A novel in-situ electroplating solution concentration on-line recycling device

Abstract

The utility model relates to the technical field of semiconductor and electron manufacturing, concretely relates to a novel in situ electroplating liquid concentration on -line reuse device, including mounting bracket and reuse subassembly, and the reuse subassembly includes nanometer fiber membrane evaporation module, support component, condenser, spacing component, buffer liquid storage tank, control electric box, water storage tank, sensing component, reinforcing member and heater, and the electroplating liquid is arranged into buffer liquid storage tank, and the liquid into buffer liquid storage tank is to guarantee original temperature, and when temperature reduces, heater heats, and the liquid of buffer liquid storage tank is extracted into nanometer fiber membrane evaporation module, and the water of diluted electroplating liquid is evaporated into water vapor by nanometer fiber membrane, and the gas is sucked from the upper portion to condenser, and the condensed water is to water storage tank, and the electroplating liquid concentrated after water extraction returns to buffer liquid storage tank, and when the data of sensing component is qualified, returns to electroplating groove, and all control and monitoring interfaces are in control electric box.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor and electronic manufacturing technology, and in particular to a novel in-situ electroplating solution concentration and online reuse device. Background Technology

[0002] In chip manufacturing processes such as wafer fabrication, packaging, and copper interconnect plating, the plating solution is continuously diluted during use. This is due to several reasons, including: the introduction of cleaning solution or DI water into the wafer, leading to a decrease in the concentration of the plating solution; overflow, evaporation, and dilution of the plating solution, reducing the concentration of metal ions; and the need for frequent replenishment of high-concentration mother liquor, increasing operating costs. Current concentration technologies, such as vacuum evaporation, membrane separation, and freeze crystallization, suffer from problems such as large equipment size, high operating costs, and unsuitability for corrosive liquids with high metal content. There is a lack of miniaturized, online, and energy-efficient solutions that can be embedded in plating lines.

[0003] This invention proposes an in-situ online electroplating solution recycling device. By employing a nanofiber membrane evaporator module, it achieves the concentration of diluted electroplating solution and the retention of metal ion components under normal temperature and pressure conditions, thereby reducing the frequency of solution replenishment, saving costs, and improving operational stability. Utility Model Content

[0004] The purpose of this invention is to provide a novel in-situ electroplating solution concentration and online reuse device. By adopting a nanofiber membrane evaporator module, the device can concentrate the diluted electroplating solution and retain the metal ion components under normal temperature and pressure conditions, thereby reducing the frequency of replenishment, saving costs, and improving operational stability.

[0005] To achieve the above objectives, this utility model provides a novel in-situ electroplating solution concentration and online reuse device, including a mounting frame and a reuse component; the reuse component includes a nanofiber membrane evaporation module, a support member, a condenser, a limiting member, a buffer storage tank, a control box, a water tank, a sensing member, and a reinforcing member; the nanofiber membrane evaporation module is fixedly connected to the mounting frame and located on one side of the mounting frame, the support member is located on one side of the mounting frame, the condenser is located on one side of the support member, the buffer storage tank is fixedly connected to the mounting frame and located on one side of the mounting frame, the control box is fixedly connected to the mounting frame and located on one side of the mounting frame, the water tank 109 is fixedly connected to the mounting frame and located on one side of the mounting frame, the sensing member is located inside the buffer storage tank, the reinforcing member is located on one side of the mounting frame, and the heater is fixedly connected to the buffer storage tank and located on one side of the buffer storage tank.

[0006] The supporting component includes a supporting plate and a supporting frame. The supporting plate is fixedly connected to the mounting frame and is located on one side of the mounting frame. One end of the supporting frame is fixedly connected to the mounting frame, and the other end is fixedly connected to the supporting plate and is located on one side of the mounting frame.

[0007] The limiting component includes a limiting member and a support rod. The limiting member is fixedly connected to the condenser and is located on one side of the condenser. The support rod is fixedly connected to the limiting member and is located on the side of the limiting member.

