dissipation part 113 dissipates heat from the second chip 123 by directly contacting or indirectly adhering to it. It should be noted that the second chip 123 may include only one chip, or it may include two or more chips disposed adjacently on the heat dissipation substrate 111. This embodiment does not limit the number of chips included in the second chip 123. If the second chip 123 includes multiple chips, the same second heat dissipation part 113 can be used to dissipate heat from all multiple chips.

[0027] The thermal conductivity of the first heat dissipation part 112 is greater than that of the second heat dissipation part 113. It should be noted that the thermal conductivity of the first heat dissipation part 112 can be greater than that of the second heat dissipation part 113 in various ways. For example, an enhanced heat transfer structure can be provided in the first heat dissipation part 112, thereby making the thermal conductivity of the first heat dissipation part 112 higher than that of the second heat dissipation part 113. The enhanced heat transfer structure may include fins, thermally conductive coatings, etc., and this embodiment does not limit the enhanced heat transfer structure. For example, the first heat dissipation part 112 is provided with at least one of fins and a thermally conductive coating, while the second heat dissipation part 113 is not provided with fins or a thermally conductive coating. Another example is that both the first heat dissipation part 112 and the second heat dissipation part 113 are provided with fins, but the first heat dissipation part 112 has more fins than the second heat dissipation part 113, resulting in a higher thermal conductivity for the first heat dissipation part 112 and a lower thermal conductivity for the second heat dissipation part 113.

[0028] In this embodiment, the power density of the first chip 122 is greater than that of the second chip 123. The first chip 122 dissipates heat through the first heat sink 112, and the second chip 123 dissipates heat through the second heat sink 113. Furthermore, the thermal conductivity of the first heat sink 112 is greater than that of the second heat sink 113. Therefore, the first heat sink 112 can transfer more heat from the first chip 122, while the second heat sink 113 can transfer less heat from the second chip 123. This results in a more balanced temperature distribution between the first chip 122 and the second chip 123 after heat dissipation, thus avoiding the problem of localized hot spots.

[0029] Figure 2 This is a schematic structural diagram of the cover according to an embodiment of the present utility model.

[0030] like Figure 2 As shown, in this embodiment, the heat dissipation assembly includes a heat dissipation substrate, a first heat dissipation part, and a second heat dissipation part, as well as a cover 214. The heat dissipation substrate and the cover 214 are disposed opposite to each other, with a first side of the heat dissipation substrate facing the cover 214 and a second side of the heat dissipation substrate facing away from the cover 214. The cover 214 is fixedly connected to the heat dissipation substrate. For example, the cover 214 and the heat dissipation substrate can be made of copper or other materials with high conductivity. The cover 214 and the heat dissipation substrate can be fixed by brazing, thus with a maximum pressure resistance of about 10 bar. The cover 214 and the heat dissipation substrate can also be fixed by bolts or other means. The cover 214 has a first side and a second side. Figure 2The first side of the cover 214 is the upper side, and the second side of the cover 214 is the lower side. After the cover 214 is assembled with the heat dissipation substrate, a cavity for accommodating the heat exchange medium is formed between the first side of the heat dissipation substrate and the second side of the cover 214. When the heat dissipation assembly dissipates heat from the chip assembly by liquid cooling, the heat exchange medium includes coolant. When the heat dissipation assembly dissipates heat from the chip assembly by air cooling, the heat exchange medium includes cold air. In this embodiment, the cover 214 is provided on the first side of the heat dissipation substrate, and a cavity is formed between the cover 214 and the heat dissipation substrate. This allows the cover 214 and the heat dissipation substrate to guide the heat exchange medium, ensuring that the heat exchange medium covers the entire heat dissipation surface.

[0031] like Figure 2 As shown, in this embodiment, a heat exchange medium inlet and a heat exchange medium outlet that are respectively connected to the cavity can be provided on the cover 214. A first connector 215 can be installed at the heat exchange medium inlet and a second connector 216 can be installed at the heat exchange medium outlet. The first connector 215 and the second connector 216 can be connected to an external heat exchanger to cool the heat exchange medium inside the cavity.

[0032] like Figure 2 As shown, for a heat dissipation component that dissipates heat from the chip assembly via liquid cooling, a liquid collection tank 2141 can be provided on the side of the cover 214 away from the heat dissipation substrate. The liquid collection tank 2141 can be located in the middle area of ​​the cover 214, and its depth can be 2 mm. The heat exchange medium inlet and outlet can be respectively located at the bottom of the liquid collection tank 2141. In this way, when liquid leakage occurs at the heat exchange medium inlet and outlet, the liquid collection tank 2141 can collect the seeping coolant, preventing the seeping coolant from damaging the chip or other heat-generating components in the chip assembly.

