Dual-mode hybrid heat dissipation module

Abstract

This utility model discloses a dual-mode hybrid heat dissipation module, including a heat dissipation substrate, an air-cooled heat dissipation component, a liquid-cooled heat dissipation component, a heat conduction connector, and a mode switching mechanism. The air-cooled heat dissipation component includes a cooling fan and a heat dissipation fin assembly mounted on the heat dissipation substrate, with the heat dissipation fin assembly located in the air outlet path of the cooling fan. The liquid-cooled heat dissipation component includes a liquid cooling plate attached to the lower surface of the heat dissipation substrate, a water pump communicating with the internal flow channels of the liquid cooling plate, and connecting pipes. Through heat pipe phase change heat transfer and the high specific heat capacity of liquid cooling, the heat dissipation efficiency is significantly improved compared to traditional air cooling. The mode switching mechanism enables dynamic adjustment: under low load, air cooling operates alone, saving energy and reducing noise; under high load, liquid cooling or hybrid mode is activated to meet high-power heat dissipation requirements.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation module technology, specifically a dual-mode hybrid heat dissipation module. Background Technology

[0002] As electronic devices evolve towards higher power densities, the heat dissipation requirements for core components such as CPUs and GPUs are surging. Traditional air-cooling modules rely on forced convection through fans and fins, but due to the low specific heat capacity of air, their heat dissipation efficiency is insufficient under high-load conditions, and the high-speed operation of fans can easily generate noise and energy consumption issues. While liquid cooling can improve heat dissipation capacity through the high specific heat capacity of coolants, its system structure is complex, its cost is high, and it is difficult to adapt to the energy-saving requirements under low load conditions. A single cooling mode has a significant bottleneck, unable to dynamically match the wide range of heat dissipation needs of devices from low-power standby to full-load operation, making it difficult to optimize the balance between heat dissipation efficiency, energy consumption, and noise. Utility Model Content

[0003] To overcome the shortcomings of existing technical solutions, this utility model provides a dual-mode hybrid heat dissipation module, which can effectively solve the problems mentioned in the background technology.

[0004] The technical solution adopted by this utility model to solve its technical problem is:

[0005] A dual-mode hybrid heat dissipation module includes a heat dissipation substrate, an air-cooled heat dissipation component, a liquid-cooled heat dissipation component, a heat conduction connector, and a mode switching mechanism.

[0006] The air-cooled heat dissipation assembly includes a heat dissipation fan and a heat dissipation fin assembly installed on the heat dissipation substrate. The heat dissipation fin assembly is located on the air outlet path of the heat dissipation fan. The liquid-cooled heat dissipation assembly includes a liquid cooling plate attached to the lower surface of the heat dissipation substrate, a water pump communicating with the internal flow channel of the liquid cooling plate, and connecting pipes.

[0007] The heat conduction connector consists of multiple heat pipes. The evaporation section of each heat pipe is tightly fitted inside the heat dissipation substrate. The condensation section of each heat pipe includes a first set of condensation sections that extend upward and penetrate into the heat dissipation fin group, and a second set of condensation sections that extend downward and are embedded or tightly attached to the upper surface of the liquid cooling plate.

[0008] The mode switching mechanism includes an isolation cavity for accommodating the liquid cooling plate and a linkage valve group located on the connecting pipeline. The isolation cavity is located below the heat dissipation base plate, and the side wall of the isolation cavity is provided with an openable and closable air duct.

[0009] As a further description of the above technical solution, the evaporation section of the heat conduction connector and the heat dissipation substrate are formed into an integral structure through a sintering process or a reflow soldering process.

[0010] As a further description of the above technical solution, the upper surface of the liquid cooling plate is provided with a fitting groove that matches the shape of the second set of condensation sections, and the second set of condensation sections is filled and fixed in the fitting groove by thermally conductive solder or high-performance thermally conductive pad.

[0011] As a further description of the above technical solution, the cooling fan is an axial fan or a centrifugal fan, the exhaust side of the cooling fan is arranged directly opposite the heat dissipation fin assembly, and the heat dissipation fin assembly has an asymmetrical structure.

[0012] As a further description of the above technical solution, a sealing ring is provided between the isolation cavity and the heat dissipation substrate, and the side wall of the isolation cavity is also provided with flow guiding ribs.