[0008] The sensing components include a temperature sensor, a conductivity sensor, and a liquid level sensor. The temperature sensor is fixedly connected to the buffer storage tank and located at the primary side of the buffer storage tank. The conductivity sensor is fixedly connected to the buffer storage tank and located on one side of the buffer storage tank. The liquid level sensor is fixedly connected to the buffer storage tank and located on one side of the buffer storage tank.

[0009] The reinforcing component includes a support baffle and a crossbar. The support baffle is fixedly connected to the mounting frame and is located on one side of the mounting frame. The crossbar is fixedly connected to the mounting frame and is located on one side of the mounting frame.

[0010] This invention discloses a novel in-situ electroplating solution concentration and online reuse device. After continuous wafer cleaning, the electroplating solution is diluted. When the concentration drops to an unusable level, it is discharged into a buffer storage tank. To maintain the original temperature, the liquid entering the buffer storage tank is heated by a heater as the temperature decreases. The liquid in the buffer storage tank is then drawn into a nanofiber membrane evaporation module. The water in the diluted electroplating solution is evaporated into water vapor by the nanofiber membrane. This vapor is drawn from the top to the condenser, where it condenses into water and flows into a storage tank. After the water is removed, the concentrated electroplating solution returns to the buffer storage tank. Once the data from the sensing component is qualified (i.e., the concentration meets the standard), the solution is returned to the electroplating tank. All control and monitoring interfaces in the entire system are located within the control box. Attached Figure Description

[0011] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below.

[0012] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0013] Figure 2 This is a structural schematic diagram of the entire utility model from another perspective.

[0014] Figure 3This is a schematic diagram of the structure of the buffer storage tank, heater, temperature sensor, conductivity sensor and level sensor of this utility model.

[0015] 101-Mounting frame, 102-Reuse component, 103-Nanofiber membrane evaporation module, 104-Supporting component, 105-Condenser, 106-Limiting component, 107-Buffer storage tank, 108-Control box, 109-Water tank, 110-Sensing component, 111-Reinforcing component, 112-Heater, 113-Support plate, 114-Support frame, 115-Limiting component, 116-Support rod, 117-Temperature sensor, 118-Conductivity sensor, 119-Level sensor, 120-Support baffle, 121-Crossbar. Detailed Implementation

[0016] The embodiments of the present invention are described in detail below. Examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, but should not be construed as limiting the present invention.

[0017] Please see Figures 1-3 ,in, Figure 1 This is a schematic diagram of the overall structure of this utility model. Figure 2 This is a structural schematic diagram of the entire utility model from another perspective. Figure 3 This is a schematic diagram of the structure of the buffer storage tank, heater, temperature sensor, conductivity sensor and level sensor of this utility model.

[0018] This utility model provides a novel in-situ electroplating solution concentration and online reuse device, including a mounting frame 101 and a reuse component 102. The reuse component 102 includes a nanofiber membrane evaporation module 103, a support component 104, a condenser 105, a limiting component 106, a buffer storage tank 107, a control box 108, a water storage tank 109, a sensing component 110, a reinforcing component 111, and a heater 112. The support component includes a support plate 113 and a support frame 114. The limiting component 106 includes a limiting element 115 and a support rod 116. The reinforcing component 111 includes a support baffle 120 and a crossbar 121. By using a nanofiber membrane evaporator module, the concentration of diluted electroplating solution and the retention of metal ion components are achieved under normal temperature and pressure conditions, thereby reducing the frequency of replenishment, saving costs, and improving operational stability.

[0019] In this specific embodiment, the nanofiber membrane evaporation module 103 is fixedly connected to the mounting frame 101 and located on one side of the mounting frame 101. The support member 104 is disposed on one side of the mounting frame 101. The condenser 105 is disposed on one side of the support member 104. The buffer storage tank 107 is fixedly connected to the mounting frame 101 and located on one side of the mounting frame 101. The control box 108 is fixedly connected to the mounting frame 101 and located on one side of the mounting frame 101. The water storage tank 109 is fixedly connected to the mounting frame 101 and located on one side of the mounting frame 101. The sensing member 110 is disposed inside the buffer storage tank 107. The reinforcing member 111 is disposed on one side of the mounting frame 101. The heater 112 is fixedly connected to the buffer storage tank 107 and located on one side of the buffer storage tank 107. The anti-slip pad is disposed at the bottom of the mounting frame 101.

