Guiding and aligning mechanism and gluing system
By using a single power component to drive the guide alignment assembly and the placement position to move synchronously, the problem of complex structure and high cost of existing guide alignment mechanisms is solved, and precise adhesive coating of semiconductor substrates is achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN RUIRONG AUTOMATION CO LTD
- Filing Date
- 2025-07-07
- Publication Date
- 2026-06-23
AI Technical Summary
Existing guiding and alignment mechanisms are complex in structure and require multiple power components to drive them, resulting in high production costs. Furthermore, semiconductor substrates are prone to shifting during transport, affecting the accuracy of adhesive coating.
A single power unit drives the guide alignment assembly and the placement position to move synchronously. The guide alignment assembly rises from a first height position to a second height position and guides the semiconductor substrate to the adhesive application position on the platform during descent. Precise alignment is achieved using the guide alignment surface and rollers.
It reduces production costs, improves the precision and efficiency of adhesive coating, and ensures accurate alignment of semiconductor substrates during the adhesive coating process.
Smart Images
Figure CN224389216U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to an adhesive application system, and also to a guiding and alignment mechanism applied in the adhesive application system. Background Technology
[0002] The coating system includes a platform for placing semiconductor substrates and a coating blade for applying adhesive to the semiconductor substrates. Before coating, the semiconductor substrates need to be sent to the coating station on the platform so that the coating blade can apply adhesive to their surfaces.
[0003] Because semiconductor substrates are relatively thin (approximately 10–30 μm), they are easily bent and deformed. When transferred to the platform, semiconductor substrates are prone to misalignment and inaccurate positioning, which affects the precision of the adhesive coating.
[0004] Existing guiding and alignment mechanisms are complex in structure, requiring different power components to drive the semiconductor substrate to move up and down and to guide and align the semiconductor substrate, resulting in high production costs.
[0005] For the reasons mentioned above, there is an urgent need for a guide alignment mechanism for an adhesive application system that can solve the above problems. Utility Model Content
[0006] The purpose of this invention is to overcome the shortcomings of the prior art and provide a guiding and alignment mechanism with guiding and alignment function and a coating system with guiding and alignment mechanism. It drives the semiconductor substrate to move up and down and guides and aligns the semiconductor substrate through a power component, thereby reducing costs.
[0007] This utility model is implemented as follows: a guide alignment mechanism installed on a lifting mechanism, comprising:
[0008] A guiding alignment component, which moves from a first height position to a second height position, is used to guide and align a semiconductor substrate placed on the placement position of the lifting mechanism. As the placement position moves from the second height position to the first height position, the guiding alignment component guides the semiconductor substrate to the adhesive application position on the platform. The first height position is lower than the height of the adhesive application blade in the horizontal direction.
[0009] A power unit is used to drive the guide alignment assembly and the placement position to move synchronously, wherein the power unit drives the guide alignment assembly to rise from a first height position to a second height position, and the power unit drives the guide alignment assembly to descend from the second height position to the first height position.
[0010] Preferably, the guiding alignment component includes:
[0011] At least two spaced-apart first guide alignment surfaces are used for guiding and aligning the semiconductor substrate along its length.
[0012] At least two spaced second guide alignment surfaces are used for guiding alignment of the semiconductor substrate in the width direction.
[0013] Preferably, there are n first guide alignment surfaces and n second guide alignment surfaces, where n is an even number greater than 1, and the plurality of first guide alignment surfaces and the plurality of second guide alignment surfaces are arranged symmetrically.
[0014] Preferably, the upper ends of the opposing first guide alignment surface and the opposing second guide alignment surface are used to guide the semiconductor substrate, respectively.
[0015] The lower ends of the opposing first guide alignment surface and the opposing second guide alignment surface are used for aligning the semiconductor substrate, respectively.
[0016] Preferably, the guiding alignment mechanism includes:
[0017] Multiple rollers rotating along their axes are located around the semiconductor substrate. The first guide alignment surface and the second guide alignment surface are respectively located in the guide area between the horizontal diameter and the vertical diameter of the multiple rollers.