[0033] like Figure 2 As shown, the heat dissipation assembly may also include a leak detection line 217 and a controller. The leak detection line 217 is disposed in the liquid accumulation tank 2141, for example, by means of a clip to fix the leak detection line 217 in the liquid accumulation tank 2141. The controller is electrically connected to the leak detection line 217. The leak detection line 217 is used to output a control signal to the controller when in contact with liquid. The controller is used to control the prompting device to issue a prompt when receiving the control signal, thereby prompting the user that a leak has occurred, so that the user can maintain the heat dissipation assembly, realizing the leak detection and alarm functions.

[0034] like Figure 2As shown, to facilitate the assembly between the heat dissipation component and the chip component, a first mounting hole can be provided on the edge of the cover 214, a second mounting hole can be provided at a corresponding position on the circuit board, and a third mounting hole can be provided on the edge of the heat dissipation board. If the heat dissipation board is small and avoids the first mounting hole, the third mounting hole can be omitted. Fasteners 218 can be installed in the first, second, and third mounting holes. Fasteners 218 can include bolts, screws, and other components, which can fix the cover 214 to the circuit board. In addition, an elastic element can be sleeved on the outer periphery of the fastener 218, with the elastic element located on the side of the cover 214 away from the heat dissipation board. The elastic element can include a spring or other elastic sleeve structure. In this embodiment, the heat dissipation component and the chip component are fixedly connected by fasteners 218. At the same time, the heat dissipation component is pressed against the surface of the chip component by elastic elements. The pressure bearing range of the heat-generating elements such as the chip is between 25kg and 40kg. Fasteners 218 and elastic elements can prevent the heat-generating elements such as the chip from being damaged due to excessive pressure. They can also ensure full contact between the cold plate and the chip under the condition that there is no risk of chip damage, and avoid poor contact between the heat-generating elements such as the chip and the heat dissipation part in the heat dissipation component.

[0035] In one embodiment, the thickness of the cover 214 ranges from 3.5mm to 4.5mm, and for example, the thickness is 4mm. The thickness of the heat dissipation substrate ranges from 1.5mm to 2.5mm, and for example, the thickness is 2mm. The thickness of the heat dissipation assembly is less than or equal to 25mm, and for example, the thickness is 23mm. In this embodiment, the thickness of the cover 214 and the heat dissipation substrate is relatively small, resulting in lower thermal resistance and improved heat transfer efficiency. Furthermore, the overall structure of the heat dissipation assembly is compact and occupies less space. While meeting strength requirements, it can be applied to a 1U server, where U is a unit of server rack height, and 1U is approximately 43.5mm.

[0036] Figure 3 This is a schematic structural diagram of the first heat dissipation part according to an embodiment of the present utility model.

[0037] like Figure 3 As shown, in this embodiment, the heat dissipation component includes a heat dissipation substrate, the heat dissipation substrate includes a first heat dissipation part 212, the first heat dissipation part 212 includes a heat dissipation plate 2121 and fins 2122.

[0038] The heat sink 2121 has a first side and a second side. The first side of the heat sink 2121 faces the cavity, and the second side of the heat sink 2121 is used to dissipate heat from the first chip. Figure 3 The first side of the heat sink 2121 can be the upper side, and the second side can be the lower side.

[0039] Fins 2122 are disposed on the first side of the heat sink 2121 and are located within the cavity. In actual manufacturing, the fins 2122 and the heat sink 2121 can be fixedly connected by welding or other methods, or they can be directly manufactured into an integral structural component by casting or other methods. The fins 2122 can increase the contact area with the heat exchange medium, thereby improving the heat exchange effect. For example, the number of fins 2122 can be one or more; this embodiment does not limit the number of fins 2122. When multiple fins 2122 are disposed on the surface of the heat sink 2121, the multiple fins 2122 can be distributed in parallel, and the thickness of the fins 2122 can range from 0.1mm to 0.2mm, with a maximum thickness of 0.15mm. The spacing between adjacent fins 2122 can range from 0.1mm to 0.2mm, and the spacing can be 0.15mm. In this way, multiple fins 2122 can form a microchannel structure, further increasing the heat dissipation area and enhancing the heat exchange capacity, which can meet the heat dissipation requirements of devices such as GPUs with a power consumption of 1000W.