[0020] This invention discloses a novel in-situ electroplating solution concentration and online reuse device. After continuous wafer cleaning, the electroplating solution is diluted. When the concentration drops to an unusable level, it is discharged into the buffer storage tank 107. To maintain the original temperature, the liquid entering the buffer storage tank 107 is heated by the heater 112 as the temperature decreases. The liquid in the buffer storage tank 107 is then drawn into the nanofiber membrane evaporation module 103. The water in the diluted electroplating solution is evaporated into water vapor by the nanofiber membrane. The vapor is drawn from the top to the condenser 105, where it condenses into water and flows into the water storage tank 109. After the water is removed, the concentrated electroplating solution returns to the buffer storage tank 107. When the data from the sensing component 110 is qualified (i.e., the concentration meets the standard), the solution returns to the electroplating tank. All control and monitoring interfaces in the entire control system are located within the control box 108.

[0021] The support plate 113 is fixedly connected to the mounting bracket 101 and is located on one side of the mounting bracket 101. One end of the support bracket 114 is fixedly connected to the mounting bracket 101, and the other end is fixedly connected to the support plate 113 and is located on one side of the mounting bracket 101. The mounting bracket 101 supports the support plate 113, making the support plate 113 more stable when supporting the condenser 105. The support plate 113 supports the condenser 105 and restricts it to a fixed position for blowing.

[0022] Secondly, the limiting member 115 is fixedly connected to the condenser 105 and located on one side of the condenser 105, and the support rod 116 is fixedly connected to the limiting member 115 and located on the side of the limiting member 115. The side of the condenser 105 has the limiting member 115 and the support rod 116. The limiting member 115 and the support rod 116 restrict the position of the condenser 105 to ensure that it is placed more stably.

[0023] Meanwhile, the temperature sensor 117 is fixedly connected to the buffer reservoir 107 and located at the primary level of the buffer reservoir 107; the conductivity sensor 118 is fixedly connected to the buffer reservoir 107 and located on one side of the buffer reservoir 107; and the liquid level sensor 119 is fixedly connected to the buffer reservoir 107 and located on one side of the buffer reservoir 107. The buffer reservoir 107 contains the temperature sensor 117 and the liquid level sensor 119. The liquid level sensor 119 detects the liquid depth, and the temperature sensor 117 detects the temperature. When the temperature drops, the heater 112 heats the liquid, and the liquid in the buffer storage tank 107 is drawn into the nanofiber membrane evaporation module 103. The water in the diluted electroplating solution is evaporated into water vapor by the nanofiber membrane. The gas is drawn away from the top to the condenser 105 and condensed into water in the water storage tank 109. After the water is removed, the concentrated electroplating solution returns to the buffer storage tank 107. When the data from the conductivity sensor 118 is qualified (i.e., the concentration meets the standard), it returns to the electroplating tank. All control and monitoring interfaces in the entire control are located in the control box 108.

[0024] In addition, the support baffle 120 is fixedly connected to the mounting frame 101 and located on one side of the mounting frame 101. The crossbar 121 is fixedly connected to the mounting frame 101 and located on one side of the mounting frame 101. The mounting frames 101 are reinforced by the crossbar 121 to ensure the stability of the support. At the same time, the bottom is fixed to ensure that the mounting base does not undergo overall misalignment or deformation while providing support, and always maintains its original shape for support.