[0013] As a further description of the above technical solution, the bottom inner surface of the isolation cavity is provided with a condensate collection tank, which is connected to the outside through a pipe.

[0014] As a further description of the above technical solution, the mode switching mechanism also includes a controller, which is connected to the linkage valve group for control.

[0015] As a further description of the above technical solution, the openable and closable air duct is a louvered structure, and the openable and closable air duct is driven by a micro motor.

[0016] As a further description of the above technical solution, an elastic support frame is provided below the heat dissipation substrate to buffer installation stress and ensure close contact between the liquid cooling plate and the second set of condensation sections of the heat conduction connector.

[0017] Compared with the prior art, the beneficial effects of this utility model are:

[0018] The dual-mode hybrid heat dissipation module of this utility model has at least one of the following beneficial effects during use:

[0019] Utilizing the phase change heat transfer of heat pipes and the high specific heat capacity of liquid cooling, heat dissipation efficiency is significantly improved compared to traditional air cooling. A mode switching mechanism enables dynamic adjustment: under low load, air cooling operates independently for energy saving and noise reduction; under high load, liquid cooling or a hybrid mode is activated to meet high-power heat dissipation demands. Structural optimizations, such as the integrated design of the heat pipe and substrate and the filling of the interlocking groove with thermally conductive material, reduce contact thermal resistance. Designs such as the isolation cavity and condensate collection tank enhance stability and safety. The controller coordinates multiple parameters to achieve seamless switching, balancing heat dissipation efficiency and energy consumption control, adapting to a wide range of load scenarios. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of a dual-mode hybrid heat dissipation module according to the present invention;

[0021] Figure 2This is a side view of a dual-mode hybrid heat dissipation module according to the present invention.

[0022] Figure 3 This is a first perspective structural diagram of a dual-mode hybrid heat dissipation module according to the present invention;

[0023] Figure 4 This is a second perspective structural diagram of a dual-mode hybrid heat dissipation module according to the present invention.

[0024] Numbering on the map:

[0025] 1. Heat dissipation base plate; 2. Air-cooled heat dissipation assembly; 3. Liquid-cooled heat dissipation assembly; 4. Heat conduction connector; 5. Mode switching mechanism; 6. Sealing ring; 7. Condensate collection tank; 8. Liquid cooling plate; 9. Connecting pipes; 10. Cooling fan; 11. Flexible support frame; 12. Heat dissipation fin assembly; 13. Air duct opening; 14. Water pump; 15. First condensation section; 16. Second condensation section; 17. Linkage valve assembly; 18. Isolation chamber. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] like Figure 1-4 As shown, this utility model provides a dual-mode hybrid heat dissipation module, including a heat dissipation substrate 1, an air-cooled heat dissipation component 2, a liquid-cooled heat dissipation component 3, a heat conduction connector 4, and a mode switching mechanism 5.

[0028] The air-cooled heat dissipation assembly 2 includes a heat dissipation fan 10 and a heat dissipation fin assembly 12 installed above the heat dissipation substrate 1. The heat dissipation fin assembly 12 is located on the air outlet path of the heat dissipation fan 10. The liquid-cooled heat dissipation assembly 3 includes a liquid cooling plate 8 attached to the lower surface of the heat dissipation substrate 1, a water pump 14 communicating with the internal flow channel of the liquid cooling plate 8, and a connecting pipe 9.

[0029] The internal flow channels of the liquid cooling plate 8 are driven by the water pump 14 to circulate the coolant (such as deionized water or HFE-type insulating fluid). After absorbing the heat from the second condensation section 16, the coolant is transported to the external radiator for cooling through the connecting pipe 9. The liquid cooling plate 8 and the heat pipe condensation section are tightly bonded together by thermally conductive solder or high-performance thermally conductive pads, effectively reducing contact thermal resistance and improving heat exchange efficiency.

[0030] The heat conduction connector 4 consists of multiple heat pipes. The evaporation section of each heat pipe is tightly fitted inside the heat dissipation substrate 1. The condensation section of each heat pipe includes a first condensation section 15 that extends upward and penetrates and is embedded in the heat dissipation fin group 12, and a second condensation section 16 that extends downward and is embedded or tightly attached to the upper surface of the liquid cooling plate 8.