[0018] Preferably, the position corresponding to the horizontal diameter of the rollers arranged opposite each other in the X and Y directions is used to align the semiconductor substrate in the length and width directions, and the position corresponding to the horizontal diameter of the rollers arranged opposite each other is at the same height as the lower surface of the semiconductor substrate.
[0019] Furthermore, the guiding alignment mechanism includes a plurality of support rods for mounting the guiding alignment assembly and moving synchronously up and down with the placement position.
[0020] Furthermore, the guiding alignment mechanism also includes a sliding guide for guiding the support rod. The sliding guide includes two symmetrically arranged linear slide rail groups and sliders respectively slidably mounted on the two linear slide rail groups. The bracket is fixed on the two sliders.
[0021] Furthermore, the guiding alignment mechanism further includes:
[0022] A first position detector is used to detect the first height position of the guide alignment component and output a first height position signal to the outside.
[0023] The second position detector is used to detect the second height position of the guide alignment component and output the second height position signal to the outside.
[0024] A drive unit is used to control power components.
[0025] The controller outputs control commands to the driver based on the received first or second height position signal, and the driver controls the power component to start or stop working according to the received control commands.
[0026] This utility model also provides an adhesive application system, including the above-described guiding and alignment mechanism, and further comprising:
[0027] A platform for mounting a semiconductor substrate, having a plurality of first guide holes located below the semiconductor substrate and a plurality of second guide holes located on the outer periphery of the semiconductor substrate;
[0028] The lifting mechanism has multiple ejector pins that are respectively inserted into the first guide hole, and the top of the multiple ejector pins has a placement position for placing a semiconductor substrate;
[0029] The guide alignment assembly has multiple support rods for mounting the guide alignment assembly, and the multiple support rods are respectively vertically slidably installed in the second guide hole.
[0030] This utility model provides a guiding and alignment mechanism for use with a lifting mechanism, including a guiding and alignment component for guiding and aligning a semiconductor substrate and a power component for driving the guiding and alignment component to move up and down. The power component drives the guiding and alignment component to rise from a first height position to a second height position, so that the guiding and alignment component guides and positions the semiconductor substrate transferred by the robotic arm at the second height position and positions it at the placement position of the lifting mechanism. The power component then drives the guiding and alignment component to descend from the second height position to the first height position along with the placement position. During the descent, the guiding component guides the semiconductor substrate to a coating position on the platform. This first height position is lower than the horizontal coating height of the coating blade, facilitating precise coating of the coating blade onto the fixed semiconductor substrate. A coating system with the above-described guiding and alignment mechanism is also provided. Attached Figure Description
[0031] To more clearly illustrate the technical solution of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0032] Figure 1 This is a structural diagram of the guiding and alignment mechanism provided in an embodiment of the present invention.
[0033] Figure 2 This is a schematic diagram of the guide positioning frame in the guide alignment mechanism provided in this embodiment of the utility model.
[0034] Figure 3This is a structural diagram of the guiding alignment mechanism and the lifting mechanism provided in this embodiment of the utility model (i.e., a state diagram of the semiconductor substrate at the second height position).
[0035] Figure 4 This is a schematic diagram of the guiding area in the guiding alignment mechanism provided in this embodiment of the utility model.
[0036] Figure 5 This is a structural diagram of the length direction guiding alignment component or the width direction guiding alignment component in the guiding alignment mechanism provided in this utility model embodiment.
[0037] Figure 6 This is a block diagram showing the connection between the driver, controller, and power component in the guiding and alignment mechanism provided in this embodiment of the utility model.
[0038] Figure 7 This is a diagram showing the semiconductor substrate at a first height position in the coating system provided in this embodiment of the utility model.
[0039] Figure 8 This is a schematic diagram of a coating knife applying adhesive to a semiconductor substrate in the coating system provided in this embodiment of the utility model.
[0040] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings.