[0040] like Figure 3 As shown, each fin 2122 can be strip-shaped and extend along a predetermined direction, which is from the heat exchange medium inlet of the cover to the heat exchange medium outlet of the cover. With this structure, the heat exchange medium enters the cavity between the cover and the heat dissipation plate from the heat exchange medium inlet, then flows along the predetermined direction and contacts the fins 2122 and the heat dissipation plate 2121, and then exits the cavity from the heat exchange medium outlet. Since the extension direction of the fins 2122 is consistent with the flow direction of the heat exchange medium, the flow resistance of the heat exchange medium can be reduced. It is understood that in other embodiments, the extension direction of the fins 2122 may also be at an angle to the flow direction of the heat exchange medium.

[0041] In one example, the first heat sink 212 has a surface facing the second chip, such as the surface of the second side of the heat sink 2121. A first thermally conductive material layer can be disposed on this surface, which may be made of a phase change thermally conductive material. During heat dissipation, the heat generated by the first chip heats the first thermally conductive material layer, causing it to melt and adhere between the first chip and the first heat sink 212, thereby improving heat transfer efficiency.

[0042] Figure 4 This is an assembly diagram of the heat dissipation substrate, the first heat dissipation part, and the second heat dissipation part according to an embodiment of the present utility model.

[0043] like Figure 4As shown, in this embodiment, the heat dissipation assembly includes a heat dissipation substrate 211, which includes a first heat dissipation portion 212 and a second heat dissipation portion 213. The structure of the first heat dissipation portion 212 can be referred to above and will not be repeated here. The second heat dissipation portion 213 includes a heat-conducting block, which is disposed on the second side of the heat dissipation substrate 211 and protrudes from the surface of the second side of the heat dissipation substrate 211. The heat-conducting block can be made of copper or other materials with high conductivity, and the heat-conducting block and the heat dissipation substrate 211 can be an integral structural component. During the heat dissipation process, the end face of the heat-conducting block facing away from the heat dissipation substrate 211 can be attached to the surface of the second chip in the circuit board, so that the heat of the second chip can be conducted to the heat-conducting block, and then conducted to the heat exchange medium through the heat dissipation substrate 211, thereby achieving the heat dissipation effect.

[0044] like Figure 4 As shown, in this embodiment, the circuit board can be provided with multiple second chips. Correspondingly, the second side of the heat dissipation board 211 can be provided with multiple second heat dissipation parts 213, which are used to dissipate heat in a one-to-one correspondence with the multiple second chips. For example, if the circuit board can be provided with three second chips, then the second side of the heat dissipation board 211 can be provided with three second heat dissipation parts 213a, 213b, and 213c, and the positions of the three second chips correspond one-to-one with the three second heat dissipation parts 213a, 213b, and 213c. In this embodiment, for application scenarios requiring high computing power, such as large models, multiple second chips will be installed on the same circuit board. Accordingly, the heat dissipation component can dissipate heat from the multiple second chips through the multiple second heat dissipation parts 213, thereby ensuring that each chip works normally under high computing power scenarios.

[0045] Furthermore, since the second heat dissipation unit 213 needs to conduct heat with the second chip through direct or indirect contact, the three second heat dissipation units 213 can also be different if the three second chips have different heights. For example, if the distance between the circuit board and the heat dissipation board 211 is L, and the heights of the three second chips protruding from the circuit board are 0.5L, 0.6L, and 0.7L respectively, then the heights of the three heat-conducting blocks protruding from the heat dissipation board 211 can be 0.5L, 0.4L, and 0.3L respectively. By adjusting the protrusion size of the heat-conducting blocks differently, the three second heat dissipation units 213a, 213b, and 213c can achieve contact and uniform heat dissipation with the second chips of different heights.

[0046] In one example, the second heat dissipation part 213 has a surface facing the second chip, such as the end face of the heat-conducting block away from the heat dissipation substrate 211, and a second thermally conductive material layer can be disposed on this surface. The second thermally conductive material layer can be made of a non-phase change thermally conductive material.

[0047] In one example, if the surface of the first heat dissipation part 212 is provided with a first thermally conductive material layer, and the surface of the second heat dissipation part 213 is provided with a second thermally conductive material layer, the thermal conductivity of the first thermally conductive material layer can be greater than that of the second thermally conductive material layer. In this way, the thermal conductivity of the first thermally conductive material layer is better, thereby further improving the heat dissipation effect of the first chip and eliminating local hot spots caused by the high temperature of the first chip.

[0048] According to another embodiment of the present invention, an electronic device is also provided, which includes a heat dissipation component and a chip component. The chip component includes a circuit board, a first chip, and a second chip. The structures of the heat dissipation component and the chip component can be referred to above, and will not be repeated in this embodiment.

