A batch patch device based on PCB production

Abstract

The utility model discloses a kind of batch patching devices based on PCB production, the utility model relates to circuit board patching technical field, including machine body and control panel being set on machine body, the conveying mechanism for conveying PCB is provided on the machine body;The top of the inner wall of the machine body is provided with a moving mechanism, and the moving mechanism is connected with mounting block, mounting plate is provided on the mounting block, speed reducer motor is uniformly provided on the mounting plate, the output shaft of the speed reducer motor is connected with electric telescopic handle, and the bottom of electric telescopic handle is provided with vacuum chuck assembly above conveying mechanism;By setting feeding mechanism and several speed reducer motors, electric telescopic handle and vacuum chuck assembly, multiple patching elements can be sucked in single time, and then batch patching can be carried out when patching, to improve patching efficiency.

Description

Technical Field

[0001] This utility model relates to the field of circuit board mounting technology, specifically a batch mounting device for PCB board production. Background Technology

[0002] After solder paste coating and printing, the PCB board can be used for chip placement. A search revealed that CN212910651U discloses a support structure for a PCB board used in a chip placement machine, which includes a frame. The frame has X-axis guide rails on both sides of its top, and the outer walls of the two X-axis guide rails have the same Y-axis guide rail. A chip placement assembly is mounted on the Y-axis guide rail. CN222017140U discloses an SMT chip placement machine whose placement mechanism includes a robotic arm and a pick-up assembly for picking up chips. The pick-up assembly is located at the end of the robotic arm and is driven by the robotic arm to place chips onto the PCB board. The pick-up assembly includes a suction cup and a negative pressure fan on the robotic arm. The suction cup and the negative pressure fan are connected through a pipe. A vent hole is provided on the end face of the suction cup that is in contact with the chip, and the vent hole is connected to the pipe.

[0003] The surface mount components in the aforementioned prior art all use a moving mechanism to drive a vacuum chuck to pick up surface mount components from the feed station and place them onto the PCB board. However, none of these technologies can perform batch placement. Furthermore, after placing one component, the aforementioned prior art technologies need to move the vacuum chuck back to the surface mount component feed station to pick up more components. Since multiple surface mount components often need to be placed on the PCB board, using the aforementioned prior art technologies would result in low placement efficiency. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides a batch chip mounting device for PCB board production, which solves the problems existing in the prior art.

[0005] To achieve the above objectives, this utility model is implemented through the following technical solution: a batch chip mounting device for PCB board production, comprising a machine body and a control panel disposed on the machine body, wherein the machine body is provided with a conveying mechanism for conveying PCB boards;

[0006] A moving mechanism is provided on the top of the inner wall of the machine body, and the moving mechanism is connected to the mounting block. A mounting plate is provided on the mounting block, and a reduction motor is evenly arranged on the mounting plate. An electric telescopic rod is connected to the output shaft of the reduction motor, and a vacuum suction cup assembly located above the conveying mechanism is provided at the bottom of the electric telescopic rod.

[0007] A feeding mechanism is provided on the inner right side wall of the machine body.

[0008] Preferably, the feeding mechanism includes a plurality of mounting rods connected to the inner wall of the machine body. Guide grooves are evenly arranged on the mounting rods. A transmission belt is arranged on the guide grooves. A push plate is arranged at the bottom front side of the transmission belt. A patch element is stacked on the top of the push plate, and the outer wall of the patch element is in contact with the guide groove. The top of the guide groove is higher than the top of the transmission belt, and the inner cavity of the guide groove has a convex structure.

[0009] Preferably, a second pusher plate of the same size as the first pusher plate is provided on the top rear side of the transmission belt.

[0010] Preferably, the moving mechanism includes an electric guide rail one disposed on the top of the inner wall of the machine body, the output end of the electric guide rail one is connected to a connecting block, the bottom of the connecting block is provided with an electric push rod, and the output end of the electric push rod is connected to an electric guide rail two, the output end of the electric guide rail two is connected to a mounting block.

[0011] Preferably, a side door is movably connected to the top right side of the machine body.

[0012] Preferably, observation windows are movably connected to both the front and rear sides of the machine body.

[0013] This invention provides a batch placement device for PCB board production. Compared with the prior art, it has the following advantages:

[0014] 1. This batch placement device for PCB board production, through its feeding mechanism and several geared motors, electric telescopic rods and vacuum suction cups, enables the picking up of multiple placement components at a time, thus allowing for batch placement and improving placement efficiency.