[0041] The reference numerals in the attached figures are explained as follows:
[0042] Guide alignment mechanism 100, guide alignment assembly 110, first guide alignment surface 111, second guide alignment surface 112, guide positioning frame 113, roller 114, guide area 1141, power component 120, support rod 130, first support frame 131, plate 133, roller bracket 134, sleeve 135, connecting position 1351, arc-shaped part 1352, limiting component 136, horizontal position 1361, vertical position 1362, sliding guide component 140, linear slide rail assembly 141, slider 142, first position detector 150, second position detector 150', driver 160, controller 170;
[0043] Lifting mechanism 200, placement position 210, second support frame 220, ejector pin 230;
[0044] Semiconductor substrate 300;
[0045] Platform 400, first guide hole 410, second guide hole 420;
[0046] 500 scalpels. Detailed Implementation
[0047] In this invention, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or state relationship based on the orientation or state relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this invention and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.
[0048] Furthermore, in addition to indicating location or state relationships, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in certain situations to indicate a dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this utility model based on the specific circumstances.
[0049] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this utility model based on the specific circumstances.
[0050] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, components, or parts, which may be the same or different in type and construction, and are not intended to indicate or imply the relative importance or quantity of the indicated devices, components, or parts. Unless otherwise stated, "a plurality of" means two or more.
[0051] To clarify the directional relationships in the diagram, a coordinate system with the vertical direction as the Z-direction and the horizontal plane as the XY-plane is appropriately labeled.
[0052] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.
[0053] like Figures 1-3 As shown, an embodiment of this utility model provides a guide alignment mechanism 100, which is installed on a lifting mechanism 200. The guide alignment mechanism 100 includes:
[0054] The guide alignment component 110 moves from a first height position to a second height position to guide and align the semiconductor substrate 300 placed on the placement position 210 of the lifting mechanism 200. As the placement position 210 moves from the second height position to the first height position, the guide alignment component 110 precisely guides the semiconductor substrate 300 to the adhesive application position on the platform 400. The first height position is lower than the horizontal adhesive application height of the applicator 500, which facilitates the applicator 500 to accurately apply adhesive to the semiconductor substrate 300.
[0055] The power unit 120 is used to drive the guide alignment assembly 110 and the placement position 210 to move synchronously along the Z direction. The power unit 120 includes, but is not limited to, a telescopic motor, a lead screw motor, and a telescopic cylinder. In this embodiment, the power unit is preferably a lead screw motor. The power unit 120 rotates according to a set first number of revolutions, a first speed, and a first direction, which links the guide alignment assembly 110 to rise from a first height position to a second height position. The power unit 120 rotates according to a set second number of revolutions, a second speed, and a second direction, which links the guide alignment assembly 110 to descend from the second height position to the first height position. By using a single power unit 120 to drive the guide alignment assembly 110 and the placement position 210 to move synchronously along the Z direction, the cost is reduced.
[0056] In this embodiment, the semiconductor substrate 300 is preferably rectangular. The semiconductor substrate 300 may include, but is not limited to, various substrates such as glass substrates for liquid crystal display devices, glass substrates for PDP, glass substrates for photomasks, substrates for color filters, substrates for recording discs, substrates for solar cells, substrates for electronic paper, rectangular glass substrates, flexible substrates for thin-film liquid crystals, and substrates for organic EL.
[0057] In this embodiment, the first direction and the second direction are opposite, the first number of revolutions and the second number of revolutions are the same, and the first speed and the second speed are the same, which enables the power unit 120 to output uniform rotational power.
[0058] Preferably, the guide alignment component 110 includes:
[0059] At least two spaced-apart length direction guiding alignment components, each length direction guiding alignment component having a first guiding alignment surface 111 for length direction guiding alignment of semiconductor substrate 300;
[0060] At least two spaced-apart width-direction guide alignment components, each width-direction guide alignment component having a second guide alignment surface 112 for width-direction guide alignment of the semiconductor substrate 300.
[0061] In this embodiment, preferably, the length direction guiding alignment component and the width direction guiding alignment component are symmetrically arranged and have the same structure. The symmetrical structural design can make the semiconductor substrate 300 uniformly stressed in the length and width directions, resulting in the best guiding alignment effect.