[0049] Those skilled in the art will understand that the features described in the various embodiments and / or claims of this utility model can be combined or combined in various ways, even if such combinations or combinations are not explicitly described in this utility model. In particular, the features described in the various embodiments and / or claims of this utility model can be combined or combined in various ways without departing from the spirit and teachings of this utility model. All such combinations and / or combinations fall within the scope of this utility model.

[0050] The specific embodiments described above do not constitute a limitation on the scope of protection of this utility model. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.

Claims

1. A heat dissipation component, comprising: A heat dissipation substrate has a first side and a second side, the second side of the heat dissipation substrate is away from the first side of the heat dissipation substrate, the first side of the heat dissipation substrate is used to contact the heat exchange medium, and the second side of the heat dissipation substrate is used to face the circuit substrate, the circuit substrate is provided with a first chip and a second chip. A first heat dissipation part is disposed on the second side of the heat dissipation substrate, and the first heat dissipation part is used to dissipate heat from the first chip. as well as The second heat dissipation part is disposed on the second side of the heat dissipation substrate and is used to dissipate heat from the second chip. The thermal conductivity of the first heat dissipation part is greater than that of the second heat dissipation part.

2. The heat dissipation assembly according to claim 1, further comprising: A cover body, which is fixedly connected to the heat dissipation substrate; The heat dissipation substrate has a first side facing the cover, a second side facing away from the cover, and a cavity for accommodating a heat exchange medium between the first side of the heat dissipation substrate and the cover. The heat exchange medium includes coolant or cold air.

3. The heat dissipation assembly of claim 2, wherein, The first heat dissipation unit includes: A heat sink, having a first side and a second side, wherein the first side of the heat sink faces the cavity, and the second side of the heat sink is used to dissipate heat from the first chip; and The fins are disposed on the first side of the heat sink and are located in the cavity.

4. The heat dissipation assembly of claim 3, wherein, The cover has a heat exchange medium inlet and a heat exchange medium outlet, the heat exchange medium inlet and the heat exchange medium outlet are respectively connected to the cavity, and the fins extend in a predetermined direction, the predetermined direction being from the heat exchange medium inlet to the heat exchange medium outlet.

5. The heat dissipation assembly according to claim 1 or 2, wherein, The second heat dissipation unit includes: A heat-conducting block is disposed on the second side of the heat dissipation substrate and protrudes from the surface of the second side of the heat dissipation substrate.

6. The heat dissipation assembly according to claim 1, wherein, The number of the second chips is multiple, the number of the second heat sinks is multiple, and the multiple second heat sinks are used to dissipate heat in a one-to-one correspondence with the multiple second chips.

7. The heat dissipation assembly according to claim 1, further comprising: A first thermally conductive material layer is disposed on the surface of the first heat dissipation part facing the first chip; as well as A second thermally conductive material layer is disposed on the surface of the second heat dissipation portion facing the second chip; The thermal conductivity of the first thermally conductive material layer is greater than that of the second thermally conductive material layer.

8. The heat dissipation assembly of claim 2, wherein, The heat exchange medium includes a coolant, and the cover has a liquid accumulation tank on the side away from the heat dissipation substrate; the bottom of the liquid accumulation tank has a heat exchange medium inlet and a heat exchange medium outlet, and the heat exchange medium inlet and the heat exchange medium outlet are respectively connected to the cavity.

9. The heat dissipation assembly according to claim 8, further comprising: A leakage detection line is installed in the liquid accumulation tank; The leakage detection line is used to output a control signal when in contact with liquid; as well as A controller, electrically connected to the leakage detection line, is used to control the prompting device to issue a prompt upon receiving the control signal.

10. The heat dissipation assembly of claim 2, wherein, The cover has a first mounting hole, the circuit board has a second mounting hole, and the heat dissipation assembly further includes: Fasteners are disposed in the first mounting hole and the second mounting hole, and the cover and the circuit board are fixedly connected by the fasteners; and An elastic element is sleeved on the outer periphery of the fastener and is disposed on the side of the cover away from the heat dissipation substrate.

11. The heat dissipation assembly of claim 2, wherein, The thickness of the cover is in the range of 3.5mm to 4.5mm, the thickness of the heat dissipation substrate is in the range of 1.5mm to 2.5mm, and the thickness of the heat dissipation component is less than or equal to 23mm.

12. An electronic device, comprising: The heat dissipation assembly according to any one of claims 1 to 11; as well as The chip assembly includes a circuit board, a first chip, and a second chip.

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