[0015] 2. This batch placement device for PCB board production uses a feeding mechanism that drives pusher plate one and pusher plate two through a transmission belt for cyclic conveying. Under the guidance of the guide groove, it can automatically push the required placement components upward for feeding, so as to feed in batches according to the needs of placement, in order to complete batch placement. When the placement components on pusher plate one are used up, they can be loaded onto pusher plate two without reversing the transmission belt to drive pusher plate one downward, thus saving the running length of the transmission belt. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the moving mechanism and vacuum suction cup assembly of this utility model;

[0018] Figure 3 This is a schematic diagram of the feeding mechanism of this utility model;

[0019] Figure 4This is a cross-sectional schematic diagram of the guide groove and transmission belt box patch element of this utility model;

[0020] Figure 5 This is a bottom view of the guide groove, push plate one, and push plate two of this utility model.

[0021] In the diagram: 1. Machine body; 2. Conveying mechanism; 3. Control panel; 4. Mounting block; 5. Mounting plate; 6. Gear motor; 7. Electric telescopic rod; 8. Vacuum suction cup assembly; 9. Mounting rod; 10. Guide groove; 11. Transmission belt; 12. Push plate one; 13. Surface mount element; 14. Push plate two; 15. Electric guide rail one; 16. Connecting block; 17. Electric push rod; 18. Electric guide rail two; 19. Side door; 20. Observation window. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] See Figures 1-5 This utility model provides the following two technical solutions:

[0024] First implementation: A batch chip mounting device for PCB board production includes a body 1 and a control panel 3 set on the body 1. The control panel 3 is used to control the electrical components mentioned above. The body 1 is provided with a conveying mechanism 2 for conveying PCB boards. The PCB boards are placed on the conveying mechanism 2 and can be guided and conveyed in the front and back directions. After the chip mounting is completed, it is conveyed to the reflow soldering machine for soldering. All of the above are existing technologies.

[0025] A moving mechanism is provided at the top of the inner wall of the body 1, and the moving mechanism is connected to the mounting block 4. It is used to drive the mounting block 4 to move so as to drive the vacuum suction cup assembly 8 to pick up the chip components and then place them on the PCB board. The mounting block 4 is provided with a mounting plate 5, and the mounting plate 5 is evenly provided with a geared motor 6. The output shaft of the geared motor 6 is connected to an electric telescopic rod 7. The battery of the electric telescopic rod 7 is located on its housing so that it will not be obstructed by the power cord during rotation. The bottom of the electric telescopic rod 7 is provided with a vacuum suction cup assembly 8 located above the conveying mechanism 2. The vacuum suction cup assembly 8 is used to pick up the chip components and can also release the chip components. This is the prior art. The electric telescopic rod 7 is used to drive the chip components to rise and fall, and the geared motor 6 is used to drive the picked-up chip components to rotate so as to place them on the PCB board in the required arrangement direction.

[0026] A feeding mechanism is provided on the inner right side of the machine body 1.

[0027] The feeding mechanism includes several mounting rods 9 connected to the inner wall of the machine body 1. Guide grooves 10 are evenly arranged on the mounting rods 9, and a transmission belt 11 is mounted on the guide grooves 10. A push plate 12 is located at the bottom front side of the transmission belt 11. A patch element 13 is stacked on top of the push plate 12, and the outer wall of the patch element 13 contacts the guide groove 10, thus guiding the patch element 13. The top of the guide groove 10 is higher than the top of the transmission belt 11, ensuring that the vacuum suction cup assembly 8 is not obstructed by the transmission belt 11 when picking up the topmost patch element 13. Furthermore, the inner cavity of the guide groove 10 has a convex shape. Figure 5 As shown, this facilitates the passage of the pusher plate 12 as it moves with the transmission belt 11. Of course, if the patch element 13 is cylindrical, a matching guide groove 10 can be used, as long as it does not affect the passage of the pusher plate 12 through the guide groove 10.

[0028] A second pusher plate 14 of the same size as the first pusher plate 12 is provided on the top rear side of the transmission belt 11, so that the first pusher plate 12 and the second pusher plate 14 move synchronously. After the patch element 13 on the first pusher plate 12 is used up, the patch element 13 can be replenished on the second pusher plate 14 without the transmission belt 11 reversing to drive the first pusher plate 12 to move downward, thereby saving the running length of the transmission belt 11.