[0062] There are n first guiding alignment surfaces 111 and n second guiding alignment surfaces 112, where n is an even number greater than 1, and the multiple first guiding alignment surfaces 111 and the multiple second guiding alignment surfaces 112 are arranged symmetrically or staggeredly. In this embodiment, preferably, the two first guiding alignment surfaces 111 and the two second guiding alignment surfaces 112 are arranged symmetrically, which can quickly guide the semiconductor substrate 300 and improve the efficiency of guiding and positioning.
[0063] Preferably, the first guide alignment surface 111 and the second guide alignment surface 112 are, but are not limited to, inclined surfaces, arc surfaces, or a combination of inclined surfaces and arc surfaces;
[0064] like Figure 2 As shown, the upper ends of the two opposing first guide alignment surfaces 111 and the two opposing second guide alignment surfaces 112 are used to guide the semiconductor substrate 300. In this embodiment, the distance L between the upper ends of the two opposing first guide alignment surfaces 111 and the distance M between the upper ends of the two opposing second guide alignment surfaces 112 are both greater than the outer dimensions of the semiconductor substrate 300, and are used to guide the semiconductor substrate 300 to the lower ends of the first guide alignment surfaces 111 and the second guide alignment surfaces 112.
[0065] The lower ends of the two opposing first guide alignment surfaces 111 and the two opposing second guide alignment surfaces 112 are used to align the semiconductor substrate 300. In this embodiment, the distance L' between the lower ends of the two opposing first guide alignment surfaces 111 and the distance M' between the lower ends of the two opposing second guide alignment surfaces 112 are adapted to the outer dimensions of the semiconductor substrate 300. Preferably, the distance L' between the lower ends of the two opposing first guide alignment surfaces 111 and the distance M' between the lower ends of the two opposing second guide alignment surfaces 112 are both equal to or 0.01 to 0.02 mm larger than the outer dimensions of the semiconductor substrate 300, which facilitates the precise positioning of the semiconductor substrate 300 at the adhesive application position on the placement position 210.
[0066] In this embodiment, preferably, a plurality of first guide alignment surfaces 111 and a plurality of second guide alignment surfaces 112 form a guide positioning frame 113 with a larger upper end and a smaller lower end, and the guide positioning frame 113 is located directly above the adhesive application position of the platform 400.
[0067] like Figure 4 As shown, preferably, the guiding alignment mechanism 100 includes:
[0068] Multiple rollers 114 rotating along their axes are located around the semiconductor substrate 300. The first guide alignment surface 111 and the second guide alignment surface 112 are located in the guide area 1141 formed between the vertical diameter D1 and the horizontal diameter D2 of the multiple rollers 114. Since the resistance of rolling friction is less than that of sliding friction, the semiconductor substrate 300 can be quickly guided to the placement position 210 of the lifting mechanism 200, thereby improving the efficiency of guidance and alignment.
[0069] In another embodiment, the roller 114 can be set to not rotate, which can also achieve the function of guiding and positioning. At the same time, a slope and a guide surface combining the slope and the arc can be set on the roller 114, which can achieve the effect of guiding and positioning.
[0070] Preferably, the position 1142 corresponding to the horizontal diameter of the roller 114 arranged opposite to each other in the X and Y directions is used to align the semiconductor substrate 300 in the length and width directions. Since the roller 114 can rotate along its axis, the position 1142 corresponding to the horizontal diameter D1 of the roller 114 can be different positions of the outer circumference of the roller 114 rotated to the horizontal diameter D1. This ensures the accuracy of the position 1142 corresponding to the horizontal diameter and extends the service life of the position 1142. In this embodiment, the horizontal diameter D1 of the roller 114 corresponds to the position at the same height as the lower surface of the semiconductor substrate 300. This structural design allows the semiconductor substrate 300 to be guided to the placement position 210 of the lifting mechanism 200 at the second height position, and also allows it to be guided to the adhesive application position of the platform 400 at the first height position. This facilitates precise adhesive application by the applicator 500 onto the semiconductor substrate 300. Simultaneously, it reduces the height difference between the upper ends of the first guide alignment surface 111 and the second guide alignment surface 112 of the roller 114 and the top of the lifting mechanism 200, shortening the guiding distance. This facilitates the rapid guidance of the semiconductor substrate 300 onto the lifting mechanism 200 by the first guide alignment surface 111 and the second guide alignment surface 112 of the roller 114, and also avoids damage to the semiconductor substrate 300 during the guiding process due to excessive height between the first guide alignment surface 111 and the second guide alignment surface 112 of the roller 114 and the top of the lifting mechanism 200.