[0031] The phase change heat transfer characteristics of the heat pipe (thermal conductivity up to 200-300 W / m·K) rapidly transfer heat to the liquid cooling plate 8, while the high specific heat capacity of the liquid cooling system (the specific heat capacity of water is 4.2 kJ / kg·℃) further enhances heat dissipation. The combination of the two improves heat dissipation efficiency by more than 40% compared to traditional air cooling, while eliminating the need for high-speed fan operation in liquid cooling mode, reducing noise and energy consumption.

[0032] The mode switching mechanism 5 includes an isolation cavity 18 for accommodating the liquid cooling plate 8 and a linkage valve group 17 disposed on the connecting pipe 9. The isolation cavity 18 is disposed below the heat dissipation base plate 1, and the side wall of the isolation cavity 18 is provided with an openable and closable air duct 13. The openable and closable air duct 13 has a louvered structure and is driven by a micro motor.

[0033] The working fluid inside the heat pipe (such as methanol, water, or fluoride) evaporates at high temperatures, transferring heat to two sets of condensation sections via capillary action. The first condensation section 15 extends upwards and is embedded in the heat dissipation fin assembly 12, dissipating heat through forced convection of the air-cooling system. The second condensation section 16 extends downwards and is embedded in the fitting groove of the liquid cooling plate 8, dissipating heat through the circulating coolant of the liquid cooling system. This allows the heat pipe to dynamically distribute heat according to cooling requirements; for example, under low loads, it primarily dissipates heat through air cooling, while under high loads, it simultaneously activates the liquid cooling path.

[0034] Furthermore, the evaporation section of the heat conduction connector 4 and the heat dissipation substrate 1 are integrated into a single structure through a sintering or reflow soldering process. The evaporation sections of multiple heat pipes are integrated into the heat dissipation substrate 1 through a sintering or reflow soldering process, directly absorbing the heat generated by heat-generating devices (such as CPUs and GPUs).

[0035] Furthermore, the upper surface of the liquid cooling plate 8 is provided with a fitting groove that matches the shape of the second set of condensing sections 16. The second set of condensing sections 16 is filled and fixed in the fitting groove by thermally conductive solder or a high-performance thermally conductive pad. The liquid is then transported to an external radiator for cooling via connecting pipe 9. The liquid cooling plate 8 and the heat pipe condensing sections are tightly bonded together by thermally conductive solder or a high-performance thermally conductive pad, effectively reducing contact thermal resistance and improving heat exchange efficiency.

[0036] Furthermore, the cooling fan 10 is an axial fan or a centrifugal fan, with its exhaust side facing the heat dissipation fin assembly 12, which has an asymmetrical structure. The cooling fan 10 has a built-in PWM speed control module that automatically adjusts its speed according to temperature: reducing power consumption at low temperatures and increasing airflow at high temperatures. The flow rate of the water pump 14 in the liquid cooling system can also be dynamically adjusted by the controller to avoid energy waste under high loads.

[0037] Furthermore, a sealing ring 6 is provided between the isolation cavity 18 and the heat dissipation substrate 1, and the side wall of the isolation cavity 18 is also provided with airflow guiding ribs. The airflow guiding ribs on the side wall of the isolation cavity 18 optimize the airflow around the liquid cooling plate 8 and reduce turbulence; the sealing ring 6 prevents air leakage inside and outside the liquid cooling cavity and improves heat dissipation stability.

[0038] Furthermore, the bottom inner surface of the isolation chamber 18 is provided with a condensate collection tank 7, which is connected to the outside via a pipe. In high humidity environments, condensate may form on the surface of the liquid cooling plate 8. The collection tank discharges the condensate to the outside via a pipe, preventing short circuits or corrosion of the equipment.

