High-performance magnetic conductive foam structure

By attaching conductive fabric to the outside of the foam and combining it with flexible magnetic materials, the problems of insufficient conductivity, magnetic attraction and flexibility of conductive foam in complex electromagnetic environments are solved, realizing a high-performance conductive foam structure suitable for flexible electronics and smart wearable devices.

CN224386000UActive Publication Date: 2026-06-19LONG YOUNG ELECTRONIC (KUNSHAN) CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
LONG YOUNG ELECTRONIC (KUNSHAN) CO LTD
Filing Date
2025-05-15
Publication Date
2026-06-19

AI Technical Summary

Technical Problem

Existing conductive foams cannot simultaneously possess high conductivity, strong magnetic attraction, and good flexibility in complex electromagnetic environments, limiting their application in scenarios such as flexible electronics and smart wearable devices.

Method used

Conductive cloth is pasted on the outside of the foam body, and flexible magnetic material is glued to one side of the conductive cloth. Combined with hot melt adhesive, conductive and wave absorption functions are achieved. The side of the conductive cloth without magnetic material is provided with conductive adhesive, and the release paper can be peeled off to allow electronic components to be attached.

Benefits of technology

It achieves a combination of high conductivity, strong magnetic attraction and good flexibility, ensuring stable use in complex environments and reliability to adapt to different shapes and environments.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application relates to the technical field of electronic materials, and particularly discloses a high-performance magnetic conductive foam structure, which comprises a foam body, the outer part of the foam body is attached with conductive cloth through hot melt adhesive, one side of the conductive cloth is attached to the other side of the conductive cloth through the hot melt adhesive, and the conductive cloth is provided with flexible magnetic material which is in contact with the hot melt adhesive on the side in contact with the front face and / or the back face of the foam body. The conductive foam structure provided by the application not only has high conductivity and can guarantee the stability of electronic signal transmission, but also has high magnetic attraction and can play a unique role in a complex electromagnetic environment; meanwhile, the conductive foam structure has good flexibility and stability, can guarantee reliability in different shapes and use environments, and has high use value.
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Description

Technical Field

[0001] This application relates to the field of electronic materials technology, and in particular to a high-performance magnetic conductive foam structure. Background Technology

[0002] Currently, although conventional conductive foam can achieve basic conductivity and electromagnetic shielding functions, it cannot simultaneously possess high conductivity, strong magnetic attraction, and good flexibility and stability. This limits its application in some complex electromagnetic environments or scenarios with high requirements for material multifunctionality, such as flexible electronics and smart wearable devices.

[0003] To address the shortcomings of existing technologies, this application discloses a high-performance magnetic conductive foam structure. Utility Model Content

[0004] To overcome the shortcomings of the prior art, this application discloses a high-performance magnetic conductive foam structure.

[0005] To achieve the above objectives, the technical solution adopted in this application is: a high-performance magnetic conductive foam structure, comprising a foam body, wherein a conductive cloth is attached to the outside of the foam body by hot melt adhesive, and one side of the conductive cloth is attached to the other side of the conductive cloth by the hot melt adhesive, wherein the conductive cloth has a flexible magnetic material in contact with the hot melt adhesive on the side that is in contact with the front and / or back of the foam body.

[0006] More preferably, the conductive cloth has a flexible magnetic material bonded to hot melt adhesive on the side that is in contact with the front of the foam body, or the conductive cloth has a flexible magnetic material bonded to hot melt adhesive on the side that is in contact with the back of the foam body; the conductive cloth has conductive adhesive on the outside of the side that is not covered with flexible magnetic material.

[0007] More preferably, release paper is adhered to the conductive adhesive.

[0008] More preferably, the foam body is any one of polyurethane foam, polyethylene foam, polypropylene foam, and silicone rubber foam.

[0009] More preferably, the thickness of the foam body is 0.5-100mm.

[0010] More preferably, the hot melt adhesive is either a polyester-based hot melt adhesive or a polyamide hot melt adhesive.

[0011] More preferably, the conductive cloth is any one of stainless steel plated conductive cloth, copper-nickel plated conductive cloth, silver plated conductive cloth, or gold plated conductive cloth.

[0012] More preferably, the thickness of the conductive cloth is 0.01-0.3 mm.

[0013] More preferably, the flexible magnetic material is one of neodymium iron boron magnets, samarium cobalt magnets, ferrite magnets, or alnico magnets.

[0014] This application achieves the following beneficial effects:

[0015] The conductive foam structure provided in this application not only has high conductivity, which can ensure the stability of electronic signal transmission, but also has strong magnetic attraction, which can play a unique role in complex electromagnetic environments. At the same time, it also has good flexibility and stability, ensuring reliability in different shapes and usage environments, and has high application value.

[0016] Other features and advantages of this application will be set forth in the following description and will be apparent in part from the description, or may be learned by practicing the application. The objectives and other advantages of this application may be realized and obtained by means of the structures shown in the description and the accompanying drawings. Attached Figure Description

[0017] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the disclosure of this application and, together with the specification, serve to explain the principles of this disclosure.