[0029] The moving mechanism includes an electric guide rail 15 located on the top of the inner wall of the body 1. The output end of the electric guide rail 15 is connected to a connecting block 16, which can drive the connecting block 16 to move laterally. An electric push rod 17 is located at the bottom of the connecting block 16, and the output end of the electric push rod 17 is connected to an electric guide rail 18, which can drive the electric guide rail 18 to rise and fall. The output end of the electric guide rail 18 is connected to the mounting block 4, which can drive the mounting block 4 to move back and forth, so as to drive the vacuum suction cup assembly 8 to the mounting element 13 for mounting.

[0030] A side door 19 is movably connected to the top right side of the body 1. After opening the side door 19, patch elements 13 can be added into the guide groove 10.

[0031] The second implementation method differs from the first implementation method in that: observation windows 20 are movably connected to both the front and rear sides of the body 1, which does not affect the observation of the patch application and can also reduce dust entering the body 1 and affecting the patch application.

[0032] Meanwhile, all contents not described in detail in this specification are existing technologies known to those skilled in the art. For example, the alignment of the movable vacuum suction cup assembly 8 with the surface mount component 13 and the surface mount point on the PCB board can be achieved by the vision inspection technology built into the existing surface mount machine. Furthermore, the model parameters of each electrical component are not specifically limited, and conventional equipment can be used.

[0033] In use, the mounting plate 5 is moved by the moving mechanism, so that the vacuum suction cup assembly 8 moves above the corresponding surface mount component 13. Then, the vacuum suction cup assembly 8 is pushed down by the corresponding electric telescopic rod 7, while the transmission belt 11 drives the push plate 12 to move up, so that the stacked surface mount components 13 are automatically moved up for feeding, so that they can be picked up after contacting the vacuum suction cup assembly 8. Multiple surface mount components 13 can be picked up at a time. After picking up, the mounting plate 5 is moved by the moving mechanism. Finally, the multiple surface mount components 13 picked up can be placed one by one on the PCB board by the geared motor 6 and the electric telescopic rod 7. Thus, by picking up components in batches at a time, batch placement can be achieved, improving the placement efficiency of the PCB board.

[0034] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0035] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A batch patching device for PCB board production, characterized in that: It includes a body (1) and a control panel (3) set on the body (1), wherein the body (1) is provided with a conveying mechanism (2) for conveying PCB boards. The top of the inner wall of the machine body (1) is provided with a moving mechanism, and the moving mechanism is connected to the mounting block (4). The mounting block (4) is provided with a mounting plate (5), and a geared motor (6) is evenly arranged on the mounting plate (5). An electric telescopic rod (7) is connected to the output shaft of the geared motor (6), and a vacuum suction cup assembly (8) located above the conveying mechanism (2) is provided at the bottom of the electric telescopic rod (7). A feeding mechanism is provided on the inner right side of the machine body (1).

2. The batch patching device based on PCB board production according to claim 1, characterized in that: The feeding mechanism includes several mounting rods (9) connected to the inner wall of the machine body (1). Guide grooves (10) are evenly arranged on the mounting rods (9). A transmission belt (11) is arranged on the guide grooves (10). A push plate (12) is arranged at the bottom front side of the transmission belt (11). A patch element (13) is stacked on the top of the push plate (12). The outer wall of the patch element (13) is in contact with the guide groove (10). The top of the guide groove (10) is higher than the top of the transmission belt (11). The inner cavity of the guide groove (10) has a convex structure.

3. The batch patching device for PCB board production according to claim 2, characterized in that: The rear top of the transmission belt (11) is provided with a push plate two (14) of the same size as push plate one (12).

4. The batch placement device for PCB board production according to claim 1, characterized in that: The moving mechanism includes an electric guide rail one (15) set on the top of the inner wall of the body (1). The output end of the electric guide rail one (15) is connected to a connecting block (16). An electric push rod (17) is set at the bottom of the connecting block (16). The output end of the electric push rod (17) is connected to an electric guide rail two (18). The output end of the electric guide rail two (18) is connected to the mounting block (4).

5. A batch placement device for PCB board production according to claim 1, characterized in that: A side door (19) is movably connected to the top right side of the body (1).

6. The batch patching device for PCB board production of claim 1, wherein: The front and rear sides of the body (1) are movably connected to observation windows (20).

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