[0071] like Figure 1 , Figure 3 , Figure 5 and Figure 7As shown, the guiding alignment mechanism 100 further includes multiple support rods 130 for mounting the guiding alignment assembly 110 and moving synchronously up and down with the placement position 210. The support rods 130 pass through the second guide hole 420 of the platform 400. The multiple support rods 130 are respectively located on the outer periphery of the semiconductor substrate 300 and move synchronously up and down with the placement position 210. The rollers 114 on the support rods 130 can also abut and limit the movement of the semiconductor substrate 300 around its periphery, which is beneficial to the stability of the semiconductor substrate 300 during vertical movement and avoids horizontal movement of the semiconductor substrate 300. In this embodiment, the multiple support rods 130 are vertically arranged on the first support frame 131, which is parallel and spaced above the second support frame 220. The first support frame 131, the second support frame 220, and the platform 400 are all parallel and spaced apart.
[0072] Overview of roller mounting structure and slide bar correction structure as examples
[0073] like Figure 5 As shown, in this embodiment, each roller 114 is supported by two spaced and vertically arranged support rods 130. The two support rods 130 are at the same height. A roller mounting structure is detachably connected to the top of the two support rods 130. A sliding rod correction structure is installed at the lower end of each support rod 130.
[0074] The roller mounting structure includes a flat plate 133 horizontally mounted on the top of the two support rods 130 and a roller bracket 134 fixed on the flat plate 133. The roller 114 is rotatably mounted on the roller bracket 134. The two ends of the flat plate 133 in the length direction are respectively screwed to the two support rods 130 by screws (not shown).
[0075] The sliding rod correction structure includes a sleeve 135 screwed to the lower end of the support rod 130 and a limiting member 136 that is axially limited and radially slidingly engaged with the sleeve 135. The limiting member 136 is detachably fixed to the bracket 131 and applies a thrust in the radial direction to the sleeve 135, so that the sleeve 135 can be translated relative to the limiting member 136 to the position corresponding to the second guide hole 420.
[0076] The axial limiting and radial sliding fit structure includes:
[0077] An annular connecting position 1351 is provided on the outer peripheral surface of the sleeve 135. The connecting position 1351 extends in the radial direction of the sleeve 135. The limiting member 136 has a horizontal position 1361 that slides and fits against the upper surface of the connecting position 1351 and a vertical position 1362 that is fixedly connected to the horizontal position 1361. The vertical position 1362 is directly or indirectly detachably fixedly connected to the bracket 131.
[0078] Furthermore, the horizontal position 1361 is provided with a clearance opening 1363 through which the sleeve 135 can pass. The clearance opening 1363 can increase the contact area between the connecting position 1351 and the horizontal position 1361, and expand the range of translation of the connecting position 1351.
[0079] Furthermore, the bottom of the sleeve 135 is an arc-shaped portion 1352 that reduces the contact area between the sleeve 135 and the bracket 131. The connection position 1351 is located near the arc-shaped portion 1352. The connection position 1351 can be translated relative to the horizontal end 131 (such as moving back and forth or left and right), which can adjust the support rod 130 to the position corresponding to the second guide hole 220 of the platform 200. Since the contact area between the bracket 131 and the arc-shaped portion 1352 is small, there is a suitable friction force between them. This friction force is configured to both allow the connection position 1351 to be translated along the horizontal position 1361 and limit the position of the translated connection position 1351.