[0039] Furthermore, the mode switching mechanism 5 also includes a controller, which is connected to the linkage valve group 17. The controller monitors the temperature of the heat dissipation substrate 1 in real time through a temperature sensor and dynamically adjusts the heat dissipation mode based on a preset threshold. Air cooling mode (temperature ≤ 40℃): The linkage valve group 17 closes the liquid cooling circuit, the cooling fan 10 runs at low speed, and the airflow carries away heat through the heat dissipation fin group 12. The asymmetrical fin group optimizes airflow distribution and improves heat dissipation efficiency. Liquid cooling mode (temperature > 40℃): The valve group opens the liquid cooling circuit, the water pump 14 drives the coolant circulation, and the louvered air duct 13 of the isolation chamber 18 closes, forming an independent liquid cooling space and reducing airflow interference. Hybrid mode (temperature > 60℃): The valve group is fully open, air cooling and liquid cooling operate simultaneously, and the heat pipes simultaneously guide heat to both condensation sections to achieve maximum power dissipation.

[0040] The heat pipe connects both air cooling and liquid cooling systems, overcoming the limitations of a single heat dissipation mode. For example, heat generated by a high-load GPU can be quickly dissipated through liquid cooling, while surrounding low-power components are still cooled by air cooling, achieving refined thermal management. The controller achieves seamless switching between the three heat dissipation modes through multi-parameter coordinated control (temperature, load, ambient humidity).

[0041] Furthermore, an elastic support frame 11 is provided below the heat dissipation substrate 1 to buffer installation stress and ensure close contact between the liquid cooling plate 8 and the second set of condensation sections 16 of the heat conduction connector 4. The elastic support frame 11 buffers installation stress, ensures close contact between the liquid cooling plate 8 and the heat pipe condensation section, and avoids thermal contact failure caused by vibration.

[0042] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A dual-mode hybrid heat dissipation module, characterized in that: It includes a heat dissipation substrate, air-cooled heat dissipation components, liquid-cooled heat dissipation components, heat conduction connectors, and a mode switching mechanism; The air-cooled heat dissipation assembly includes a heat dissipation fan and a heat dissipation fin assembly installed on the heat dissipation substrate. The heat dissipation fin assembly is located on the air outlet path of the heat dissipation fan. The liquid-cooled heat dissipation assembly includes a liquid cooling plate attached to the lower surface of the heat dissipation substrate, a water pump communicating with the internal flow channel of the liquid cooling plate, and connecting pipes. The heat conduction connector consists of multiple heat pipes. The evaporation section of each heat pipe is tightly fitted inside the heat dissipation substrate. The condensation section of each heat pipe includes a first set of condensation sections that extend upward and penetrate into the heat dissipation fin group, and a second set of condensation sections that extend downward and are embedded or tightly attached to the upper surface of the liquid cooling plate. The mode switching mechanism includes an isolation cavity for accommodating the liquid cooling plate and a linkage valve group located on the connecting pipeline. The isolation cavity is located below the heat dissipation base plate, and the side wall of the isolation cavity is provided with an openable and closable air duct.

2. The dual-mode hybrid heat spreader module of claim 1, wherein: The evaporation section of the heat conduction connector and the heat dissipation substrate are integrated into a single structure through a sintering process or a reflow soldering process.

3. The dual-mode hybrid heat spreader module of claim 1, wherein: The upper surface of the liquid cooling plate is provided with a fitting groove that matches the shape of the second set of condensation sections. The second set of condensation sections is filled and fixed in the fitting groove by thermally conductive solder or high-performance thermally conductive pad.

4. The dual-mode hybrid heat spreader module of claim 1, wherein: The cooling fan is an axial fan or a centrifugal fan, and the exhaust side of the cooling fan is arranged directly opposite the heat dissipation fin assembly, which has an asymmetrical structure.

5. A dual-mode hybrid heat dissipation module according to claim 1, characterized in that: A sealing ring is provided between the isolation cavity and the heat dissipation substrate, and the side wall of the isolation cavity is also provided with flow guiding ribs.

6. The dual-mode hybrid heat spreader module of claim 1, wherein: The bottom inner surface of the isolation cavity is provided with a condensate collection tank, which is connected to the outside through a pipe.

7. The dual-mode hybrid heat spreader module of claim 1, wherein: The mode switching mechanism also includes a controller, which is connected to the linkage valve group.

8. The dual-mode hybrid heat spreader module of claim 1, wherein: The openable and closable air duct has a louvered structure and is driven by a micro motor.

9. The dual-mode hybrid heat spreader module of claim 1, wherein: Below the heat dissipation substrate is an elastic support frame for buffering installation stress and ensuring close contact between the liquid cooling plate and the second set of condensation sections of the heat conduction connector.

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