A protection structure for heavy components on a PCB

Abstract

This utility model discloses a protective structure for heavier components on a PCB board, designed to address the issue of solder joints detaching from heavy components such as transformers and capacitors due to accidental drops during installation or testing of security cameras and other equipment. The protective structure includes a PCB containment area surrounding the component, with a pre-drilled gap around the component's outer edge. An EVA foam barrier, secured to the containment area with adhesive, prevents adhesive leakage by ensuring a smooth adhesive surface within the containment area. The foam barrier's height is 30%–70% of the component's height. Soft silicone fills the gap between the barrier and the component, forming a buffer structure that effectively protects the component's solder joints. While absorbing impact energy and protecting the component, it also facilitates disassembly for subsequent maintenance, improving reliability.

Description

Technical Field

[0001] This utility model relates to the technical field of PCB board protection, specifically a protective structure for heavier components on a PCB board. Background Technology

[0002] In electronic devices such as security cameras, there is a frequent risk of drops. Because components like transformers and capacitors on the PCB motherboard inside the camera have a high center of gravity or are relatively heavy compared to other components, they can experience excessive impact torque when the camera is dropped, easily causing solder joints to detach and rendering the camera unusable. Traditional reinforcement methods (such as overall potting) suffer from difficulties in repair, glue overflow contaminating surrounding components, and a lack of localized impact protection solutions for heavier components, making it difficult to balance reliable protection with ease of repair. Utility Model Content

[0003] The purpose of this invention is to provide a protective structure for heavier components on a PCB board, which effectively protects the solder joints of the components during drop impacts, while ensuring the maintainability of the PCB board.

[0004] To achieve the above objectives, this utility model is implemented through the following technical solution: a protective structure for heavier components on a PCB board, including a restricted area on the PCB board, the restricted area surrounding the heavier components on the PCB board, and a gap between the surrounding boundary and the outer edge of the heavier components, with no components in the gap.

[0005] A fencing structure, the bottom of which covers the restricted area via a connecting structure and surrounds the sidewalls of the heavier components;

[0006] A soft filling structure is provided, which fills the gap between the enclosure structure and the heavier component, and bonds the heavier component and the enclosure structure together.

[0007] A further technical solution is that the enclosure structure is a single foam enclosure, and the foam enclosure is a closed frame.

[0008] In a further technical solution, the height of the enclosure structure is 30% to 70% of the height of the heavier component, and the thickness is 1.5 mm to 3 mm.

[0009] In a further technical solution, the connecting structure is an adhesive layer, which can cover the restricted area, and the area of ​​the adhesive layer is larger than the bottom area of ​​the foam barrier.

[0010] In a further technical solution, the soft filling structure is soft-filled silicone, and its top surface height is lower than the height of the enclosure structure.

[0011] In a further technical solution, the inner side of the enclosure structure is an inclined surface, which gradually widens from the bottom to the top to form an flared structure.

[0012] In a further technical solution, elastic microparticles are distributed within the soft filling structure, and the particle size of the elastic microparticles is 0.1 mm to 0.5 mm.

[0013] In a further technical solution, the distance between the inner wall of the foam enclosure and the side wall of the heavier component is 0.3 to 1.5 mm.

[0014] In a further technical solution, the PCB board is a security camera motherboard, and the heavier components include a transformer and a capacitor, with the transformer and the capacitor sharing the same enclosure structure.

[0015] In a further technical solution, the heavier component has a weight of 3 grams or more and a height of 5 millimeters or more.

[0016] In summary, this utility model has the following beneficial effects:

[0017] Low cost and high-efficiency production: By sharing a single EVA foam enclosure to cover multiple heavier components, the amount of material used is reduced. Combined with end-to-end splicing or overall closed design, the installation process is simplified and production efficiency is improved.

[0018] Leak-proof adhesive and bonding optimization: A flat adhesive surface is provided in the restricted areas to ensure that the bottom of the foam barrier is tightly attached and to prevent adhesive leakage during application;

[0019] The inner wall of the enclosure maintains a gap of 0.3–1.5 mm from the side wall of the component, which not only prevents compression deformation but also allows space for the flow of adhesive, thus enhancing the reliability of the bonding.

[0020] Improved impact resistance: Soft silicone fills the gaps, and elastic microparticles efficiently absorb drop energy;

[0021] The flared design inside the enclosure guides the glue buildup, disperses stress, and avoids rigid collisions.

[0022] The enclosure isolates heavier components, preventing glue from contaminating surrounding parts. During maintenance, only the enclosure structure needs to be removed, making it convenient and quick. Attached Figure Description

[0023] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0024] Figure 1 This is a first three-dimensional structural schematic diagram of this application;

[0025] Figure 2 This is a second three-dimensional structural schematic diagram of this application;

[0026] Figure 3 This is a top view of the enclosure structure removed in this application;

[0027] Figure 4 This is a schematic diagram of the enclosure structure of this application.