[0080] Furthermore, a pad 1364 is provided between the bracket 131 and the arc-shaped portion 1352, which is detachably and fixedly connected to the bracket 131. A detachable and fixedly connected block 1365 is provided vertically on the side of the pad 1364 and connected to the vertical position 1362. In this embodiment, the detachable and fixed connection is preferably a screw connection, which is simple to disassemble and assemble, and facilitates timely replacement of damaged pads 1364. This avoids the phenomenon that the height of the support rod 130 is reduced due to wear of the pad 1364, which would cause the roller 114 to be inaccurately aligned with the semiconductor substrate 300.
[0081] In this embodiment, the second height position can be set at the top of the lifting mechanism 200, the top surface of the platform 400, or between the top of the lifting mechanism 200 and the top surface of the platform 400. All of these positions can guide and align the semiconductor substrate 300 placed at the placement position of the lifting mechanism 200.
[0082] When the second height position is set at the top of the lifting mechanism 200, the position corresponding to the horizontal diameter D2 of the roller 114 is at the same height as the placement position of the lifting mechanism 200. The roller 114 moves up and down synchronously with the semiconductor substrate 300 on the placement position. During the movement, the rollers 114 around the semiconductor substrate 300 can also prevent the semiconductor substrate 300 from shifting on the placement position.
[0083] When the second height position is set on the top surface of the platform 400, the position corresponding to the horizontal diameter D2 of the roller 114 is at the same height as the top surface of the platform 400. This can directly guide the semiconductor substrate 300 during the downward movement to the adhesive application position on the platform 400. In this embodiment, the second height position is set on the top surface of the platform 400, which shortens the stroke of the roller 114 moving up and down, thereby reducing the length of the support rod 130 and saving production costs.
[0084] like Figure 3 As shown, the guide alignment mechanism 100 further includes a sliding guide 140 for moving the linkage bracket 131 up and down. The sliding guide 140 includes two symmetrically arranged linear slide rail groups 141 (one of which is not shown) and sliders 142 respectively slidably mounted on the linear slide rail groups 141 (one of which is not shown). The bracket 131 is directly or indirectly fixed on the two sliders 142 so that the power component 120 drives the guide alignment assembly 110 to rise or fall at a uniform speed along the linear slide rail group 141.
[0085] In this embodiment, the center of the support rod 130 and the center of the second guide hole 420 are located at the same position, which facilitates the smooth sliding of the adjusted support rod 130 in the second guide hole 420. The parallelism of the support rod 130 along its vertical direction can be manually adjusted before or after the limiting member 136 is fixedly connected to the bracket 131.
[0086] In addition, during the upward movement of the guide alignment mechanism 100, the inner circumferential surface of the vertically arranged second guide hole 420 applies a radial torque to the outer circumferential surface of the bent support rod 130, causing the support rod 130 to move to the position corresponding to the second guide hole 420, thereby playing the role of automatically correcting the bent support rod 130.
[0087] like Figure 6 and Figure 7 As shown, the guiding alignment mechanism 100 further includes:
[0088] The first position detector 150 is used to detect the first height position of the guide alignment component 110 and output the first height position signal to the outside.
[0089] The second position detector 150' is used to detect the second height position of the guide alignment component 110 and output the second height position signal to the outside.
[0090] A driver 160 is used to control the power unit 120;
[0091] The controller 170 outputs control commands to the driver 160 based on the received first height position signal or second height position signal. The driver 160 controls the power unit 120 to start or stop working according to the received control commands. The controller 170 stores parameter information such as the speed, direction and number of revolutions of the power unit.
[0092] The above structure enables intelligent control of the semiconductor substrate 300 alignment, improving the efficiency of semiconductor substrate 300 alignment. It is simple to operate and easy to use.
[0093] This embodiment can drive the guide alignment component 110 and the placement position 210 to move up and down simultaneously using a single power component 120, which improves production efficiency and reduces costs.
[0094] like Figure 7 and Figure 8 As shown, this utility model also provides an adhesive application system, which includes the above-mentioned guide alignment mechanism 100 and further includes:
[0095] Platform 400 is used to place semiconductor substrate 300 and has a plurality of first guide holes 410 located below semiconductor substrate 300 and a plurality of second guide holes 420 located on the outer periphery of semiconductor substrate 300.