[0018] Figure 1 This is a schematic diagram of a structure disclosed in this application;

[0019] Figure 2 This is another structural diagram disclosed in this application;

[0020] In the diagram: 10, foam body; 20, hot melt adhesive; 30, conductive cloth; 40, flexible magnetic material; 50, conductive adhesive; 60, release paper. Detailed Implementation

[0021] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0022] In the description of this application, it should be understood that the terms "opening", "upper", "lower", "thickness", "top", "middle", "length", "inner", "around", etc., which indicate orientation or positional relationship, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the component or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0023] Example

[0024] To address the limitation of existing conductive foams in complex electromagnetic environments or scenarios requiring high material versatility, reference was made to... Figure 1 As shown, this application discloses a high-performance magnetic conductive foam structure, including a foam body 10. A conductive cloth 30 is adhered to the outside of the foam body 10 by hot melt adhesive 20, and one side of the conductive cloth 30 is adhered to the other side of the conductive cloth 30 by hot melt adhesive 20. A flexible magnetic material 40 is provided on the side of the conductive cloth 30 that is in contact with the front and / or back of the foam body 10 and is in contact with the hot melt adhesive 20. Based on the combination of the foam body 10 and the conductive cloth 30 by hot melt adhesive 20, the functions of conducting electricity and absorbing waves of traditional conductive foam can be realized. In addition, in specific use, one or both sides of the conductive foam structure are attached to electronic components. In this way, the corresponding flexible magnetic material 40 can automatically attract the electronic components and thus achieve fixation. This structure has good flexibility and can be adjusted and installed according to changes in spatial environment and shape, and it is relatively stable in use.

[0025] refer to Figure 2 As shown, in another embodiment, the conductive cloth 30 of this application has a flexible magnetic material 40 that is bonded to the hot melt adhesive 20 on the side that is in contact with the front of the foam body 10, or the conductive cloth 30 has a flexible magnetic material 40 that is bonded to the hot melt adhesive 20 on the side that is in contact with the back of the foam body 10; the conductive cloth 30 has a conductive adhesive 50 on the outside of the side that is not covered with the flexible magnetic material 40. As an auxiliary material, release paper 60 is attached to the conductive adhesive 50. In some application scenarios, one side of the conductive foam structure can be attracted to electronic components through the flexible material, and the other side can be attracted to electronic components through the conductive adhesive 50. Of course, in actual use, the operator must tear off the release paper 60.

[0026] The following is a description of the materials involved in the conductive foam structure of this application:

[0027] The foam body 10 can be any one of polyurethane foam, polyethylene foam, polypropylene foam, or silicone rubber foam, and the thickness of the foam body 10 is 0.5-100mm. In actual manufacturing, in addition to the above four types of foam, other types of foam body 10 can also be selected in this application. The specific thickness of the foam body 10 is selected according to the usage requirements of the electronic product, which will not be elaborated on here.

[0028] The hot melt adhesive 20 can be either a polyester hot melt adhesive or a polyamide hot melt adhesive. In actual manufacturing, in addition to the two types of hot melt adhesives 20 mentioned above, other types of hot melt adhesives 20 can also be selected in this application, which will not be elaborated here.

[0029] The conductive cloth 30 can be any one of stainless steel plated conductive cloth, copper-nickel plated conductive cloth, silver plated conductive cloth, or gold plated conductive cloth, and the thickness of the conductive cloth 30 is 0.01-0.3mm. In addition to the above three types of conductive cloth 30, other types of conductive cloth 30 can also be selected in this application, and the specific thickness of the conductive cloth 30 can be selected according to the usage requirements of the electronic product, which will not be elaborated here.

[0030] The flexible magnetic material 40 is one of neodymium iron boron magnet, samarium cobalt magnet, ferrite magnet or alnico magnet. In addition to the above four types of flexible magnetic materials 40, other types of flexible magnetic materials 40 may also be selected for the flexible magnetic material 40 of this application, which will not be described in detail here.

[0031] In the description of this specification, the references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0032] The above embodiments are only for illustrating the technical concept and features of this application, and are intended to enable those skilled in the art to understand the content of this application and implement it accordingly. They should not be used to limit the scope of protection of this application. All equivalent changes or modifications made in accordance with the spirit and essence of this application should be included within the scope of protection of this application.

Claims

1. A high-performance magnetic conductive foam structure, characterized in that, The foam body (10) is covered with a conductive cloth (30) by hot melt adhesive (20) on the outside of the foam body (10). One side of the conductive cloth (30) is bonded to the other side of the conductive cloth (30) by the hot melt adhesive (20). The conductive cloth (30) has a flexible magnetic material (40) in contact with the hot melt adhesive (20) on the side that is in contact with the front and / or back of the foam body (10).

2. The high-performance magnetic conductive foam structure of claim 1, wherein, The conductive cloth (30) has a flexible magnetic material (40) that is bonded to the hot melt adhesive (20) on the side that is in contact with the front of the foam body (10), or the conductive cloth (30) has a flexible magnetic material (40) that is bonded to the hot melt adhesive (20) on the side that is in contact with the back of the foam body (10); the conductive cloth (30) has conductive adhesive (50) on the outside of the side that is not covered with the flexible magnetic material (40).

3. The high-performance magnetic conductive foam structure of claim 2, wherein, Release paper (60) is attached to the conductive adhesive (50).

4. The high-performance magnetic conductive foam structure of claim 1, wherein, The foam body (10) is any one of polyurethane foam, polyethylene foam, polypropylene foam, and silicone rubber foam.

5. The high-performance magnetically attractable conductive foam structure of claim 4, wherein, The thickness of the foam body (10) is 0.5-100mm.

6. The high-performance magnetic conductive foam structure of claim 1, wherein, The hot melt adhesive (20) is either a polyester hot melt adhesive or a polyamide hot melt adhesive.

7. The high-performance magnetic conductive foam structure of claim 1, wherein, The conductive cloth (30) is any one of stainless steel plated conductive cloth, copper-nickel plated conductive cloth, silver plated conductive cloth or gold plated conductive cloth.

8. The high-performance magnetically attractable conductive foam structure of claim 7, wherein, The thickness of the conductive cloth (30) is 0.01-0.3 mm.

9. The high-performance magnetic conductive foam structure of claim 1, wherein, The flexible magnetic material (40) is one of neodymium iron boron magnets, samarium cobalt magnets, ferrite magnets or alnico magnets.