[0028] In the diagram: 100, PCB board; 101, heavier components; 102, restricted area; 200, enclosure structure. Detailed Implementation

[0029] To more clearly illustrate the overall concept of this application, a detailed explanation is provided below with reference to the accompanying drawings.

[0030] Many specific details are set forth in the following description in order to provide a full understanding of this application. However, this application may also be implemented in other ways different from those described herein. Therefore, the scope of protection of this application is not limited to the specific embodiments disclosed below.

[0031] Furthermore, it should be understood in the description of this application that the terms "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0032] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0033] In this application, unless otherwise expressly specified and limited, the "above" or "below" of the second feature can mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. In the description of this specification, references to terms such as "an embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described can be combined in any suitable manner in one or more embodiments or examples.

[0034] like Figures 1-4 As shown, a protective structure for heavier components on a PCB board includes:

[0035] A fabric-restricted area 102 is provided on the PCB board 100. The fabric-restricted area 102 surrounds the heavier components 101 provided on the PCB board 100, and there is a gap between the surrounding boundary and the outer edge of the heavier components 101. There are no components in the gap, but wiring is allowed. The fabric-restricted area is a flat plane, which facilitates the subsequent installation of the enclosure structure 200.

[0036] In this embodiment, the PCB board 100 is the motherboard of the security camera, and the heavier components 101 include a transformer and a capacitor. The transformer and the capacitor share the same enclosure structure 200. The heavier components 101 have a weight of 3 grams or more and a height of 5 millimeters or more.

[0037] Specifically, the components around the transformer and capacitor are not arranged to create a flat bonding area for the EVA foam. This prevents uneven bonding at the bottom of the foam from causing glue leakage during application. The shared foam enclosure reduces material usage and lowers costs.

[0038] The protective structure also includes a barrier structure 200, the bottom of which covers the restricted area 102 via a connecting structure and surrounds the side wall of the heavier component 101;

[0039] In one embodiment, the enclosure structure 200 is a single foam enclosure, and the foam enclosure is spliced ​​end to end to form a closed frame. The closed frame structure is formed by splicing the ends to surround the heavier component 101. The foam enclosure can be processed into standard size by die-cutting process, and its inner wall maintains a uniform gap of 0.3 to 1.5 mm with the side wall of the heavier component to ensure that the soft filling structure fully covers and avoids squeezing the heavier component 101.

[0040] Specifically, the foam enclosure can be made of EVA foam, which is low in cost and easy to mass-produce. The end-to-end splicing design simplifies the installation process and improves production efficiency. The gap of 0.3 mm to 1.5 mm can prevent the components from being deformed by pressure, while leaving space for the flow of glue and enhancing the reliability of the bond. When repairing, the foam enclosure can be removed simply.

[0041] In another embodiment, the foam barrier can be directly die-cut into a closed shape, with the bottom surface having the same outline as the restricted area. When in use, it can be directly installed in the restricted area 102, which is convenient and quick.

[0042] In one embodiment, the height of the enclosure structure 200 is 30% to 70% of the height of the heavier component 101, and the thickness is 1.5 mm to 3 mm. For example, for a transformer or capacitor with a height greater than or equal to 5 mm, the enclosure height can be set to 3.5 mm and the thickness is preferably 2 mm.

[0043] A reasonable height ratio can effectively prevent glue from overflowing and avoid excessive space occupation on the PCB board. A reasonable thickness range can balance structural strength and flexibility, ensuring maximum cushioning effect when dropped.

[0044] In one embodiment, the inner side of the enclosure structure 200 is an inclined surface that gradually expands from the bottom to the top to form an flared structure. The distance between the flared structure and the sidewall of the heavier component 101 gradually increases from 0.3 mm at the bottom to 1.5 mm at the top. The flared structure guides the adhesive to accumulate upward along the inclined surface, improving shear resistance. The gradual expansion design reduces stress gradients and avoids rigid collisions between the enclosure and the component when falling. The increased top gap can accommodate more adhesive and adapt to the impact dispersion requirements of different drop angles.

[0045] In one embodiment, the distance between the inner wall of the foam enclosure and the side wall of the heavier component is 0.3 to 1.5 mm.

[0046] In one embodiment, the connecting structure is an adhesive layer that can cover the fabric-free area 102, and the area of ​​the adhesive layer is larger than the bottom area of ​​the foam enclosure.