[0025] In using this invention, the buffer storage tank 107 is equipped with a temperature sensor 117 and a liquid level sensor 119. The liquid level sensor 119 detects the liquid depth, and the temperature sensor 117 detects the temperature. When the temperature decreases, the heater 112 heats the liquid. The liquid in the buffer storage tank 107 is drawn into the nanofiber membrane evaporation module 103. The water in the diluted electroplating solution is evaporated into water vapor by the nanofiber membrane. The vapor is drawn from the top to the condenser 105, where it condenses into water and flows into the water storage tank 109. After the water is removed, the concentrated electroplating solution returns to the buffer storage tank 107. When the data from the conductivity sensor 118 is qualified (i.e., the concentration meets the standard), the solution returns to the electroplating tank. All control and monitoring interfaces in the entire control system are located in the control box 108. Taking a certain wafer copper electroplating line as an example, the amount of water introduced per batch of diluent is approximately 5–10 L; one set of nanofiber membrane modules (effective membrane area 1.2 m²) is used. 2 ), evaporation flux 8–12 kg / m³ per hour 2 The device occupies only 0.3m² of space. 2 It can be embedded in the empty space behind the electroplating equipment; after 48 hours of continuous operation, the replenishment frequency decreases by about 60%, and the composition of the electroplating solution remains stable; the conductivity of the concentrate is restored to the level of the original solution, and the copper ion concentration error is less than ±2%.

[0026] The above-disclosed embodiments are merely a novel in-situ electroplating solution concentration and online reuse device or a variety of preferred embodiments of this application, and should not be construed as limiting the scope of this application. Those skilled in the art can understand that all or part of the processes of the above embodiments can be implemented, and equivalent changes made in accordance with the claims of this application still fall within the scope of this application.

Claims

1. A novel in-situ electroplating solution concentration and online reuse device, comprising a mounting frame, characterized in that, It also includes reused components; The recycling component includes a nanofiber membrane evaporation module, a support component, a condenser, a limiting component, a buffer storage tank, a control box, a water storage tank, a sensing component, a reinforcing component, and a heater. The nanofiber membrane evaporation module is fixedly connected to the mounting frame and located on one side of the mounting frame. The support member is located on one side of the mounting frame. The condenser is located on one side of the support member. The limiting member is located on the side of the condenser. The buffer storage tank is fixedly connected to the mounting frame and located on one side of the mounting frame. The control box is fixedly connected to the mounting frame and located on one side of the mounting frame. The water storage tank is fixedly connected to the mounting frame and located on one side of the mounting frame. The sensing member is located inside the buffer storage tank. The reinforcing member is located on one side of the mounting frame. The heater is fixedly connected to the buffer storage tank and located on one side of the buffer storage tank.

2. The novel in-situ electroplating solution concentration and online reuse device as described in claim 1, characterized in that, The supporting component includes a supporting plate and a supporting frame. The supporting plate is fixedly connected to the mounting frame and is located on one side of the mounting frame. One end of the supporting frame is fixedly connected to the mounting frame, and the other end is fixedly connected to the supporting plate and is located on one side of the mounting frame.

3. The novel in-situ electroplating solution concentration and online reuse device as described in claim 2, characterized in that, The limiting component includes a limiting member and a support rod. The limiting member is fixedly connected to the condenser and located on one side of the condenser. The support rod is fixedly connected to the limiting member and located on the side of the limiting member.

4. The novel in-situ electroplating solution concentration and online reuse device as described in claim 3, characterized in that, The sensing components include a temperature sensor, a conductivity sensor, and a liquid level sensor. The temperature sensor is fixedly connected to the buffer storage tank and located at the primary side of the buffer storage tank. The conductivity sensor is fixedly connected to the buffer storage tank and located on one side of the buffer storage tank. The liquid level sensor is fixedly connected to the buffer storage tank and located on one side of the buffer storage tank.

5. A novel in-situ electroplating solution concentration and online reuse device as described in claim 4, characterized in that, The reinforcing component includes a support baffle and a crossbar. The support baffle is fixedly connected to the mounting frame and is located on one side of the mounting frame. The crossbar is fixedly connected to the mounting frame and is located on one side of the mounting frame.

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