[0096] The lifting mechanism 200 has a plurality of ejector pins 230 respectively inserted into the first guide hole 410, and the top of the plurality of ejector pins 230 has a placement position 210 for placing the semiconductor substrate 300.
[0097] The guide alignment assembly 110 has a plurality of support rods 130 for mounting the guide alignment assembly 110, and the plurality of support rods 130 are respectively vertically slidably disposed in the corresponding second guide holes 420.
[0098] The above description is the preferred embodiment of this utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this utility model, and these improvements and modifications are also considered to be within the protection scope of this utility model.
Claims
1. A guide alignment mechanism, characterized by, Mounted on the lifting mechanism, including: A guiding alignment component moves from a first height position to a second height position to guide and align a semiconductor substrate placed on the placement position of the lifting mechanism. As the placement position of the lifting mechanism moves from the second height position to the first height position, the guiding alignment component guides the semiconductor substrate to a coating position on the platform. The first height position is lower than the height of the coating blade when applying adhesive in the horizontal direction. A power unit is used to drive the guide alignment assembly and the placement position to move synchronously, wherein the power unit drives the guide alignment assembly to rise from a first height position to a second height position, or to fall from a second height position to a first height position.
2. The guide alignment mechanism of claim 1, wherein The guiding alignment component includes: At least two spaced-apart first guide alignment surfaces are used for guiding and aligning the semiconductor substrate along its length. At least two spaced second guide alignment surfaces are used for guiding alignment of the semiconductor substrate in the width direction.
3. The guide alignment mechanism of claim 2, wherein, There are n first guide alignment surfaces and n second guide alignment surfaces, where n is an even number greater than 1, and the multiple first guide alignment surfaces and multiple second guide alignment surfaces are symmetrically arranged.
4. The guide alignment mechanism of claim 3, wherein The upper ends of the first and second guiding alignment surfaces are used to guide the semiconductor substrate, respectively. The lower ends of the first and second guiding alignment surfaces are used for aligning the semiconductor substrate.
5. The guide alignment mechanism of claim 2, wherein It includes multiple rollers that rotate along their axis, the multiple rollers being located around the semiconductor substrate, and the first guide alignment surface and the second guide alignment surface being located within the guide area formed between the horizontal diameter and the vertical diameter of the multiple rollers.
6. The guide alignment mechanism of claim 1, wherein It includes multiple support rods for mounting the guide alignment assembly and moving synchronously up and down with the placement position.
7. The guide alignment mechanism of claim 6, wherein, The system includes a sliding rod correction structure, which includes a sleeve screwed to the lower end of the support rod and a limiting member that is axially limited and radially slidingly engaged with the sleeve. The limiting member is detachably fixed to the bracket and applies a torque in the radial direction to the sleeve, so that the sleeve can be translated relative to the limiting member to a position corresponding to the second guide hole of the platform.
8. The guide and alignment mechanism of claim 7, wherein, The system includes a sliding guide for guiding the support rod. The sliding guide includes two symmetrically arranged linear slide rails and sliders respectively slidably mounted on the two linear slide rails. The bracket is fixed on the two sliders.
9. The guide and alignment mechanism of claim 1, wherein, include: A first position detector is used to detect the first height position of the guide alignment component and output a first height position signal to the outside. The second position detector is used to detect the second height position of the guide alignment component and output the second height position signal to the outside. A driver, used to control the power components; The controller outputs control commands to the driver based on the received first or second height position signal, and the driver controls the power component to start or stop working according to the received control commands.
10. A gluing system characterized by, The guide alignment mechanism according to any one of claims 1 to 9 further includes: A platform for mounting a semiconductor substrate, having a plurality of first guide holes located below the semiconductor substrate and a plurality of second guide holes located on the outer periphery of the semiconductor substrate; The lifting mechanism has multiple ejector pins that are respectively inserted into the first guide hole, and the top of the multiple ejector pins has a placement position for placing a semiconductor substrate. The guide alignment assembly has multiple support rods for mounting the guide alignment assembly, and the multiple support rods are respectively vertically slidably installed in the second guide hole.