[0047] Specifically, the adhesive layer can be a 3M adhesive layer formed by applying 3M glue to the bottom surface of the foam barrier, or an adhesive layer formed by other adhesives, so that the foam barrier can be pasted on the restricted area 102. The transformer and capacitor are reinforced to the motherboard by using glue to stick the foam barrier.

[0048] 3M adhesive was chosen because it has excellent weather resistance and can withstand environments ranging from -40°C to 85°C.

[0049] The purpose of attaching foam barriers is to create a barrier for subsequent glue injection or application, allowing the glue to accumulate to a certain height. Otherwise, the glue will run all over the motherboard, failing to accumulate to the required height and achieve the desired bonding effect, and making subsequent motherboard repairs more difficult. Foam barriers also increase reliability and effectively protect motherboard components during bare-metal drops.

[0050] The EVA foam enclosure isolates the transformer, capacitors and other components, without affecting other components on the PCB board, thus ensuring the PCB board's maintainability.

[0051] In one embodiment, the protective structure further includes a soft filler structure that fills the gap between the enclosure structure 200 and the heavier component 101, and bonds the heavier component 101 and the enclosure structure 200.

[0052] In one embodiment, the protective structure further includes a soft-fill structure, which is soft-filled silicone with an elastic modulus of less than or equal to 5 MPa, and whose top surface is lower than the height of the enclosure structure 200, for example, 0.5 mm to 1 mm lower than the top of the enclosure structure 200.

[0053] Specifically, the soft filling structure uses Kafert K-5933W adhesive to fill the gap between the enclosure structure 200 and the heavier components 101. After curing, it forms a soft filling silicone, which has good adhesion to the surfaces of the PCB board 100, transformer, and capacitor. As it is soft silicone, it can absorb energy well during the drop, reducing the impact on the transformer and capacitor.

[0054] The soft-filled silicone is formed by using a filling adhesive, which can effectively absorb vibration and increase its reliability.

[0055] In one embodiment, elastic microparticles with a particle size of 0.1 mm to 0.5 mm are uniformly distributed within the soft-filled structure.

[0056] For example, adding EPDM rubber particles to the adhesive can further enhance its impact resistance.

[0057] For any parts not mentioned in this application, existing technologies may be used or referenced.

[0058] The various embodiments in this specification are described in a progressive manner. The same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on describing the differences from other embodiments.

[0059] The above description is merely an embodiment of this application and is not intended to limit the scope of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of the claims of this application.

Claims

1. A protection structure for heavy components on a PCB board, characterized in that, include: A fabric-blocking area (102) is provided on the PCB board (100), the fabric-blocking area (102) surrounds the heavier components (101) provided on the PCB board (100), and there is a gap between the surrounding boundary and the outer edge of the heavier components (101), and there are no components in the gap; A fencing structure (200) is provided, the bottom of which covers the restricted area (102) via a connecting structure and surrounds the sidewall of the heavier component (101). A soft filling structure is provided to fill the gap between the enclosure structure (200) and the heavier component (101) and to bond the heavier component (101) and the enclosure structure (200).

2. The protective structure for heavier components on a PCB board according to claim 1, characterized in that, The enclosure structure (200) is a single foam enclosure, and the foam enclosure is a closed frame.

3. The protective structure for heavier components on a PCB board according to claim 2, characterized in that, The height of the enclosure structure (200) is 30% to 70% of the height of the heavier component (101), and the thickness is 1.5 mm to 3 mm.

4. The protective structure for heavier components on a PCB board according to claim 1, characterized in that, The connecting structure is an adhesive layer that can cover the restricted area (102), and the area of ​​the adhesive layer is larger than the bottom area of ​​the foam enclosure.

5. The protective structure for heavier components on a PCB board according to claim 1, characterized in that, The soft filling structure is soft-filled silicone, and its top surface height is lower than the height of the enclosure structure (200).

6. The protective structure for heavier components on a PCB board according to claim 1, characterized in that, The inner side of the enclosure structure (200) is an inclined surface, which gradually expands from the bottom to the top to form an flared structure.

7. The protective structure for heavier components on a PCB board according to claim 1, characterized in that, The soft filling structure contains elastic microparticles with a particle size of 0.1 mm to 0.5 mm.

8. The protective structure for heavier components on a PCB board according to claim 2, characterized in that, The distance between the inner wall of the foam enclosure and the side wall of the heavier component is 0.3 to 1.5 mm.

9. The protective structure for heavier components on a PCB board according to claim 1, characterized in that, The PCB board (100) is the mainboard of the security camera, and the heavier components (101) include a transformer and a capacitor, which share the same enclosure structure (200).

10. The protective structure for heavier components on a PCB board according to claim 9, characterized in that, The heavier component (101) has a weight of 3 grams or more and a height of 5 millimeters or more.

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